KR20240141192A - 검사 장치 및 검사 방법 - Google Patents

검사 장치 및 검사 방법 Download PDF

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Publication number
KR20240141192A
KR20240141192A KR1020247028367A KR20247028367A KR20240141192A KR 20240141192 A KR20240141192 A KR 20240141192A KR 1020247028367 A KR1020247028367 A KR 1020247028367A KR 20247028367 A KR20247028367 A KR 20247028367A KR 20240141192 A KR20240141192 A KR 20240141192A
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South Korea
Prior art keywords
inspection
ray
rays
target
inspection device
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Pending
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KR1020247028367A
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English (en)
Korean (ko)
Inventor
다케오 츠카모토
Original Assignee
캐논 아네르바 가부시키가이샤
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Publication of KR20240141192A publication Critical patent/KR20240141192A/ko
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18Investigating the presence of flaws defects or foreign matter
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20008Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/2206Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/223Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KHANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K7/00Gamma- or X-ray microscopes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00X-ray tubes
    • H01J35/02Details
    • H01J35/14Arrangements for concentrating, focusing, or directing the cathode ray
    • H01J35/153Spot position control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00X-ray tubes
    • H01J35/02Details
    • H01J35/16Vessels; Containers; Shields associated therewith
    • H01J35/18Windows
    • H01J35/186Windows used as targets or X-ray converters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/03Investigating materials by wave or particle radiation by transmission
    • G01N2223/04Investigating materials by wave or particle radiation by transmission and measuring absorption
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/05Investigating materials by wave or particle radiation by diffraction, scatter or reflection
    • G01N2223/052Investigating materials by wave or particle radiation by diffraction, scatter or reflection reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/07Investigating materials by wave or particle radiation secondary emission
    • G01N2223/071Investigating materials by wave or particle radiation secondary emission combination of measurements, at least 1 secondary emission
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/07Investigating materials by wave or particle radiation secondary emission
    • G01N2223/076X-ray fluorescence
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/10Different kinds of radiation or particles
    • G01N2223/101Different kinds of radiation or particles electromagnetic radiation
    • G01N2223/1016X-ray
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/20Sources of radiation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/20Sources of radiation
    • G01N2223/204Sources of radiation source created from radiated target
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/30Accessories, mechanical or electrical features
    • G01N2223/32Accessories, mechanical or electrical features adjustments of elements during operation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/60Specific applications or type of materials
    • G01N2223/643Specific applications or type of materials object on conveyor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00Investigating materials by wave or particle radiation
    • G01N2223/60Specific applications or type of materials
    • G01N2223/652Specific applications or type of materials impurities, foreign matter, trace amounts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Toxicology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Engineering & Computer Science (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020247028367A 2022-01-31 2022-03-31 검사 장치 및 검사 방법 Pending KR20240141192A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022013653 2022-01-31
JPJP-P-2022-013653 2022-01-31
PCT/JP2022/016709 WO2023145101A1 (ja) 2022-01-31 2022-03-31 検査装置および検査方法

Publications (1)

Publication Number Publication Date
KR20240141192A true KR20240141192A (ko) 2024-09-25

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Family Applications (5)

Application Number Title Priority Date Filing Date
KR1020247028367A Pending KR20240141192A (ko) 2022-01-31 2022-03-31 검사 장치 및 검사 방법
KR1020247028350A Withdrawn KR20240141191A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법
KR1020247027476A Withdrawn KR20240136405A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법
KR1020247028368A Pending KR20240135667A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법
KR1020247027603A Withdrawn KR20240136411A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법

Family Applications After (4)

Application Number Title Priority Date Filing Date
KR1020247028350A Withdrawn KR20240141191A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법
KR1020247027476A Withdrawn KR20240136405A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법
KR1020247028368A Pending KR20240135667A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법
KR1020247027603A Withdrawn KR20240136411A (ko) 2022-01-31 2022-11-29 검사 장치 및 검사 방법

Country Status (7)

Country Link
US (6) US11921059B2 (https=)
EP (5) EP4474800A4 (https=)
JP (6) JP7667321B2 (https=)
KR (5) KR20240141192A (https=)
CN (5) CN118661094A (https=)
TW (6) TWI846289B (https=)
WO (5) WO2023145101A1 (https=)

