TWI846289B - 檢查裝置及檢查方法 - Google Patents

檢查裝置及檢查方法 Download PDF

Info

Publication number
TWI846289B
TWI846289B TW112102600A TW112102600A TWI846289B TW I846289 B TWI846289 B TW I846289B TW 112102600 A TW112102600 A TW 112102600A TW 112102600 A TW112102600 A TW 112102600A TW I846289 B TWI846289 B TW I846289B
Authority
TW
Taiwan
Prior art keywords
inspection
ray
rays
foreign matter
aforementioned
Prior art date
Application number
TW112102600A
Other languages
English (en)
Chinese (zh)
Other versions
TW202346853A (zh
Inventor
�本健夫
Original Assignee
日商佳能安內華股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能安內華股份有限公司 filed Critical 日商佳能安內華股份有限公司
Publication of TW202346853A publication Critical patent/TW202346853A/zh
Application granted granted Critical
Publication of TWI846289B publication Critical patent/TWI846289B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20008—Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/2206—Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K7/00—Gamma- or X-ray microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/14—Arrangements for concentrating, focusing, or directing the cathode ray
    • H01J35/153—Spot position control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/16—Vessels; Containers; Shields associated therewith
    • H01J35/18—Windows
    • H01J35/186—Windows used as targets or X-ray converters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/03—Investigating materials by wave or particle radiation by transmission
    • G01N2223/04—Investigating materials by wave or particle radiation by transmission and measuring absorption
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
    • G01N2223/052—Investigating materials by wave or particle radiation by diffraction, scatter or reflection reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G01N2223/071—Investigating materials by wave or particle radiation secondary emission combination of measurements, at least 1 secondary emission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G01N2223/076—X-ray fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/10—Different kinds of radiation or particles
    • G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
    • G01N2223/1016—X-ray
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/20—Sources of radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/20—Sources of radiation
    • G01N2223/204—Sources of radiation source created from radiated target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/30—Accessories, mechanical or electrical features
    • G01N2223/32—Accessories, mechanical or electrical features adjustments of elements during operation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/643—Specific applications or type of materials object on conveyor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/652—Specific applications or type of materials impurities, foreign matter, trace amounts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Toxicology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Engineering & Computer Science (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW112102600A 2022-01-31 2023-01-19 檢查裝置及檢查方法 TWI846289B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-013653 2022-01-31
JP2022013653 2022-01-31

Publications (2)

Publication Number Publication Date
TW202346853A TW202346853A (zh) 2023-12-01
TWI846289B true TWI846289B (zh) 2024-06-21

Family

ID=87471017

Family Applications (6)

Application Number Title Priority Date Filing Date
TW112102600A TWI846289B (zh) 2022-01-31 2023-01-19 檢查裝置及檢查方法
TW113116471A TW202433050A (zh) 2022-01-31 2023-01-19 檢查裝置及檢查方法
TW112103028A TWI845135B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法
TW112103030A TWI845136B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法
TW112103029A TWI874900B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法
TW112103027A TWI866041B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法

Family Applications After (5)

Application Number Title Priority Date Filing Date
TW113116471A TW202433050A (zh) 2022-01-31 2023-01-19 檢查裝置及檢查方法
TW112103028A TWI845135B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法
TW112103030A TWI845136B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法
TW112103029A TWI874900B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法
TW112103027A TWI866041B (zh) 2022-01-31 2023-01-30 檢查裝置以及檢查方法

Country Status (7)

Country Link
US (6) US11921059B2 (https=)
EP (5) EP4474800A4 (https=)
JP (6) JP7667321B2 (https=)
KR (5) KR20240141192A (https=)
CN (5) CN118661094A (https=)
TW (6) TWI846289B (https=)
WO (5) WO2023145101A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4474800A4 (en) * 2022-01-31 2026-01-07 Canon Anelva Corp INSPECTION DEVICE AND INSPECTION PROCEDURE

