WO2022102506A1 - 低誘電性接着剤組成物 - Google Patents
低誘電性接着剤組成物 Download PDFInfo
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- WO2022102506A1 WO2022102506A1 PCT/JP2021/040581 JP2021040581W WO2022102506A1 WO 2022102506 A1 WO2022102506 A1 WO 2022102506A1 JP 2021040581 W JP2021040581 W JP 2021040581W WO 2022102506 A1 WO2022102506 A1 WO 2022102506A1
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- resin
- adhesive composition
- film
- alicyclic skeleton
- composition according
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- 239000000853 adhesive Substances 0.000 title claims abstract description 108
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 108
- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 229920005989 resin Polymers 0.000 claims abstract description 132
- 239000011347 resin Substances 0.000 claims abstract description 132
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 107
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 95
- 239000003822 epoxy resin Substances 0.000 claims abstract description 65
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 65
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 39
- 239000010408 film Substances 0.000 claims description 95
- 239000012790 adhesive layer Substances 0.000 claims description 69
- -1 polyethylene terephthalate Polymers 0.000 claims description 55
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 239000002253 acid Substances 0.000 claims description 20
- 229920001577 copolymer Polymers 0.000 claims description 16
- 239000012787 coverlay film Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 9
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 229920006290 polyethylene naphthalate film Polymers 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 3
- 229920003235 aromatic polyamide Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract 1
- 239000002585 base Substances 0.000 description 25
- 239000000047 product Substances 0.000 description 25
- 239000003795 chemical substances by application Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 239000002904 solvent Substances 0.000 description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 12
- 239000003607 modifier Substances 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 229920000106 Liquid crystal polymer Polymers 0.000 description 10
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 10
- 239000003999 initiator Substances 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 8
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- 150000008065 acid anhydrides Chemical class 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 5
- 150000001408 amides Chemical class 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- 229920000388 Polyphosphate Polymers 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 150000003949 imides Chemical class 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 229920006124 polyolefin elastomer Polymers 0.000 description 4
- 239000001205 polyphosphate Substances 0.000 description 4
- 235000011176 polyphosphates Nutrition 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 3
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000003712 anti-aging effect Effects 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- SSUJUUNLZQVZMO-UHFFFAOYSA-N 1,2,3,4,8,9,10,10a-octahydropyrimido[1,2-a]azepine Chemical compound C1CCC=CN2CCCNC21 SSUJUUNLZQVZMO-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 239000004254 Ammonium phosphate Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 2
- 235000019289 ammonium phosphates Nutrition 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 150000007974 melamines Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000012968 metallocene catalyst Substances 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- YTZKOQUCBOVLHL-UHFFFAOYSA-N tert-butylbenzene Chemical compound CC(C)(C)C1=CC=CC=C1 YTZKOQUCBOVLHL-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 1
- XGINAUQXFXVBND-UHFFFAOYSA-N 1,2,6,7,8,8a-hexahydropyrrolo[1,2-a]pyrimidine Chemical compound N1CC=CN2CCCC21 XGINAUQXFXVBND-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- WOUXRHNTGOLKPF-UHFFFAOYSA-N 1-methyl-3-prop-1-en-2-ylcyclohexane Chemical compound CC1CCCC(C(C)=C)C1 WOUXRHNTGOLKPF-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 1
- LSIXBBPOJBJQHN-UHFFFAOYSA-N 2,3-Dimethylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C(C)=C(C)C1C2 LSIXBBPOJBJQHN-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- GVJRTUUUJYMTNQ-UHFFFAOYSA-N 2-(2,5-dioxofuran-3-yl)acetic acid Chemical compound OC(=O)CC1=CC(=O)OC1=O GVJRTUUUJYMTNQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- DIQZGCCQHMIOLR-UHFFFAOYSA-N 2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]prop-2-enoic acid;methane Chemical compound C.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O DIQZGCCQHMIOLR-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- JUHBZVGMCWBTAX-UHFFFAOYSA-N 2-[[(2,3-diphenyloxiran-2-yl)-diphenylmethoxy]-diphenylmethyl]-2,3-diphenyloxirane;ethane Chemical compound CC.C=1C=CC=CC=1C(C1(C(O1)C=1C=CC=CC=1)C=1C=CC=CC=1)(C=1C=CC=CC=1)OC(C1(C(O1)C=1C=CC=CC=1)C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 JUHBZVGMCWBTAX-UHFFFAOYSA-N 0.000 description 1
- PLDLPVSQYMQDBL-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethoxy)-2,2-bis(oxiran-2-ylmethoxymethyl)propoxy]methyl]oxirane Chemical compound C1OC1COCC(COCC1OC1)(COCC1OC1)COCC1CO1 PLDLPVSQYMQDBL-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- RJIQELZAIWFNTQ-UHFFFAOYSA-N 2-phenyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound O=C1NC(=O)NC(=O)N1.C1=CNC(C=2C=CC=CC=2)=N1 RJIQELZAIWFNTQ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- VEEKCIOFMIAGSF-UHFFFAOYSA-N 4-butylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C=CC1(CCCC)C2 VEEKCIOFMIAGSF-UHFFFAOYSA-N 0.000 description 1
- WXOFQPMQHAHBKI-UHFFFAOYSA-N 4-ethylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C=CC1(CC)C2 WXOFQPMQHAHBKI-UHFFFAOYSA-N 0.000 description 1
- RMDKEBZUCHXUER-UHFFFAOYSA-N 4-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1CC2C=CC1(C)C2 RMDKEBZUCHXUER-UHFFFAOYSA-N 0.000 description 1
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- ANALBGQGSOHBHD-UHFFFAOYSA-K CC(CP([O-])=O)(C)C.[Al+3].CC(CP([O-])=O)(C)C.CC(CP([O-])=O)(C)C Chemical compound CC(CP([O-])=O)(C)C.[Al+3].CC(CP([O-])=O)(C)C.CC(CP([O-])=O)(C)C ANALBGQGSOHBHD-UHFFFAOYSA-K 0.000 description 1
- QDZXJOMXPRWGFG-UHFFFAOYSA-N CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 Chemical compound CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 QDZXJOMXPRWGFG-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- FMRHJJZUHUTGKE-UHFFFAOYSA-N Ethylhexyl salicylate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1O FMRHJJZUHUTGKE-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- AGJXDKGTTMVHOU-UHFFFAOYSA-N [4-(hydroxymethyl)-1h-imidazol-5-yl]methanol Chemical compound OCC=1N=CNC=1CO AGJXDKGTTMVHOU-UHFFFAOYSA-N 0.000 description 1
- PMOVRVGWLWHABA-UHFFFAOYSA-J [Ti+4].CC(C)C(C)(C)P([O-])=O.CC(C)C(C)(C)P([O-])=O.CC(C)C(C)(C)P([O-])=O.CC(C)C(C)(C)P([O-])=O Chemical compound [Ti+4].CC(C)C(C)(C)P([O-])=O.CC(C)C(C)(C)P([O-])=O.CC(C)C(C)(C)P([O-])=O.CC(C)C(C)(C)P([O-])=O PMOVRVGWLWHABA-UHFFFAOYSA-J 0.000 description 1
- HZSAGZAJGQNWSD-UHFFFAOYSA-J [Ti+4].[O-]P(=O)(c1ccccc1)c1ccccc1.[O-]P(=O)(c1ccccc1)c1ccccc1.[O-]P(=O)(c1ccccc1)c1ccccc1.[O-]P(=O)(c1ccccc1)c1ccccc1 Chemical compound [Ti+4].[O-]P(=O)(c1ccccc1)c1ccccc1.[O-]P(=O)(c1ccccc1)c1ccccc1.[O-]P(=O)(c1ccccc1)c1ccccc1.[O-]P(=O)(c1ccccc1)c1ccccc1 HZSAGZAJGQNWSD-UHFFFAOYSA-J 0.000 description 1
- BBUVVWFDWAGLPU-UHFFFAOYSA-L [Zn++].CC(C)(C)P([O-])=O.CC(C)(C)P([O-])=O Chemical compound [Zn++].CC(C)(C)P([O-])=O.CC(C)(C)P([O-])=O BBUVVWFDWAGLPU-UHFFFAOYSA-L 0.000 description 1
- NPTUWPLFDDQVQB-UHFFFAOYSA-N [Zn+2].[Zn+2].[Zn+2].C=1C=CC=CC=1P([O-])([O-])([O-])C1=CC=CC=C1.C=1C=CC=CC=1P([O-])([O-])([O-])C1=CC=CC=C1 Chemical compound [Zn+2].[Zn+2].[Zn+2].C=1C=CC=CC=1P([O-])([O-])([O-])C1=CC=CC=C1.C=1C=CC=CC=1P([O-])([O-])([O-])C1=CC=CC=C1 NPTUWPLFDDQVQB-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- IPTNXMGXEGQYSY-UHFFFAOYSA-N acetic acid;1-methoxybutan-1-ol Chemical compound CC(O)=O.CCCC(O)OC IPTNXMGXEGQYSY-UHFFFAOYSA-N 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QNNHFEIZWVGBTM-UHFFFAOYSA-K aluminum;diphenylphosphinate Chemical compound [Al+3].C=1C=CC=CC=1P(=O)([O-])C1=CC=CC=C1.C=1C=CC=CC=1P(=O)([O-])C1=CC=CC=C1.C=1C=CC=CC=1P(=O)([O-])C1=CC=CC=C1 QNNHFEIZWVGBTM-UHFFFAOYSA-K 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 101150059062 apln gene Proteins 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- IHWUGQBRUYYZNM-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-3,4-dicarboxylic acid Chemical compound C1CC2(C(O)=O)C(C(=O)O)=CC1C2 IHWUGQBRUYYZNM-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- ZXOATMQSUNJNNG-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OCC2OC2)=CC=1C(=O)OCC1CO1 ZXOATMQSUNJNNG-UHFFFAOYSA-N 0.000 description 1
