TWI839685B - 接著劑組成物與使用該組成物之包覆層薄膜、接合片、貼銅層合板及電磁波遮蔽材 - Google Patents
接著劑組成物與使用該組成物之包覆層薄膜、接合片、貼銅層合板及電磁波遮蔽材 Download PDFInfo
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- TWI839685B TWI839685B TW111106140A TW111106140A TWI839685B TW I839685 B TWI839685 B TW I839685B TW 111106140 A TW111106140 A TW 111106140A TW 111106140 A TW111106140 A TW 111106140A TW I839685 B TWI839685 B TW I839685B
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- adhesive composition
- epoxy resin
- resin
- polyolefin resin
- modified polyolefin
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Abstract
本發明之接著劑組成物為,含有(A)變性聚烯烴系樹脂及(B)環氧化合物,其特徵為,變性聚烯烴系樹脂(A)為,使用含有α,β-不飽和羧酸或其衍生物的變性劑對聚烯烴樹脂進行接枝變性而得之樹脂,環氧化合物(B)之含量,相對於變性聚烯烴系樹脂(A)100質量份,為1~20質量份,環氧化合物為由2種類以上的環氧基所形成者。
Description
本發明為有關一種具有優良接著性、焊料耐熱性及介電特性,而適用於電子零件接著用之接著劑組成物,及使用其之包覆層薄膜、接合片、貼銅層合板及電磁波遮蔽材之發明。
近年來,伴隨電子機器之小型化、高密度化等的多樣化,可撓式印刷配線板相關製品(以下,亦稱為「FPC相關製品」)之需要性有增大之趨勢。FPC相關製品,例如,聚醯亞胺薄膜與銅箔貼合而得之可撓式貼銅層合板、於可撓式貼銅層合板上形成線路而製得之可撓式印刷配線板、可撓式印刷配線板與補強板貼合而得之附補強板之可撓式印刷配線板、可撓式貼銅層合板或可撓式印刷配線板重複層合而得之多層板、基材薄膜上貼合銅配線之可撓式扁平電纜等。該些製品中,於製造可撓式貼銅層合板之情形中,聚醯亞胺薄膜與銅箔之接著上,通常為使用接著劑。
又,於製造可撓式印刷配線板之情形中,為保護配線部份,通常多使用稱為「包覆層薄膜」之薄膜。該包覆層薄膜,為具備有絕緣樹脂層,與形成於該表面之接著劑層,於絕緣樹脂層之形成中,聚醯亞胺樹脂組成物則被廣泛使用。又,例如,亦可使用熱壓著等,於具有配線部份之面上,介由接著劑層貼附包覆層薄膜之方式,而可製造可撓式印刷配線板。此時,包覆層薄膜之接著劑層,對於配線部份及薄膜基層等二者,具有強固接著性為必要之條件。
又,印刷配線板,已知為於基板之表面上,使導體層與有機絕緣層形成交互層合的堆疊方式之多層印刷配線板。製造該些多層印刷配線板時,就接合導體層及有機絕緣層之目的,亦使用稱為「接合片」之絕緣接著層形成材料。絕緣接著層中,對於配線部份之埋入性或形成線路的導體部之構成材料(銅等)及有機絕緣層(聚醯亞胺樹脂等)等二者,具有強固接著性為必要之條件。
該些FPC相關製品所使用的接著劑,已有提出使用含有環氧樹脂及對該環氧樹脂具有高度反應性之熱可塑性樹脂的環氧系接著劑組成物之提案。
例如,日本國特開平7-235767號公報中,已有揭示使用環氧系接著劑作為主成份,此外,再使用含有烯烴-酸系酯共聚橡膠及硬化劑的接著劑之技術,具體而言,為使用乙烯-丙烯酸酯共聚橡膠/環氧樹脂系接著劑。
日本國特開2001-354936號公報中,揭示一種含有(A)環氧當量1000以下之雙酚型環氧樹脂、(B)環氧當量200~500之酚醛清漆型環氧樹脂、(C)具有環氧當量400~2500、重量平均分子量20000以上,且於分子末端以外的分子鏈中具有縮水甘油基,由苯乙烯產生之單位的熱可塑性彈性體、(D)重量平均分子量10000以上的雙酚型環氧樹脂或苯氧樹脂、(E)環氧樹脂硬化劑、(F)硬化促進劑、(G)無機填充劑,及(H)含有溶劑之可撓式配線板用接著劑組成物,具體而言,為使用含有縮水甘油基之熱可塑性彈性體/環氧樹脂系接著劑。
日本國特開2007-2121號公報中,揭示一種含有:含有環氧樹脂之基底樹脂,與苯乙烯-馬來酸共聚物的環氧系接著劑。該些文獻所記載的接著劑組成物,經由利用橡膠或彈性體成份的羧基與環氧樹脂之反應性,而可實現迅速的硬化反應,故亦具有優良接著性。
又,日本國特開平10-17685號公報中,揭示一種製造預浸體之製造所使用的接著劑,其為以1分子中具有2個以上的環氧基之環氧樹脂(I)、芳香族乙烯基化合物與馬來酸酐作為必要成份所製得之共聚樹脂(II),及1分子中具有2個酚性羥基之酚化合物(III)作為必要成份所製得之環氧樹脂組成物。
上述接著劑中,除以往的接著機能以外,例如,伴隨對於放熱性或導電性等機能之要求增加,而為達成該要求時,多於接著劑中添加大量的無機填料。
[發明所欲解決之問題]
近年來,伴隨需要急遽擴大的手提電話、資訊機器端末等移動體通信機器中,因必須以高速處理大量的數據,故訊號亦進入高周波數化。伴隨訊號速度的高速化,及訊號的高周波數化,於FPC相關製品所使用的接著劑中,則尋求一種對於接著後、硬化的材料(硬化物),於高周波數區域中具有優良介電特性(低介電係數及低損耗因子)的接著劑。
但是,上述文獻所記載的接著劑組成物之硬化物,於極超短波的微波帶(1~3GHz)中,其介電特性仍未極充份。
又,印刷配線板中,於對應搭載電子零件等之際所使用的焊料材料之無鉛化進度中,則要求於260℃左右的回焊溫度間之焊料耐熱性。例如,將經聚醯亞胺薄膜及金屬鍍敷的銅箔,經由接著劑進行接合而得之可撓式貼銅層合板進行回焊步驟之後,亦被要求應具有良好的接著狀態。
本發明,不僅以提供對於含有聚醯亞胺樹脂等之薄膜、含有銅等的金屬或合金之箔等的各種物品具有良好的接著性以外,也以提供一種可賦予具有優良介電特性的硬化物之接著劑組成物為目的。又,本發明又以提供一種對於使用回焊步驟以製造FPC相關製品時所使用的可撓式貼銅層合板等的前驅體,賦予焊料耐熱性的接著劑組成物為目的。
[解決問題之方法]
本發明者們,經使用含有具有特定構造的變性聚烯烴系樹脂,與至少2種環氧樹脂,且使環氧樹脂的合計含量設定於特定比例而得之接著劑組成物時,發現不僅可得到優良的接著性,且可得到優良的介電特性及焊料耐熱性,因而完成本發明。
即,本發明係具有以下之內容。
1. 一種接著劑組成物,其為含有(A)變性聚烯烴系樹脂,與(B)環氧樹脂之接著劑組成物,其特徵為,
上述變性聚烯烴系樹脂(A)係聚烯烴樹脂被以含有α,β-不飽和羧酸或其衍生物的變性劑所接枝變性而得之樹脂,
上述環氧樹脂(B)之含量,相對於上述變性聚烯烴系樹脂(A)100質量份,為1~20質量份,
上述環氧樹脂(B)為包含2種類以上的環氧樹脂。
2. 上述項1所記載之接著劑組成物中,上述環氧樹脂(B)為包含酚醛清漆型環氧樹脂。
3. 上述項2所記載之接著劑組成物中,上述環氧樹脂(B)為包含雙酚A型酚醛清漆型環氧樹脂。
4. 上述項1所記載之接著劑組成物中,上述環氧樹脂(B)為包含具有脂環骨架之環氧樹脂。
5. 上述項1所記載之接著劑組成物中,上述變性聚烯烴系樹脂(A)為包含變性聚丙烯樹脂。
6. 上述項1所記載之接著劑組成物中,上述α,β-不飽和羧酸之衍生物為由依康酸酐、馬來酸酐、烏頭酸酐及檬康酸酐所成之群選出之至少1種。
7. 上述項1所記載之接著劑組成物中,上述源自α,β-不飽和羧酸或其衍生物之接枝部份的含有比例,相對於上述變性聚烯烴系樹脂100質量%,為0.1~20質量%。
8. 上述項1所記載之接著劑組成物中,尚含有(C)具有烷氧矽烷基之咪唑系化合物,上述含有烷氧矽烷基之咪唑系化合物(C)之含量,於上述變性聚烯烴系樹脂(A)及上述環氧樹脂(B)的合計為100質量份時,為0.3~5質量份。
9. 上述項1所記載之接著劑組成物中,尚含有(D)抗氧化劑,上述抗氧化劑(D)之含量,於上述變性聚烯烴系樹脂(A)及上述環氧樹脂(B)的合計為100質量份時,為0.1~10質量份。
10. 上述項1所記載之接著劑組成物中,尚含有(E)含有磷之化合物,上述含有磷之化合物(E)之含量,於上述變性聚烯烴系樹脂(A)及上述環氧樹脂(B)的合計為100質量份時,為0.5~50質量份。
11. 上述項1所記載之接著劑組成物中,尚含有(F)導電填料,上述導電填料(F)之含量,於上述變性聚烯烴系樹脂(A)及上述環氧樹脂(B)的合計為100質量份時,為10~350質量份。
