KR102797875B1 - 머신 러닝을 사용한 반도체 오버레이 측정 - Google Patents

머신 러닝을 사용한 반도체 오버레이 측정 Download PDF

Info

Publication number
KR102797875B1
KR102797875B1 KR1020227045264A KR20227045264A KR102797875B1 KR 102797875 B1 KR102797875 B1 KR 102797875B1 KR 1020227045264 A KR1020227045264 A KR 1020227045264A KR 20227045264 A KR20227045264 A KR 20227045264A KR 102797875 B1 KR102797875 B1 KR 102797875B1
Authority
KR
South Korea
Prior art keywords
region
structures
process layer
commands
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227045264A
Other languages
English (en)
Korean (ko)
Other versions
KR20230027074A (ko
Inventor
아르핏 야티
Original Assignee
케이엘에이 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케이엘에이 코포레이션 filed Critical 케이엘에이 코포레이션
Publication of KR20230027074A publication Critical patent/KR20230027074A/ko
Application granted granted Critical
Publication of KR102797875B1 publication Critical patent/KR102797875B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2413—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on distances to training or reference patterns
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/12—Edge-based segmentation
    • H01L22/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Quality & Reliability (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Evolutionary Computation (AREA)
  • Evolutionary Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Image Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
KR1020227045264A 2020-06-24 2021-06-23 머신 러닝을 사용한 반도체 오버레이 측정 Active KR102797875B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
IN202041026631 2020-06-24
IN202041026631 2020-06-24
US202063063973P 2020-08-11 2020-08-11
US63/063,973 2020-08-11
US17/135,998 2020-12-29
US17/135,998 US11967058B2 (en) 2020-06-24 2020-12-29 Semiconductor overlay measurements using machine learning
PCT/US2021/038563 WO2021262778A1 (en) 2020-06-24 2021-06-23 Semiconductor overlay measurements using machine learning

Publications (2)

Publication Number Publication Date
KR20230027074A KR20230027074A (ko) 2023-02-27
KR102797875B1 true KR102797875B1 (ko) 2025-04-17

Family

ID=79031289

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227045264A Active KR102797875B1 (ko) 2020-06-24 2021-06-23 머신 러닝을 사용한 반도체 오버레이 측정

Country Status (8)

Country Link
US (1) US11967058B2 (https=)
EP (1) EP4150662A4 (https=)
JP (1) JP7490094B2 (https=)
KR (1) KR102797875B1 (https=)
CN (1) CN115699282A (https=)
IL (1) IL298625B2 (https=)
TW (1) TWI864292B (https=)
WO (1) WO2021262778A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12014961B2 (en) * 2021-04-19 2024-06-18 Nanya Technology Corporation Method of semiconductor overlay measuring and method of semiconductor structure manufacturing
US12535744B2 (en) * 2022-10-31 2026-01-27 Kla Corporation Overlay estimation based on optical inspection and machine learning

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100834832B1 (ko) 2006-11-29 2008-06-03 삼성전자주식회사 오버레이 계측설비를 이용한 패턴의 임계치수 측정방법
US8148682B2 (en) * 2009-12-29 2012-04-03 Hitachi, Ltd. Method and apparatus for pattern position and overlay measurement
JP5081276B2 (ja) 2010-06-02 2012-11-28 株式会社日立ハイテクノロジーズ パターン計測装置、パターン計測方法、およびプログラム
JP6029293B2 (ja) * 2012-03-07 2016-11-24 株式会社日立ハイテクノロジーズ 走査型電子顕微鏡の画像処理装置、および、走査方法
KR102521159B1 (ko) * 2014-11-25 2023-04-13 피디에프 솔루션즈, 인코포레이티드 반도체 제조 공정을 위한 개선된 공정 제어 기술
US10545490B2 (en) * 2015-06-01 2020-01-28 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US9530199B1 (en) * 2015-07-13 2016-12-27 Applied Materials Israel Ltd Technique for measuring overlay between layers of a multilayer structure
KR102278879B1 (ko) * 2016-01-27 2021-07-19 주식회사 히타치하이테크 계측 장치, 방법 및 표시 장치
US10615084B2 (en) 2016-03-01 2020-04-07 Asml Netherlands B.V. Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values
US11580398B2 (en) 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
US10817999B2 (en) 2017-07-18 2020-10-27 Kla Corporation Image-based overlay metrology and monitoring using through-focus imaging
US10915017B2 (en) * 2017-08-31 2021-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-function overlay marks for reducing noise and extracting focus and critical dimension information
US10795268B2 (en) * 2017-09-29 2020-10-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for measuring overlay errors using overlay measurement patterns
US10837919B2 (en) * 2017-11-06 2020-11-17 Kla Corporation Single cell scatterometry overlay targets
CN116758012A (zh) 2018-06-08 2023-09-15 Asml荷兰有限公司 确定与在衬底上的结构相关的感兴趣的特性的方法、掩模版、衬底
US11094053B2 (en) 2018-10-08 2021-08-17 Kla Corporation Deep learning based adaptive regions of interest for critical dimension measurements of semiconductor substrates
JP7209835B2 (ja) * 2018-11-30 2023-01-20 エーエスエムエル ネザーランズ ビー．ブイ． 機械学習モデル予測における不確実性を減少させる方法
JP7341241B2 (ja) * 2019-08-30 2023-09-08 株式会社日立ハイテク 計測システム、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する方法、およびコンピュータに、所定の構造を含む半導体の画像計測を行う際に用いる学習モデルを生成する処理を実行させるためのプログラムを格納する記憶媒体
US12197138B2 (en) * 2021-02-25 2025-01-14 Taiwan Semiconductor Manufacturing Co., Ltd. Machine learning on overlay management

