JPWO2021210599A1 - - Google Patents

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Publication number
JPWO2021210599A1
JPWO2021210599A1 JP2022515407A JP2022515407A JPWO2021210599A1 JP WO2021210599 A1 JPWO2021210599 A1 JP WO2021210599A1 JP 2022515407 A JP2022515407 A JP 2022515407A JP 2022515407 A JP2022515407 A JP 2022515407A JP WO2021210599 A1 JPWO2021210599 A1 JP WO2021210599A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022515407A
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Japanese (ja)
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JP7731346B2 (ja
JPWO2021210599A5 (https=
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Detergent Compositions (AREA)
JP2022515407A 2020-04-15 2021-04-14 基板の洗浄方法 Active JP7731346B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020072961 2020-04-15
JP2020072961 2020-04-15
PCT/JP2021/015404 WO2021210599A1 (ja) 2020-04-15 2021-04-14 基板の洗浄方法

Publications (3)

Publication Number Publication Date
JPWO2021210599A1 true JPWO2021210599A1 (https=) 2021-10-21
JPWO2021210599A5 JPWO2021210599A5 (https=) 2023-01-05
JP7731346B2 JP7731346B2 (ja) 2025-08-29

Family

ID=78084566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515407A Active JP7731346B2 (ja) 2020-04-15 2021-04-14 基板の洗浄方法

Country Status (4)

Country Link
JP (1) JP7731346B2 (https=)
CN (1) CN115280244B (https=)
TW (1) TWI865770B (https=)
WO (1) WO2021210599A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115261879A (zh) * 2022-07-05 2022-11-01 南通群安电子材料有限公司 适用于msap制程的有机去膜液
CN119955345A (zh) * 2024-12-19 2025-05-09 广东润和新材料科技有限公司 一种飞机临时保护涂料清洗剂及其制备方法和应用

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914629B1 (https=) * 1970-12-08 1974-04-09
JPS5192735A (ja) * 1975-02-12 1976-08-14 Kinzokusenjoyososeibutsu
JPS60218488A (ja) * 1984-04-12 1985-11-01 Rinrei:Kk 鉄錆除去剤
JPH05112885A (ja) * 1991-08-19 1993-05-07 Nachi Fujikoshi Corp 高速度工具鋼のチタンコーテイング被膜の除去剤
JPH08283791A (ja) * 1993-10-22 1996-10-29 Kazuyuki Urushibara インク及び油汚れ除去剤
JPH09143776A (ja) * 1995-11-14 1997-06-03 Osamu Yumita ホイール用錆取り剤及びホイール用錆取り剤の 製造方法
JP2003027092A (ja) * 2001-07-16 2003-01-29 Techno Trading:Kk 除錆洗浄剤組成物
JP2003076037A (ja) * 2001-08-31 2003-03-14 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2007114519A (ja) * 2005-10-20 2007-05-10 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2013177384A (ja) * 2012-02-09 2013-09-09 Kracie Seiyaku Kk 角質剥離組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013141014A1 (ja) * 2012-03-22 2013-09-26 株式会社Adeka 新規化合物及び感光性樹脂組成物
CN110225667B (zh) * 2013-09-11 2023-01-10 花王株式会社 树脂掩模层用洗涤剂组合物及电路基板的制造方法
US10189847B2 (en) * 2014-04-04 2019-01-29 Adeka Corporation Oxime ester compound and photopolymerization initiator containing said compound
EP3170844A4 (en) * 2014-07-16 2018-01-10 Adeka Corporation Photosensitive composition
WO2017057086A1 (ja) * 2015-09-30 2017-04-06 旭化成株式会社 フレキソ印刷用感光性樹脂組成物及びフレキソ印刷原版
JP6824719B2 (ja) * 2015-12-28 2021-02-03 花王株式会社 ネガ型樹脂マスク剥離用洗浄剤組成物
KR102160022B1 (ko) * 2016-08-31 2020-09-25 후지필름 가부시키가이샤 처리액, 기판의 세정 방법, 반도체 디바이스의 제조 방법
CN111417623B (zh) * 2017-12-13 2025-01-07 株式会社艾迪科 化合物、潜伏性碱产生剂、含该化合物的感光性树脂组合物及固化物
JP6924690B2 (ja) * 2017-12-21 2021-08-25 花王株式会社 樹脂マスク剥離洗浄方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914629B1 (https=) * 1970-12-08 1974-04-09
JPS5192735A (ja) * 1975-02-12 1976-08-14 Kinzokusenjoyososeibutsu
JPS60218488A (ja) * 1984-04-12 1985-11-01 Rinrei:Kk 鉄錆除去剤
JPH05112885A (ja) * 1991-08-19 1993-05-07 Nachi Fujikoshi Corp 高速度工具鋼のチタンコーテイング被膜の除去剤
JPH08283791A (ja) * 1993-10-22 1996-10-29 Kazuyuki Urushibara インク及び油汚れ除去剤
JPH09143776A (ja) * 1995-11-14 1997-06-03 Osamu Yumita ホイール用錆取り剤及びホイール用錆取り剤の 製造方法
JP2003027092A (ja) * 2001-07-16 2003-01-29 Techno Trading:Kk 除錆洗浄剤組成物
JP2003076037A (ja) * 2001-08-31 2003-03-14 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2007114519A (ja) * 2005-10-20 2007-05-10 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2013177384A (ja) * 2012-02-09 2013-09-09 Kracie Seiyaku Kk 角質剥離組成物

Also Published As

Publication number Publication date
WO2021210599A1 (ja) 2021-10-21
CN115280244B (zh) 2026-02-13
TWI865770B (zh) 2024-12-11
JP7731346B2 (ja) 2025-08-29
CN115280244A (zh) 2022-11-01
TW202215172A (zh) 2022-04-16

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