12.一種包覆層薄膜,其特徵為,於聚醯亞胺薄膜之單一面上形成由上述項1~11中任一項所記載之接著劑組成物而形成的接著劑層。
13.一種接合片,其特徵為,於離型性薄膜之表面上形成由上述項1~11中任一項所記載之接著劑組成物而形成的接著劑層。
14.一種貼銅層合板,其特徵為,使用上述項1~11中任一項所記載之接著劑組成物而形成的接著劑層,層合於聚醯亞胺薄膜的至少單一面與銅箔之間。
15.一種電磁波遮蔽材,其特徵為,使用上述項1~11中任一項所記載之接著劑組成物而形成的接著劑層作為構成成份。
[發明之效果]
本發明之接著劑組成物,可提供一種不僅對於包含聚醯亞胺樹脂等之薄膜、包含銅等的金屬或合金之箔等的各種物品,具有優良接著性外,亦具有優良介電特性(低介電係數及低損耗因子)等之硬化物。又,本發明之接著劑組成物,可對使用回焊步驟以製造FPC相關製品所使用的前驅體賦予焊料耐熱性。因此,本發明之接著劑組成物及使用其所形成的接合片、包覆層薄膜、貼銅層合板等之附有接著劑層的層合體,適合使用於FPC相關製品之製造等。
[發明之實施形態]
以下,將說明本發明之實施形態。
1.接著劑組成物
本發明之接著劑組成物為含有(A)變性聚烯烴系樹脂,與(B)環氧樹脂之接著劑組成物,其特徵為,上述變性聚烯烴系樹脂(A)為,使用含有α,β-不飽和羧酸或其衍生物的變性劑對聚烯烴樹脂進行接枝變性而得之樹脂,上述環氧樹脂(B)之含量,相對於上述變性聚烯烴系樹脂(A)100質量份,為1~20質量份,上述環氧樹脂(B)為2種類以上的環氧樹脂。本發明之接著劑組成物,可再含有溶劑、添加劑等。
上述變性聚烯烴系樹脂(A)為具有由聚烯烴樹脂產生之部份,與由變性劑產生之接枝部份的樹脂,較佳為可溶解於後述溶劑之樹脂。
上述變性聚烯烴系樹脂(A),較佳為於聚烯烴樹脂之存在下,經由包含α,β-不飽和羧酸或其衍生物的變性劑進行接枝聚合而製得者。上述變性聚烯烴系樹脂(A)進行接枝聚合的製造方法,可使用公知方法進行,製造時,亦可使用自由基起始劑。製造上述變性聚烯烴系樹脂(A)的具體方法,例如,使聚烯烴樹脂於甲苯等溶劑中進行加熱溶解,再添加變性劑及自由基起始劑之溶液法、使用班伯里混練機、捏合機、擠壓機等,使聚烯烴樹脂、變性劑及自由基起始劑進行溶融混練之溶融法等。溶融法之情形中,聚烯烴樹脂、變性劑及自由基起始劑之使用方法,並未有特別之限定,可將該些一起添加於反應系,或逐次添加皆可。
製造上述變性聚烯烴系樹脂(A)之情形中,可再使用可提高包含α,β-不飽和羧酸或其衍生物的變性劑之接枝效率的變性助劑、調整樹脂安定性的安定劑等。
進行接枝聚合之聚烯烴樹脂,只要具有由烯烴所產生的結構單位時,並未有特別之限定。上述聚烯烴樹脂,例如,可使用由乙烯、丙烯、丁烯、戊烯、己烯、庚烯、辛烯、4-甲基-1-戊烯等的碳原子數2~20之烯烴的寡聚物或共聚物為佳。本發明中,又以使用碳原子數2~6之烯烴的寡聚物或共聚物為特佳。聚烯烴樹脂之中,由上述烯烴所產生的結構單位的含有比例,可以任意地選擇。又,進行接枝聚合之聚烯烴樹脂,可為變性聚烯烴樹脂及非變性聚烯烴樹脂之任一者。使用本發明之接著劑組成物,對難接著性被附著物進行接著時,上述變性聚烯烴系樹脂(A),以非變性聚烯烴樹脂之變性物為佳,以乙烯-丙烯共聚物、丙烯-丁烯共聚物或乙烯-丙烯-丁烯共聚物之變性樹脂,即,包含變性聚丙烯樹脂者為較佳。該情形中,於使用含有丙烯單位的含有比例為50莫耳%以上的聚烯烴樹脂而得的變性聚丙烯樹脂之接著劑組成物時,可得到更優良的接著性。因此,本發明中,上述聚烯烴樹脂以包含聚丙烯者為特佳。又,使用含有丙烯單位的含有比例為50莫耳%以上的聚烯烴樹脂而得的變性聚烯烴系樹脂(A)之接著劑組成物時,例如,可對2個構件接著後的接著部(接著層)賦予柔軟性。聚烯烴樹脂之分子量,並未有特別之限制。
變性劑,為包含α,β-不飽和羧酸及其衍生物中之至少一者。α,β-不飽和羧酸,可列舉如,馬來酸、富馬酸、四氫苯二甲酸、依康酸、檬康酸、巴豆酸、烏頭酸、降莰烯二羧酸等。又,α,β-不飽和聚羧酸之衍生物,可列舉如,酸酐、酸鹵化物、醯胺、醯亞胺、酯等。上述變性劑,以依康酸酐、馬來酸酐、烏頭酸酐及檬康酸酐為佳,依康酸酐及馬來酸酐,就接著性之觀點為特佳。使用變性劑之情形,只要為由α,β-不飽和羧酸及其衍生物所選出之1種以上者即可,亦可為α,β-不飽和羧酸之1種以上與其衍生物之1種以上的組合、α,β-不飽和羧酸2種以上的組合,或α,β-不飽和羧酸之衍生物之2種以上的組合。
本發明之變性劑,可配合目的,於α,β-不飽和羧酸等之中,再含有其他化合物(其他變性劑)。其他化合物(其他變性劑),例如,丙烯酸或甲基丙烯酸(以下,「丙烯酸基」及/或「甲基丙烯酸基」亦稱為「(甲基)丙烯酸基」)、(甲基)丙烯酸之衍生物、芳香族乙烯基化合物、環己基乙烯基醚等。該些其他化合物,可單獨使用亦可、將2種以上組合使用亦可。
上述(甲基)丙烯酸之衍生物,可使用下述通式(1)所表示之(甲基)丙烯酸酯。
(式中,R
1為氫原子或甲基,R
2為烴基)。
上述通式(1)中,R
1為氫原子或甲基,較佳為甲基。R
2為烴基,較佳為碳原子數8~18之烷基、碳原子數8~18之環烷基或碳原子數8~18之芳基。
上述通式(1)所示化合物,可列舉如,(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十三烷酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯等。該些化合物,可單獨使用亦可、將2個以上組合使用亦可。本發明中,就改良耐熱接著性之觀點,其他變性劑,以包含具有碳原子數8~18之烷基的(甲基)丙烯酸酯者為佳。具有碳原子數8~18之烷基的(甲基)丙烯酸酯,又以(甲基)丙烯酸辛酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十三烷酯及(甲基)丙烯酸硬脂酯為特佳。
(甲基)丙烯酸酯以外的(甲基)丙烯酸衍生物,可列舉如,(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸縮水甘油酯、含有異氰酸酯基之(甲基)丙烯酸等。
上述芳香族乙烯基化合物,可列舉如,苯乙烯、o-甲基苯乙烯、p-甲基苯乙烯、α-甲基苯乙烯等。
上述變性劑,於α,β-不飽和羧酸或其衍生物,與其他變性劑併用時,可經由變性劑而提高接枝率、提高所得變性聚烯烴系樹脂(A)對溶劑之溶解性、提高含有該變性聚烯烴系樹脂(A)之接著劑組成物的接著性等。
如上所述般,變性聚烯烴系樹脂(A)為具有至少由變性劑所產生的接枝部份。以下,將說明變性聚烯烴系樹脂(A)所包含的接枝部份的含有比例(以下,亦稱為「接枝質量」)。
上述變性聚烯烴系樹脂(A),為具有由α,β-不飽和羧酸或其衍生物所產生的接枝部份。上述變性聚烯烴系樹脂(A)中,α,β-不飽和羧酸或其衍生物所產生的接枝部份之接枝質量,就接著劑組成物之接著性的觀點,相對於變性聚烯烴系樹脂(A)100質量%,較佳為0.1~20質量%,更佳為0.2~18質量%。接枝質量為0.1質量%以上時,可使變性聚烯烴系樹脂(A)對於溶劑之溶解性更為優良,且對於由金屬等所形成的被附著物的接著性特別優良。又,接枝質量為20質量%以下時,對於由樹脂等所形成的被附著物的接著性特別優良。
上述變性聚烯烴系樹脂(A)中,α,β-不飽和羧酸或其衍生物所產生的接枝部份之接枝質量,可使用鹼滴定法求得,但α,β-不飽和羧酸之衍生物為不具有酸基的醯亞胺等情形時,接枝質量可使用傅力葉變換紅外線分光法求得。
上述變性聚烯烴系樹脂(A)中,其他變性劑為包含上述通式(1)所表示之(甲基)丙烯酸酯所產生的接枝部份之情形時,其接枝質量,相對於變性聚烯烴系樹脂(A)100質量%,較佳為0.1~30質量%,更佳為0.3~25質量%。上述(甲基)丙烯酸酯所產生的接枝部份的接枝質量為0.1~30質量%時,可使變性聚烯烴系樹脂(A)對於溶劑具有優良的溶解性,接著劑組成物,於含有後述其他樹脂或彈性體的情形時,可與該些具有優良的相溶性,而可更提高對被附著物之接著性。
上述接枝部份,於包含上述通式(1)所表示之(甲基)丙烯酸酯所產生的接枝部份之情形,所得變性聚烯烴系樹脂(A)中,接枝部份之接枝質量,可使用傅力葉變換紅外線分光法求得。
上述變性聚烯烴系樹脂(A)為使用自由基起始劑製造時,自由基起始劑,可由公知的成份中,適當地選擇。本發明中,例如,可使用苯甲醯基過氧化物、二異丙苯基過氧化物、月桂醯基過氧化物、二-t-丁基過氧化物、2,5-二甲基-2,5-二(t-丁基過氧化)己烷、氫過氧化異丙苯過氧化物等的有機過氧化物為佳。
製造上述變性聚烯烴系樹脂(A)之情形,可使用變性助劑、安定劑等。變性助劑,可列舉如,二乙烯基苯、己二烯、二環戊二烯等。又,安定劑,可列舉如,氫醌、苯醌、亞硝基苯基羥基化合物等。