- NEPKLUNSRVEBIX-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OCC2OC2)C=CC=1C(=O)OCC1CO1 NEPKLUNSRVEBIX-UHFFFAOYSA-N 0.000 description 1
- JQDCYGOHLMJDNA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) butanedioate Chemical compound C1OC1COC(=O)CCC(=O)OCC1CO1 JQDCYGOHLMJDNA-UHFFFAOYSA-N 0.000 description 1
- KTPIWUHKYIJBCR-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-4-ene-1,2-dicarboxylate Chemical compound C1C=CCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KTPIWUHKYIJBCR-UHFFFAOYSA-N 0.000 description 1
- NFVGWOSADNLNHZ-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) decanedioate Chemical compound C1OC1COC(=O)CCCCCCCCC(=O)OCC1CO1 NFVGWOSADNLNHZ-UHFFFAOYSA-N 0.000 description 1
- KBWLNCUTNDKMPN-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) hexanedioate Chemical compound C1OC1COC(=O)CCCCC(=O)OCC1CO1 KBWLNCUTNDKMPN-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- ORSVWFJAARXBHC-UHFFFAOYSA-N carbamic acid;phosphoric acid Chemical compound NC(O)=O.OP(O)(O)=O ORSVWFJAARXBHC-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- CEDDGDWODCGBFQ-UHFFFAOYSA-N carbamimidoylazanium;hydron;phosphate Chemical compound NC(N)=N.OP(O)(O)=O CEDDGDWODCGBFQ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- ZOLLIQAKMYWTBR-RYMQXAEESA-N cyclododecatriene Chemical compound C/1C\C=C\CC\C=C/CC\C=C\1 ZOLLIQAKMYWTBR-RYMQXAEESA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- ICPMUWPXCAVOOQ-UHFFFAOYSA-N cycloocta-1,3,5-triene Chemical compound C1CC=CC=CC=C1 ICPMUWPXCAVOOQ-UHFFFAOYSA-N 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000008049 diazo compounds Chemical class 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- HFVKYLPSHXAMME-UHFFFAOYSA-J diethylphosphinate;titanium(4+) Chemical compound [Ti+4].CCP([O-])(=O)CC.CCP([O-])(=O)CC.CCP([O-])(=O)CC.CCP([O-])(=O)CC HFVKYLPSHXAMME-UHFFFAOYSA-J 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- HANKSFAYJLDDKP-UHFFFAOYSA-N dihydrodicyclopentadiene Chemical compound C12CC=CC2C2CCC1C2 HANKSFAYJLDDKP-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- GUOAPVPPPVLIQQ-UHFFFAOYSA-N dimethyldicyclopentadiene Chemical compound C1=CC2CC1C1C2C(C)C(C)=C1 GUOAPVPPPVLIQQ-UHFFFAOYSA-N 0.000 description 1
- 239000012971 dimethylpiperazine Substances 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- OIAUFEASXQPCFE-UHFFFAOYSA-N formaldehyde;1,3-xylene Chemical compound O=C.CC1=CC=CC(C)=C1 OIAUFEASXQPCFE-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- UCQHUEOREKHIBP-UHFFFAOYSA-N heptacyclo[9.6.1.14,7.113,16.02,10.03,8.012,17]icosa-5,14-diene Chemical compound C1C(C23)C4C(C=C5)CC5C4C1C3CC1C2C2C=CC1C2 UCQHUEOREKHIBP-UHFFFAOYSA-N 0.000 description 1
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 1
- SCFQUKBBGYTJNC-UHFFFAOYSA-N heptyl prop-2-enoate Chemical compound CCCCCCCOC(=O)C=C SCFQUKBBGYTJNC-UHFFFAOYSA-N 0.000 description 1
- AHAREKHAZNPPMI-UHFFFAOYSA-N hexa-1,3-diene Chemical compound CCC=CC=C AHAREKHAZNPPMI-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229940035429 isobutyl alcohol Drugs 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- RCBVSNVPJSTILC-UHFFFAOYSA-N oxiran-2-ylmethyl 2-hydroxybenzoate Chemical compound OC1=CC=CC=C1C(=O)OCC1OC1 RCBVSNVPJSTILC-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- JLQFVGYYVXALAG-CFEVTAHFSA-N yasmin 28 Chemical compound OC1=CC=C2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1.C([C@]12[C@H]3C[C@H]3[C@H]3[C@H]4[C@@H]([C@]5(CCC(=O)C=C5[C@@H]5C[C@@H]54)C)CC[C@@]31C)CC(=O)O2 JLQFVGYYVXALAG-CFEVTAHFSA-N 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J165/00—Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Definitions
- the present invention relates to a low-dielectric adhesive composition having low dielectric property and good adhesiveness, as well as excellent heat resistance to wet-heat solder and laser workability. More specifically, the present invention relates to an adhesive composition suitable for bonding applications such as electronic components, and in particular, for manufacturing related products of flexible printed wiring boards (hereinafter, also referred to as "FPC").
- FPC flexible printed wiring boards
- FPC-related products which are one of the electronic components, include flexible copper-clad laminates and flexible copper-clad laminates in which copper foil is bonded to polyimide films, polyethylene naphthalate films, liquid crystal polymer (LCP) films, and the like.
- Flexible printed wiring board on which electronic circuits are formed flexible printed wiring board with reinforcing plate in which flexible printed wiring board and reinforcing plate are bonded, flexible copper-clad laminated board and multi-layer board in which flexible printed wiring boards are laminated and joined, base film
- a flexible flat cable hereinafter, also referred to as "FFC”
- FFC flexible flat cable
- a laminate with an adhesive layer called a "coverlay film” is usually used to protect the wiring portion.
- This coverlay film includes an insulating resin layer and an adhesive layer formed on the surface thereof, and a polyimide resin composition is widely used for forming the insulating resin layer.
- a flexible printed wiring board is manufactured by attaching a coverlay film to a surface having a wiring portion via an adhesive layer by using a hot press or the like.
- the adhesive layer of the coverlay film needs to have strong adhesiveness to both the wiring portion and the base film.
- Patent Document 1 describes a cover made of a vinyl compound such as oligophenylene ether, a polystyrene-poly (ethylene / butylene) block copolymer, an epoxy resin, and a curing catalyst. Ray film is disclosed.
- Patent Document 2 contains a carboxyl group-containing styrene-based elastomer and an epoxy resin, and by setting the content of the styrene-based elastomer and the epoxy resin within a predetermined range, an adhesive cured product measured at a frequency of 1 GHz.
- An adhesive composition having a dielectric constant of less than 3.0 is disclosed.
- Patent Document 3 contains a modified polyolefin resin obtained by graft-modifying an unmodified polyolefin resin with a modifier containing ⁇ , ⁇ -unsaturated carboxylic acid or a derivative thereof, and an epoxy resin, and these two resins are used.
- an adhesive composition in which the dielectric constant of the cured adhesive product measured at a frequency of 1 GHz is less than 2.5 by setting the content within a predetermined range.
- the present invention has been made in view of the above problems, and provides a low-dielectric adhesive composition having not only low dielectric property and good adhesiveness but also excellent heat resistance to wet-heat solder and laser processability.
- the purpose is to provide.
- an adhesive composition containing a polyolefin-based resin (A), an alicyclic skeleton-containing resin (B), and an epoxy resin (C) as resin components the present inventors have added the polyolefin-based resin (A) and By using a resin containing a carboxyl group and / or a derivative thereof as at least one of the alicyclic skeleton-containing resin (B), not only the dielectric property is low and the adhesiveness is good, but also the heat resistance of wet and heat solder and the laser are used. We have found that an adhesive composition having excellent processability can be obtained, and have completed the present invention.
- the following adhesive compositions are provided.
- 1. It contains a polyolefin resin (A), an alicyclic skeleton-containing resin (B), and an epoxy resin (C), and at least one of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B).
- An adhesive composition comprising a carboxyl group and / or a derivative thereof, wherein the cured product has a dielectric constant of less than 2.5.
- the total content of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) is 50 parts by mass or more with respect to 100 parts by mass of the solid content of the adhesive composition, and the epoxy resin (C).
- the polyolefin resin (A) contains a carboxyl group and / or a derivative thereof, and the acid value of the polyolefin resin is 0.1 to 50 mgKOH / g.
- the polyolefin resin (A) is at least one selected from the group consisting of an ethylene-propylene copolymer, a propylene-butene copolymer and an ethylene-propylene-butene copolymer. ⁇ 4.
- the alicyclic skeleton-containing resin (B) contains a carboxyl group and / or a derivative thereof, and the acid value of the alicyclic skeleton-containing resin (B) is 0.1 to 50 mgKOH / g. ⁇ 5.
- the alicyclic skeleton-containing resin (B) has an alicyclic skeleton in the side chain. ⁇ 6.
