CN202565566U - Led软灯条用半固化白色阻焊膜 - Google Patents

Led软灯条用半固化白色阻焊膜 Download PDF

Info

Publication number
CN202565566U
CN202565566U CN2011203385830U CN201120338583U CN202565566U CN 202565566 U CN202565566 U CN 202565566U CN 2011203385830 U CN2011203385830 U CN 2011203385830U CN 201120338583 U CN201120338583 U CN 201120338583U CN 202565566 U CN202565566 U CN 202565566U
Authority
CN
China
Prior art keywords
semi
white
solid preparation
glued membrane
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011203385830U
Other languages
English (en)
Inventor
洪立秋
青志保
向必军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Nikko electronic Polytron Technologies Inc
Original Assignee
Dongguan Qunyue Ele-Materials & Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Qunyue Ele-Materials & Technology Co ltd filed Critical Dongguan Qunyue Ele-Materials & Technology Co ltd
Priority to CN2011203385830U priority Critical patent/CN202565566U/zh
Application granted granted Critical
Publication of CN202565566U publication Critical patent/CN202565566U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型涉及LED软灯条线路板所用阻焊绝缘材料技术领域,尤其涉及LED软灯条用半固化白色阻焊膜,它为三层结构,第一层是白色阻焊层,第二层是半固化胶膜,第三层是离型层,所述的白色阻焊层、半固化胶膜、离型层自上至下贴合为一体,具有白度高而稳定、柔韧性好,阻焊性能优异,生产工艺较简单,成本较低廉的特点。

Description

LED软灯条用半固化白色阻焊膜
技术领域
本实用新型涉及LED软灯条线路板所用阻焊绝缘材料技术领域,尤其涉及LED软灯条用半固化白色阻焊膜。
背景技术
近年来,结合FPC(柔性线路板)技术的LED软灯条极大地推动了LED照明产业的迅速发展。由于LED发光效率的限制,LED软灯条大都使用反射率较高的白色阻焊膜,该白色阻焊膜主要有两种形式,一是采取直接在线路板上丝印白色阻焊油墨的形式,由于其工序繁琐,并且一般的白色阻焊油墨的硬度较高,抗挠性较差,同时在高温下易黄变,导致产品合格率较差,严重影响了LED软灯条的使用寿命;二是如授权公告号为CN201563288U的中国实用新型专利公开了一种白色覆盖膜的结构,其绝缘层采用聚酰亚胺薄膜或聚酯薄膜,在挠折性上得到很大的改善,但是白色阻焊油墨的缺点没有得到解决,另外该专利所述白色覆盖膜采用四层结构,生产工艺较复杂,构成成本也较昂贵。
实用新型内容
本实用新型的目的在于针对现有技术的不足而提供一种LED软灯条用半固化白色阻焊膜,其白度高而稳定、柔韧性好,阻焊性能优异,生产工艺较简单,成本较低廉。
为实现上述目的,本实用新型采用如下技术方案:
LED软灯条用半固化白色阻焊膜,它为三层结构,第一层是白色阻焊层,第二层是半固化胶膜,第三层是离型层,所述的白色阻焊层、半固化胶膜、离型层自上至下贴合为一体。
所述的白色阻焊层为白色聚酰亚胺薄膜、白色聚醚醚酮薄膜、白色聚四氟乙烯薄膜中的任意一种。
所述的白色阻焊层为白色聚酰亚胺薄膜、白色聚醚醚酮薄膜、白色聚四氟乙烯薄膜中的任意两种或两种以上的混合物薄膜。
所述的半固化胶膜为具有阻燃作用且半固化的环氧树脂胶膜、聚酯树脂胶膜、丙烯酸酯树脂胶膜、改性聚酰亚胺树脂胶膜中的任意一种。
所述的半固化胶膜为具有阻燃作用且半固化的环氧树脂胶膜、聚酯树脂胶膜、丙烯酸酯树脂胶膜、改性聚酰亚胺树脂胶膜中的任意两种或两种以上的混合物胶膜。
所述的离型层为单面或双面涂覆有硅或非硅离型剂的淋膜纸、聚乙烯薄膜、聚酯薄膜中的任意一种。
本实用新型的有益效果是:本实用新型所述LED软灯条用半固化白色阻焊膜,它为三层结构,第一层是白色阻焊层,第二层是半固化胶膜,第三层是离型层,所述的白色阻焊层、半固化胶膜、离型层自上至下贴合为一体,具有白度高而稳定、柔韧性好,阻焊性能优异,生产工艺较简单,成本较低廉的特点。
附图说明
图1是本实用新型的结构示意图。
具体实施方式
下面结合附图和实施例对本实用新型作进一步详细说明。
如图1所示,本实用新型所述LED软灯条用半固化白色阻焊膜,它为三层结构,第一层是白色阻焊层1,第二层是半固化胶膜2,第三层是离型层3,所述的白色阻焊层1、半固化胶膜2、离型层3自上至下贴合为一体。
作为优选的实施方式,所述的白色阻焊层1为白色聚酰亚胺薄膜、白色聚醚醚酮薄膜、白色聚四氟乙烯薄膜中的任意一种。作为另一优选的实施方式,所述的白色阻焊层1为白色聚酰亚胺薄膜、白色聚醚醚酮薄膜、白色聚四氟乙烯薄膜中的任意两种或两种以上的混合物薄膜,例如,为白色聚酰亚胺薄膜和白色聚醚醚酮薄膜的混合物薄膜,或者白色聚酰亚胺薄膜、白色聚醚醚酮薄膜和白色聚四氟乙烯薄膜的三者混合物薄膜等。
作为优选的实施方式,所述的半固化胶膜2为具有阻燃作用且半固化的环氧树脂胶膜、聚酯树脂胶膜、丙烯酸酯树脂胶膜、改性聚酰亚胺树脂胶膜中的任意一种。作为另一优选的实施方式,所述的半固化胶膜2为具有阻燃作用且半固化的环氧树脂胶膜、聚酯树脂胶膜、丙烯酸酯树脂胶膜、改性聚酰亚胺树脂胶膜中的任意两种或两种以上的混合物胶膜,例如,为具有阻燃作用且半固化的环氧树脂胶膜和聚酯树脂胶膜的混合物胶膜,或者具有阻燃作用且半固化的聚酯树脂胶膜、丙烯酸酯树脂胶膜和改性聚酰亚胺树脂胶的三者混合物胶膜等。
所述的离型层3为单面或双面涂覆有硅或非硅离型剂的淋膜纸、聚乙烯薄膜、聚酯薄膜中的任意一种。例如,单面涂覆有非硅离型剂的淋膜纸,或者单面或双面涂覆有硅或非硅离型剂的聚乙烯薄膜、聚酯薄膜等。
本实用新型所述LED软灯条用半固化白色阻焊膜,半固化白色阻焊膜可以通过热压合在LED软灯条线路板上,对线路板起到阻焊、绝缘保护等作用,并具有白度高而稳定、柔韧性好,阻焊性能优异等特点。该半固化白色阻焊膜最主要的特征是采用柔韧性好,耐高温,阻焊性、绝缘性好的白色高分子薄膜代替白色阻焊油墨和绝缘层,既可以不需使用白色阻焊油墨,简化工艺,又可以彻底改善因白色阻焊油墨带来的挠折性差、易掉油和高温黄变的缺点。与现有技术相比,本实用新型所述LED软灯条用半固化白色阻焊膜,更能针对LED软灯条的制作与应用,并具有白度高而稳定、柔韧性好,阻焊性能优异,成本低廉等优势。
以上所述仅是本实用新型的较佳实施方式,故凡依本实用新型专利申请范围所述的构造、特征及原理所做的等效变化或修饰,均包括于本实用新型专利申请范围内。

