JPWO2021079677A1 - - Google Patents

Info

Publication number
JPWO2021079677A1
JPWO2021079677A1 JP2021554180A JP2021554180A JPWO2021079677A1 JP WO2021079677 A1 JPWO2021079677 A1 JP WO2021079677A1 JP 2021554180 A JP2021554180 A JP 2021554180A JP 2021554180 A JP2021554180 A JP 2021554180A JP WO2021079677 A1 JPWO2021079677 A1 JP WO2021079677A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021554180A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021079677A1 publication Critical patent/JPWO2021079677A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021554180A 2019-10-24 2020-09-24 Pending JPWO2021079677A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019193856 2019-10-24
PCT/JP2020/035983 WO2021079677A1 (ja) 2019-10-24 2020-09-24 封止用樹脂組成物、及び半導体装置

Publications (1)

Publication Number Publication Date
JPWO2021079677A1 true JPWO2021079677A1 (https=) 2021-04-29

Family

ID=75619295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554180A Pending JPWO2021079677A1 (https=) 2019-10-24 2020-09-24

Country Status (4)

Country Link
JP (1) JPWO2021079677A1 (https=)
CN (1) CN114585684A (https=)
TW (1) TWI862704B (https=)
WO (1) WO2021079677A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118525369A (zh) * 2022-02-28 2024-08-20 株式会社力森诺科 底部填充材料、半导体封装和半导体封装的制造方法
KR20240029962A (ko) * 2022-08-29 2024-03-07 주식회사 케이씨씨 에폭시 수지 조성물
JP2024064288A (ja) * 2022-10-27 2024-05-14 株式会社トクヤマ 樹脂組成物、半導体封止剤、及び予測装置
CN119799233A (zh) * 2025-01-02 2025-04-11 万华化学集团股份有限公司 一种环氧树脂组合物胶粘剂及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
US20120046390A1 (en) * 2010-08-18 2012-02-23 Jui-Hung Chen Epoxy resin composition
JP2012227449A (ja) * 2011-04-21 2012-11-15 Nippon Shokubai Co Ltd 非晶質シリカ粒子
WO2018070237A1 (ja) * 2016-10-14 2018-04-19 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2019163861A1 (ja) * 2018-02-21 2019-08-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、積層シート、硬化物、半導体装置及び半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63230729A (ja) * 1987-03-20 1988-09-27 Sumitomo Chem Co Ltd 半導体封止用樹脂組成物
JPH02167362A (ja) * 1988-08-04 1990-06-27 Polyplastics Co 電子部品封止用樹脂組成物及び電子部品
JP2671727B2 (ja) * 1992-09-17 1997-10-29 信越化学工業株式会社 表面処理シリカ並びにその製造方法及び半導体封止用樹脂組成物用充填剤
JP4802421B2 (ja) * 2001-08-31 2011-10-26 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
US20150050778A1 (en) * 2012-03-07 2015-02-19 Toray Industries, Inc. Method and apparatus for producing semiconductor device
JP5937403B2 (ja) * 2012-04-02 2016-06-22 デンカ株式会社 スラリー組成物及びそれを用いた樹脂組成物
JP6302902B2 (ja) * 2013-06-14 2018-03-28 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP7225546B2 (ja) * 2018-03-01 2023-02-21 味の素株式会社 封止用樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004352783A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Works Ltd 封止用樹脂組成物
US20120046390A1 (en) * 2010-08-18 2012-02-23 Jui-Hung Chen Epoxy resin composition
JP2012227449A (ja) * 2011-04-21 2012-11-15 Nippon Shokubai Co Ltd 非晶質シリカ粒子
WO2018070237A1 (ja) * 2016-10-14 2018-04-19 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2019163861A1 (ja) * 2018-02-21 2019-08-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、積層シート、硬化物、半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW202129863A (zh) 2021-08-01
WO2021079677A1 (ja) 2021-04-29
CN114585684A (zh) 2022-06-03
TWI862704B (zh) 2024-11-21

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