JP2022157695A5 - - Google Patents

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Publication number
JP2022157695A5
JP2022157695A5 JP2021062057A JP2021062057A JP2022157695A5 JP 2022157695 A5 JP2022157695 A5 JP 2022157695A5 JP 2021062057 A JP2021062057 A JP 2021062057A JP 2021062057 A JP2021062057 A JP 2021062057A JP 2022157695 A5 JP2022157695 A5 JP 2022157695A5
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JP
Japan
Prior art keywords
filler
resin layer
curable
polyphenylene ether
composition
Prior art date
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Application number
JP2021062057A
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English (en)
Japanese (ja)
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JP7705269B2 (ja
JP2022157695A (ja
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Publication date
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Priority claimed from JP2021062057A external-priority patent/JP7705269B2/ja
Priority to JP2021062057A priority Critical patent/JP7705269B2/ja
Priority to KR1020237028278A priority patent/KR20230164007A/ko
Priority to TW111112568A priority patent/TWI862911B/zh
Priority to CN202280014146.4A priority patent/CN116867646B/zh
Priority to US18/552,743 priority patent/US12447725B2/en
Priority to PCT/JP2022/016760 priority patent/WO2022211071A1/ja
Publication of JP2022157695A publication Critical patent/JP2022157695A/ja
Publication of JP2022157695A5 publication Critical patent/JP2022157695A5/ja
Publication of JP7705269B2 publication Critical patent/JP7705269B2/ja
Application granted granted Critical
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JP2021062057A 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品 Active JP7705269B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021062057A JP7705269B2 (ja) 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品
US18/552,743 US12447725B2 (en) 2021-03-31 2022-03-31 Curable resin multilayer body, dry film, cured product and electronic component
TW111112568A TWI862911B (zh) 2021-03-31 2022-03-31 硬化性樹脂積層體、乾薄膜、硬化物及電子零件
CN202280014146.4A CN116867646B (zh) 2021-03-31 2022-03-31 固化性树脂层叠体、干膜、固化物和电子部件
KR1020237028278A KR20230164007A (ko) 2021-03-31 2022-03-31 경화성 수지 적층체, 드라이 필름, 경화물 및 전자부품
PCT/JP2022/016760 WO2022211071A1 (ja) 2021-03-31 2022-03-31 硬化性樹脂積層体、ドライフィルム、硬化物及び電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021062057A JP7705269B2 (ja) 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品

Publications (3)

Publication Number Publication Date
JP2022157695A JP2022157695A (ja) 2022-10-14
JP2022157695A5 true JP2022157695A5 (https=) 2024-03-08
JP7705269B2 JP7705269B2 (ja) 2025-07-09

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ID=83559575

Family Applications (1)

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JP2021062057A Active JP7705269B2 (ja) 2021-03-31 2021-03-31 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品

Country Status (1)

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JP (1) JP7705269B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024160719A (ja) * 2023-05-02 2024-11-15 信越化学工業株式会社 スチレン系エラストマー組成物、未硬化樹脂フィルム、硬化樹脂フィルム、接着フィルム、封止材及び基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11227077A (ja) * 1998-02-13 1999-08-24 Mitsubishi Eng Plast Corp 多層中空体
JP2003017861A (ja) * 2001-06-28 2003-01-17 Kyocera Corp 多層配線基板及びその製造方法
JP4276137B2 (ja) * 2003-08-08 2009-06-10 積水化成品工業株式会社 自動車内装材用発泡シート
JP7418985B2 (ja) * 2018-09-28 2024-01-22 太陽ホールディングス株式会社 硬化性組成物、ドライフィルム、硬化物および電子部品
JP7497143B2 (ja) * 2019-05-31 2024-06-10 太陽ホールディングス株式会社 ポリフェニレンエーテル、硬化性組成物、ドライフィルム、プリプレグ、硬化物および電子部品

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