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5635716A (en) * 1995-03-17 1997-06-03 International Superconductivity Technology Center Method for identifying surface atoms of solid sample and apparatus therefor
TW201531696A (zh) * 2014-01-21 2015-08-16 Jordan Valley Semiconductors 用於切線入射ｘ射線螢光之角度校正
US20150247811A1 (en) * 2014-02-28 2015-09-03 Sigray, Inc. X-ray surface analysis and measurement apparatus
CN206020314U (zh) * 2016-09-09 2017-03-15 广州市怡文环境科技股份有限公司 一种全反射x射线荧光分析系统
WO2017104659A1 (ja) * 2015-12-15 2017-06-22 株式会社堀場製作所 Ｘ線管、及び、ｘ線分析装置

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01244344A (ja) * 1988-03-25 1989-09-28 Hitachi Ltd Ｘ線吸収スペクトル測定装置
JPH07119717B2 (ja) * 1989-12-12 1995-12-20 シャープ株式会社 半導体材料評価装置
JPH0534131A (ja) * 1991-08-05 1993-02-09 Fujitsu Ltd 画像処理方法及び画像処理装置
JPH05346411A (ja) * 1992-04-16 1993-12-27 Rigaku Denki Kogyo Kk 蛍光ｘ線分析装置
DE69510734T2 (de) * 1994-03-02 2000-02-17 Koninklijke Philips Electronics N.V., Eindhoven Röntgenspektrometer mit streifendem ausfallwinkel
KR100233312B1 (ko) * 1995-08-09 1999-12-01 야마모토 카즈모토 전반사 형광 x선 분석 장치 및 방법
US5742658A (en) * 1996-05-23 1998-04-21 Advanced Micro Devices, Inc. Apparatus and method for determining the elemental compositions and relative locations of particles on the surface of a semiconductor wafer
JPH09318565A (ja) * 1996-05-24 1997-12-12 Rigaku Ind Co Ｘ線分析方法および装置
JP2984232B2 (ja) * 1996-10-25 1999-11-29 株式会社テクノス研究所 Ｘ線分析装置およびｘ線照射角設定方法
US6005915A (en) 1997-11-07 1999-12-21 Advanced Micro Devices, Inc. Apparatus and method for measuring the roughness of a target material surface based upon the scattering of incident X-ray photons
US6108398A (en) * 1998-07-13 2000-08-22 Jordan Valley Applied Radiation Ltd. X-ray microfluorescence analyzer
JP2000055841A (ja) * 1998-08-13 2000-02-25 Fujitsu Ltd Ｘ線分析方法
DE19934987B4 (de) 1999-07-26 2004-11-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Röntgenanode und ihre Verwendung
DE19948382A1 (de) 1999-10-07 2001-05-03 Gemetec Ges Fuer Mestechnik Un Detektor für grosse Waferflächen
JP2001208708A (ja) 2000-01-31 2001-08-03 Japan Science & Technology Corp 斜出射電子線プローブマイクロｘ線分析による異物の分析方法およびその装置
US6829327B1 (en) * 2000-09-22 2004-12-07 X-Ray Optical Systems, Inc. Total-reflection x-ray fluorescence apparatus and method using a doubly-curved optic
JP2002202272A (ja) 2000-12-28 2002-07-19 Shimadzu Corp Ｘ線透視検査装置
JP3673825B2 (ja) 2001-03-27 2005-07-20 独立行政法人物質・材料研究機構 斜出射ｘ線分析方法
JP3998556B2 (ja) * 2002-10-17 2007-10-31 株式会社東研 高分解能ｘ線顕微検査装置