- the epoxy resin (C) is a polyfunctional epoxy resin containing a dicyclopentadiene skeleton. ⁇ 7.
- the dielectric loss tangent of the cured product measured at a frequency of 1 GHz is less than 0.01.
- the adhesive composition according to any one of the above items. 10 The solder heat resistance temperature after humidification treatment at a temperature of 40 ° C. and a humidity of 90% for 12 hours is 260 ° C. or higher. ⁇ 9.
- the adhesive layer obtained by using the adhesive composition according to any one of the above items is a polyimide film, a polyether ether ketone film, a polyphenylene sulfide film, an aramid film, a polyethylene naphthalate film, a liquid crystal polymer film, or a polyethylene terephthalate.
- a coverlay film characterized by being formed on at least one side of one of a film selected from a film, a polyethylene film, a polypropylene film, a TPX film, and a fluororesin film. 15. Above 1. ⁇ 14. A bonding sheet, characterized in that the adhesive layer obtained by using the adhesive composition according to any one of the above items is formed on at least one side of a releasable film.
- the adhesive composition of the present invention contains a polyolefin-based resin (A), an alicyclic skeleton-containing resin (B), and an epoxy resin (C) as resin components, and is a polyolefin-based resin (A) and an alicyclic resin. Since at least one of the formula skeleton-containing resin (B) contains a carboxyl group and / or a derivative thereof, not only the dielectric property is low and the adhesiveness is good, but also the wet heat solder heat resistance and the laser processability are excellent. ..
- the adhesive composition of the present invention is an adhesive composition containing a polyolefin resin (A), an alicyclic skeleton-containing resin (B), and an epoxy resin (C). At least one of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and / or a derivative thereof, and the dielectric constant of the cured product is less than 2.5. ..
- the matters specifying the present invention will be specifically described below.
- Polyolefin resin (A) The polyolefin-based resin (A) is one of the main components of the adhesive composition, and is a component that imparts electrical properties in addition to adhesiveness and flexibility of the cured product.
- the polyolefin-based resin is not particularly limited as long as it has a structural unit derived from an olefin, but has 2 carbon atoms such as ethylene, propylene, butene, pentene, hexene, heptene, octene, and 4-methyl-1-pentene.
- a homopolymer or copolymer of 20 or more is preferably used.
- homopolymers or copolymers of olefins having 2 or more and 6 or less carbon atoms are particularly preferable.
- the content ratio of the structural unit in the polyolefin resin can be arbitrarily selected, but when bonding to a poorly adhesive adherend, the above-mentioned polyolefin resin is an ethylene-propylene copolymer or a propylene-butene copolymer. Alternatively, it is preferably an ethylene-propylene-butene copolymer.
- the content ratio of the propylene unit is within the above range, flexibility can be imparted to the bonded portion after the two members are bonded.
- the molecular weight of the polyolefin resin is not particularly limited.
- the polyolefin resin (A) does not include the alicyclic skeleton-containing resin (B) and the epoxy resin (C), which will be described later.
- the polyolefin resin (A) is acid-modified and contains a carboxyl group and / or a derivative thereof.
- the above-mentioned “derivative” includes the form of an acid anhydride in which water molecules are removed from two carboxyl groups and bonded to each other, and other substances derived from carboxyl groups such as acid halide, amide, imide, and ester. Although morphology is also included, the preferred derivative is acid anhydride.
- a polyolefin resin containing a carboxyl group and / or a derivative thereof may be referred to as "acid-modified polyolefin resin", "modified polyolefin resin” or "carboxyl group-containing polyolefin resin”.
- the acid-modified polyolefin resin is a resin having a portion derived from the unmodified polyolefin resin and a graft portion derived from the modifier, preferably ⁇ , ⁇ - in the presence of the unmodified polyolefin resin. It can be obtained by graft-polymerizing a denaturing agent containing an unsaturated carboxylic acid or a derivative thereof.
- the modified polyolefin resin can be produced by graft polymerization by a known method, and a radical initiator may be used in the production.
- a radical initiator may be used in the production.
- the method for producing the modified polyolefin resin include a solution method in which an unmodified polyolefin resin is heated and dissolved in a solvent such as toluene and the modifier and the radical initiator are added, a Banbury mixer, a kneader, an extruder and the like.
- examples thereof include a melting method in which an unmodified polyolefin resin, a modifying agent and a radical initiator are melt-kneaded using the above.
- the method of using the unmodified polyolefin resin, the modifier and the radical initiator is not particularly limited, and these may be added collectively to the reaction system or sequentially.
- a modification aid for improving the graft efficiency of ⁇ , ⁇ -unsaturated carboxylic acid, a stabilizer for adjusting the resin stability, and the like can be further used. ..
- the following alicyclic skeleton-containing resin (B) can be used in the same manner.
- the modified polyolefin resin has at least a graft portion derived from the modifying agent.
- graft mass the content ratio of the graft portion contained in the modified polyolefin resin
- the modified polyolefin resin has a grafted portion derived from ⁇ , ⁇ -unsaturated carboxylic acid or a derivative thereof.
- the graft mass of the graft portion derived from ⁇ , ⁇ -unsaturated carboxylic acid or its derivative is 0.1 to 20 mass with respect to 100% by mass of the modified polyolefin resin from the viewpoint of adhesiveness. %, More preferably 0.2 to 18% by mass.
- the graft mass is 0.1% by mass or more, the solubility in a solvent is excellent, and the adhesiveness to an adherend made of a metal or the like is particularly excellent. Further, when the graft mass is 20% by mass or less, sufficient adhesiveness to an adherend made of a resin or the like can be obtained.
- the graft mass derived from the ⁇ , ⁇ -unsaturated carboxylic acid or a derivative thereof in the modified polyolefin resin can be determined by an alkaline titration method, but the derivative of the ⁇ , ⁇ -unsaturated carboxylic acid does not have an acid group.
- the graft mass can be determined by Fourier transform infrared spectroscopy.
- the modified polyolefin resin contains a graft portion derived from a (meth) acrylic acid ester represented by the following formula (3)
- the graft mass thereof is 0.1 to 100% by mass with respect to 100% by mass of the modified polyolefin resin. It is preferably 30% by mass, more preferably 0.3 to 25% by mass.
- the solubility in a solvent is excellent, the compatibility with other resins or elastomers described later is excellent, and the adhesiveness to the adherend is further improved. be able to.
- the graft mass in the obtained modified polyolefin resin can be determined by Fourier transform infrared spectroscopy.
- the weight average molecular weight (Mw) of the modified polyolefin resin (A) is preferably 30,000 to 250,000, more preferably 50,000 to 200,000. Since the weight average molecular weight (Mw) is 30,000 to 250,000, it has excellent solubility in a solvent and initial adhesiveness to an adherend, and also has solvent resistance in the bonded portion after bonding. It can be an excellent adhesive composition.
- the acid value of the acid-modified polyolefin resin (A) is preferably 0.1 to 100 mgKOH / g, more preferably 0.5 to 70 mgKOH / g, and 1.0 to 50 mgKOH / g. It is more preferable to have.
- the acid value is 0.1 to 100 mgKOH / g, the adhesive composition is sufficiently cured, and good adhesiveness, heat resistance and resin outflow property can be obtained.
- the total content of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) is preferably 50 parts by mass or more, preferably 60 parts by mass or more, based on 100 parts by mass of the solid content of the adhesive composition. Is more preferable. When this content is 50 parts by mass or more, the flexibility of the adhesive layer becomes good, and warpage of the laminated body can be suppressed.
- the total content of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) is preferably 99 parts by mass or less with respect to 100 parts by mass of the solid content of the adhesive composition.
- the content ratio is in this range, a high improvement effect of wet-heat solder heat resistance can be obtained.
- Alicyclic skeleton-containing resin (B) is a polymer containing the compound (b) having an alicyclic skeleton as a monomer unit, in other words, a compound having a saturated or unsaturated cyclic hydrocarbon skeleton (b). ), Examples of the polymer containing a structural unit derived from.
- the polymer may be a homopolymer or a copolymer.
- the compound (b) is a compound (b) having an unsaturated cyclic hydrocarbon skeleton such as styrene or norbornene
- the alicyclic skeleton of the alicyclic skeleton-containing resin (B) is the compound (b).
- the alicyclic skeleton-containing resin (B) may have an alicyclic skeleton on at least one of a main chain and a side chain, and preferably has a main chain and a chain hydrocarbon chain such as an olefin polymer. / Or a resin having an alicyclic skeleton in the side chain, exhibiting thermoplasticity by itself, and being amorphous.
- the alicyclic skeleton-containing resin (B) does not include the epoxy resin (C) described later.
- Examples of the compound (b) having an alicyclic skeleton include a polycyclic cyclic olefin and a monocyclic cyclic olefin.
- Examples of the polycyclic olefin include norbornene, methylnorbornene, dimethylnorbornene, ethylnorbornene, etilidennorbornene, butylnorbornene, dicyclopentadiene, dihydrodicyclopentadiene, methyldicyclopentadiene, dimethyldicyclopentadiene, and tetracyclododecene.
- Examples thereof include methyltetracyclododecene, dimethylcyclotetradodecene, tricyclopentadiene, tetracyclopentadiene and the like.
- Examples of the monocyclic olefin include cyclobutene, cyclopentene, cyclooctene, cyclooctadiene, cyclooctatriene, cyclododecatriene and the like.