Claims (4)

1.LED软灯条用半固化白色阻焊膜,其特征在于:它为三层结构,第一层是白色阻焊层(1),第二层是半固化胶膜(2),第三层是离型层(3),所述的白色阻焊层(1)、半固化胶膜(2)、离型层(3)自上至下贴合为一体。
2.根据权利要求1所述的LED软灯条用半固化白色阻焊膜,其特征在于:所述的白色阻焊层(1)为白色聚酰亚胺薄膜、白色聚醚醚酮薄膜、白色聚四氟乙烯薄膜中的任意一种。
3.根据权利要求1所述的LED软灯条用半固化白色阻焊膜,其特征在于:所述的半固化胶膜(2)为具有阻燃作用且半固化的环氧树脂胶膜、聚酯树脂胶膜、丙烯酸酯树脂胶膜、改性聚酰亚胺树脂胶膜中的任意一种。
4.根据权利要求1所述的LED软灯条用半固化白色阻焊膜,其特征在于:所述的离型层(3)为单面或双面涂覆有硅或非硅离型剂的淋膜纸、聚乙烯薄膜、聚酯薄膜中的任意一种。 
CN2011203385830U 2011-09-05 2011-09-05 Led软灯条用半固化白色阻焊膜 Expired - Fee Related CN202565566U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203385830U CN202565566U (zh) 2011-09-05 2011-09-05 Led软灯条用半固化白色阻焊膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203385830U CN202565566U (zh) 2011-09-05 2011-09-05 Led软灯条用半固化白色阻焊膜

