TWI864292B - 使用機器學習之半導體疊加測量 - Google Patents

使用機器學習之半導體疊加測量 Download PDF

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Publication number
TWI864292B
TWI864292B TW110120546A TW110120546A TWI864292B TW I864292 B TWI864292 B TW I864292B TW 110120546 A TW110120546 A TW 110120546A TW 110120546 A TW110120546 A TW 110120546A TW I864292 B TWI864292 B TW I864292B
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Taiwan
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region
structures
area
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edge
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TW110120546A
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TW202205160A (zh
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阿比特 耶提
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美商科磊股份有限公司
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2413—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on distances to training or reference patterns
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/12—Edge-based segmentation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Quality & Reliability (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Evolutionary Computation (AREA)
  • Evolutionary Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Image Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
TW110120546A 2020-06-24 2021-06-07 使用機器學習之半導體疊加測量 TWI864292B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
IN202041026631 2020-06-24
IN202041026631 2020-06-24
US202063063973P 2020-08-11 2020-08-11
US63/063,973 2020-08-11
US17/135,998 2020-12-29
US17/135,998 US11967058B2 (en) 2020-06-24 2020-12-29 Semiconductor overlay measurements using machine learning

Publications (2)

Publication Number Publication Date
TW202205160A TW202205160A (zh) 2022-02-01
TWI864292B true TWI864292B (zh) 2024-12-01

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TW110120546A TWI864292B (zh) 2020-06-24 2021-06-07 使用機器學習之半導體疊加測量

Country Status (8)

Country Link
US (1) US11967058B2 (https=)
EP (1) EP4150662A4 (https=)
JP (1) JP7490094B2 (https=)
KR (1) KR102797875B1 (https=)
CN (1) CN115699282A (https=)
IL (1) IL298625B2 (https=)
TW (1) TWI864292B (https=)
WO (1) WO2021262778A1 (https=)

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US12014961B2 (en) * 2021-04-19 2024-06-18 Nanya Technology Corporation Method of semiconductor overlay measuring and method of semiconductor structure manufacturing
US12535744B2 (en) * 2022-10-31 2026-01-27 Kla Corporation Overlay estimation based on optical inspection and machine learning

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US20160148850A1 (en) * 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US9851714B2 (en) * 2015-06-01 2017-12-26 Applied Materials Israel, Ltd. Method of inspecting a specimen and system thereof
US9978558B2 (en) * 2012-03-07 2018-05-22 Hitachi High-Technologies Corporation Scanning-electron-microscope image processing device and scanning method
TW201915599A (zh) * 2017-09-29 2019-04-16 台灣積體電路製造股份有限公司 疊對誤差測量結構以及疊對誤差測量方法
TW201921574A (zh) * 2017-08-31 2019-06-01 台灣積體電路製造股份有限公司 半導體裝置、製造方法及測量方法
TW201931024A (zh) * 2017-11-06 2019-08-01 美商克萊譚克公司 單一胞元散射疊對目標

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KR100834832B1 (ko) 2006-11-29 2008-06-03 삼성전자주식회사 오버레이 계측설비를 이용한 패턴의 임계치수 측정방법
US8148682B2 (en) * 2009-12-29 2012-04-03 Hitachi, Ltd. Method and apparatus for pattern position and overlay measurement
JP5081276B2 (ja) 2010-06-02 2012-11-28 株式会社日立ハイテクノロジーズ パターン計測装置、パターン計測方法、およびプログラム
US9530199B1 (en) * 2015-07-13 2016-12-27 Applied Materials Israel Ltd Technique for measuring overlay between layers of a multilayer structure
KR102278879B1 (ko) * 2016-01-27 2021-07-19 주식회사 히타치하이테크 계측 장치, 방법 및 표시 장치
US10615084B2 (en) 2016-03-01 2020-04-07 Asml Netherlands B.V. Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values
US11580398B2 (en) 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
US10817999B2 (en) 2017-07-18 2020-10-27 Kla Corporation Image-based overlay metrology and monitoring using through-focus imaging
CN116758012A (zh) 2018-06-08 2023-09-15 Asml荷兰有限公司 确定与在衬底上的结构相关的感兴趣的特性的方法、掩模版、衬底
US11094053B2 (en) 2018-10-08 2021-08-17 Kla Corporation Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
JP7209835B2 (ja) * 2018-11-30 2023-01-20 エーエスエムエル ネザーランズ ビー．ブイ． 機械学習モデル予測における不確実性を減少させる方法
JP7341241B2 (ja) * 2019-08-30 2023-09-08 株式会社日立ハイテク 計測システム、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する方法、およびコンピュータに、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する処理を実行させるためのプログラムを格納する記憶媒体
US12197138B2 (en) * 2021-02-25 2025-01-14 Taiwan Semiconductor Manufacturing Co., Ltd. Machine learning on overlay management

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9978558B2 (en) * 2012-03-07 2018-05-22 Hitachi High-Technologies Corporation Scanning-electron-microscope image processing device and scanning method
US20160148850A1 (en) * 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US9851714B2 (en) * 2015-06-01 2017-12-26 Applied Materials Israel, Ltd. Method of inspecting a specimen and system thereof
TW201921574A (zh) * 2017-08-31 2019-06-01 台灣積體電路製造股份有限公司 半導體裝置、製造方法及測量方法
TW201915599A (zh) * 2017-09-29 2019-04-16 台灣積體電路製造股份有限公司 疊對誤差測量結構以及疊對誤差測量方法
TW201931024A (zh) * 2017-11-06 2019-08-01 美商克萊譚克公司 單一胞元散射疊對目標

Also Published As

Publication number Publication date
JP7490094B2 (ja) 2024-05-24
WO2021262778A1 (en) 2021-12-30
JP2023531530A (ja) 2023-07-24
TW202205160A (zh) 2022-02-01
IL298625B1 (en) 2025-06-01
KR20230027074A (ko) 2023-02-27
IL298625B2 (en) 2025-10-01
IL298625A (en) 2023-01-01
CN115699282A (zh) 2023-02-03
US20210407073A1 (en) 2021-12-30
EP4150662A4 (en) 2024-06-12
US11967058B2 (en) 2024-04-23
KR102797875B1 (ko) 2025-04-17
EP4150662A1 (en) 2023-03-22

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