- Examples of the alicyclic skeleton-containing resin (B) having an alicyclic skeleton on the side chain include a saturated alicyclic hydrocarbon compound (vinylcycloalkane) having a vinyl group such as vinylcyclohexane and 3-methylisopropenylcyclohexane.
- Examples thereof include a hydrocarbon block copolymer containing a vinyl hydride aromatic polymer block A obtained by vinyl addition polymerization of the above and an olefin polymer block B mainly composed of an olefin compound such as ethylene.
- the vinyl hydride aromatic polymer block A may contain a monomer component other than the vinyl hydride aromatic compound in a proportion of 50% by mass or less of the total weight of the block A, for example.
- the olefin polymer block B may contain a monomer component other than the olefin compound in a proportion of 50% by mass or less of the total weight of the block B, for example.
- the hydrogen atom bonded to the alicyclic skeleton such as the cyclohexane ring of the vinyl hydride aromatic polymer block A may be substituted with a methyl group, a butyl group, a chlorine atom or the like.
- the olefin compound in addition to ethylene, ethylene, propylene, isobutylene, 1-butene, 1-pentene, 4-methyl-1-pentene and the like can also be used.
- Examples of the alicyclic skeleton-containing resin (B) having an alicyclic skeleton in the main chain include a block mainly composed of an ethylene or ⁇ -olefin polymer and norbornene or as represented by the following formula (1).
- Examples thereof include a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) containing a block mainly composed of a polymer of a cyclic alkene such as a derivative thereof.
- Examples of the ⁇ -olefin include ⁇ -olefins having 3 to 12 carbon atoms.
- R 1 is hydrogen or an alkyl group having 1 to 10 carbon atoms
- R 2 and R 3 are independently hydrogen or an alkyl group having 1 to 6 carbon atoms, respectively).
- the alicyclic skeleton-containing resin (B) having an alicyclic skeleton in the main chain for example, TOPAS (trade name: Polyplastics Co., Ltd.), which is a cycloolefin copolymer copolymerized with norbornene and ethylene, is used.
- TOPAS trade name: Polyplastics Co., Ltd.
- ARTON trade name: manufactured by JSR Co., Ltd.
- ZEONEX which are cycloolefin copolymers obtained by hydrogenating various cyclic monomers after ring-opening metathesis polymerization.
- ZEONOR trade name: manufactured by Nippon Zeon Co., Ltd.
- the alicyclic skeleton-containing resin (B) is preferably acid-modified to contain a carboxyl group and / or a derivative thereof.
- at least one of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) may contain a carboxyl group and / or a derivative thereof, but at least the alicyclic skeleton-containing resin (B) is carboxyl.
- both the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) contain a carboxyl group and / or a derivative thereof.
- the above-mentioned “derivative” includes the form of an acid anhydride in which water molecules are removed from two carboxyl groups and bonded to each other, and other substances derived from carboxyl groups such as acid halide, amide, imide, and ester. Although morphology is also included, the preferred derivative is acid anhydride.
- the alicyclic skeleton-containing resin containing a carboxyl group and / or a derivative thereof is referred to as an "acid-modified alicyclic skeleton-containing resin", a “modified alicyclic skeleton-containing resin” or a “carboxyl group”. It may also be referred to as "containing alicyclic skeleton-containing resin”.
- the acid-modified alicyclic skeleton-containing resin is a resin having a portion derived from an unmodified alicyclic skeleton-containing resin and a graft portion derived from a modifying agent, and preferably contains an unmodified alicyclic skeleton.
- the modified alicyclic skeleton-containing resin can be produced by graft polymerization by a known method, and a radical initiator may be used in the production.
- a radical initiator may be used in the production.
- the method for producing the modified alicyclic skeleton-containing resin include a solution method in which an unmodified alicyclic skeleton-containing resin is heated and dissolved in a solvent such as toluene and the modifier and the radical initiator are added, or a Banbury mixer.
- a melting method in which an unmodified alicyclic skeleton-containing resin, a modifying agent and a radical initiator are melt-kneaded using a kneader, an extruder or the like can be mentioned.
- the method of using the unmodified alicyclic skeleton-containing resin, the modifying agent and the radical initiator is not particularly limited, and these may be added collectively to the reaction system or sequentially.
- a modification aid for improving the graft efficiency of ⁇ , ⁇ -unsaturated carboxylic acid, a stabilizer for adjusting the resin stability, and the like are further used. be able to.
- the denaturing agent contains ⁇ , ⁇ -unsaturated carboxylic acid and its derivative.
- ⁇ , ⁇ -unsaturated carboxylic acid include maleic acid, fumaric acid, tetrahydrophthalic acid, itaconic acid, citraconic acid, crotonic acid, aconitic acid, norbornenedicarboxylic acid and the like.
- the derivative of the unsaturated polycarboxylic acid include acid anhydride, acid halide, amide, imide, and ester.
- itaconic anhydride, maleic anhydride, aconitic anhydride and citraconic anhydride are preferable, and itaconic anhydride and maleic anhydride are particularly preferable in terms of adhesiveness.
- a modifier may be one or more selected from ⁇ , ⁇ -unsaturated carboxylic acid and its derivatives, and a combination of one or more ⁇ , ⁇ -unsaturated carboxylic acids and one or more derivatives thereof, ⁇ , It can be a combination of two or more kinds of ⁇ -unsaturated carboxylic acid or a combination of two or more kinds of derivatives of ⁇ , ⁇ -unsaturated carboxylic acid.
- the denaturing agent according to the present invention may contain other compounds (other denaturing agents) in addition to ⁇ , ⁇ -unsaturated carboxylic acid and the like, depending on the purpose.
- other compounds (other modifiers) include (meth) acrylic acid esters represented by the following formula (2), (meth) acrylic acid, other (meth) acrylic acid derivatives, aromatic vinyl compounds, and the like. Cyclohexyl vinyl ether and the like can be mentioned. These other compounds may be used alone or in combination of two or more.
- CH 2 CR 1 COOR 2 (2) (In the formula, R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrocarbon group.)
- R 1 is a hydrogen atom or a methyl group, preferably a methyl group.
- R 2 is a hydrocarbon group, preferably an alkyl group having 8 to 18 carbon atoms.
- Examples of the compound represented by the above formula (2) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, and (meth).
- Hexyl acrylate, (meth) heptyl acrylate, octyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, stearyl (meth) acrylate, (meth) acrylic Cyclohexyl acid, benzyl (meth) acrylate and the like can be mentioned. These compounds may be used alone or in combination of two or more.
- a modifier further containing a (meth) acrylic acid ester having an alkyl group having 8 to 18 carbon atoms, and in particular, octyl (meth) acrylate. It preferably contains lauryl (meth) acrylate, tridecyl (meth) acrylate or stearyl (meth) acrylate.
- Examples of the (meth) acrylic acid derivative other than the (meth) acrylic acid ester include hydroxyethyl (meth) acrylate, glycidyl (meth) acrylate, and (meth) acrylic acid containing isocyanate.
- Examples of the aromatic vinyl compound include styrene, o-methylstyrene, p-methylstyrene, ⁇ -methylstyrene and the like.
- the amount used thereof is ⁇ , ⁇ -unsaturated carboxylic acid and its derivatives and the (meth) acrylic acid ester. It is desirable not to exceed the total usage.
- the radical initiator used for producing the modified alicyclic skeleton-containing resin can be appropriately selected from known ones, and for example, benzoyl peroxide, dicumyl peroxide, lauroyl peroxide, and di-t-butyl peroxide. , 2,5-Dimethyl-2,5-di (t-butylperoxy) hexane, cumenehydroperoxide and other organic peroxides are preferably used.
- modification aid that can be used in the production of the modified alicyclic skeleton-containing resin
- modification aid examples include divinylbenzene, hexadiene, and dicyclopentadiene.
- stabilizer include hydroquinone, benzoquinone, nitrosophenylhydroxy compound and the like.
- the weight average molecular weight (Mw) of the alicyclic skeleton-containing resin (B) is preferably 10,000 to 200,000, more preferably 20,000 to 150,000, and even more preferably 30,000. ⁇ 100,000. Since the weight average molecular weight (Mw) is 10,000 to 200,000, it has excellent solubility in a solvent and initial adhesiveness to an adherend, and also has solvent resistance in the bonded portion after bonding. It can be an excellent adhesive composition.
- the acid value of the acid-modified alicyclic skeleton-containing resin (B) is preferably 0.1 to 50 mgKOH / g, more preferably 1 to 30 mgKOH / g, and 2 to 20 mgKOH / g. Is even more preferable.
- the acid value is 0.1 to 50 mgKOH / g, the adhesive composition is sufficiently cured, and good adhesiveness and heat resistance to wet-heat solder can be obtained.
- the alicyclic skeleton-containing resin (B) preferably has a glass transition temperature of 60 to 180 ° C, more preferably 70 to 160 ° C, and even more preferably 80 to 150 ° C. When the glass transition temperature is in this range, the heat resistance of the wet-heat solder is improved. It is more preferable to use the alicyclic skeleton-containing resin (B) having such a glass transition temperature and having been acid-modified because the adhesiveness and the heat resistance of the wet-heat solder are further improved.
- the content of the alicyclic skeleton-containing resin (B) in the present invention is as described above for the polyolefin resin (A).
- Epoxy resin (C) Next, the epoxy resin (C), which is another component of the adhesive composition, will be described.
