CN120187797A - 热固性树脂组合物、覆盖膜及柔性印刷布线板 - Google Patents

热固性树脂组合物、覆盖膜及柔性印刷布线板 Download PDF

Info

Publication number
CN120187797A
CN120187797A CN202380078821.4A CN202380078821A CN120187797A CN 120187797 A CN120187797 A CN 120187797A CN 202380078821 A CN202380078821 A CN 202380078821A CN 120187797 A CN120187797 A CN 120187797A
Authority
CN
China
Prior art keywords
mass
parts
cover film
resin composition
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380078821.4A
Other languages
English (en)
Chinese (zh)
Inventor
权平贵志
古川胜彦
石川雄己
须藤启佑
藤田秀一
松山浩幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arisawa Mfg Co Ltd
Original Assignee
Arisawa Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arisawa Mfg Co Ltd filed Critical Arisawa Mfg Co Ltd
Publication of CN120187797A publication Critical patent/CN120187797A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380078821.4A 2022-12-19 2023-11-30 热固性树脂组合物、覆盖膜及柔性印刷布线板 Pending CN120187797A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-201801 2022-12-19
JP2022201801 2022-12-19
PCT/JP2023/042846 WO2024135268A1 (ja) 2022-12-19 2023-11-30 熱硬化性樹脂組成物、カバーレイフィルム、及びフレキシブルプリント配線板

Publications (1)

Publication Number Publication Date
CN120187797A true CN120187797A (zh) 2025-06-20

Family

ID=91588317

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380078821.4A Pending CN120187797A (zh) 2022-12-19 2023-11-30 热固性树脂组合物、覆盖膜及柔性印刷布线板

Country Status (5)

Country Link
JP (1) JPWO2024135268A1 (https=)
KR (1) KR20250113445A (https=)
CN (1) CN120187797A (https=)
TW (1) TWI866686B (https=)
WO (1) WO2024135268A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3931387B2 (ja) * 1997-07-03 2007-06-13 東洋紡績株式会社 ポリアミドイミド樹脂およびそれを用いた非水電解質二次電池および回路基板
CN103124474B (zh) * 2006-04-25 2017-11-28 日立化成株式会社 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板
JP5672701B2 (ja) * 2008-10-01 2015-02-18 東洋紡株式会社 ポリアミドイミド樹脂、該樹脂組成物、難燃性接着剤組成物並びに該組成物からなる接着剤シート、カバーレイフィルム及びプリント配線板
JP2010265376A (ja) * 2009-05-14 2010-11-25 Toyobo Co Ltd 易接着性成型用ポリエステルフィルム及び成型用ゴム／ポリエステルフィルム積層体
CN103650649B (zh) * 2011-07-07 2017-09-29 日立化成株式会社 粘接膜、使用了该粘接膜的多层印制电路板、及该多层印制电路板的制造方法
JP2013043925A (ja) 2011-08-23 2013-03-04 Nippon Steel & Sumikin Chemical Co Ltd 接着剤樹脂組成物、その硬化物、接着剤フィルム、カバーレイフィルム及び回路基板
WO2019244452A1 (ja) * 2018-06-21 2019-12-26 東洋紡株式会社 アクリロニトリルブタジエンゴム共重合ポリアミドイミド樹脂を含む接着剤組成物
CN109337066B (zh) * 2018-09-28 2020-08-11 浙江大学 一种具有反应活性、易溶解的刚性链聚合物及其制备方法和组合物
JP7090824B1 (ja) * 2020-07-22 2022-06-24 株式会社有沢製作所 熱硬化性樹脂組成物、カバーレイフィルム、接着シート、及びフレキシブルプリント配線板

Also Published As

Publication number Publication date
KR20250113445A (ko) 2025-07-25
TW202430612A (zh) 2024-08-01
WO2024135268A1 (ja) 2024-06-27
TWI866686B (zh) 2024-12-11
JPWO2024135268A1 (https=) 2024-06-27

Similar Documents

Publication Publication Date Title
CN104053721B (zh) 树脂组合物
KR100605517B1 (ko) 폴리이미드-금속 적층체 및 폴리아미드이미드-금속 적층체
CN105308121B (zh) 树脂组合物
TWI750050B (zh) 黏結膜、其黏結膜附著層疊體及其金屬箔層疊體
CN107418144A (zh) 树脂组合物
TW200911944A (en) Flame retardant adhesive composition, and coverlay film using same
JP2007305963A (ja) 応力緩和層付半導体素子搭載用基板並びにその製造方法
CN102127291B (zh) 无卤环氧树脂组合物及用其制备的覆盖膜
JP5008536B2 (ja) 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
JP2024159771A (ja) フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板
TWI879891B (zh) 樹脂薄片
KR101797723B1 (ko) 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
JP2009149829A (ja) 難燃性接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
JP2013035881A (ja) 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルム、金属箔、銅張板および多層ビルドアップ基板
JP2003136632A (ja) 金属付きポリイミドフィルムの製造方法および当該製造方法により得られる金属付きポリイミドフィルム
TWI785514B (zh) 黏結膜、其黏結膜附著層疊體及其金屬箔層疊體
JP3638404B2 (ja) フレキシブル印刷配線用基板
JP4363137B2 (ja) 金属箔層付き基板フィルム及び両面金属箔付き基板フィルム
CN120187797A (zh) 热固性树脂组合物、覆盖膜及柔性印刷布线板
CN112313302B (zh) 包含丙烯腈丁二烯橡胶共聚聚酰胺酰亚胺树脂的粘接剂组合物
TW202409238A (zh) 硬化性樹脂組成物、硬化性膜及積層膜
JP2011246406A (ja) 有機けい素化合物
JP2003200527A (ja) 金属箔積層体および両面金属箔積層体
JP2001119129A (ja) カバーレイフィルム
JPH06322324A (ja) ボンディングシート

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination