JPWO2024135268A5 - - Google Patents

Info

Publication number
JPWO2024135268A5
JPWO2024135268A5 JP2024565718A JP2024565718A JPWO2024135268A5 JP WO2024135268 A5 JPWO2024135268 A5 JP WO2024135268A5 JP 2024565718 A JP2024565718 A JP 2024565718A JP 2024565718 A JP2024565718 A JP 2024565718A JP WO2024135268 A5 JPWO2024135268 A5 JP WO2024135268A5
Authority
JP
Japan
Prior art keywords
mass
parts
coverlay film
laminated
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024565718A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024135268A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/042846 external-priority patent/WO2024135268A1/ja
Publication of JPWO2024135268A1 publication Critical patent/JPWO2024135268A1/ja
Publication of JPWO2024135268A5 publication Critical patent/JPWO2024135268A5/ja
Pending legal-status Critical Current

Links

JP2024565718A 2022-12-19 2023-11-30 Pending JPWO2024135268A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022201801 2022-12-19
PCT/JP2023/042846 WO2024135268A1 (ja) 2022-12-19 2023-11-30 熱硬化性樹脂組成物、カバーレイフィルム、及びフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2024135268A1 JPWO2024135268A1 (https=) 2024-06-27
JPWO2024135268A5 true JPWO2024135268A5 (https=) 2025-07-29

Family

ID=91588317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024565718A Pending JPWO2024135268A1 (https=) 2022-12-19 2023-11-30

Country Status (5)

Country Link
JP (1) JPWO2024135268A1 (https=)
KR (1) KR20250113445A (https=)
CN (1) CN120187797A (https=)
TW (1) TWI866686B (https=)
WO (1) WO2024135268A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3931387B2 (ja) * 1997-07-03 2007-06-13 東洋紡績株式会社 ポリアミドイミド樹脂およびそれを用いた非水電解質二次電池および回路基板
US20090323300A1 (en) * 2006-04-25 2009-12-31 Daisuke Fujimoto Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
JP5672701B2 (ja) * 2008-10-01 2015-02-18 東洋紡株式会社 ポリアミドイミド樹脂、該樹脂組成物、難燃性接着剤組成物並びに該組成物からなる接着剤シート、カバーレイフィルム及びプリント配線板
JP2010265376A (ja) * 2009-05-14 2010-11-25 Toyobo Co Ltd 易接着性成型用ポリエステルフィルム及び成型用ゴム／ポリエステルフィルム積層体
US10645804B2 (en) * 2011-07-07 2020-05-05 Hitachi Chemical Company, Ltd. Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board
JP2013043925A (ja) 2011-08-23 2013-03-04 Nippon Steel & Sumikin Chemical Co Ltd 接着剤樹脂組成物、その硬化物、接着剤フィルム、カバーレイフィルム及び回路基板
WO2019244452A1 (ja) * 2018-06-21 2019-12-26 東洋紡株式会社 アクリロニトリルブタジエンゴム共重合ポリアミドイミド樹脂を含む接着剤組成物
CN109337066B (zh) * 2018-09-28 2020-08-11 浙江大学 一种具有反应活性、易溶解的刚性链聚合物及其制备方法和组合物
KR102463618B1 (ko) * 2020-07-22 2022-11-04 가부시키가이샤 아리사와 세이사쿠쇼 열경화성 수지 조성물, 커버레이 필름, 접착 시트 및 플렉시블 프린트 배선판

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