- the epoxy resin (C) reacts with the carboxy group in the carboxyl group-containing polyolefin resin (A) and / or the carboxyl group-containing alicyclic skeleton-containing resin (B) to provide high adhesiveness to the adherend.
- Examples of the epoxy resin (C) are bisphenol A type epoxy resin, bisphenol F type epoxy resin, or hydrogenated thereof; orthophthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, p-.
- Glycidyl ester-based epoxy resins such as hydroxybenzoic acid glycidyl ester, tetrahydrophthalic acid diglycidyl ester, succinic acid diglycidyl ester, adipic acid diglycidyl ester, sebacic acid diglycidyl ester, trimellitic acid triglycidyl ester; ethylene glycol diglycidyl ether , Propropylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenylglycidyl ether ethane, triphenyl glycidyl ether
- Glycidyl ether-based epoxy resins such as ethane, polyglycid
- epoxy resin (C) brominated bisphenol A type epoxy resin, phosphorus-containing epoxy resin, dicyclopentadiene skeleton-containing epoxy resin, naphthalene skeleton-containing epoxy resin, anthracene type epoxy resin, tertiary butyl catechol type epoxy resin, Triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, biphenyl type epoxy resin, bisphenol S type epoxy resin and the like can be used. Only one type of these epoxy resins may be used, or two or more types may be used in combination. Among the above epoxy resins, an epoxy resin having no glycidylamino group is preferable. This is because the storage stability of the laminate with the adhesive layer is improved. Further, since an adhesive composition having excellent electrical properties can be obtained, an epoxy resin having an alicyclic skeleton is preferable, and an epoxy resin having a dicyclopentadiene skeleton is more preferable.
- the epoxy resin used in the present invention is preferably one having two or more epoxy groups in one molecule. This is because a crosslinked structure can be formed by reaction with the carboxyl group-containing polyolefin resin (A) and / or the carboxyl group-containing alicyclic skeleton-containing resin (B), and high heat resistance can be exhibited. Further, when an epoxy resin having two or more epoxy groups is used, the degree of cross-linking with the carboxyl group-containing polyolefin resin (A) and / or the carboxyl group-containing alicyclic skeleton-containing resin (B) is sufficient and sufficient. Excellent heat resistance can be obtained. Therefore, a particularly preferred epoxy resin is a polyfunctional epoxy resin having a dicyclopentadiene skeleton.
- the content of the epoxy resin (C) is preferably 1 to 20 parts by mass with respect to 100 parts by mass in total of the contents of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B). ..
- the content is more preferably 3 to 15 parts by mass. When this content is within the above range, sufficient adhesiveness and heat resistance can be obtained, and deterioration of peeling adhesive strength and electrical characteristics can be prevented.
- the adhesive composition according to the present invention contains a polyolefin resin (A), an alicyclic skeleton-containing resin (B) and an epoxy resin (C), and is an adhesive measured at a frequency of 1 GHz. It is characterized in that the dielectric constant ( ⁇ ) of the cured product is less than 2.5. If the dielectric constant is less than 2.5, it is suitable for use in FPC-related products. Further, it is preferable that the dielectric loss tangent (tan ⁇ ) of the cured adhesive material measured at a frequency of 1 GHz is less than 0.01. If the dielectric loss tangent is less than 0.01, an FPC-related product having excellent electrical characteristics can be manufactured.
- the dielectric constant and the dielectric tangent can be adjusted according to the ratio of the polyolefin resin (A), the alicyclic skeleton-containing resin (B) and the epoxy resin (C) in the adhesive composition, they vary depending on the application.
- the composition of the adhesive composition can be set. The method for measuring the dielectric constant and the dielectric loss tangent will be described later.
- the adhesive composition according to the present invention contains a polyolefin resin (A), an alicyclic skeleton-containing resin (B) and an epoxy resin (C), and contains a polyolefin resin (A). ) And the alicyclic skeleton-containing resin (B) contain a carboxyl group and / or a derivative thereof, so that the temperature of the solder heat resistance after being humidified at a temperature of 40 ° C. and a humidity of 90% for 12 hours is increased. It can be preferably 240 ° C. or higher.
- both the polyolefin-based resin (A) and the alicyclic skeleton-containing resin (B) contain a carboxyl group and / or a derivative thereof, the temperature of the solder heat resistance can be further increased, and in particular, the polyolefin-based resin.
- the content ratio of (A) to the alicyclic skeleton-containing resin (B) [polyolefin resin (A)]: [alicyclic skeleton-containing resin (B)] is 5:95 to 95: 5
- the temperature of the solder heat resistance can be set to 240 ° C. or higher.
- the polyolefin resin (A) and the alicyclic skeleton-containing resin are included.
- Other thermoplastic resins other than (B), ultraviolet absorbers, tackifiers, flame retardants, curing agents, curing accelerators, coupling agents, heat aging inhibitors, leveling agents, antifoaming agents, inorganic fillers, pigments , And a solvent or the like can be contained to such an extent that the function of the adhesive composition is not affected.
- thermoplastic resin examples include phenoxy resin, polyamide resin, polyester resin, polycarbonate resin, polyphenylene oxide resin, polyurethane resin, polyacetal resin, polyethylene resin, polypropylene resin, polyvinyl resin and the like. These thermoplastic resins may be used alone or in combination of two or more.
- tackifier examples include kumaron-inden resin, terpene resin, terpene-phenol resin, rosin resin, pt-butylphenol-acetylene resin, phenol-formaldehyde resin, xylene-formaldehyde resin, petroleum hydrocarbon resin, and the like. Examples thereof include hydrogenated hydrocarbon resins and terepine resins. These tackifiers may be used alone or in combination of two or more.
- the flame retardant may be either an organic flame retardant or an inorganic flame retardant.
- organic flame retardant include melamine phosphate, melamine polyphosphate, guanidine phosphate, guanidine polyphosphate, ammonium phosphate, ammonium polyphosphate, ammonium phosphate amide ammonium, polyphosphate amide ammonium, phosphate carbamate, and polyphosphate carbamate.
- Aluminum Trisdiphenylphosphite Aluminum Trismethylethylphosphinate, Aluminum Trisdiphenylphosphinate, Zinc bisdiethylphosphinate, Zinc bismethylethylphosphinate, Zinc bisdiphenylphosphite, Titanyl bisdiphenylphosphite, Titanium tetrakisdiethylphosphinate , Phosphate-based flame retardants such as titanyl bismethylethylphosphinate, titanium tetrakismethylethylphosphinate, titanyl bisdiphenylphosphinate, titanium tetrakisdiphenylphosphinate; triazine compounds such as melamine, melam, melamine cyanurate, and cyanuric acid compounds.
- Isocyanuric acid compound triazole compound, tetrazole compound, diazo compound, urea and other nitrogen-based flame retardant; silicone compound, silane compound and other silicon-based flame retardant.
- the inorganic flame retardant include metal hydroxides such as aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, barium hydroxide and calcium hydroxide; tin oxide, aluminum oxide, magnesium oxide, zirconium oxide and zinc oxide.
- Metal oxides such as molybdenum oxide and nickel oxide; zinc carbonate, magnesium carbonate, barium carbonate, zinc borate, hydrated glass and the like can be mentioned. Two or more of these flame retardants can be used in combination.
- the curing agent examples include, but are not limited to, an amine-based curing agent and an acid anhydride-based curing agent.
- the amine-based curing agent examples include melamine resins such as methylated melamine resin, butylated melamine resin and benzoguanamine resin, dicyandiamide, and 4,4'-diphenyldiaminosulfone.
- the acid anhydride examples include aromatic acid anhydrides and aliphatic acid anhydrides. These curing agents may be used alone or in combination of two or more.
- the content of the curing agent is preferably 1 to 100 parts by mass, more preferably 5 to 70 parts by mass with respect to 100 parts by mass of the epoxy resin (C).
- the curing accelerator is used for the purpose of accelerating the reaction between the carboxyl group-containing polyolefin resin (A) and / or the carboxyl group-containing alicyclic skeleton-containing resin (B) and the epoxy resin, and is tertiary.
- Amine-based curing accelerators, tertiary amine salt-based curing accelerators, imidazole-based curing accelerators, and the like can be used.
- tertiary amine-based curing accelerator examples include benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol, tetramethylguanidine, triethanolamine, N, N'. -Dimethylpiperazine, triethylenediamine, 1,8-diazabicyclo [5.4.0] undecene and the like can be mentioned.
- 1,8-diazabicyclo [5.4.0] undecene, formate, octylate, p-toluenesulfonate, o-phthalate, phenol salt or Phenol novolak resin salt 1,5-diazabicyclo [4.3.0] nonene, formate, octylate, p-toluenesulfonate, o-phthalate, phenol salt or phenolnovolak resin salt, etc.
- imidazole-based curing accelerator examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole, and 2-phenyl-.
- the content of the curing accelerator is preferably 0.5 to 10 parts by mass with respect to 100 parts by mass of the epoxy resin (C), and 1 to 5 parts by mass. It is more preferable that it is a part.
- the content of the curing accelerator is within the above range, it has excellent adhesiveness and heat resistance.
- Examples of the coupling agent include vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-acryloxypropyltrimethoxysilane, and N.
- a silane-based coupling agent such as imidazole silane; a titanate-based coupling agent; an aluminate-based coupling agent; a zirconium-based coupling agent and the like. These may be used alone or in combination of two or more.