上述變性聚烯烴系樹脂(A)的重量平均分子量(Mw),較佳為30,000~250,000,更佳為50,000~200,000。重量平均分子量(Mw)為30,000~250,000時,對於溶劑具有優良溶解性,使接著劑組成物對被附著物的初期接著性更為優良,此外,對於接著後的接著部的耐溶劑性亦為優良。
上述變性聚烯烴系樹脂(A)之酸價,較佳為0.1~50mgKOH/g,更佳為0.5~40mgKOH/g、更佳為1.0~30mgKOH/g。使用含有該酸價為0.1~50mgKOH/g之變性聚烯烴系樹脂(A)的接著劑組成物時,可形成充份硬化的接著部,且可得到良好的接著性、耐熱性及樹脂流出性。
本發明之接著劑組成物中,上述變性聚烯烴系樹脂(A)之含量,相對於接著劑組成物的固形分(溶劑除外)100質量%,較佳為50質量%以上,更佳為60質量%以上。但,上限較佳為99質量%。該含量未達50質量%的接著劑組成物,所形成的接著劑層會有不具有柔軟性之情形,又,所製得的一體化物也會發生翹曲等變形之情形。
上述環氧樹脂(B),為一種於100~200℃左右的加熱條件下,與上述變性聚烯烴系樹脂(A)中的羧基進行反應時,可提高反應產物對被附著物之接著性,或使包含反應產物的硬化物發揮出耐熱性的成份。
上述環氧樹脂(B),以一分子中具有2個以上的環氧基者為佳,例如,雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、溴化雙酚A型環氧樹脂等的雙酚型環氧樹脂;上述雙酚型環氧樹脂之氫化物、二環戊二烯骨架含有環氧樹脂等的具有脂環骨架之環氧樹脂;酚酚醛清漆型環氧樹脂、o-甲酚酚醛清漆型環氧樹脂、雙酚A型酚醛清漆型環氧樹脂等之酚醛清漆型環氧樹脂;苯二甲酸二縮水甘油酯、異苯二甲酸二縮水甘油酯、對苯二甲酸二縮水甘油酯、p-羥基安息香酸二縮水甘油酯、四氫苯二甲酸二縮水甘油酯、琥珀酸二縮水甘油酯、己二酸二縮水甘油酯、癸二酸二縮水甘油酯、偏苯三甲酸三縮水甘油酯等的縮水甘油酯系環氧樹脂;乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁烷二醇二縮水甘油醚、1,6-己烷二醇二縮水甘油醚、三羥甲基丙烷三縮水甘油醚、季戊四醇四縮水甘油醚、四苯基縮水甘油醚乙烷、三苯基縮水甘油醚乙烷、季戊四醇之聚縮水甘油醚、聚甘油之聚縮水甘油醚等的縮水甘油醚系環氧樹脂;三縮水甘油異三聚氰酸酯、四縮水甘油二胺基二苯基甲烷等的縮水甘油胺系環氧樹脂;環氧化聚丁二烯、環氧化大豆油等的線狀脂肪族環氧樹脂;含有磷之環氧樹脂;含有萘骨架之環氧樹脂;蒽型環氧樹脂;叔丁基兒茶酚型環氧樹脂;三苯基甲烷型環氧樹脂;四苯基乙烷型環氧樹脂;聯苯型環氧樹脂等等。但,上述環氧樹脂(B),並不僅限定於該些內容。
上述環氧樹脂(B),以雙酚型環氧樹脂、酚醛清漆型環氧樹脂,及具有脂環骨架之環氧樹脂為佳。
本發明之環氧樹脂(B),於一分子中具有2個以上的環氧基時,與變性聚烯烴系樹脂(A)進行反應中,可有效率地形成交聯構造,而使所得的硬化物產生高耐熱性。
本發明之接著劑組成物,其特徵為,含有2種以上的環氧樹脂。含有2種以上的環氧樹脂時,因具有相乘之效果,故可滿足與被附著物之接著性,及硬化物之耐熱性及介電特性。本發明中,使用2種以上一分子中具有2個以上的環氧基之環氧樹脂時,可確實地得到該效果。
具體而言,若為欲製得與被附著物具有優良接著性的接著劑組成物時,以含有酚醛清漆型環氧樹脂者為佳,若為欲製得具有優良介電特性之硬化物的接著劑組成物時,以含有具脂環骨架之環氧樹脂為佳。又,該些環氧樹脂併用時,可使接著性或介電特性得到相乘的良好效果。酚醛清漆型環氧樹脂,以雙酚A型酚醛清漆型環氧樹脂為較佳,又,具有脂環骨架之環氧樹脂,以具有二環戊二烯骨架之環氧樹脂為較佳。
本發明中,可確實得到上述效果的環氧樹脂(B),係如以下所示。
(1)併用具有脂環骨架的環氧樹脂,與酚醛清漆型環氧樹脂及雙酚型環氧樹脂中之任一者,兩者的含有比例,於兩者合計為100質量%時,較佳為20~95質量%及5~80質量%,更佳為30~85質量%及15~70質量%之態樣
(2)併用酚醛清漆型環氧樹脂,與雙酚型環氧樹脂,兩者的含有比例,於兩者合計為100質量%時,較佳為20~95質量%及5~80質量%,更佳為30~85質量%及15~70質量%之態樣
本發明之接著劑組成物所含的上述環氧樹脂(B)之合計含量之比例,就與被附著物之接著性,及硬化物之耐熱性及介電特性之觀點,相對於上述變性聚烯烴系樹脂(A)100質量份,為1~20質量份,較佳為3~15質量份。
本發明之接著劑組成物,可含有具有烷氧矽烷基之咪唑系化合物(C)。
咪唑系化合物,一般為作為環氧樹脂之硬化劑使用,但於本發明中,使用同時含有變性聚烯烴系樹脂(A)及環氧樹脂(B),與上述具有烷氧矽烷基之咪唑系化合物(C)的接著劑組成物時,特別是可提高對於被金屬鍍敷的銅箔之接著性。推測應為烷氧矽烷基及咪唑構造對於金屬及變性聚烯烴系樹脂(A)中任一者皆顯示出有高親和性,故經由其相互作用而可提高接著性。此外,咪唑構造,推測因可與環氧樹脂(B)進行反應,故對於聚醯亞胺薄膜及金屬鍍敷之銅箔而言,將使用含有含烷氧矽烷基之咪唑系化合物(C)的接著劑組成物進行接合而得之可撓式貼銅層合板進行回焊步驟時,也可維持該優良的接著性。
上述具有烷氧矽烷基之咪唑系化合物(C),以下述通式(2)所表示之化合物或其酸加成物為佳。含有該些化合物的接著劑組成物,可充份地產生上述之效果。
(式中,R
1及R
2各自獨立為,由氫原子、取代或非取代之烷基,及取代或非取代之芳基所成之群所選出之1種,R
3及R
4各自獨立為,由氫原子,及取代或非取代之烷基所成之群所選出之1種,R
3中之至少1個為取代或非取代之烷基。n為1~3。R
5為伸烷鏈或伸烷鏈之一部份被下述式(3)、(4)、(5)及(6)所表示之基中之至少1個所取代的2價之基)。
(式中,R
6為氫原子或羥基)。
(式中,R
7為,由氫原子、取代或非取代之烷基,及取代或非取代之芳基所選出之1種)。
(式中,R
8及R
9各自獨立為,由氫原子、取代或非取代之烷基,及取代或非取代之芳基所選出之1種)。
上述通式(2)所表示之具有烷氧矽烷基之咪唑系化合物,為一分子中同時具有咪唑基及烷氧矽烷基之化合物。構成咪唑基之咪唑環,可具有飽和烴基、不飽和烴基等的取代基,上述通式(2)之含有烷氧矽烷基之咪唑系化合物的R
1或R
2,各自獨立為由氫原子、取代或非取代之烷基,及取代或非取代之芳基所成之群所選出之1種。
上述通式(2)所表示之化合物中,烷氧矽烷基及咪唑基,較佳為介由碳原子數1~10之伸烷鏈或該伸烷鏈之一部份被式(3)、(4)、(5)及(6)所表示之基中之至少1個所取代的2價之基而鍵結者。上述通式(2)所表示之化合物中,以下述通式(7)及(8)所表示之化合物為佳。
(式中,R
1及R
2各自獨立為,由氫原子、取代或非取代之烷基,及取代或非取代之芳基所成之群所選出之1種,R
3及R
4各自獨立為,由氫原子,及取代或非取代之烷基所成之群所選出之1種,R
3中之至少1個為取代或非取代之烷基,R
6為氫原子或羥基。m為1~30,n為1~3)。
(式中,R
1及R
2各自獨立為,由氫原子、取代或非取代之烷基,及取代或非取代之芳基所成之群所選出之1種,R
3及R
4各自獨立為,由氫原子,及取代或非取代之烷基所成之群所選出之1種,R
3中之至少1個為取代或非取代之烷基,R
7為由氫原子、取代或非取代之烷基,及取代或非取代之芳基所選出之1種。m為1~30,n為1~3)。
上述具有烷氧矽烷基之咪唑系化合物(C)的具體例,可列舉如,1-(2-羥基-3-三甲氧矽烷基丙氧基丙基)-咪唑、1-(2-羥基-3-三乙氧矽烷基丙氧基丙基)-咪唑、1-(2-羥基-3-三丙氧矽烷基丙氧基丙基)-咪唑、1-(2-羥基-3-三丁氧矽烷基丙氧基丙基)-咪唑、1-(2-羥基-3-三乙氧矽烷基丙氧基丙基)-2-甲基咪唑、1-(2-羥基-3-三乙氧矽烷基丙氧基丙基)-4-甲基咪唑、1-(3-側氧-4-三甲氧矽烷基丙氧基丙基)-咪唑、1-三甲氧矽烷基丙胺基)-咪唑等。
上述通式(2)所表示之化合物,可使咪唑、2-烷基咪唑、2,4-二烷基咪唑、4-乙烯基咪唑等的咪唑化合物,與3-環氧丙氧基烷基矽烷化合物等進行反應而製得。上述具有烷氧矽烷基之咪唑系化合物(C),不僅可使用上述通式(2)所表示之化合物,亦可該化合物之鹽或酸加成物。附加之酸,可列舉如,乙酸、乳酸、水楊酸、安息香酸、己二酸、苯二甲酸、枸椽酸、酒石酸、馬來酸、偏苯三甲酸、磷酸、三聚異氰酸等。該些之酸,可單獨使用亦可,將2種以上組合使用亦可。
又,亦可使用上述通式(2)所表示之化合物之烷氧矽烷基經水解而生成的矽醇化合物、矽醇化合物經脫水縮合反應而生成的聚有機矽氧烷化合物等。