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EP4474800A4 (en) * 2022-01-31 2026-01-07 Canon Anelva Corp INSPECTION DEVICE AND INSPECTION PROCEDURE

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01244344A (ja) * 1988-03-25 1989-09-28 Hitachi Ltd X線吸収スペクトル測定装置
JPH07119717B2 (ja) * 1989-12-12 1995-12-20 シャープ株式会社 半導体材料評価装置
JPH0534131A (ja) * 1991-08-05 1993-02-09 Fujitsu Ltd 画像処理方法及び画像処理装置
JPH05346411A (ja) * 1992-04-16 1993-12-27 Rigaku Denki Kogyo Kk 蛍光x線分析装置
DE69510734T2 (de) * 1994-03-02 2000-02-17 Koninklijke Philips Electronics N.V., Eindhoven Röntgenspektrometer mit streifendem ausfallwinkel
JP3165615B2 (ja) * 1995-03-17 2001-05-14 財団法人国際超電導産業技術研究センター 表面元素分析方法及び装置
KR100233312B1 (ko) * 1995-08-09 1999-12-01 야마모토 카즈모토 전반사 형광 x선 분석 장치 및 방법
US5742658A (en) * 1996-05-23 1998-04-21 Advanced Micro Devices, Inc. Apparatus and method for determining the elemental compositions and relative locations of particles on the surface of a semiconductor wafer
JPH09318565A (ja) * 1996-05-24 1997-12-12 Rigaku Ind Co X線分析方法および装置
JP2984232B2 (ja) * 1996-10-25 1999-11-29 株式会社テクノス研究所 X線分析装置およびx線照射角設定方法
US6005915A (en) 1997-11-07 1999-12-21 Advanced Micro Devices, Inc. Apparatus and method for measuring the roughness of a target material surface based upon the scattering of incident X-ray photons
US6108398A (en) * 1998-07-13 2000-08-22 Jordan Valley Applied Radiation Ltd. X-ray microfluorescence analyzer
JP2000055841A (ja) * 1998-08-13 2000-02-25 Fujitsu Ltd X線分析方法
DE19934987B4 (de) 1999-07-26 2004-11-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Röntgenanode und ihre Verwendung
DE19948382A1 (de) 1999-10-07 2001-05-03 Gemetec Ges Fuer Mestechnik Un Detektor für grosse Waferflächen
JP2001208708A (ja) 2000-01-31 2001-08-03 Japan Science & Technology Corp 斜出射電子線プローブマイクロx線分析による異物の分析方法およびその装置
US6829327B1 (en) * 2000-09-22 2004-12-07 X-Ray Optical Systems, Inc. Total-reflection x-ray fluorescence apparatus and method using a doubly-curved optic
JP2002202272A (ja) 2000-12-28 2002-07-19 Shimadzu Corp X線透視検査装置
JP3673825B2 (ja) 2001-03-27 2005-07-20 独立行政法人物質・材料研究機構 斜出射x線分析方法
JP3998556B2 (ja) * 2002-10-17 2007-10-31 株式会社東研 高分解能x線顕微検査装置
US7065176B2 (en) 2003-05-28 2006-06-20 General Electric Company Method and system to inspect a component
JP2005121468A (ja) 2003-10-16 2005-05-12 Tohken Co Ltd 蛍光x線を利用した毛髪等の食品異物検査装置
JP2005292077A (ja) * 2004-04-05 2005-10-20 Fuji Electric Holdings Co Ltd X線顕微鏡装置
US7916834B2 (en) * 2007-02-12 2011-03-29 Thermo Niton Analyzers Llc Small spot X-ray fluorescence (XRF) analyzer
JP2007212468A (ja) * 2007-03-16 2007-08-23 Tohken Co Ltd 高分解機能x線顕微検査装置
JP5127313B2 (ja) 2007-06-15 2013-01-23 義久 石黒 検査システム
JP2009075018A (ja) * 2007-09-21 2009-04-09 Technos:Kk 蛍光x線分析装置および蛍光x線分析方法
JP5489412B2 (ja) 2008-03-26 2014-05-14 株式会社マーストーケンソリューション 蛍光x線分析機能付き高分解能x線顕微装置
