TWI864645B - 流量控制裝置的排氣構造、排氣方法以及具備該排氣構造的氣體供給系統、及氣體供給方法 - Google Patents
流量控制裝置的排氣構造、排氣方法以及具備該排氣構造的氣體供給系統、及氣體供給方法 Download PDFInfo
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- TWI864645B TWI864645B TW112110637A TW112110637A TWI864645B TW I864645 B TWI864645 B TW I864645B TW 112110637 A TW112110637 A TW 112110637A TW 112110637 A TW112110637 A TW 112110637A TW I864645 B TWI864645 B TW I864645B
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- aforementioned
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
- G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Flow Control (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022045363 | 2022-03-22 | ||
| JP2022-045363 | 2022-03-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202409772A TW202409772A (zh) | 2024-03-01 |
| TWI864645B true TWI864645B (zh) | 2024-12-01 |
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ID=88101498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112110637A TWI864645B (zh) | 2022-03-22 | 2023-03-22 | 流量控制裝置的排氣構造、排氣方法以及具備該排氣構造的氣體供給系統、及氣體供給方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250251745A1 (https=) |
| JP (1) | JP7823843B2 (https=) |
| KR (1) | KR20240137654A (https=) |
| CN (1) | CN118786400A (https=) |
| TW (1) | TWI864645B (https=) |
| WO (1) | WO2023182105A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015064035A1 (ja) * | 2013-10-31 | 2015-05-07 | 株式会社フジキン | 圧力式流量制御装置 |
| CN110444460A (zh) * | 2014-08-20 | 2019-11-12 | 东京毅力科创株式会社 | 等离子体处理装置的应用方法 |
| US20210043425A1 (en) * | 2018-07-02 | 2021-02-11 | Tokyo Electron Limited | Gas supply system, plasma processing device, and control method for gas supply system |
| TWI719992B (zh) * | 2015-06-19 | 2021-03-01 | 日商東京威力科創股份有限公司 | 氣體供給系統、氣體供給控制方法及氣體置換方法 |
| TW202125626A (zh) * | 2019-11-21 | 2021-07-01 | 日商東京威力科創股份有限公司 | 氣體供給系統、電漿處理裝置及氣體供給系統之控制方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4648098B2 (ja) * | 2005-06-06 | 2011-03-09 | シーケーディ株式会社 | 流量制御機器絶対流量検定システム |
| JP6012247B2 (ja) * | 2012-04-27 | 2016-10-25 | 株式会社フジキン | 流体制御装置 |
| JP6321972B2 (ja) * | 2014-01-21 | 2018-05-09 | 株式会社フジキン | 圧力式流量制御装置及びその流量制御開始時のオーバーシュート防止方法 |
| JP6047540B2 (ja) * | 2014-11-05 | 2016-12-21 | Ckd株式会社 | 流量検定ユニット |
-
2023
- 2023-03-15 CN CN202380024208.4A patent/CN118786400A/zh active Pending
- 2023-03-15 KR KR1020247028019A patent/KR20240137654A/ko active Pending
- 2023-03-15 JP JP2024510068A patent/JP7823843B2/ja active Active
- 2023-03-15 US US18/846,977 patent/US20250251745A1/en active Pending
- 2023-03-15 WO PCT/JP2023/010113 patent/WO2023182105A1/ja not_active Ceased
- 2023-03-22 TW TW112110637A patent/TWI864645B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015064035A1 (ja) * | 2013-10-31 | 2015-05-07 | 株式会社フジキン | 圧力式流量制御装置 |
| CN110444460A (zh) * | 2014-08-20 | 2019-11-12 | 东京毅力科创株式会社 | 等离子体处理装置的应用方法 |
| TWI719992B (zh) * | 2015-06-19 | 2021-03-01 | 日商東京威力科創股份有限公司 | 氣體供給系統、氣體供給控制方法及氣體置換方法 |
| US20210043425A1 (en) * | 2018-07-02 | 2021-02-11 | Tokyo Electron Limited | Gas supply system, plasma processing device, and control method for gas supply system |
| TW202125626A (zh) * | 2019-11-21 | 2021-07-01 | 日商東京威力科創股份有限公司 | 氣體供給系統、電漿處理裝置及氣體供給系統之控制方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023182105A1 (ja) | 2023-09-28 |
| US20250251745A1 (en) | 2025-08-07 |
| TW202409772A (zh) | 2024-03-01 |
| JP7823843B2 (ja) | 2026-03-04 |
| JPWO2023182105A1 (https=) | 2023-09-28 |
| CN118786400A (zh) | 2024-10-15 |
| KR20240137654A (ko) | 2024-09-20 |
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