上述通式(7)所示化合物,可經由咪唑、2-烷基咪唑、2,4-二烷基咪唑、4-乙烯基咪唑等的咪唑化合物,與3-環氧丙氧基丙基三烷氧矽烷、3-環氧丙氧基丙基二烷氧基烷基矽烷、3-環氧丙氧基丙基烷氧基二烷基矽烷等的3-環氧丙氧基丙基矽烷化合物進行反應等方式而可製得。該些之中,特佳之原料為,咪唑及3-環氧丙氧基丙基三甲氧基矽烷,反應產物為1-(2-羥基-3-三甲氧矽烷基丙氧基丙基)-咪唑。
上述通式(8)所示化合物,可經由咪唑化合物,與3-甲基丙烯醯氧基丙基三甲氧基矽烷等進行反應等之方式而可製得。
含有作為上述具有烷氧矽烷基之咪唑系化合物(C)的上述通式(7)所表示之化合物或其酸加成物及上述通式(8)所示化合物或其酸加成物的接著劑組成物,可提供具有良好耐熱性的硬化物,而為較佳的組成物。又,該些化合物,對於溶劑具有良好的溶解性,而為較佳,更佳為上述通式(7)所表示之化合物的酸加成物。
本發明之接著劑組成物含有上述具有烷氧矽烷基之咪唑系化合物(C)時,其含量,於變性聚烯烴系樹脂(A)及環氧樹脂(B)之合計為100質量份時,就對於經金屬鍍敷之銅箔的密著性及耐回焊性之觀點,較佳為0.3~5.0質量份,更佳為0.5~3.0質量份。上述含有烷氧矽烷基之咪唑系化合物(C)的含量過少時,對於本發明之接著劑組成物的經金屬鍍敷之銅箔,會造成密著性與耐回焊性降低,另一方面,該含量過多時,會有造成接著劑組成物的保存安定性降低之情形。
本發明之接著劑組成物,可配合各種目的,含有抗氧化劑(D)、含有磷之化合物(E)、導電填料(F)等。
上述抗氧化劑(D)的具體例,可列舉如,2,6-二-t-丁基-4-甲酚、n-十八烷基-3-(3’,5’-二-t-丁基-4’-羥基苯基)丙酸酯、四[伸甲基-3-(3,5-二-t-丁基-4-羥基苯基)丙酸酯]甲烷等的酚系抗氧化劑;二月桂基-3,3’-硫二丙酸酯、二肉豆蔻基-3,3’-二硫丙酸酯等的硫系抗氧化劑;三壬基苯基亞磷酸酯及三(2,4-二-t-丁基苯基)亞磷酸酯等的磷系抗氧化劑等。該些抗氧化劑,可單獨使用亦可,將2種以上組合使用亦可。
本發明之接著劑組成物含有抗氧化劑(D)時,可抑制本發明之接著劑組成物所含成份的氧化分解、抑制接著劑組成物之硬化物的介電特性惡化,或焊料處理後接著性降低等。
本發明之接著劑組成物,於含有抗氧化劑(D)時,抗氧化劑(D)之含量,於變性聚烯烴系樹脂(A)及環氧樹脂(B)之合計為100質量份時,較佳為0.1~10質量份,更佳為0.2~5質量份。上述抗氧化劑(D)之含量於該範圍時,可抑制接著劑組成物之氧化。
上述含有磷之化合物(E),除上述磷系抗氧化劑以外的化合物,具體例如,磷酸三聚氰胺、聚磷酸三聚氰胺、磷酸胍、聚磷酸胍、磷酸銨、聚磷酸銨、磷酸醯胺銨、聚磷酸醯胺銨、磷酸胺甲酸酯、聚磷酸胺甲酸酯、三-二乙基次膦(phosphine)酸鋁、三甲基乙基次膦酸鋁、三-二苯基次膦酸鋁、雙-二乙基次膦酸鋅、雙甲基乙基次膦酸鋅、雙-二苯基次膦酸鋅、雙-二乙基次膦酸氧鈦、四-二乙基次膦酸鈦、雙甲基乙基次膦酸氧鈦、四甲基乙基次膦酸鈦、雙-二苯基次膦酸氧鈦、四-二苯基次膦酸鈦等。該些化合物,可單獨使用亦可、將2種以上組合使用亦可。
上述含有磷之化合物(E),可賦予本發明之接著劑組成物提高難燃性之效果。
本發明之接著劑組成物,於含有含磷之化合物(E)時,含有磷之化合物(E)之含量,只要不會使接著劑之特性惡化之範圍,並未有特別之限定,於變性聚烯烴系樹脂(A)及環氧樹脂(B)之合計為100質量份時,較佳為0.5~50質量份,更佳為1~30質量份。
上述導電填料(F)的具體例,可列舉如,石墨;銅粉、鋁粉、銀粉等的金屬粉等。
上述導電填料(F),對於本發明之接著劑組成物除可提高耐熱性以外,亦具有賦予接著劑層導電性之作用。因此,含有上述導電填料(F)的接著劑組成物,特別適合使用作為導電性接著劑之構成成份或電磁波遮蔽材之形成材料。
本發明之接著劑組成物,於含有導電填料(F)時,其含量,就接著劑層之耐熱性及導電性之觀點,於變性聚烯烴系樹脂(A)及環氧樹脂(B)之合計為100質量份時,較佳為10~350質量份。該含量過多時,對於經金屬鍍敷之銅箔等,會有接著性不充份之情形。
又,本發明之接著劑組成物中,於不會影響接著劑組成物機能之範圍,可再含有其他熱可塑性樹脂、黏著賦予劑、其他的難燃劑、具有烷氧矽烷基之咪唑系化合物(C)以外的硬化劑或硬化促進劑、其他的填料、耦合劑、均染劑、消泡劑、顏料、溶劑等。
其他的熱可塑性樹脂,例如,苯氧樹脂、聚醯胺樹脂、聚酯樹脂、聚碳酸酯樹脂、聚伸苯基氧化物樹脂、聚胺基甲酸酯樹脂、聚縮醛樹脂、聚乙烯系樹脂、聚丙烯系樹脂、聚乙烯系樹脂等。該些熱可塑性樹脂,可單獨使用亦可、將2種以上合併使用亦可。
上述黏著賦予劑,例如,苯并呋喃-茚樹脂、萜烯樹脂、萜烯-酚樹脂、松脂樹脂、p-t-丁酚-乙炔樹脂、酚-甲醛樹脂、二甲苯-甲醛樹脂、石油系烴樹脂、氫化烴樹脂、松節油系樹脂等。該些的黏著賦予劑,可單獨使用亦可、將2種以上合併使用亦可。
其他的難燃劑,可為有機系難燃劑及無機系難燃劑中之任一種。有機系如,三聚氰胺、密白胺、三聚氰胺氰尿酸酯等的三系化合物,或三聚氰酸化合物、三聚異氰酸化合物、三唑系化合物、四唑化合物、重氮化合物、脲等的氮系難燃劑;聚矽氧化合物、矽烷化合物等的矽系難燃劑等。又,無機系難燃劑如,氫氧化鋁、氫氧化鎂、氫氧化鋯、氫氧化鋇、氫氧化鈣等的金屬氫氧化物;氧化錫、氧化鋯、氧化鉬、氧化鎳等的金屬氧化物;碳酸鋅、碳酸鎂、碳酸鋇、硼酸鋅、水合玻璃等。該些難燃劑,可單獨使用亦可、將2種以上合併使用亦可。
其他的硬化劑,例如,胺系硬化劑、酸酐系硬化劑等。胺系硬化劑,例如,甲基化三聚氰胺樹脂、丁基化三聚氰胺樹脂、苯併胍樹脂等的三聚氰胺樹脂;雙氰二醯胺、4,4’-二苯基二胺基碸等。又,酸酐系硬化劑如,芳香族系酸酐,及脂肪族系酸酐等。該些硬化劑,可單獨使用亦可、將2種以上合併使用亦可。本發明之接著劑組成物含有其他的硬化劑時,其他的硬化劑之含量,相對於環氧樹脂(B)100質量份,較佳為1~100質量份,更佳為5~70質量份。
上述硬化促進劑,例如可為促進變性聚烯烴系樹脂(A)與環氧樹脂(B)進行反應者,除上述胺系硬化劑以外的三級胺系硬化促進劑或三級胺鹽系硬化促進劑、咪唑系硬化促進劑等。該些硬化促進劑,可單獨使用亦可、將2種以上合併使用亦可。
三級胺系硬化促進劑,例如,苄基二甲胺、2-(二甲胺基甲基)酚、2,4,6-三(二甲胺基甲基)酚、四甲基胍、三乙醇胺、N,N’-二甲基哌嗪、三乙烯基二胺、1,8-二氮雜雙環[5.4.0]十一烯等。
三級胺鹽系硬化促進劑,例如,1,8-二氮雜雙環[5.4.0]十一烯的甲酸鹽、辛酸鹽、p-甲苯磺酸鹽、o-苯二甲酸鹽、酚鹽或酚酚醛清漆樹脂鹽,或1,5-二氮雜雙環[4.3.0]壬烯的甲酸鹽、辛基酸鹽、p-甲苯磺酸鹽、o-苯二甲酸鹽、酚鹽或酚酚醛清漆樹脂鹽等。
咪唑系硬化促進劑,例如,2-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、1,2-二甲基咪唑、2-甲基-4-乙基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、2,4-二胺基-6-[2’-甲基咪唑基-(1’)]乙基-s-三、2,4-二胺基-6-[2’-十一烷基咪唑基-(1’)]乙基-s-三、2,4-二胺基-6-[2’-乙基-4’-甲基咪唑基-(1’)]乙基-s-三、2,4-二胺基-6-[2’-甲基咪唑基-(1’)]乙基-s-三三聚異氰酸加成物、2-苯基咪唑三聚異氰酸加成物、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑等。
本發明之接著劑組成物含有硬化促進劑時,硬化促進劑之含量,相對於環氧樹脂(B)100質量份,較佳為1~10質量份,更佳為2~5質量份。硬化促進劑之含量於上述範圍內時,具有優良的接著性及耐熱性。
又,上述耦合劑,例如,乙烯基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、p-苯乙烯基三甲氧基矽烷、3-甲基丙烯醯氧基(methacryloxy)丙基甲基二甲氧基矽烷、3-丙烯醯氧丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、3-醯脲丙基三乙氧基矽烷、3-氫硫基丙基甲基二甲氧基矽烷、雙(三乙氧矽烷基丙基)四硫醚、3-異氰酸酯丙基三乙氧基矽烷、咪唑矽烷等的矽烷系耦合劑;鈦酸酯系耦合劑;鋁酸酯系耦合劑;鋯系耦合劑等。該些可單獨使用亦可、將2種以上組合使用亦可。
其他的填料的具體例,可列舉如,碳酸鈣、氧化鋁、氧化鎂、氮化鋁、氧化鈦、氧化鋅、滑石、氣相二氧化矽、其他的二氧化矽等的粉體所形成之無機填料;氟樹脂粉末等的樹脂填料等。其他的填料之添加效果,可提高由本發明之接著劑組成物所形成的接著劑層之耐熱性等。又,使用氧化鋁、氧化鎂、氮化鋁等較高熱傳導性之填料時,可提高接著劑層的熱傳導性。又,使用氣相二氧化矽時,可改善接著劑組成物的塗佈性。