JP5292323B2 (ja) 2010-01-25 2013-09-18 株式会社リガク 微小部x線計測装置
JP4914514B2 (ja) 2010-07-02 2012-04-11 株式会社リガク 蛍光x線分析装置および方法
JP5887760B2 (ja) * 2011-08-24 2016-03-16 富士通株式会社 半導体装置の検査方法及び半導体装置の製造方法
JP5881159B2 (ja) 2012-03-27 2016-03-09 株式会社リガク 異種物質の検査装置及び異種物質の検査方法
US9194828B2 (en) * 2012-05-22 2015-11-24 Aribex, Inc. Handheld x-ray system for 3D scatter imaging
US20140067316A1 (en) * 2012-08-30 2014-03-06 Kabushiki Kaisha Toshiba Measuring apparatus, detector deviation monitoring method and measuring method
JP6026936B2 (ja) * 2013-03-28 2016-11-16 株式会社日立ハイテクサイエンス 異物検出装置
US9551677B2 (en) * 2014-01-21 2017-01-24 Bruker Jv Israel Ltd. Angle calibration for grazing-incidence X-ray fluorescence (GIXRF)
US9594036B2 (en) * 2014-02-28 2017-03-14 Sigray, Inc. X-ray surface analysis and measurement apparatus
EP2927948A1 (en) 2014-04-04 2015-10-07 Nordson Corporation X-ray inspection apparatus for inspecting semiconductor wafers
CN107076684B (zh) 2014-09-02 2021-04-02 株式会社尼康 测量处理装置、测量处理方法和测量处理程序
US10514345B2 (en) * 2014-10-14 2019-12-24 Rigaku Corporation X-ray thin film inspection device
US10269536B2 (en) * 2015-03-25 2019-04-23 Hitachi High-Technologies Corporation Electron microscope
CN108401442B (zh) * 2015-06-30 2021-01-15 伊利诺斯工具制品有限公司 联机x射线测量设备和方法
US10295486B2 (en) 2015-08-18 2019-05-21 Sigray, Inc. Detector for X-rays with high spatial and high spectral resolution
JP6630365B2 (ja) * 2015-12-15 2020-01-15 株式会社堀場製作所 X線管、及び、x線分析装置
CN105758345B (zh) * 2016-04-22 2018-06-05 武汉科技大学 一种在线测量带钢镀层厚度的x射线荧光成像装置
CN206020314U (zh) * 2016-09-09 2017-03-15 广州市怡文环境科技股份有限公司 一种全反射x射线荧光分析系统
JP6867224B2 (ja) * 2017-04-28 2021-04-28 浜松ホトニクス株式会社 X線管及びx線発生装置
US10895541B2 (en) 2018-01-06 2021-01-19 Kla-Tencor Corporation Systems and methods for combined x-ray reflectometry and photoelectron spectroscopy
JP2019215205A (ja) 2018-06-12 2019-12-19 ローム株式会社 撮像装置、撮像方法、及び検査装置
JP6601854B1 (ja) * 2018-06-21 2019-11-06 株式会社リガク 蛍光x線分析システム
JP7153525B2 (ja) * 2018-10-12 2022-10-14 アンリツ株式会社 X線検査装置
WO2020084890A1 (ja) 2018-10-25 2020-04-30 株式会社堀場製作所 X線分析装置及びx線発生ユニット
CN113877059B (zh) 2020-07-03 2025-12-09 何浩明 具有调整机构以使贴片单元贴合人体的衣物结构
CN114486971A (zh) * 2022-01-25 2022-05-13 深圳市埃芯半导体科技有限公司 多源设计的x射线分析系统和方法
EP4474800A4 (en) * 2022-01-31 2026-01-07 Canon Anelva Corp INSPECTION DEVICE AND INSPECTION PROCEDURE

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WO2023145237A1 (ja) 2023-08-03
KR20240141191A (ko) 2024-09-25
TW202346848A (zh) 2023-12-01
TWI845135B (zh) 2024-06-11
JP7667322B2 (ja) 2025-04-22
CN118661093A (zh) 2024-09-17
US20230349843A1 (en) 2023-11-02
JPWO2023145237A1 (https=) 2023-08-03
EP4474802A1 (en) 2024-12-11
CN118661094A (zh) 2024-09-17
TW202346847A (zh) 2023-12-01
EP4474800A1 (en) 2024-12-11
TW202433050A (zh) 2024-08-16
EP4474800A4 (en) 2026-01-07
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