US7065176B2 (en) 2003-05-28 2006-06-20 General Electric Company Method and system to inspect a component
JP2005121468A (ja) 2003-10-16 2005-05-12 Tohken Co Ltd 蛍光ｘ線を利用した毛髪等の食品異物検査装置
JP2005292077A (ja) * 2004-04-05 2005-10-20 Fuji Electric Holdings Co Ltd Ｘ線顕微鏡装置
US7916834B2 (en) * 2007-02-12 2011-03-29 Thermo Niton Analyzers Llc Small spot X-ray fluorescence (XRF) analyzer
JP2007212468A (ja) * 2007-03-16 2007-08-23 Tohken Co Ltd 高分解機能ｘ線顕微検査装置
JP5127313B2 (ja) 2007-06-15 2013-01-23 義久 石黒 検査システム
JP2009075018A (ja) * 2007-09-21 2009-04-09 Technos:Kk 蛍光ｘ線分析装置および蛍光ｘ線分析方法
JP5489412B2 (ja) 2008-03-26 2014-05-14 株式会社マーストーケンソリューション 蛍光ｘ線分析機能付き高分解能ｘ線顕微装置
JP5292323B2 (ja) 2010-01-25 2013-09-18 株式会社リガク 微小部ｘ線計測装置
JP4914514B2 (ja) 2010-07-02 2012-04-11 株式会社リガク 蛍光ｘ線分析装置および方法
JP5887760B2 (ja) * 2011-08-24 2016-03-16 富士通株式会社 半導体装置の検査方法及び半導体装置の製造方法
JP5881159B2 (ja) 2012-03-27 2016-03-09 株式会社リガク 異種物質の検査装置及び異種物質の検査方法
US9194828B2 (en) * 2012-05-22 2015-11-24 Aribex, Inc. Handheld x-ray system for 3D scatter imaging
US20140067316A1 (en) * 2012-08-30 2014-03-06 Kabushiki Kaisha Toshiba Measuring apparatus, detector deviation monitoring method and measuring method
JP6026936B2 (ja) * 2013-03-28 2016-11-16 株式会社日立ハイテクサイエンス 異物検出装置
EP2927948A1 (en) 2014-04-04 2015-10-07 Nordson Corporation X-ray inspection apparatus for inspecting semiconductor wafers
CN107076684B (zh) 2014-09-02 2021-04-02 株式会社尼康 测量处理装置、测量处理方法和测量处理程序
US10514345B2 (en) * 2014-10-14 2019-12-24 Rigaku Corporation X-ray thin film inspection device
US10269536B2 (en) * 2015-03-25 2019-04-23 Hitachi High-Technologies Corporation Electron microscope
CN108401442B (zh) * 2015-06-30 2021-01-15 伊利诺斯工具制品有限公司 联机x射线测量设备和方法
US10295486B2 (en) 2015-08-18 2019-05-21 Sigray, Inc. Detector for X-rays with high spatial and high spectral resolution
CN105758345B (zh) * 2016-04-22 2018-06-05 武汉科技大学 一种在线测量带钢镀层厚度的x射线荧光成像装置
JP6867224B2 (ja) * 2017-04-28 2021-04-28 浜松ホトニクス株式会社 Ｘ線管及びｘ線発生装置
US10895541B2 (en) 2018-01-06 2021-01-19 Kla-Tencor Corporation Systems and methods for combined x-ray reflectometry and photoelectron spectroscopy
JP2019215205A (ja) 2018-06-12 2019-12-19 ローム株式会社 撮像装置、撮像方法、及び検査装置
JP6601854B1 (ja) * 2018-06-21 2019-11-06 株式会社リガク 蛍光ｘ線分析システム
JP7153525B2 (ja) * 2018-10-12 2022-10-14 アンリツ株式会社 Ｘ線検査装置
WO2020084890A1 (ja) 2018-10-25 2020-04-30 株式会社堀場製作所 Ｘ線分析装置及びｘ線発生ユニット
CN113877059B (zh) 2020-07-03 2025-12-09 何浩明 具有调整机构以使贴片单元贴合人体的衣物结构
CN114486971A (zh) * 2022-01-25 2022-05-13 深圳市埃芯半导体科技有限公司 多源设计的x射线分析系统和方法
EP4474800A4 (en) * 2022-01-31 2026-01-07 Canon Anelva Corp INSPECTION DEVICE AND INSPECTION PROCEDURE