上述溶劑,例如,甲醇、乙醇、異丙醇、n-丙醇、異丁醇、n-丁醇、苄醇、乙二醇單甲醚、丙二醇單甲醚、二乙二醇單甲醚、二丙酮醇等的醇類;丙酮、甲基乙基酮、甲基異丁基酮、甲基戊酮、環己酮、異佛爾酮等的酮類;甲苯、二甲苯、乙基苯、三甲苯等之芳香族烴類;乙酸甲基、乙酸乙基、乙二醇單甲醚乙酸酯、3-甲氧基丁基乙酸酯等的酯類;己烷、庚烷、環己烷、甲基環己烷等的脂肪族烴類等。該些溶劑,可單獨使用亦可、將2種以上組合使用亦可。本發明之接著劑組成物,為包含溶劑的溶液或分散液(樹脂塗料)時,於塗佈基材形成塗膜時,可圓滑地進行,而容易製得所期待的厚度之接著劑層。
本發明之接著劑組成物包含溶劑時,該溶劑之含量,就包含形成接著劑層的作業性等之觀點,較佳為20~97質量%,更佳為50~90質量%。溶劑含量於上述範圍內時,可使溶液達適當黏度,而容易進行均勻的塗佈。
本發明之接著劑組成物,較佳為使變性聚烯烴系樹脂(A)及環氧樹脂(B)溶解於溶劑,且其他的成份為分散或溶解於該溶液的組成物。
本發明之接著劑組成物,可將變性聚烯烴系樹脂(A)、環氧樹脂(B)及其他成份混合之方式而製得。原料成份之混合方法,只要可製得均勻的組成物時,並未有特別之限定。
本發明之接著劑組成物,適合使用於相同材料或相異材料所形成2個構件相互間之接著。又,本發明之接著劑組成物,適合製造1個構件之表面,具有具接著性之層(接著劑層)的製品,即,附有接著劑層的層合體。後者之情形,可將包含溶劑的液狀接著劑組成物,塗佈於構件之表面,於不會使塗膜硬化之溫度下進行乾燥結果,而製得較佳為具有B平台狀的具有接著性之層(接著劑層)的製品(包覆層薄膜、接合片等)。具有B平台狀的具有接著劑層之構件,與其他的構件,較佳為於加壓條件下、加熱至100℃以上之方式,而可製造具有充份接著性的一體化物。
本發明中,不使用含有上述導電填料(F)等的導電成份的接著劑組成物,於形成接著劑層之後,再加熱形成硬化物時,於測定該硬化物於周波數1GHz下的介電係數(ε)為2.5以下,可使其損耗因子(tanδ)未達0.01。因此,本發明之接著劑組成物,適合製造具有優良介電特性的FPC相關製品。又,周波數1GHz所測定之接著劑硬化物的損耗因子(tanδ),以未達0.01為佳。介電係數及損耗因子,可經由接著劑組成物所含之變性聚烯烴系樹脂(A)及環氧樹脂(B)之種類,及該些的含有比例而調整,故可配合用途,設定各種構成內容的接著劑組成物。又,介電係數及損耗因子之測定方法係如後所述。
2.包覆層薄膜
使用本發明之接著劑組成物,於電氣絕緣性基材薄膜之單一面上,形成接著劑層之方式,可製得包覆層薄膜。
上述基材薄膜所包含的樹脂,例如,聚醯亞胺、聚醚醚酮、聚伸苯基硫醚、芳香族聚醯胺、聚乙烯萘酯、液晶聚合物等。該些之中,又就接著劑層對基材薄膜之接著性及介電特性之觀點,以使用聚醯亞胺、聚乙烯萘酯及液晶聚合物為佳,又以聚醯亞胺為特佳。本發明之一實施形態之包覆層薄膜之特徵為,使用上述本發明之接著劑組成物所得的接著劑層,為形成於聚醯亞胺薄膜之單一面上。
製造本發明之包覆層薄膜之方法,例如,將含有溶劑之接著劑組成物(樹脂塗料),塗佈於含有聚醯亞胺等的基材薄膜之表面,形成塗膜(樹脂塗料層)後,由塗膜中去除溶劑,而可製得形成B平台狀的接著劑層之包覆層薄膜。
上述基材薄膜的厚度,並未有特別之限定,較佳為5~100μm,更佳為5~50μmm、更佳為5~30μm。
去除上述溶劑之溫度,較佳為40~250℃,更佳為70~170℃。去除溶劑之方法,並未有特別之限定,通常可使用將附有塗膜之薄膜,於使用熱風加熱、遠紅外線加熱、高周波衍生加熱等的爐中進行乾燥之方法為佳。上述塗膜之乾燥後的厚度,即,接著劑層的厚度,較佳為5~45μm,更佳為10~35μm。
適合製造本發明之包覆層薄膜的基材薄膜,可使用市售物品,例如,東麗・杜邦公司製「KAPTON(登記商標)」、東洋紡績公司製「XENOMAX(登記商標)」、宇部興產公司製「UPILEX(登記商標)-S」、Kaneka公司製「APICAL(登記商標)」等。
又,製造其他的包覆層薄膜時,基材薄膜可使用帝人杜邦薄膜公司製「TEONEX(登記商標)」等的聚乙烯萘酯薄膜、Kuraray公司製「VECSTAR(登記商標)」、Primetech公司製「BYOCK(登記商標)」等的液晶聚合物薄膜等。基材薄膜,亦可使用將該樹脂薄膜化至所期待的厚度者。
又,本發明之包覆層薄膜,必要時,於接著劑層之表面,亦具備離型性薄膜層。形成上述離型性薄膜層時,可使用聚乙烯對苯二甲酸酯薄膜、聚乙烯薄膜、聚丙烯薄膜、聚矽氧離型處理紙、聚烯烴樹脂包覆紙、聚甲基戊烯(TPX)薄膜、氟系樹脂薄膜等公知的離型性薄膜。具備離型性薄膜層的包覆層薄膜,因接著劑層被保護,故適用於保管之際等。
3.接合片
本發明之接合片,為附有接著劑層的層合體之另一態樣。
本發明之接合片,為使用上述本發明之接著劑組成物,於離型性薄膜之表面形成接著劑層者。又,本發明之接合片,亦可為於2片離型性薄膜之間,具備接著劑層之態樣。本發明之接合片,可將離型性薄膜剝離後使用。離型性薄膜,可使用與製造上述本發明之包覆層薄膜時所使用者為相同的離型性薄膜。
製造本發明之接合片的方法,例如,可使用於離型性薄膜之表面,塗佈含有溶劑之接著劑組成物(樹脂塗料),形成塗膜(樹脂塗料層)之後,再由塗膜中去除溶劑之方法。去除溶劑時,可使用製造上述本發明之包覆層薄膜的方法中之去除溶劑之方法。
上述離型性薄膜的厚度,並未有特別之限定,較佳為5~100μm,更佳為5~50μm,最佳為5~30μm。
本發明之接合片中,接著劑層的厚度,較佳為5~100μm,更佳為10~70μm,最佳為10~50μm。
上述接著劑組成物中,含有上述導電填料(F)時,使用該導電填料(F)及含有溶劑之接著劑組成物(樹脂塗料)時,可製得具備有具導電性的接著層之導電性接合片。
4.貼銅層合板
本發明之貼銅層合板,為使用上述本發明之接著劑組成物,貼合聚醯亞胺薄膜與銅箔而得之層合體。即,本發明之貼銅層合板,為依基材薄膜、接著劑層及銅箔之順序所構成者。本發明之貼銅層合板中,接著劑層及銅箔,可形成於基材薄膜之兩面。即,本發明之貼銅層合板,可為於基材薄膜之1面側及其他面側,依序具備接著劑層及銅箔而得之層合體。本發明之接著劑組成物,因與含銅之物品具有優良接著性,故本發明之貼銅層合板,可形成具有優良安定性之一體化物。又,本發明之貼銅層合板所含的接著劑層,可由硬化物所形成者亦可、未硬化物所形成者亦可。
本發明之貼銅層合板中,接著劑層的厚度,較佳為5~45μm,更佳為10~35μm。
製造本發明之貼銅層合板之方法,例如,可使用將上述本發明之包覆層薄膜的接著劑層與銅箔進行面接觸,於80℃~150℃下進行熱層合,再以後硬化方式使接著劑層硬化之方法。後硬化之條件,例如,為100℃~200℃、30分鐘~4小時。又,上述銅箔,並未有特別之限定,可使用電解銅箔、壓延銅箔等。
5.電磁波遮蔽材
本發明之電磁波遮蔽材,為具備使用上述本發明之接著劑組成物而形成接著劑層之物品。本發明中之較佳態樣為,接著劑層為含有導電填料(F)之電磁波遮蔽材。依此方式,可防止電磁波之雜訊所造成的電子機器之誤動,或受到通信電波之影響而洩漏機密資訊等。
製造本發明之電磁波遮蔽材之方法,例如,可使用將具備有含有導電填料(F)之接著劑層的導電性接合片,與遮蔽材接合之方法。
[實施例]
本發明,將以實施例及比較例為基礎作更具體的說明,但本發明並不受該些內容所限定。
1.原料
1-1.變性聚烯烴系樹脂(A)
使用依下述方法製得之變性聚烯烴系樹脂a1~a4。
(1)變性聚烯烴系樹脂a1
將使用茂金屬觸媒作為聚合觸媒所製得之由丙烯單位75莫耳%及丁烯單體25莫耳%所形成之丙烯-丁烯無規共聚物100質量份、馬來酸酐22質量份及二-t-丁基過氧化物6質量份溶解於甲苯溶劑,將此溶液於1L高壓釜中,升溫至140℃,於該溫度下,再攪拌3小時。其次,將所得反應液冷卻,將此反應液,注入置有大量的甲基乙基酮的容器中,將樹脂析出。隨後,經由離心分離,將殘留的未反應物等進行分離、純化。隨後,將回收的樹脂,於減壓下進行70℃、5小時之乾燥處理,而製得變性聚烯烴系樹脂a1。變性聚烯烴系樹脂a1,其重量平均分子量為5.5萬、酸價為30mgKOH/g。又,構成該變性聚烯烴系樹脂a1的接枝部份之含有比例,為5.2質量%。
(2)變性聚烯烴系樹脂a2
將使用茂金屬觸媒作為聚合觸媒所製得之由丙烯單位75莫耳%及丁烯單體25莫耳%所形成之丙烯-丁烯無規共聚物100質量份、馬來酸酐18質量份及二-t-丁基過氧化物6質量份溶解於甲苯溶劑,將此溶液於1L高壓釜中,升溫至140℃,於該溫度下,再攪拌3小時。其次,將所得反應液冷卻,將此反應液,注入置有大量的甲基乙基酮的容器中,將樹脂析出。隨後,經由離心分離,將殘留的未反應物等進行分離、純化。隨後,將回收的樹脂,於減壓下進行70℃、5小時之乾燥處理,製得變性聚烯烴系樹脂a2。變性聚烯烴系樹脂a2,其重量平均分子量為6.5萬、酸價為20mgKOH/g。又,構成該變性聚烯烴系樹脂a2的接枝部份之含有比例,為3.5質量%。