Also Published As

Publication number Publication date
JP7490094B2 (ja) 2024-05-24
WO2021262778A1 (en) 2021-12-30
JP2023531530A (ja) 2023-07-24
TW202205160A (zh) 2022-02-01
IL298625B1 (en) 2025-06-01
KR20230027074A (ko) 2023-02-27
IL298625B2 (en) 2025-10-01
IL298625A (en) 2023-01-01
CN115699282A (zh) 2023-02-03
US20210407073A1 (en) 2021-12-30
EP4150662A4 (en) 2024-06-12
US11967058B2 (en) 2024-04-23
EP4150662A1 (en) 2023-03-22
TWI864292B (zh) 2024-12-01

Similar Documents

Publication Publication Date Title
CN114078114B (zh) 用于生成用于晶片分析的校准数据的方法和系统
KR102797875B1 (ko) 머신 러닝을 사용한 반도체 오버레이 측정
CN113888510B (zh) 检测方法、检测装置、检测设备及计算机可读存储介质
US10074167B2 (en) Reducing registration and design vicinity induced noise for intra-die inspection
JP2016091053A (ja) 情報処理装置および容器形状の推定方法、ワークピッキングシステム、プログラム
JP2018136896A (ja) 情報処理装置、システム、情報処理方法、および物品の製造方法
US9978558B2 (en) Scanning-electron-microscope image processing device and scanning method
JP2010086925A (ja) パターンマッチング方法、及び画像処理装置
WO2011043293A1 (ja) パターンマッチング方法、パターンマッチングプログラム、電子計算機、電子デバイス検査装置
CN111539955A (zh) 一种缺陷检测方法
CN117689727A (zh) 晶圆定位方法、装置、设备和存储介质
WO2020217970A1 (ja) ワイヤ形状測定装置及びワイヤ三次元画像生成方法並びにワイヤ形状測定方法
WO2012029220A1 (ja) 半導体製造装置の管理装置、及びコンピュータプログラム
JP7062563B2 (ja) 輪郭抽出方法、輪郭抽出装置、及びプログラム
WO2012132273A1 (ja) 外観検査方法およびその装置
US9633429B2 (en) Pattern outline extraction device, pattern outline extraction method, and computer program product
KR101653861B1 (ko) 묘화 데이터 생성 방법, 묘화 방법, 묘화 데이터 생성 장치, 및 묘화 장치
JP2010287762A (ja) パターン検査方法、パターン検査プログラムおよびパターン検査装置
KR102227341B1 (ko) 위치 어긋남량 취득 장치, 검사 장치, 위치 어긋남량 취득 방법 및 검사 방법
CN111507061A (zh) 缺陷图形特征参数的分析方法
CN109084721B (zh) 用于确定半导体器件中的目标结构的形貌参数的方法和设备
KR20240154557A (ko) 프로파일 검출 방법 및 프로파일 검출 장치
US8442270B2 (en) Object detecting method and non-transitory computer-readable recording medium storing an object detection program
CN114322865A (zh) 半导体器件的测量方法、装置及存储介质
CN119379799B (zh) 一种半导体机台量测定位方法及半导体机台

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000