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5635716A (en) * 1995-03-17 1997-06-03 International Superconductivity Technology Center Method for identifying surface atoms of solid sample and apparatus therefor
TW201531696A (zh) * 2014-01-21 2015-08-16 Jordan Valley Semiconductors 用於切線入射ｘ射線螢光之角度校正
US20150247811A1 (en) * 2014-02-28 2015-09-03 Sigray, Inc. X-ray surface analysis and measurement apparatus
WO2017104659A1 (ja) * 2015-12-15 2017-06-22 株式会社堀場製作所 Ｘ線管、及び、ｘ線分析装置
CN206020314U (zh) * 2016-09-09 2017-03-15 广州市怡文环境科技股份有限公司 一种全反射x射线荧光分析系统

Also Published As

Publication number Publication date
WO2023145237A1 (ja) 2023-08-03
KR20240141191A (ko) 2024-09-25
TW202346848A (zh) 2023-12-01
TWI845135B (zh) 2024-06-11
JP7667322B2 (ja) 2025-04-22
CN118661093A (zh) 2024-09-17
US20230349843A1 (en) 2023-11-02
JPWO2023145237A1 (https=) 2023-08-03
EP4474802A1 (en) 2024-12-11
CN118661094A (zh) 2024-09-17
TW202346847A (zh) 2023-12-01
EP4474800A1 (en) 2024-12-11
TW202433050A (zh) 2024-08-16
EP4474800A4 (en) 2026-01-07
KR20240141192A (ko) 2024-09-25
JP7667882B2 (ja) 2025-04-23
JP7667883B2 (ja) 2025-04-23
CN118891514A (zh) 2024-11-01
US11921059B2 (en) 2024-03-05
WO2023145235A1 (ja) 2023-08-03
US12241848B2 (en) 2025-03-04
EP4474803A4 (en) 2026-01-14
WO2023145236A1 (ja) 2023-08-03
EP4474804A4 (en) 2026-01-21
US20240369502A1 (en) 2024-11-07
US11927554B2 (en) 2024-03-12
US11977038B2 (en) 2024-05-07
US20230349841A1 (en) 2023-11-02
KR20240135667A (ko) 2024-09-11
US11971370B2 (en) 2024-04-30
CN118901003A (zh) 2024-11-05
US20230349846A1 (en) 2023-11-02
JPWO2023145236A1 (https=) 2023-08-03
JP2023111866A (ja) 2023-08-10
JP2025039599A (ja) 2025-03-21
TW202346853A (zh) 2023-12-01
EP4474803A1 (en) 2024-12-11
TWI866041B (zh) 2024-12-11
JPWO2023145235A1 (https=) 2023-08-03
EP4474801A1 (en) 2024-12-11
JP7615183B2 (ja) 2025-01-16
US20230349844A1 (en) 2023-11-02
CN118679379A (zh) 2024-09-20
EP4474801A4 (en) 2026-01-14
TWI845136B (zh) 2024-06-11
TWI874900B (zh) 2025-03-01
EP4474802A4 (en) 2026-01-14
KR20240136405A (ko) 2024-09-13
JP7667321B2 (ja) 2025-04-22
TW202338340A (zh) 2023-10-01
JPWO2023145238A1 (https=) 2023-08-03
EP4474804A1 (en) 2024-12-11
KR20240136411A (ko) 2024-09-13
WO2023145101A1 (ja) 2023-08-03
TW202338863A (zh) 2023-10-01
WO2023145238A1 (ja) 2023-08-03
US20230349845A1 (en) 2023-11-02

Similar Documents

Publication Publication Date Title
US7627088B2 (en) X-ray tube and X-ray analysis apparatus
TWI846289B (zh) 檢查裝置及檢查方法