(3)變性聚烯烴系樹脂a3
將使用茂金屬觸媒作為聚合觸媒所製得之由丙烯單位97莫耳%及伸乙基單位3莫耳%所形成之丙烯-伸乙基無規共聚物100質量份、馬來酸酐1.5質量份、甲基丙烯酸月桂酸酯0.8質量份及二-t-丁基過氧化物1.2質量份,使用圓筒部的最高溫度設定為170℃的二軸擠壓機,進行混練反應。隨後,於擠壓機內進行減壓脫氣,去除殘留的未反應物,而製得變性聚烯烴系樹脂a3。變性聚烯烴系樹脂a3,其重量平均分子量為13萬、酸價為15mgKOH/g。又,構成該變性聚烯烴系樹脂a3的接枝部份之含有比例,為2.6質量%。
(4)變性聚烯烴系樹脂a4
將旭化成公司製氫化苯乙烯丁二烯嵌段共聚物「TUFTEC H1052」(商品名)或100質量份、馬來酸酐1.5質量份、甲基丙烯酸月桂酸酯0.8質量份及二-t-丁基過氧化物1.2質量份,使用圓筒部的最高溫度設定為170℃之二軸擠壓機,進行混練反應。隨後,於擠壓機內進行減壓脫氣,去除殘留的未反應物,而製得變性聚烯烴系樹脂a4。變性聚烯烴系樹脂a4,其重量平均分子量為6萬、酸價為15mgKOH/g。又,構成該變性聚烯烴系樹脂a4的接枝部份之含有比例,為2.6質量%。
1-2.環氧樹脂(B)
(1)環氧樹脂b1
DIC公司製雙酚A型酚醛清漆型環氧樹脂「EPICLON N-865」(商品名)
(2)環氧樹脂b2
DIC公司製含有二環戊二烯骨架之環氧樹脂「EPICLON HP-7200」(商品名)
(3)環氧樹脂b3
日本化藥公司製甲酚酚醛清漆型環氧樹脂「EOCN-102S」(商品名)
(4)環氧樹脂b4
三菱化學公司製雙酚A型環氧樹脂「JER 828」(商品名)
1-3.具有烷氧矽烷基之咪唑系化合物(C)
(1)咪唑系化合物c1
1-(2-羥基-3-三甲氧矽烷基丙氧基丙基)-咪唑
(2)咪唑系化合物c2
咪唑系化合物c1之乙酸加成物
1-4.抗氧化劑(D)
Adeka公司製酚系抗氧化劑「ADEKASTUFF A330」(商品名)
1-5.含有磷之化合物(E)
Clariant公司製二甲基次膦(phosphine)酸鋁「Exolit OP935」(商品名)
1-6.導電填料(F)
福田金屬箔粉工業公司製銅粉「FCC-115A」(商品名)
1-7.硬化促進劑
四國化成工業公司製咪唑系硬化促進劑「Q-AZOLE C11-Z」(商品名)
1-8.其他的填料
日本Aerosil公司製氣相二氧化矽「AEROSIL R974」(商品名)(平均粒徑12nm)
1-9.溶劑
由甲基環己烷、甲苯、甲基乙基酮及甲醇所形成的混合溶劑(質量比=270:180:5:2)
實施例1~14及比較例1~4
於附有攪拌裝置之燒瓶中,將上述原料依表1所示比例添加,於60℃加溫下,攪拌6小時,將成份(A)、成份(B)、成份(C)、成份(D)及硬化促進劑溶解於溶劑中,將成份(E)、成份(F)及其他的填料分散於其中,而製得實施例1~14及比較例1~4之液狀接著劑組成物。
使用該些所製得之液狀接著劑組成物,製得包覆層薄膜、接合片,及接著試驗片A及B,並進行下述(i)~(v)之評估。又,另製造不含實施例1~14及比較例1~4之液狀接著劑組成物之成份(F)的液狀接著劑組成物(無導電填料),進行下述(vi)之評估。
(1)包覆層薄膜之製作
將液狀接著劑組成物,以乾燥後的厚度為40μm之方式,使用滾筒塗佈於厚度25μm聚醯亞胺薄膜之表面,於140℃下進行2分鐘乾燥處理,製得具有接著劑層之包覆層薄膜。
(2)接著試驗片A之製作
準備厚度35μm的經金屬鍍敷之銅箔。隨後,以該金屬鍍敷處理面接觸上述包覆層薄膜之接著劑層面之方式重疊,於150℃、0.3MPa及1m/分鐘之條件下進行壓合。所得層合體(聚醯亞胺薄膜/接著劑層/金屬鍍敷銅箔),於150℃及3MPa之條件下,進行5分鐘加熱壓著後,再於烤箱中,以160℃、2小時時間進行後硬化處理,製得接著試驗片A。
(3)接合片之製作
準備厚度35μm之離型性PET薄膜。隨後,將液狀接著劑組成物以乾燥後的厚度為25μm之方式,使用滾筒塗佈於該表面,進行140℃、2分鐘之乾燥後,製得具有接著劑層之接合片。
(4)接著試驗片B之製作
準備厚度300μm之經鎳鍍敷的SUS304板,將該鎳鍍敷處理面對上述接合片的接著劑層進行接觸方式重疊,於150℃及0.3MPa、1m/分鐘之條件進行壓合,製得層合體X(SUS304板/接合片)。
另外,準備一具備厚度25μm的聚醯亞胺薄膜,與於其單一面之表面所形成的銅之線路圖型,以線路圖型接觸接著劑層而被覆線路圖型的包覆層薄膜部(聚醯亞胺層的厚度25μm)的可撓式印刷配線板。又,於被覆線路圖型的包覆層薄膜部中,形成直徑1mm的貫通孔(through hole),並經由該貫通孔,使銅之線路圖型露出。
由上述層合體X中,剝離離型性PET薄膜,使接著於SUS304板的接著劑層,與上述可撓式印刷配線板的包覆層薄膜部側表面進行全面接觸,於150℃及3MPa之條件,進行5分鐘壓著。隨後,再於烤箱內,以160℃、2小時時間進行後硬化處理,而製得接著試驗片B(SUS304板/接著劑層/可撓式印刷配線板)。
(i)剝離接著強度
接著性之評估,為使用依JIS C 6481「印刷配線板用貼銅層合板試驗方法」為基準,於溫度23℃及拉伸速度50mm/分鐘之條件,測定由各接著試驗片A的金屬鍍敷處理後的銅箔剝離聚醯亞胺薄膜時,剝離180°時之接著強度(N/mm)。測定時的接著試驗片之寬度為10mm。
(ii)焊料耐熱性
依JIS C 6481為基準,依下述條件進行試驗。
將聚醯亞胺薄膜之面向上,使其上述接著試驗片A浮於260℃的焊浴中60秒鐘,以目視方式評估接著劑層之膨脹、剝離等外觀異常現象之有無。其結果,未確認發生膨脹、剝離等外觀異常者,標記為「○」;確認發生膨脹、剝離等外觀異常者,標記為「×」。
又,將由上述焊浴取出之試驗片,依JIS C 6481為基準,測定於23℃下,將聚醯亞胺薄膜由經金屬鍍敷的銅箔上剝離時,剝離180°時之接著強度(N/cm)。測定時之接著試驗片寬度設定為10mm、拉伸速度設定為50mm/分鐘。
(iii)難燃性
將上述包覆層薄膜以160℃、2小時時間進行加熱硬化,依UL-94為基準,進行難燃性評估。試驗合格(VTM-0級)者,標記為「○」;不合格者,標記為「×」。
(iv)導電性(連接電阻)
使用電阻值測定器測定上述接著試驗片B(SUS板/接著劑層/可撓式印刷配線板)之SUS板,與可撓式印刷配線板的線路圖型的銅部份之間的連接電阻值。其結果,連接電阻值未達1Ω者,標記為「○」;1~3Ω者,標記為「△」;超過3Ω者,標記為「×」。
(v)焊料處理後之導電性(連接電阻)
使上述接著試驗片B浮於260℃之焊料浴中60秒鐘。隨後,由焊料浴中取出,使用電阻值測定器測定接著試驗片B之SUS板,與可撓式印刷配線板的線路圖型的銅部份之間的連接電阻值。其結果,連接電阻值未達1Ω者,標記為「○」;1~3Ω者,標記為「△」;超過3Ω者,標記為「×」。
(vi)介電特性(介電係數及損耗因子)
將液狀接著劑組成物(無導電填料),使用滾筒塗佈於厚度38μm之離型性聚乙烯對苯二甲酸酯薄膜之表面。其次,將附有該塗膜的薄膜靜置於烘箱內,將塗膜進行120℃、3分鐘乾燥後,形成被膜(接著劑層),而製得接合片。其次,將此接合片靜置於烘箱內,進行180℃、30分鐘之加熱處理。隨後,將離型性薄膜剝離,製得介電特性評估用的硬化試驗片。
使用Agilent公司製「電子回路網解析裝置85071E-300」,依分離柱介電體共振器法(SPDR法),於溫度23℃及周波數1GHz之條件,對15mm×80mm×50μm的硬化試驗片測定介電係數(ε)及損耗因子(tanδ)。
評估結果係如表2所示。
由表2結果得知以下內容。
實施例1~14的接著劑組成物,無論任一種,對於經金屬鍍敷的銅箔皆具有優良的接著性。該些之中,實施例1及8,為含有具有烷氧矽烷基之咪唑系化合物(C)的接著劑組成物之例,其與不含組成物的實施例9相比較時,對於經金屬鍍敷的銅箔具有更優良的密著性及耐回焊性。
另一方面,比較例1~3為由僅含有1種環氧樹脂所得之組成物,故無論耐回焊性及介電特性中之任一者或二者皆為低劣,又,未含有環氧樹脂的比較例4,其耐回焊性並不充份。
又,實施例1~14的接著劑組成物(無導電填料),無論任一者,其硬化物皆顯示出優良的介電特性。
[產業上之利用性]
本發明之接著劑組成物,對於樹脂薄膜、經金屬鍍敷的銅箔等的被附著物具有優良的接著性,其硬化物亦具有優良的介電特性,又,亦具有優良的焊料耐熱性。此外,使用含有導電性填料的接著劑組成物所得之硬化物,亦具有優良的導電性。因此,本發明之接著劑組成物,適合使用於製造包覆層薄膜、可撓式貼銅層合板、接合片、導電性接合片、電磁波遮蔽材等。
Claims (14)
