TWI843260B - 配線基板及其製造方法 - Google Patents
配線基板及其製造方法 Download PDFInfo
- Publication number
- TWI843260B TWI843260B TW111140912A TW111140912A TWI843260B TW I843260 B TWI843260 B TW I843260B TW 111140912 A TW111140912 A TW 111140912A TW 111140912 A TW111140912 A TW 111140912A TW I843260 B TWI843260 B TW I843260B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- wiring conductor
- base metal
- metal layer
- electrolytic coating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 239000004020 conductor Substances 0.000 claims abstract description 158
- 239000010953 base metal Substances 0.000 claims abstract description 85
- 239000010410 layer Substances 0.000 claims description 214
- 239000011248 coating agent Substances 0.000 claims description 48
- 238000000576 coating method Methods 0.000 claims description 48
- 239000011247 coating layer Substances 0.000 claims description 39
- 238000007747 plating Methods 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 17
- 238000009413 insulation Methods 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021176324 | 2021-10-28 | ||
| JP2021-176324 | 2021-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202333542A TW202333542A (zh) | 2023-08-16 |
| TWI843260B true TWI843260B (zh) | 2024-05-21 |
Family
ID=86157798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111140912A TWI843260B (zh) | 2021-10-28 | 2022-10-27 | 配線基板及其製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240422900A1 (https=) |
| JP (1) | JP7660699B2 (https=) |
| KR (1) | KR20240056637A (https=) |
| CN (1) | CN118120341A (https=) |
| TW (1) | TWI843260B (https=) |
| WO (1) | WO2023074661A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024006475A (ja) * | 2022-07-01 | 2024-01-17 | イビデン株式会社 | 配線基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001060589A (ja) * | 1999-08-20 | 2001-03-06 | Matsushita Electronics Industry Corp | 半導体装置の製造方法 |
| TW201826895A (zh) * | 2016-10-11 | 2018-07-16 | 日商迪思科股份有限公司 | 配線基板的製造方法 |
| TW202014076A (zh) * | 2018-09-28 | 2020-04-01 | 日商三井金屬鑛業股份有限公司 | 多層配線板的製造方法 |
| TW202131767A (zh) * | 2015-09-25 | 2021-08-16 | 日商大日本印刷股份有限公司 | 配線基板與其製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004149926A (ja) | 2003-11-20 | 2004-05-27 | Matsushita Electric Ind Co Ltd | 埋め込み配線の形成方法 |
| JP2005183452A (ja) | 2003-12-16 | 2005-07-07 | Fujikura Ltd | 端子部の接合構造及び接合方法 |
| JP4395388B2 (ja) | 2004-02-20 | 2010-01-06 | 京セラ株式会社 | 配線基板およびその製造方法 |
| JP7063101B2 (ja) | 2018-05-11 | 2022-05-09 | 住友電気工業株式会社 | プリント配線板及びプリント配線板の製造方法 |
-
2022
- 2022-10-25 WO PCT/JP2022/039641 patent/WO2023074661A1/ja not_active Ceased
- 2022-10-25 JP JP2023556450A patent/JP7660699B2/ja active Active
- 2022-10-25 US US18/703,638 patent/US20240422900A1/en active Pending
- 2022-10-25 CN CN202280070335.3A patent/CN118120341A/zh not_active Withdrawn
- 2022-10-25 KR KR1020247012742A patent/KR20240056637A/ko not_active Ceased
- 2022-10-27 TW TW111140912A patent/TWI843260B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001060589A (ja) * | 1999-08-20 | 2001-03-06 | Matsushita Electronics Industry Corp | 半導体装置の製造方法 |
| TW202131767A (zh) * | 2015-09-25 | 2021-08-16 | 日商大日本印刷股份有限公司 | 配線基板與其製造方法 |
| TW201826895A (zh) * | 2016-10-11 | 2018-07-16 | 日商迪思科股份有限公司 | 配線基板的製造方法 |
| TW202014076A (zh) * | 2018-09-28 | 2020-04-01 | 日商三井金屬鑛業股份有限公司 | 多層配線板的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023074661A1 (https=) | 2023-05-04 |
| US20240422900A1 (en) | 2024-12-19 |
| CN118120341A (zh) | 2024-05-31 |
| WO2023074661A1 (ja) | 2023-05-04 |
| JP7660699B2 (ja) | 2025-04-11 |
| TW202333542A (zh) | 2023-08-16 |
| KR20240056637A (ko) | 2024-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6885800B2 (ja) | 配線基板およびその製造方法 | |
| US8735741B2 (en) | Circuit board and mounting structure using the same | |
| CN102111951A (zh) | 多层布线基板 | |
| JP5221887B2 (ja) | 配線基盤の製造方法 | |
| TWI843260B (zh) | 配線基板及其製造方法 | |
| US6946737B2 (en) | Robust interlocking via | |
| JP7583680B2 (ja) | 配線基板およびその製造方法 | |
| TWI859795B (zh) | 配線基板 | |
| JP7234049B2 (ja) | プリント配線基板 | |
| TWI889081B (zh) | 配線基板及其製造方法 | |
| TWI881482B (zh) | 配線基板及使用該配線基板之安裝構造體 | |
| TWI866088B (zh) | 配線基板及安裝構造體 | |
| WO2025115582A1 (ja) | 配線基板およびその製造方法 | |
| KR100797669B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
| CN108093566B (zh) | 配线基板及其制造方法 | |
| JP2002185140A (ja) | 多層プリント基板及びその製造方法 | |
| JP2024085310A (ja) | 配線基板 | |
| CN117529976A (zh) | 布线基板 | |
| TW202415158A (zh) | 配線基板及使用該配線基板之安裝構造體 | |
| JP2024113263A (ja) | 配線基板 | |
| CN116896820A (zh) | 印刷电路板 | |
| JP2013062292A (ja) | 多層配線基板及びその製造方法 | |
| JP2020194875A (ja) | 配線基板およびそれを用いた電子部品実装構造体 |