- heat antiaging agent examples include 2,6-di-tert-butyl-4-methylphenol, n-octadecyl-3- (3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate, and the like.
- Phenol-based antioxidants such as glycol-bis [3- (3-t-butyl-5-methyl-4-hydroxyphenyl) propionate; dilauryl-3,3'-thiodipropionate, dimyristyl-3,3 '-Sulfur-based antioxidants such as dithiopropionate; phosphorus-based antioxidants such as trisnonylphenyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, and the like.
- the content of the heat antiaging agent may be 0.1 to 10 parts by mass with respect to 100 parts by mass in total of the contents of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B). It is preferably 0.5 to 5 parts by mass, more preferably 0.5 to 5 parts by mass. When this content is within the above range, the electrical characteristics and heat resistance can be improved.
- inorganic filler examples include powders made of titanium oxide, aluminum oxide, zinc oxide, carbon black, silica, talc, copper, silver and the like. These may be used alone or in combination of two or more.
- the adhesive composition comprises at least one of a polyolefin resin (A), an alicyclic skeleton-containing resin (B), an epoxy resin (C) (however, a polyolefin resin (A) and an alicyclic skeleton-containing resin (B)).
- a polyolefin resin (A) an alicyclic skeleton-containing resin (B)
- an epoxy resin (C) (however, a polyolefin resin (A) and an alicyclic skeleton-containing resin (B)).
- the mixing method is not particularly limited, and the adhesive composition may be uniform. Since the adhesive composition is preferably used in the form of a solution or a dispersion, a solvent is also usually used.
- the solvent examples include alcohols such as methanol, ethanol, isopropyl alcohol, n-propyl alcohol, isobutyl alcohol, n-butyl alcohol, benzyl alcohol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, and diacetone alcohol.
- alcohols such as methanol, ethanol, isopropyl alcohol, n-propyl alcohol, isobutyl alcohol, n-butyl alcohol, benzyl alcohol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, and diacetone alcohol.
- Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone, cyclohexanone, isophorone; aromatic hydrocarbons such as toluene, xylene, ethylbenzene, mesitylene; methyl acetate, ethyl acetate, ethylene glycol monomethyl ether acetate, 3- Esters such as methoxybutyl acetate; aliphatic hydrocarbons such as hexane, heptane, cyclohexane, methylcyclohexane and the like can be mentioned. These solvents may be used alone or in combination of two or more.
- the adhesive composition is a solution containing a solvent or a dispersion (resin varnish), coating on the base film and formation of the adhesive layer can be smoothly performed, and an adhesive layer having a desired thickness can be obtained. It can be easily obtained.
- the solid content concentration is preferably in the range of 3 to 80% by mass, more preferably 10 to 50% by mass, from the viewpoint of workability including formation of the adhesive layer.
- the solid content concentration is 80% by mass or less, the viscosity of the solution is appropriate and it is easy to apply the solution uniformly.
- a laminate with an adhesive layer comprising an adhesive layer made of the adhesive composition of the present invention and a base film in contact with at least one surface of the adhesive layer.
- the adhesive layer has a B-stage shape.
- the B-stage shape of the adhesive layer means a semi-cured state in which a part of the adhesive composition starts to cure, and means a state in which the curing of the adhesive composition further progresses by heating or the like. ..
- a coverlay film is mentioned as one aspect of the laminate with an adhesive layer obtained by using the adhesive composition of the present invention.
- the coverlay film has an adhesive layer formed on at least one surface of the base film, and is a laminate in which the base film and the adhesive layer are difficult to peel off.
- the base film includes a polyimide film, a polyether ether ketone film, a polyphenylene sulfide film, an aramid film, a polyethylene naphthalate film, a liquid crystal polymer film, a polyethylene terephthalate film, and a polyethylene film.
- a polyimide film, a polyethylene naphthalate film, and a liquid crystal polymer film are preferable, and a polyimide film and a liquid crystal polymer film are more preferable, from the viewpoint of adhesiveness and electrical characteristics.
- Such base films are commercially available, and for polyimide films, "Kapton (registered trademark)” manufactured by Toray DuPont Co., Ltd., “Zenomax (registered trademark)” manufactured by Toyo Spinning Co., Ltd., and Ube Kosan (registered trademark). "UPIREX (registered trademark) -S” manufactured by Kaneka Corporation, “Apical (registered trademark)” manufactured by Kaneka Corporation, etc. can be used.
- As the polyethylene naphthalate film “Theonex (registered trademark)” manufactured by Teijin DuPont Film Co., Ltd. can be used.
- liquid crystal polymer film "Vexter (registered trademark)” manufactured by Kuraray Co., Ltd., “Viac (registered trademark)” manufactured by Primatec Co., Ltd. and the like can be used.
- the base film can also be used by forming the corresponding resin into a film having a desired thickness.
- a resin varnish containing the above adhesive composition and a solvent is applied to the surface of a base film such as a polyimide film to form a resin varnish layer, and then the resin varnish is formed.
- a coverlay film on which a B-stage-like adhesive layer is formed can be produced.
- the drying temperature at the time of removing the solvent is preferably 40 to 250 ° C, more preferably 70 to 170 ° C. When the drying temperature is 40 ° C. or higher, it becomes easy to prevent deterioration of the electrical characteristics due to the residual solvent, and when the drying temperature is 250 ° C. or lower, it becomes easy to obtain a B-stage-shaped adhesive layer.
- the drying is performed by passing the laminate coated with the adhesive composition through a furnace in which hot air drying, far infrared ray heating, high frequency induction heating and the like are performed.
- a releasable film may be laminated on the surface of the adhesive layer for storage or the like.
- known films such as polyethylene terephthalate film, polyethylene film, polypropylene film, silicone releasable paper, polyolefin resin coated paper, polymethylpentene (TPX) film, and fluororesin film are used.
- the bonding sheet also has the adhesive layer formed on at least one surface of the base film, and a releasable film is used as the base film. Further, the bonding sheet may have an aspect in which an adhesive layer is provided between the two releasable films.
- the releasable film is peeled off before use.
- the same releasable film as described above can be used as the releasable film as described above can be used.
- Such releasable films are also commercially available, such as “Lumirror (registered trademark)” manufactured by Toray Film Processing Co., Ltd., “Toyobo Esther (registered trademark) film” manufactured by Toyobo Co., Ltd., and “” by Asahi Glass Co., Ltd. " “Aflex (registered trademark)”, “Opuran (registered trademark)” manufactured by Mitsui Chemicals Tocello Co., Ltd., etc. can be used.
- a method for producing a bonding sheet for example, there is a method in which a resin varnish containing the adhesive composition and a solvent is applied to the surface of a release film and dried in the same manner as in the case of the coverlay film.
- the thickness of the base film is preferably 5 to 100 ⁇ m, more preferably 5 to 50 ⁇ m, and even more preferably 5 to 30 ⁇ m in order to thin the laminated body with the adhesive layer.
- the thickness of the B-stage adhesive layer is preferably 5 to 100 ⁇ m, more preferably 10 to 70 ⁇ m, and even more preferably 10 to 50 ⁇ m.
- the thickness of the base film and the adhesive layer is selected depending on the application, but the base film tends to be thinner in order to improve the electrical characteristics. Generally, when the thickness of the base film is thin and the thickness of the adhesive layer is thick, the laminate with the adhesive layer tends to warp and the workability is lowered. However, the laminate with the adhesive layer of the present invention is deteriorated. Even when the thickness of the base film is thin and the thickness of the adhesive layer is thick, the body hardly warps the laminated body.
- the ratio (A / B) of the thickness (A) of the adhesive layer to the thickness (B) of the base film is 1 or more and 10 or less. It is preferably 1 or more and 5 or less, more preferably. Further, it is preferable that the thickness of the adhesive layer is thicker than the thickness of the base film.
- the warp of the laminate with the adhesive layer affects the workability in the manufacturing process of the FPC-related product, it is preferable that the warp is as small as possible.
- the ratio (H / L) to the length (L) of one side is preferably less than 0.05. This ratio is more preferably less than 0.04 and even more preferably less than 0.03.
- the ratio (H / L) is less than 0.05, it is possible to further suppress warping and curling of the laminated body, so that workability is excellent.
- the lower limit of H / L is 0 when H is 0, that is, 0.
- the dielectric constant ( ⁇ ) of the laminate with the adhesive layer measured at a frequency of 1 GHz is less than 3.0, and the dielectric loss tangent (tan ⁇ ) is 0.01. It is preferably less than.
- the dielectric constant is more preferably 2.9 or less, and the dielectric loss tangent is more preferably 0.005 or less.
- the dielectric constant is less than 3.0 and the dielectric loss tangent is less than 0.01, it can be suitably used for FPC-related products having strict requirements for electrical characteristics. Since the dielectric constant and the dielectric loss tangent can be adjusted by the type and content of the adhesive component, the type of the base film, and the like, laminates having various configurations can be set according to the application.
- the dielectric constant ( ⁇ ) of the laminated body with the adhesive layer measured at a frequency of 1 GHz is 2.2 or more, and the dielectric loss tangent (tan ⁇ ) is 0.
- the above is preferable.