Publications (1)

Publication Number Publication Date
CN202565566U true CN202565566U (zh) 2012-11-28

Family

ID=47215160

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203385830U Expired - Fee Related CN202565566U (zh) 2011-09-05 2011-09-05 Led软灯条用半固化白色阻焊膜

Country Status (1)

Country Link
CN (1) CN202565566U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015161652A1 (zh) * 2014-04-25 2015-10-29 陈弘昌 自粘基板的贴装方法
CN105592623A (zh) * 2014-11-13 2016-05-18 昆山雅森电子材料科技有限公司 白色覆盖膜

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015161652A1 (zh) * 2014-04-25 2015-10-29 陈弘昌 自粘基板的贴装方法
CN105592623A (zh) * 2014-11-13 2016-05-18 昆山雅森电子材料科技有限公司 白色覆盖膜

Similar Documents

Publication Publication Date Title
CN206442590U (zh) 软硬结合板的改良结构
CN202565566U (zh) Led软灯条用半固化白色阻焊膜
CN202958045U (zh) 一种高可靠性软硬结合板
CN203618239U (zh) 刚挠结合线路板的压合结构
CN207166846U (zh) 高可靠性高良率软硬结合pcb板
CN206164964U (zh) 一种fpc板
CN204217196U (zh) 线路板的纸基覆盖膜及纸基覆盖膜线路板
CN203884069U (zh) 一种多功能柔性印刷线路板
CN203618215U (zh) 防阶梯式印制板翘曲的排板结构
CN202310299U (zh) 一种软硬结合板
CN202222083U (zh) 一种手机及其软硬相结合的电路板
CN204367507U (zh) 一种柔性纸基覆铜板
CN209517623U (zh) 一种耐压pcb线路板
CN202282911U (zh) 一种可弯曲防断裂的软硬结合板
CN203104949U (zh) 一种双面pcb板
CN206525024U (zh) 一种埋容埋阻的可挠性覆铜基板
CN206433257U (zh) 一种复合式电路板
CN205793620U (zh) 多层柔性线路板
CN202053608U (zh) 一种新型结构的覆铜板
CN201797649U (zh) 改善内层厚铜与高填胶结构的高填胶板
CN206005035U (zh) 具有保护膜保护软板的软硬结合印刷线路板
CN205793611U (zh) 一种可弯折的铝基板
CN206136439U (zh) 一种柔性电路板
CN208801685U (zh) 一种具有高强度耐腐蚀的覆铜板
CN204887699U (zh) 一种局部嵌入高频模块的线路板

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: WUXI QUNYUE ELECTRONICS TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: DONGGUAN QUNYUE ELE-MATERIALS + TECHNOLOGY CO.,LTD.

Effective date: 20130903

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 523000 DONGGUAN, GUANGDONG PROVINCE TO: 241103 WUHU, ANHUI PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20130903

Address after: Anhui Wuhu Economic Development Zone Wuhu County Zhi Zhen Wan 241103 Anhui Province

Patentee after: Wuxi Qunyue Electronics Technology Co., Ltd.

Address before: Changping Village town of Kau 523000 Guangdong city of Dongguan province by large Bay Industrial Zone lirenmeng Dong F Industrial Park, Dongguan city group Yue electronic Mstar Technology Ltd

Patentee before: Dongguan Qunyue Ele-materials & Technology Co.,Ltd.

ASS Succession or assignment of patent right

Owner name: DONGGUAN QUNYUE ELE-MATERIALS + TECHNOLOGY CO.,LTD

Free format text: FORMER OWNER: WUXI QUNYUE ELECTRONICS TECHNOLOGY CO., LTD.

Effective date: 20141216

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 241103 WUHU, ANHUI PROVINCE TO: 523000 DONGGUAN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20141216

Address after: Changping Village town of Kau 523000 Guangdong province Dongguan city by the Bay Industrial Park lirenmeng Industrial Park C building the first floor

Patentee after: Dongguan Qunyue Ele-materials & Technology Co.,Ltd.

Address before: Anhui Wuhu Economic Development Zone Wuhu County Zhi Zhen Wan 241103 Anhui Province

Patentee before: Wuxi Qunyue Electronics Technology Co., Ltd.

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160815

Address after: 628000 Sichuan province Guangyuan City Office, District No. 266 dam

Patentee after: Sichuan Nikko electronic Polytron Technologies Inc

Address before: Changping Village town of Kau 523000 Guangdong province Dongguan city by the Bay Industrial Park lirenmeng Industrial Park C building the first floor

Patentee before: Dongguan Qunyue Ele-materials & Technology Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121128

Termination date: 20190905

CF01 Termination of patent right due to non-payment of annual fee