JPWO2024135268A1 - - Google Patents

Info

Publication number
JPWO2024135268A1
JPWO2024135268A1 JP2024565718A JP2024565718A JPWO2024135268A1 JP WO2024135268 A1 JPWO2024135268 A1 JP WO2024135268A1 JP 2024565718 A JP2024565718 A JP 2024565718A JP 2024565718 A JP2024565718 A JP 2024565718A JP WO2024135268 A1 JPWO2024135268 A1 JP WO2024135268A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024565718A
Other languages
Japanese (ja)
Other versions
JPWO2024135268A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024135268A1 publication Critical patent/JPWO2024135268A1/ja
Publication of JPWO2024135268A5 publication Critical patent/JPWO2024135268A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2024565718A 2022-12-19 2023-11-30 Pending JPWO2024135268A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022201801 2022-12-19
PCT/JP2023/042846 WO2024135268A1 (ja) 2022-12-19 2023-11-30 熱硬化性樹脂組成物、カバーレイフィルム、及びフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2024135268A1 true JPWO2024135268A1 (https=) 2024-06-27
JPWO2024135268A5 JPWO2024135268A5 (https=) 2025-07-29

Family

ID=91588317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024565718A Pending JPWO2024135268A1 (https=) 2022-12-19 2023-11-30

Country Status (5)

Country Link
JP (1) JPWO2024135268A1 (https=)
KR (1) KR20250113445A (https=)
CN (1) CN120187797A (https=)
TW (1) TWI866686B (https=)
WO (1) WO2024135268A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121455A (ja) * 1997-07-03 1999-01-26 Toyobo Co Ltd ポリアミドイミド樹脂組成物およびそれを用いた非水電解質二次電池および回路基板
WO2010038644A1 (ja) * 2008-10-01 2010-04-08 東洋紡績株式会社 ポリアミドイミド樹脂、該樹脂組成物、難燃性接着剤組成物並びに該組成物からなる接着剤シート、カバーレイフィルム及びプリント配線板
JP2010265376A (ja) * 2009-05-14 2010-11-25 Toyobo Co Ltd 易接着性成型用ポリエステルフィルム及び成型用ゴム／ポリエステルフィルム積層体
WO2019244452A1 (ja) * 2018-06-21 2019-12-26 東洋紡株式会社 アクリロニトリルブタジエンゴム共重合ポリアミドイミド樹脂を含む接着剤組成物
WO2022019095A1 (ja) * 2020-07-22 2022-01-27 株式会社有沢製作所 熱硬化性樹脂組成物、カバーレイフィルム、接着シート、及びフレキシブルプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103124474B (zh) * 2006-04-25 2017-11-28 日立化成株式会社 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板
CN103650649B (zh) * 2011-07-07 2017-09-29 日立化成株式会社 粘接膜、使用了该粘接膜的多层印制电路板、及该多层印制电路板的制造方法
JP2013043925A (ja) 2011-08-23 2013-03-04 Nippon Steel & Sumikin Chemical Co Ltd 接着剤樹脂組成物、その硬化物、接着剤フィルム、カバーレイフィルム及び回路基板
CN109337066B (zh) * 2018-09-28 2020-08-11 浙江大学 一种具有反应活性、易溶解的刚性链聚合物及其制备方法和组合物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121455A (ja) * 1997-07-03 1999-01-26 Toyobo Co Ltd ポリアミドイミド樹脂組成物およびそれを用いた非水電解質二次電池および回路基板
WO2010038644A1 (ja) * 2008-10-01 2010-04-08 東洋紡績株式会社 ポリアミドイミド樹脂、該樹脂組成物、難燃性接着剤組成物並びに該組成物からなる接着剤シート、カバーレイフィルム及びプリント配線板
JP2010265376A (ja) * 2009-05-14 2010-11-25 Toyobo Co Ltd 易接着性成型用ポリエステルフィルム及び成型用ゴム／ポリエステルフィルム積層体
WO2019244452A1 (ja) * 2018-06-21 2019-12-26 東洋紡株式会社 アクリロニトリルブタジエンゴム共重合ポリアミドイミド樹脂を含む接着剤組成物
WO2022019095A1 (ja) * 2020-07-22 2022-01-27 株式会社有沢製作所 熱硬化性樹脂組成物、カバーレイフィルム、接着シート、及びフレキシブルプリント配線板

Also Published As

Publication number Publication date
KR20250113445A (ko) 2025-07-25
TW202430612A (zh) 2024-08-01
WO2024135268A1 (ja) 2024-06-27
TWI866686B (zh) 2024-12-11
CN120187797A (zh) 2025-06-20

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