TWI865770B - 基板之洗淨方法 - Google Patents

基板之洗淨方法 Download PDF

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Publication number
TWI865770B
TWI865770B TW110113568A TW110113568A TWI865770B TW I865770 B TWI865770 B TW I865770B TW 110113568 A TW110113568 A TW 110113568A TW 110113568 A TW110113568 A TW 110113568A TW I865770 B TWI865770 B TW I865770B
Authority
TW
Taiwan
Prior art keywords
component
mass
cleaning agent
agent composition
resin mask
Prior art date
Application number
TW110113568A
Other languages
English (en)
Chinese (zh)
Other versions
TW202215172A (zh
Inventor
山田晃平
Original Assignee
日商花王股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商花王股份有限公司 filed Critical 日商花王股份有限公司
Publication of TW202215172A publication Critical patent/TW202215172A/zh
Application granted granted Critical
Publication of TWI865770B publication Critical patent/TWI865770B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Detergent Compositions (AREA)
TW110113568A 2020-04-15 2021-04-15 基板之洗淨方法 TWI865770B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-072961 2020-04-15
JP2020072961 2020-04-15

Publications (2)

Publication Number Publication Date
TW202215172A TW202215172A (zh) 2022-04-16
TWI865770B true TWI865770B (zh) 2024-12-11

Family

ID=78084566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110113568A TWI865770B (zh) 2020-04-15 2021-04-15 基板之洗淨方法

Country Status (4)

Country Link
JP (1) JP7731346B2 (https=)
CN (1) CN115280244B (https=)
TW (1) TWI865770B (https=)
WO (1) WO2021210599A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115261879A (zh) * 2022-07-05 2022-11-01 南通群安电子材料有限公司 适用于msap制程的有机去膜液
CN119955345A (zh) * 2024-12-19 2025-05-09 广东润和新材料科技有限公司 一种飞机临时保护涂料清洗剂及其制备方法和应用

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192735A (ja) * 1975-02-12 1976-08-14 Kinzokusenjoyososeibutsu
JPH05112885A (ja) * 1991-08-19 1993-05-07 Nachi Fujikoshi Corp 高速度工具鋼のチタンコーテイング被膜の除去剤
JPH08283791A (ja) * 1993-10-22 1996-10-29 Kazuyuki Urushibara インク及び油汚れ除去剤
JP2003076037A (ja) * 2001-08-31 2003-03-14 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2013177384A (ja) * 2012-02-09 2013-09-09 Kracie Seiyaku Kk 角質剥離組成物
TW201348201A (zh) * 2012-03-22 2013-12-01 Adeka Corp 新穎化合物及感光性樹脂組合物
TW201546046A (zh) * 2014-04-04 2015-12-16 Adeka Corp 肟酯化合物及含該化合物之光聚合起始劑
TW201608342A (zh) * 2014-07-16 2016-03-01 Adeka Corp 感光性組合物
TW201719284A (zh) * 2015-09-30 2017-06-01 Asahi Chemical Ind 柔版印刷用感光性樹脂組合物及柔版印刷原版
TW201930290A (zh) * 2017-12-13 2019-08-01 日商艾迪科股份有限公司 化合物、潛在性鹼產生劑、含有該化合物之感光性樹脂組合物、及硬化物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914629B1 (https=) * 1970-12-08 1974-04-09
JPS60218488A (ja) * 1984-04-12 1985-11-01 Rinrei:Kk 鉄錆除去剤
JP3041763B2 (ja) * 1995-11-14 2000-05-15 修 弓田 ホイール用錆取り剤の製造方法及びこの製造方法により得られるホイール用錆取り剤
JP2003027092A (ja) * 2001-07-16 2003-01-29 Techno Trading:Kk 除錆洗浄剤組成物
JP2007114519A (ja) * 2005-10-20 2007-05-10 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
CN110225667B (zh) * 2013-09-11 2023-01-10 花王株式会社 树脂掩模层用洗涤剂组合物及电路基板的制造方法
JP6824719B2 (ja) * 2015-12-28 2021-02-03 花王株式会社 ネガ型樹脂マスク剥離用洗浄剤組成物
KR102160022B1 (ko) * 2016-08-31 2020-09-25 후지필름 가부시키가이샤 처리액, 기판의 세정 방법, 반도체 디바이스의 제조 방법
JP6924690B2 (ja) * 2017-12-21 2021-08-25 花王株式会社 樹脂マスク剥離洗浄方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192735A (ja) * 1975-02-12 1976-08-14 Kinzokusenjoyososeibutsu
JPH05112885A (ja) * 1991-08-19 1993-05-07 Nachi Fujikoshi Corp 高速度工具鋼のチタンコーテイング被膜の除去剤
JPH08283791A (ja) * 1993-10-22 1996-10-29 Kazuyuki Urushibara インク及び油汚れ除去剤
JP2003076037A (ja) * 2001-08-31 2003-03-14 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2013177384A (ja) * 2012-02-09 2013-09-09 Kracie Seiyaku Kk 角質剥離組成物
TW201348201A (zh) * 2012-03-22 2013-12-01 Adeka Corp 新穎化合物及感光性樹脂組合物
TW201546046A (zh) * 2014-04-04 2015-12-16 Adeka Corp 肟酯化合物及含該化合物之光聚合起始劑
TW201608342A (zh) * 2014-07-16 2016-03-01 Adeka Corp 感光性組合物
TW201719284A (zh) * 2015-09-30 2017-06-01 Asahi Chemical Ind 柔版印刷用感光性樹脂組合物及柔版印刷原版
TW201930290A (zh) * 2017-12-13 2019-08-01 日商艾迪科股份有限公司 化合物、潛在性鹼產生劑、含有該化合物之感光性樹脂組合物、及硬化物

Also Published As

Publication number Publication date
WO2021210599A1 (ja) 2021-10-21
CN115280244B (zh) 2026-02-13
JP7731346B2 (ja) 2025-08-29
JPWO2021210599A1 (https=) 2021-10-21
CN115280244A (zh) 2022-11-01
TW202215172A (zh) 2022-04-16

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