CN114585684A - 密封用树脂组合物及半导体装置 - Google Patents

密封用树脂组合物及半导体装置 Download PDF

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Publication number
CN114585684A
CN114585684A CN202080073411.7A CN202080073411A CN114585684A CN 114585684 A CN114585684 A CN 114585684A CN 202080073411 A CN202080073411 A CN 202080073411A CN 114585684 A CN114585684 A CN 114585684A
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China
Prior art keywords
silica
resin composition
sealing
less
sealing resin
Prior art date
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Withdrawn
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CN202080073411.7A
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English (en)
Chinese (zh)
Inventor
木佐贯敦
伊藤明日美
小西孝宪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Filing date
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Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN114585684A publication Critical patent/CN114585684A/zh
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202080073411.7A 2019-10-24 2020-09-24 密封用树脂组合物及半导体装置 Withdrawn CN114585684A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019193856 2019-10-24
JP2019-193856 2019-10-24
PCT/JP2020/035983 WO2021079677A1 (ja) 2019-10-24 2020-09-24 封止用樹脂組成物、及び半導体装置

Publications (1)

Publication Number Publication Date
CN114585684A true CN114585684A (zh) 2022-06-03

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Family Applications (1)

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CN202080073411.7A Withdrawn CN114585684A (zh) 2019-10-24 2020-09-24 密封用树脂组合物及半导体装置

Country Status (4)

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JP (1) JPWO2021079677A1 (https=)
CN (1) CN114585684A (https=)
TW (1) TWI862704B (https=)
WO (1) WO2021079677A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119799233A (zh) * 2025-01-02 2025-04-11 万华化学集团股份有限公司 一种环氧树脂组合物胶粘剂及其制备方法和应用

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118525369A (zh) * 2022-02-28 2024-08-20 株式会社力森诺科 底部填充材料、半导体封装和半导体封装的制造方法
KR20240029962A (ko) * 2022-08-29 2024-03-07 주식회사 케이씨씨 에폭시 수지 조성물
JP2024064288A (ja) * 2022-10-27 2024-05-14 株式会社トクヤマ 樹脂組成物、半導体封止剤、及び予測装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63230729A (ja) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd 半導体封止用樹脂組成物
JPH02167362A (ja) * 1988-08-04 1990-06-27 Polyplastics Co 電子部品封止用樹脂組成物及び電子部品
JPH06100313A (ja) * 1992-09-17 1994-04-12 Shin Etsu Chem Co Ltd 表面処理シリカ並びにその製造方法及び半導体封止用樹脂組成物用充填剤
JP2003073527A (ja) * 2001-08-31 2003-03-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
JP2012227449A (ja) * 2011-04-21 2012-11-15 Nippon Shokubai Co Ltd 非晶質シリカ粒子
JP2013212956A (ja) * 2012-04-02 2013-10-17 Denki Kagaku Kogyo Kk スラリー組成物及びそれを用いた樹脂組成物
CN109844020A (zh) * 2016-10-14 2019-06-04 日立化成株式会社 密封用树脂组合物、电子部件装置及电子部件装置的制造方法
WO2019163861A1 (ja) * 2018-02-21 2019-08-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、積層シート、硬化物、半導体装置及び半導体装置の製造方法
JP2019151716A (ja) * 2018-03-01 2019-09-12 味の素株式会社 封止用樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI432477B (zh) * 2010-08-18 2014-04-01 Benq Materials Corp 環氧樹脂組成物
US20150050778A1 (en) * 2012-03-07 2015-02-19 Toray Industries, Inc. Method and apparatus for producing semiconductor device
JP6302902B2 (ja) * 2013-06-14 2018-03-28 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63230729A (ja) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd 半導体封止用樹脂組成物
JPH02167362A (ja) * 1988-08-04 1990-06-27 Polyplastics Co 電子部品封止用樹脂組成物及び電子部品
JPH06100313A (ja) * 1992-09-17 1994-04-12 Shin Etsu Chem Co Ltd 表面処理シリカ並びにその製造方法及び半導体封止用樹脂組成物用充填剤
JP2003073527A (ja) * 2001-08-31 2003-03-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
JP2012227449A (ja) * 2011-04-21 2012-11-15 Nippon Shokubai Co Ltd 非晶質シリカ粒子
JP2013212956A (ja) * 2012-04-02 2013-10-17 Denki Kagaku Kogyo Kk スラリー組成物及びそれを用いた樹脂組成物
CN109844020A (zh) * 2016-10-14 2019-06-04 日立化成株式会社 密封用树脂组合物、电子部件装置及电子部件装置的制造方法
WO2019163861A1 (ja) * 2018-02-21 2019-08-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、積層シート、硬化物、半導体装置及び半導体装置の製造方法
JP2019151716A (ja) * 2018-03-01 2019-09-12 味の素株式会社 封止用樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119799233A (zh) * 2025-01-02 2025-04-11 万华化学集团股份有限公司 一种环氧树脂组合物胶粘剂及其制备方法和应用

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TW202129863A (zh) 2021-08-01
WO2021079677A1 (ja) 2021-04-29
JPWO2021079677A1 (https=) 2021-04-29
TWI862704B (zh) 2024-11-21

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Application publication date: 20220603