JP7731346B2 - 基板の洗浄方法 - Google Patents

基板の洗浄方法

Info

Publication number
JP7731346B2
JP7731346B2 JP2022515407A JP2022515407A JP7731346B2 JP 7731346 B2 JP7731346 B2 JP 7731346B2 JP 2022515407 A JP2022515407 A JP 2022515407A JP 2022515407 A JP2022515407 A JP 2022515407A JP 7731346 B2 JP7731346 B2 JP 7731346B2
Authority
JP
Japan
Prior art keywords
component
mass
cleaning
present disclosure
cleaning composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022515407A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021210599A1 (https=
JPWO2021210599A5 (https=
Inventor
晃平 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of JPWO2021210599A1 publication Critical patent/JPWO2021210599A1/ja
Publication of JPWO2021210599A5 publication Critical patent/JPWO2021210599A5/ja
Application granted granted Critical
Publication of JP7731346B2 publication Critical patent/JP7731346B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Detergent Compositions (AREA)
JP2022515407A 2020-04-15 2021-04-14 基板の洗浄方法 Active JP7731346B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020072961 2020-04-15
JP2020072961 2020-04-15
PCT/JP2021/015404 WO2021210599A1 (ja) 2020-04-15 2021-04-14 基板の洗浄方法

Publications (3)

Publication Number Publication Date
JPWO2021210599A1 JPWO2021210599A1 (https=) 2021-10-21
JPWO2021210599A5 JPWO2021210599A5 (https=) 2023-01-05
JP7731346B2 true JP7731346B2 (ja) 2025-08-29

Family

ID=78084566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515407A Active JP7731346B2 (ja) 2020-04-15 2021-04-14 基板の洗浄方法

Country Status (4)

Country Link
JP (1) JP7731346B2 (https=)
CN (1) CN115280244B (https=)
TW (1) TWI865770B (https=)
WO (1) WO2021210599A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115261879A (zh) * 2022-07-05 2022-11-01 南通群安电子材料有限公司 适用于msap制程的有机去膜液
CN119955345A (zh) * 2024-12-19 2025-05-09 广东润和新材料科技有限公司 一种飞机临时保护涂料清洗剂及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027092A (ja) 2001-07-16 2003-01-29 Techno Trading:Kk 除錆洗浄剤組成物
JP2003076037A (ja) 2001-08-31 2003-03-14 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2007114519A (ja) 2005-10-20 2007-05-10 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2013177384A (ja) 2012-02-09 2013-09-09 Kracie Seiyaku Kk 角質剥離組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914629B1 (https=) * 1970-12-08 1974-04-09
JPS5192735A (ja) * 1975-02-12 1976-08-14 Kinzokusenjoyososeibutsu
JPS60218488A (ja) * 1984-04-12 1985-11-01 Rinrei:Kk 鉄錆除去剤
JP2597931B2 (ja) * 1991-08-19 1997-04-09 株式会社不二越 高速度工具鋼のチタンコーティング被膜の除去剤
JPH08283791A (ja) * 1993-10-22 1996-10-29 Kazuyuki Urushibara インク及び油汚れ除去剤
JP3041763B2 (ja) * 1995-11-14 2000-05-15 修 弓田 ホイール用錆取り剤の製造方法及びこの製造方法により得られるホイール用錆取り剤
WO2013141014A1 (ja) * 2012-03-22 2013-09-26 株式会社Adeka 新規化合物及び感光性樹脂組成物
CN110225667B (zh) * 2013-09-11 2023-01-10 花王株式会社 树脂掩模层用洗涤剂组合物及电路基板的制造方法
US10189847B2 (en) * 2014-04-04 2019-01-29 Adeka Corporation Oxime ester compound and photopolymerization initiator containing said compound
EP3170844A4 (en) * 2014-07-16 2018-01-10 Adeka Corporation Photosensitive composition
WO2017057086A1 (ja) * 2015-09-30 2017-04-06 旭化成株式会社 フレキソ印刷用感光性樹脂組成物及びフレキソ印刷原版
JP6824719B2 (ja) * 2015-12-28 2021-02-03 花王株式会社 ネガ型樹脂マスク剥離用洗浄剤組成物
KR102160022B1 (ko) * 2016-08-31 2020-09-25 후지필름 가부시키가이샤 처리액, 기판의 세정 방법, 반도체 디바이스의 제조 방법
CN111417623B (zh) * 2017-12-13 2025-01-07 株式会社艾迪科 化合物、潜伏性碱产生剂、含该化合物的感光性树脂组合物及固化物
JP6924690B2 (ja) * 2017-12-21 2021-08-25 花王株式会社 樹脂マスク剥離洗浄方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027092A (ja) 2001-07-16 2003-01-29 Techno Trading:Kk 除錆洗浄剤組成物
JP2003076037A (ja) 2001-08-31 2003-03-14 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2007114519A (ja) 2005-10-20 2007-05-10 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2013177384A (ja) 2012-02-09 2013-09-09 Kracie Seiyaku Kk 角質剥離組成物

Also Published As

Publication number Publication date
WO2021210599A1 (ja) 2021-10-21
CN115280244B (zh) 2026-02-13
TWI865770B (zh) 2024-12-11
JPWO2021210599A1 (https=) 2021-10-21
CN115280244A (zh) 2022-11-01
TW202215172A (zh) 2022-04-16

Similar Documents

Publication Publication Date Title
JP2025067925A (ja) 樹脂マスク剥離用洗浄剤組成物
JP7731346B2 (ja) 基板の洗浄方法
JP7739305B2 (ja) 基板の洗浄方法
JP7420664B2 (ja) 樹脂マスク剥離用洗浄剤組成物
WO2023145826A1 (ja) 樹脂マスクの剥離方法
TWI810335B (zh) 樹脂遮罩剝離用洗淨劑組合物
JP7765673B1 (ja) 樹脂マスク剥離剤組成物
JP7817815B2 (ja) 樹脂マスク剥離用洗浄剤組成物
JP7784507B1 (ja) 基板の処理方法
JP7795674B1 (ja) 基板の処理方法
JP7773670B1 (ja) 基板の処理方法
JP2025114005A (ja) レジスト剥離及びシードエッチング用の処理液及び処理方法
JP2025081065A (ja) 基板の洗浄方法
JP2023172703A (ja) 洗浄方法
JP2024085216A (ja) 洗浄方法
JP2025007286A (ja) 洗浄方法
JP2026059452A (ja) 基板の洗浄方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220708

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240311

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250603

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250729

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250814

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250819

R150 Certificate of patent or registration of utility model

Ref document number: 7731346

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150