- 一種接著劑組成物,其係含有(A)變性聚烯烴系樹脂、(B)環氧樹脂與(F)導電填料之接著劑組成物,其特徵為, 前述變性聚烯烴系樹脂(A)係聚烯烴樹脂被以含有α,β-不飽和羧酸或其衍生物的變性劑所接枝變性而得之樹脂, 前述環氧樹脂(B)之含量,相對於前述變性聚烯烴系樹脂(A)100質量份,係1~20質量份, 前述環氧樹脂(B)係包含2種類以上的環氧樹脂, 前述導電填料(F)之含量,相對於前述變性聚烯烴系樹脂(A)及前述環氧樹脂(B)之合計為100質量份時,係10~350質量份。
- 如請求項1之接著劑組成物,其中,前述環氧樹脂(B)係包含酚醛清漆型環氧樹脂。
- 如請求項2之接著劑組成物,其中,前述環氧樹脂(B)係包含雙酚A型酚醛清漆型環氧樹脂。
- 如請求項1之接著劑組成物,其中,前述環氧樹脂(B)係包含具有脂環骨架之環氧樹脂。
- 如請求項1之接著劑組成物,其中,前述變性聚烯烴系樹脂(A)係包含變性聚丙烯樹脂。
- 如請求項1之接著劑組成物,其中,前述α,β-不飽和羧酸之衍生物係由依康酸酐、馬來酸酐、烏頭酸酐及檬康酸酐所成之群選出之至少1種。
- 如請求項1之接著劑組成物,其中,源自前述α,β-不飽和羧酸或其衍生物之接枝部份的含有比例,相對於前述變性聚烯烴系樹脂100質量%,係0.1~20質量%。
- 如請求項1之接著劑組成物,其尚含有(C)具有烷氧矽烷基之咪唑系化合物,前述含有烷氧矽烷基之咪唑系化合物(C)之含量,相對於前述變性聚烯烴系樹脂(A)及前述環氧樹脂(B)之合計為100質量份時,係0.3~5質量份。
- 如請求項1之接著劑組成物,其尚含有(D)抗氧化劑,前述抗氧化劑(D)之含量,相對於前述變性聚烯烴系樹脂(A)及前述環氧樹脂(B)之合計為100質量份時,係0.1~10質量份。
- 如請求項1之接著劑組成物,其尚含有(E)含有磷之化合物,前述含有磷之化合物(E)之含量,相對於前述變性聚烯烴系樹脂(A)及前述環氧樹脂(B)之合計為100質量份時,係0.5~50質量份。
- 一種包覆層薄膜,其特徵為,使用如請求項1~10中任一項之接著劑組成物而形成的接著劑層,係形成於聚醯亞胺薄膜之單一面上。
- 一種接合片,其特徵為,使用如請求項1~10中任一項之接著劑組成物而形成的接著劑層,係形成於離型性薄膜之表面上。
- 一種貼銅層合板,其特徵為,使用如請求項1~10中任一項之接著劑組成物而形成的接著劑層,係層合於聚醯亞胺薄膜的至少單一面與銅箔之間。
- 一種電磁波遮蔽材,其特徵為,使用如請求項1~10中任一項之接著劑組成物而形成的接著劑層作為構成成份。
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JP6914145B2 (ja) * | 2017-08-23 | 2021-08-04 | 藤森工業株式会社 | 接着性樹脂組成物及び積層体 |
JP7153489B2 (ja) * | 2018-07-09 | 2022-10-14 | 信越ポリマー株式会社 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板 |
JP6968041B2 (ja) * | 2018-07-11 | 2021-11-17 | タツタ電線株式会社 | 導電性接着剤 |
KR20200038814A (ko) * | 2018-10-04 | 2020-04-14 | 주식회사 엘지화학 | 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트 |
JP7251167B2 (ja) * | 2019-01-28 | 2023-04-04 | 株式会社レゾナック | フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法 |
JP7283989B2 (ja) * | 2019-06-19 | 2023-05-30 | 藤森工業株式会社 | 接着性樹脂積層体、積層体、接着性樹脂積層体の製造方法および積層体の製造方法 |
CN114207076B (zh) * | 2019-08-08 | 2024-09-10 | 三键有限公司 | 粘接剂组合物、固化物及接合体 |
WO2021100339A1 (ja) * | 2019-11-22 | 2021-05-27 | 昭和電工株式会社 | 複合積層体及び、接合体 |
EP4092065A4 (en) * | 2020-01-16 | 2024-01-24 | Sumitomo Seika Chemicals Co., Ltd. | RESIN COMPOSITION |
JP7553402B2 (ja) | 2020-06-09 | 2024-09-18 | 三洋化成工業株式会社 | 熱硬化性樹脂組成物 |
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CN112951482B (zh) * | 2021-02-26 | 2022-05-17 | 无锡帝科电子材料股份有限公司 | 一种电子元器件浆料及加工工艺 |
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KR102478142B1 (ko) * | 2021-09-13 | 2022-12-16 | (주)에이치앤비이십일 | 접착 조성물 및 이를 포함하는 본딩 시트 |
JP7348673B2 (ja) * | 2021-12-03 | 2023-09-21 | ニッカン工業株式会社 | 樹脂組成物、及び、これを用いたカバーレイフィルム、接着剤シート、樹脂付き金属箔、金属張積層板またはプリント配線板 |
CN114292607B (zh) * | 2022-01-06 | 2023-06-06 | 广东东溢新材料科技有限公司 | 一种胶黏剂及其制备方法和应用 |
JP7549937B2 (ja) | 2022-08-30 | 2024-09-12 | ユニチカ株式会社 | プリント配線板 |
WO2024135629A1 (ja) * | 2022-12-22 | 2024-06-27 | 株式会社レゾナック | 変性スチレン系エラストマー及び変性スチレン系エラストマーの製造方法 |
JP7358670B1 (ja) * | 2023-03-30 | 2023-10-10 | パナック株式会社 | 接続体 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1060401A (ja) * | 1996-08-20 | 1998-03-03 | Mitsui Petrochem Ind Ltd | 接着剤組成物 |
JP2007251138A (ja) * | 2006-02-16 | 2007-09-27 | Toray Ind Inc | 電子材料用接着剤シート |
JP2014208764A (ja) * | 2013-03-22 | 2014-11-06 | 積水化学工業株式会社 | エポキシ樹脂材料及び多層基板 |
TW201606013A (zh) * | 2014-08-01 | 2016-02-16 | 東洋油墨Sc控股股份有限公司 | 接著劑組合物、積層體、蓄電元件用包裝材料、蓄電元件用容器及蓄電元件 |
TW201610048A (zh) * | 2014-06-11 | 2016-03-16 | Toyo Boseki | 聚烯烴系接著劑組成物 |
WO2016047289A1 (ja) * | 2014-09-24 | 2016-03-31 | 東亞合成株式会社 | 接着剤組成物及びこれを用いた接着剤層付き積層体 |
JP2016089090A (ja) * | 2014-11-07 | 2016-05-23 | 三井化学株式会社 | 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57166B2 (zh) | 1974-03-25 | 1982-01-05 | ||
JPH07235767A (ja) | 1994-02-24 | 1995-09-05 | Tokai Rubber Ind Ltd | フレキシブル印刷回路基板、フレキシブル印刷配線板およびこれらに用いられる接着剤組成物 |
JP3678258B2 (ja) | 1996-07-08 | 2005-08-03 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
JP2001354936A (ja) | 2000-06-14 | 2001-12-25 | Sumitomo Bakelite Co Ltd | フレキシブル配線板用接着剤組成物 |