- the flexible copper-clad laminate can be obtained by laminating a base film and a copper foil using the laminate with an adhesive layer. That is, the obtained flexible copper-clad laminate is composed of a base film, an adhesive layer, and a copper foil in this order. The adhesive layer and the copper foil may be formed on both sides of the base film. Since the adhesive composition of the present invention has excellent adhesiveness to articles containing copper, the flexible copper-clad laminate obtained by the present invention has excellent stability as an integrated product.
- the adhesive layer of the laminate and the copper foil are brought into surface contact, heat laminating is performed at 80 ° C to 150 ° C, and the adhesive layer is further subjected to aftercure.
- the aftercure conditions can be, for example, 100 ° C. to 200 ° C., 30 minutes to 4 hours.
- the copper foil is not particularly limited, and electrolytic copper foil, rolled copper foil, and the like can be used.
- a flexible flat cable can be obtained by laminating a base film and copper wiring using the laminate with an adhesive layer. That is, the obtained flexible flat cable is composed of a base film, an adhesive layer, and copper wiring in this order. The adhesive layer and the copper wiring may be formed on both sides of the base film. Since the adhesive composition of the present invention has excellent adhesiveness to articles containing copper, the flexible flat cable obtained by the present invention has excellent stability as an integrated product.
- the adhesive layer of the laminate is brought into contact with copper wiring, thermal lamination is performed at 80 ° C to 150 ° C, and the adhesive layer is further cured by aftercure.
- the aftercure conditions can be, for example, 100 ° C. to 200 ° C., 30 minutes to 4 hours.
- the shape of the copper wiring is not particularly limited, and the shape or the like may be appropriately selected as desired.
- Acid value 1 g of the polyolefin resin (A) or the alicyclic skeleton-containing resin (B) is dissolved in 30 ml of toluene, and the automatic titrator "AT-510" manufactured by Kyoto Denshi Kogyo Co., Ltd. is used as a burette by the company "APB-". The one to which "510-20B" was connected was used. Potentiometric titration was performed using a 0.01 mol / L benzyl alcoholic KOH solution as a titration reagent, and the number of mg of KOH per 1 g of the resin was calculated.
- This test piece was subjected to measurement in a tensile mode by a dynamic viscoelasticity measuring device "EXSTAR DMS6100" (manufactured by SII Nanotechnology) under the conditions of a heating rate of 2 ° C./min and a frequency of 1 Hz.
- the maximum value of the loss tangent of the obtained curve was taken as the glass transition temperature (Tg).
- a release polyethylene terephthalate film having a thickness of 38 ⁇ m was prepared, and the liquid adhesive composition shown in Table 1 was rolled-coated on one surface thereof.
- the film with a coating film was allowed to stand in an oven and dried at 90 ° C. for 3 minutes to form a film (adhesive layer) having a thickness of 25 ⁇ m to obtain a bonding sheet.
- a single-sided copper-clad laminate (LCP film 50 ⁇ m, rolled copper foil 12 ⁇ m) having a thickness of 62 ⁇ m was prepared, and the LCP surface and the adhesive layer of the bonding sheet were laminated so as to be in surface contact, and the temperature was 150 ° C.
- Laminating was performed under the conditions of a pressure of 0.4 MPa and a speed of 0.5 m / min to obtain a single-sided copper-clad laminate with an adhesive layer.
- the rolled copper foil having a thickness of 35 ⁇ m and the adhesive layer of the single-sided copper-clad laminate with the adhesive layer were superposed so as to be in surface contact with each other, and the temperature was 150 ° C., the pressure was 0.4 MPa, and the speed was 0.5 m / min.
- Laminate was performed under the conditions of. Next, this laminate (single-sided copper-clad laminate / adhesive layer / copper foil) was heat-bonded for 30 minutes under the conditions of a temperature of 180 ° C.
- the permittivity ( ⁇ ) and the dielectric loss tangent (tan ⁇ ) are measured by a split-post dielectric resonator method (SPDR method) using a network analyzer 85071E-300 (manufactured by Agilent) under the conditions of a temperature of 23 ° C. and a frequency of 1 GHz. bottom.
- SPDR method split-post dielectric resonator method
- Polyolefin-based resin a1 100 parts by mass of a propylene-ethylene random copolymer composed of 97 mol% of propylene unit and 3 mol% of ethylene unit, 1.0 part by mass of maleic anhydride, 0.5 part by mass of lauryl methacrylate produced using a metallocene catalyst as a polymerization catalyst. And 0.8 parts by mass of dit-butyl peroxide was kneaded and reacted using a twin-screw extruder in which the maximum temperature of the cylinder part was set to 170 ° C.
- modified olefin-based elastomer had a weight average molecular weight of 150,000 and an acid value of 10 mgKOH / g.
- Polyolefin-based resin a2 (olefin-based elastomer) A propylene-ethylene random copolymer composed of 97 mol% of propylene unit and 3 mol% of ethylene unit produced by using a metallocene catalyst as a polymerization catalyst was used.
- Styrene-based elastomer A trade name "Tuftec M1913" (maleic acid-modified styrene-ethylenebutylene-styrene block copolymer) manufactured by Asahi Kasei Chemicals Co., Ltd. was used.
- the acid value of this copolymer is 10 mgKOH / g, the styrene / ethylene butylene ratio is 30/70, and the weight average molecular weight is 150,000.
- Alicyclic skeleton-containing resin (1) Alicyclic skeleton-containing resin b1 Cyclic olefin resin (manufactured by Nippon Zeon, trade name "Zeonoa 1060R", 100 parts by mass is heated and dissolved in 400 parts by mass of xylene in a four-necked flask in a nitrogen atmosphere, and then stirred while keeping the internal temperature at 140 ° C. , 8 parts by mass of maleic anhydride and 3 parts by mass of dicumyl peroxide as a radical generator were added over 2 hours each, and then the reaction was carried out for 6 hours. After the reaction was completed, the obtained reaction product was put into a large amount of acetone.
- the resin was further washed with acetone several times to remove unreacted maleic anhydride, and then dried under reduced pressure to obtain an alicyclic skeleton-containing resin b1.
- the pellet was extruded into a strand shape from an extruder in a molten state, cooled and then pelletized to recover the pellet. Then, 4 parts by mass of maleic anhydride, 2 parts by mass of dicumylperoxide, and 230 parts by mass of tert-butylbenzene were added to 100 parts by mass of the hydride of the obtained styrene-ethylenebutylene-styrene block copolymer. After reacting in an autoclave at 135 ° C. for 6 hours, it was poured into a large amount of isopropyl alcohol to precipitate, and the mixture was collected by filtration.
- the recovered resin was dried at 100 ° C. and 1 Torr or less for 48 hours to obtain an alicyclic skeleton-containing resin b2.
- Epoxy resin (1) Epoxy resin c1 The product name "EPICLON HP-7200" (dicyclopentadiene skeleton-containing epoxy resin) manufactured by DIC Corporation was used. (2) Epoxy resin c2 The product name "EPICLON N-655EXP” (cresol novolac type epoxy resin) manufactured by DIC Corporation was used.
- Curing accelerator A product name "Curesol C11-Z” (imidazole-based curing accelerator) manufactured by Shikoku Chemicals Corporation was used.
- Ultraviolet absorber The product name "Uvinul 3049" manufactured by BASF was used.
- Adhesive Composition A liquid adhesive composition was prepared and evaluated by adding the above raw materials to a 1000 ml flask equipped with a stirrer at the ratios shown in Table 1 and stirring and dissolving at room temperature for 6 hours. The results are shown in Table 1.
- the adhesive compositions of Examples 1 to 11 are excellent in adhesiveness, wet-heat solder heat resistance, and electrical characteristics. Further, from the comparison between Example 1 and Example 11, it can be seen that when the ultraviolet absorber is contained, the laser drilling workability is also excellent. On the other hand, when the adhesive composition does not contain the alicyclic skeleton-containing resin (B) as in Comparative Example 1, the heat resistance of the wet-heat solder is inferior. Further, when the adhesive composition does not contain the polyolefin resin (A) as in Comparative Example 2, the adhesiveness and the heat resistance of the wet-heat solder are inferior.
- the adhesive composition does not contain the epoxy resin (C) as in Comparative Example 3, the heat resistance of the wet-heat solder is inferior.
- Comparative Example 4 when neither the polyolefin resin (A) nor the alicyclic skeleton-containing resin (B) contained in the adhesive composition contains a carboxyl group, the heat resistance of the wet-heat solder is inferior. ..
- Comparative Example 5 when the adhesive composition contains a styrene-based elastomer containing a carboxyl group instead of the polyolefin-based resin (A) and the alicyclic skeleton-containing resin (B), the adhesiveness is adhesive. Is improved, but the heat resistance of wet and heat solder is inferior.
- the adhesive composition of the present invention is excellent in adhesiveness, wet-heat solder heat resistance, electrical properties, and the like. Therefore, the adhesive composition of the present invention is suitable for producing FPC-related products.
