TWI862704B - 密封用樹脂組成物及半導體裝置 - Google Patents

密封用樹脂組成物及半導體裝置 Download PDF

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Publication number
TWI862704B
TWI862704B TW109134616A TW109134616A TWI862704B TW I862704 B TWI862704 B TW I862704B TW 109134616 A TW109134616 A TW 109134616A TW 109134616 A TW109134616 A TW 109134616A TW I862704 B TWI862704 B TW I862704B
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Taiwan
Prior art keywords
silica
resin composition
particle size
sealing resin
less
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TW109134616A
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English (en)
Chinese (zh)
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TW202129863A (zh
Inventor
木佐貫敦
伊藤明日美
小西孝憲
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日商松下知識產權經營股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW109134616A 2019-10-24 2020-10-06 密封用樹脂組成物及半導體裝置 TWI862704B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019193856 2019-10-24
JP2019-193856 2019-10-24

Publications (2)

Publication Number Publication Date
TW202129863A TW202129863A (zh) 2021-08-01
TWI862704B true TWI862704B (zh) 2024-11-21

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TW109134616A TWI862704B (zh) 2019-10-24 2020-10-06 密封用樹脂組成物及半導體裝置

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JP (1) JPWO2021079677A1 (https=)
CN (1) CN114585684A (https=)
TW (1) TWI862704B (https=)
WO (1) WO2021079677A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118525369A (zh) * 2022-02-28 2024-08-20 株式会社力森诺科 底部填充材料、半导体封装和半导体封装的制造方法
KR20240029962A (ko) * 2022-08-29 2024-03-07 주식회사 케이씨씨 에폭시 수지 조성물
JP2024064288A (ja) * 2022-10-27 2024-05-14 株式会社トクヤマ 樹脂組成物、半導体封止剤、及び予測装置
CN119799233A (zh) * 2025-01-02 2025-04-11 万华化学集团股份有限公司 一种环氧树脂组合物胶粘剂及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
TW201209069A (en) * 2010-08-18 2012-03-01 Benq Materials Corp Epoxy composite
TW201347054A (zh) * 2012-03-07 2013-11-16 東麗股份有限公司 半導體裝置之製造方法及半導體裝置之製造裝置
TW201510094A (zh) * 2013-06-14 2015-03-16 道康寧東麗股份有限公司 反應性聚矽氧組合物、反應性熱塑體、硬化物、及光半導體裝置
WO2018070237A1 (ja) * 2016-10-14 2018-04-19 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63230729A (ja) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd 半導体封止用樹脂組成物
JPH02167362A (ja) * 1988-08-04 1990-06-27 Polyplastics Co 電子部品封止用樹脂組成物及び電子部品
JP2671727B2 (ja) * 1992-09-17 1997-10-29 信越化学工業株式会社 表面処理シリカ並びにその製造方法及び半導体封止用樹脂組成物用充填剤
JP4802421B2 (ja) * 2001-08-31 2011-10-26 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP5758686B2 (ja) * 2011-04-21 2015-08-05 株式会社日本触媒 非晶質シリカ粒子
JP5937403B2 (ja) * 2012-04-02 2016-06-22 デンカ株式会社 スラリー組成物及びそれを用いた樹脂組成物
WO2019163861A1 (ja) * 2018-02-21 2019-08-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、積層シート、硬化物、半導体装置及び半導体装置の製造方法
JP7225546B2 (ja) * 2018-03-01 2023-02-21 味の素株式会社 封止用樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
TW201209069A (en) * 2010-08-18 2012-03-01 Benq Materials Corp Epoxy composite
TW201347054A (zh) * 2012-03-07 2013-11-16 東麗股份有限公司 半導體裝置之製造方法及半導體裝置之製造裝置
TW201510094A (zh) * 2013-06-14 2015-03-16 道康寧東麗股份有限公司 反應性聚矽氧組合物、反應性熱塑體、硬化物、及光半導體裝置
WO2018070237A1 (ja) * 2016-10-14 2018-04-19 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

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TW202129863A (zh) 2021-08-01
WO2021079677A1 (ja) 2021-04-29
JPWO2021079677A1 (https=) 2021-04-29
CN114585684A (zh) 2022-06-03

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