JP4849654B2 (ja) * | 2000-09-12 | 2012-01-11 | 日東電工株式会社 | 接着剤組成物および接着シート |
JP4184008B2 (ja) | 2001-09-07 | 2008-11-19 | Tdk株式会社 | 不要電波抑制方法及び道路付帯設備 |
US20050059754A1 (en) * | 2003-07-31 | 2005-03-17 | Lunt Michael S. | Electrically conductive, flame retardant fillers, method of manufacture, and use thereof |
JP2007002121A (ja) | 2005-06-24 | 2007-01-11 | Fujikura Ltd | エポキシ系接着剤、カバーレイ、プリプレグ、金属張積層板、プリント配線基板 |
JP2008177463A (ja) * | 2007-01-22 | 2008-07-31 | Kyocera Chemical Corp | フレキシブル配線板用接着剤組成物、フレキシブル配線板用カバーレイ、および電磁波シールド層付フレキシブル配線板 |
WO2009090997A1 (ja) | 2008-01-15 | 2009-07-23 | Toyo Ink Manufacturing Co., Ltd. | 硬化性電磁波シールド性接着性フィルム、その製造方法、及びその使用方法、並びに電磁波遮蔽物の製造方法及び電磁波遮蔽物 |
JP4722954B2 (ja) * | 2008-03-17 | 2011-07-13 | イビデン株式会社 | プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法 |
US9079378B2 (en) | 2009-03-31 | 2015-07-14 | Jx Nippon Mining & Metals Corporation | Electromagnetic shielding material and method of producing electromagnetic shielding material |
CN102359794B (zh) | 2011-08-29 | 2013-07-03 | 深圳市锐钜科技有限公司 | 一种多联机中央空调外机计费方法及系统 |
JP5726048B2 (ja) | 2011-11-14 | 2015-05-27 | 藤森工業株式会社 | Fpc用電磁波シールド材 |
JP2013159762A (ja) * | 2012-02-08 | 2013-08-19 | Toyo Ink Sc Holdings Co Ltd | 熱硬化性接着剤組成物および接着シ−ト |
CN103571215A (zh) * | 2012-07-18 | 2014-02-12 | 天瑞企业股份有限公司 | 高导热及emi遮蔽的高分子复合材 |
JP2014141603A (ja) * | 2013-01-25 | 2014-08-07 | Toyo Ink Sc Holdings Co Ltd | 誘電特性に優れる接着剤組成物、それを用いた接着剤シート、およびプリント配線板 |
JP6081819B2 (ja) | 2013-02-28 | 2017-02-15 | 藤森工業株式会社 | Fpc用電磁波シールド材 |
CN104582246B (zh) | 2013-10-24 | 2017-09-15 | 信越聚合物株式会社 | 电磁波屏蔽膜以及带电磁波屏蔽膜的柔性印刷电路板 |
TWI707949B (zh) * | 2014-06-09 | 2020-10-21 | 美商健臻公司 | 種子罐培養法(seed train processes)及其用途 |
US20170088753A1 (en) | 2014-09-17 | 2017-03-30 | Dic Corporation | Laminating adhesive, laminate using the same, and secondary battery |
JP2016151046A (ja) | 2015-02-17 | 2016-08-22 | 四国化成工業株式会社 | 表面処理剤、樹脂組成物及びそれらの利用 |
JP6183491B2 (ja) | 2015-03-26 | 2017-08-23 | 東洋インキScホールディングス株式会社 | 導電性接着剤、導電性接着シートおよび電磁波シールドシート |
KR102340014B1 (ko) | 2016-08-09 | 2021-12-16 | 도요보 가부시키가이샤 | 저유전 접착제층을 함유하는 적층체 |
-
2017
- 2017-12-15 KR KR1020197019698A patent/KR102479228B1/ko active IP Right Grant
- 2017-12-15 US US16/470,767 patent/US11624009B2/en active Active
- 2017-12-15 CN CN201780076998.5A patent/CN110072961B/zh active Active
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- 2017-12-20 TW TW111106140A patent/TWI839685B/zh active
-
2021
- 2021-11-04 JP JP2021180535A patent/JP7335559B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1060401A (ja) * | 1996-08-20 | 1998-03-03 | Mitsui Petrochem Ind Ltd | 接着剤組成物 |
JP2007251138A (ja) * | 2006-02-16 | 2007-09-27 | Toray Ind Inc | 電子材料用接着剤シート |
JP2014208764A (ja) * | 2013-03-22 | 2014-11-06 | 積水化学工業株式会社 | エポキシ樹脂材料及び多層基板 |
TW201610048A (zh) * | 2014-06-11 | 2016-03-16 | Toyo Boseki | 聚烯烴系接著劑組成物 |
TW201606013A (zh) * | 2014-08-01 | 2016-02-16 | 東洋油墨Sc控股股份有限公司 | 接著劑組合物、積層體、蓄電元件用包裝材料、蓄電元件用容器及蓄電元件 |
WO2016047289A1 (ja) * | 2014-09-24 | 2016-03-31 | 東亞合成株式会社 | 接着剤組成物及びこれを用いた接着剤層付き積層体 |
TW201617426A (zh) * | 2014-09-24 | 2016-05-16 | Toagosei Co Ltd | 接著劑組成物及使用其之附有接著劑層之積層體 |
JP2016089090A (ja) * | 2014-11-07 | 2016-05-23 | 三井化学株式会社 | 樹脂組成物、接着剤、カバーレイフィルム、ボンディングシート、銅張積層板および電磁波シールド材 |
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US11624009B2 (en) | 2023-04-11 |
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JPWO2018116967A1 (ja) | 2019-11-21 |
TW202223045A (zh) | 2022-06-16 |
KR20190100930A (ko) | 2019-08-29 |
KR102479228B1 (ko) | 2022-12-21 |
JP2022023988A (ja) | 2022-02-08 |
CN110072961B (zh) | 2022-02-08 |
JP6973411B2 (ja) | 2021-11-24 |
CN110072961A (zh) | 2019-07-30 |
TWI839686B (zh) | 2024-04-21 |
WO2018116967A1 (ja) | 2018-06-28 |
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