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Abstract
Description
1.ポリオレフィン系樹脂(A)と、脂環式骨格含有樹脂(B)と、エポキシ樹脂(C)とを含有し、前記ポリオレフィン系樹脂(A)及び前記脂環式骨格含有樹脂(B)の少なくとも一方がカルボキシル基及び/又はその誘導体を含有し、硬化物の誘電率が、2.5未満であることを特徴とする接着剤組成物。
2.前記ポリオレフィン系樹脂(A)および前記脂環式骨格含有樹脂(B)の含有量の合計が、接着剤組成物の固形分100質量部に対して50質量部以上であり、前記エポキシ樹脂(C)の含有量が、前記ポリオレフィン系樹脂(A)および前記脂環式骨格含有樹脂(B)の含有量の合計100質量部に対して1~20質量部である、上記1.に記載の接着剤組成物。
3.前記ポリオレフィン系樹脂(A)と前記脂環式骨格含有樹脂(B)の含有量比が、質量比で[ポリオレフィン系樹脂(A)]:[脂環式骨格含有樹脂(B)]=5:95~95:5である、上記1.又は2.に記載の接着剤組成物。
4.前記ポリオレフィン系樹脂(A)がカルボキシル基及び/又はその誘導体を含有し、該ポリオレフィン系樹脂の酸価が、0.1~50mgKOH/gである、上記1.~3.のいずれか1項に記載の接着剤組成物。
5.前記ポリオレフィン系樹脂(A)が、エチレン-プロピレン共重合体、プロピレン-ブテン共重合体及びエチレン-プロピレン-ブテン共重合体からなる群より選択される少なくとも1種である、上記1.~4.のいずれか1項に記載の接着剤組成物。
6.前記脂環式骨格含有樹脂(B)がカルボキシル基及び/又はその誘導体を含有し、該脂環式骨格含有樹脂(B)の酸価が、0.1~50mgKOH/gである、上記1.~5.のいずれか1項に記載の接着剤組成物。
7.前記脂環式骨格含有樹脂(B)が、側鎖に脂環式骨格を有する上記1.~6.のいずれか1項に記載の接着剤組成物。
8.前記エポキシ樹脂(C)が、ジシクロペンタジエン骨格を含有する多官能のエポキシ樹脂である上記1.~7.のいずれか1項に記載の接着剤組成物。
9.周波数1GHzで測定した前記硬化物の誘電正接が、0.01未満である上記1.~8.のいずれか1項に記載の接着剤組成物。
10.温度40℃および湿度90%にて12時間加湿処理した後のはんだ耐熱性の温度が260℃以上である、上記1.~9.のいずれか1項に記載の接着剤組成物。
11.さらに、紫外線吸収剤を含有する、上記1.~10.のいずれかに1項記載の接着剤組成物。
12.フレキシブル銅張積層板用である、上記1.~11.に記載の接着剤組成物。
13.フレキシブルフラットケーブル用である、上記1.~12.のいずれか1項に記載の接着剤組成物。
14.上記1.~13.のいずれか1項に記載の接着剤組成物を用いて得られた接着性層が、ポリイミドフィルム、ポリエーテルエーテルケトンフィルム、ポリフェニレンサルファイドフィルム、アラミドフィルム、ポリエチレンナフタレートフィルム、液晶ポリマーフィルム、ポリエチレンテレフタレートフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、TPXフィルム、及びフッ素系樹脂フィルムより選択される1種のフィルムの少なくとも片面に形成されてなることを特徴とするカバーレイフィルム。
15.上記1.~14.のいずれか1項に記載の接着剤組成物を用いて得られた接着性層が、離型性フィルムの少なくとも片面に形成されてなることを特徴とするボンディングシート。
本発明の接着剤組成物は、ポリオレフィン系樹脂(A)と、脂環式骨格含有樹脂(B)と、エポキシ樹脂(C)とを含有する接着剤組成物であって、前記ポリオレフィン系樹脂(A)および前記脂環式骨格含有樹脂(B)の少なくとも一方がカルボキシル基及び/又はその誘導体を含有し、硬化物の誘電率が、2.5未満であることを特徴とする。以下に本発明を特定する事項について、具体的に説明する。
上記ポリオレフィン系樹脂(A)は、接着剤組成物の主要な成分の1つであり、接着性や硬化物の柔軟性に加えて、電気特性を与える成分である。このポリオレフィン系樹脂は、オレフィンに由来する構造単位を有するものであれば、特に限定されないが、エチレン、プロピレン、ブテン、ペンテン、ヘキセン、ヘプテン、オクテン、4-メチル-1-ペンテン等の炭素数2以上20以下の単独重合体又は共重合体が好ましく用いられる。本発明においては、炭素数2以上6以下のオレフィンの単独重合体又は共重合体が特に好ましい。ポリオレフィン系樹脂中の構造単位の含有割合は任意に選択できるが、難接着性被着体への接着を行う場合は、上記ポリオレフィン系樹脂は、エチレン-プロピレン共重合体、プロピレン-ブテン共重合体又はエチレン-プロピレン-ブテン共重合体であることが好ましい。尚、特に優れた接着性を得る場合には、プロピレン単位の含有割合が50モル%以上98モル%以下であるポリオレフィン系樹脂を用いることが好ましい。プロピレン単位の含有割合が前記の範囲内であると、2つの部材を接着した後の接着部に柔軟性を付与することができる。また、ポリオレフィン系樹脂の分子量は、特に制限されない。なお、ポリオレフィン系樹脂(A)は後で説明する脂環式骨格含有樹脂(B)及びエポキシ樹脂(C)を包含するものではない。
酸変性されたポリオレフィン系樹脂は、未変性ポリオレフィン系樹脂に由来する部分と、変性剤に由来するグラフト部分とを有する樹脂であり、好ましくは、未変性ポリオレフィン系樹脂の存在下にα,β-不飽和カルボン酸又はその誘導体を含む変性剤をグラフト重合することにより得ることができる。グラフト重合による変性ポリオレフィン系樹脂の製造は、公知の方法で行うことが可能であり、製造の際にはラジカル開始剤を用いてもよい。上記変性ポリオレフィン系樹脂の製造方法としては、例えば、未変性ポリオレフィン系樹脂をトルエン等の溶剤に加熱溶解し、上記変性剤及びラジカル開始剤を添加する溶液法や、バンバリーミキサー、ニーダー、押出機等を使用して未変性ポリオレフィン系樹脂、変性剤及びラジカル開始剤を溶融混練する溶融法等が挙げられる。未変性ポリオレフィン系樹脂、変性剤及びラジカル開始剤の使用方法は、特に限定されず、これらを、反応系に一括添加しても、逐次添加してもよい。
また、ポリオレフィン系樹脂(A)と脂環式骨格含有樹脂(B)の含有量比は、質量比で[ポリオレフィン系樹脂(A)]:[脂環式骨格含有樹脂(B)]=5:95~95:5であることが好ましく、[ポリオレフィン系樹脂(A)]:[脂環式骨格含有樹脂(B)]=10:90~90:10であることがより好ましい。含有量比がこの範囲にあると、湿熱はんだ耐熱性の高い改善効果が得られる。
脂環式骨格含有樹脂(B)としては、脂環式骨格を有する化合物(b)を単量体単位として含む重合体、換言すれば、飽和または不飽和環式炭化水素骨格を有する化合物(b)から誘導された構造単位を含む重合体が挙げられる。該重合体は単独重合体であっても、共重合体であってもよい。上記化合物(b)がスチレンやノルボルネン等の不飽和環式炭化水素骨格を有する化合物(b)である場合、脂環式骨格含有樹脂(B)の脂環式骨格は、該化合物(b)の重合反応または水素付加反応により生成する。脂環式骨格含有樹脂(B)は、脂環式骨格を主鎖および側鎖の少なくとも一方に有するものであってよく、好ましくは、オレフィン系重合体等の鎖式炭化水素鎖の主鎖および/または側鎖に脂環式骨格を有し、樹脂単体で熱可塑性を示し、非晶性であるものが挙げられる。脂環式骨格含有樹脂(B)は後で説明するエポキシ樹脂(C)を包含するものではない。
酸変性された脂環式骨格含有樹脂は、未変性脂環式骨格含有樹脂に由来する部分と、変性剤に由来するグラフト部分とを有する樹脂であり、好ましくは、未変性脂環式骨格含有樹脂の存在下にα,β-不飽和カルボン酸またはその誘導体を含む変性剤をグラフト重合することにより得ることができる。グラフト重合による変性脂環式骨格含有樹脂の製造は、公知の方法で行うことが可能であり、製造の際にはラジカル開始剤を用いてもよい。上記変性脂環式骨格含有樹脂の製造方法としては、例えば、未変性脂環式骨格含有樹脂をトルエン等の溶剤に加熱溶解し、上記変性剤およびラジカル開始剤を添加する溶液法や、バンバリーミキサー、ニーダー、押出機等を使用して未変性脂環式骨格含有樹脂、変性剤およびラジカル開始剤を溶融混練する溶融法等が挙げられる。未変性脂環式骨格含有樹脂、変性剤およびラジカル開始剤の使用方法は、特に限定されず、これらを、反応系に一括添加しても、逐次添加してもよい。上記変性脂環式骨格含有樹脂を製造する場合には、α,β-不飽和カルボン酸のグラフト効率を向上させるための変性助剤、樹脂安定性の調整のための安定剤等を更に使用することができる。
CH2=CR1COOR2 (2)
(式中、R1は水素原子またはメチル基であり、R2は炭化水素基である。)
次に、上記接着剤組成物のもう一つの成分であるエポキシ樹脂(C)について説明する。エポキシ樹脂は(C)は、上記カルボキシル基含有ポリオレフィン系樹脂(A)および/または上記カルボキシル基含有脂環式骨格含有樹脂(B)中のカルボキシ基と反応し、被着体に対する高い接着性や、接着剤硬化物の耐熱性を発現させる成分である。
上記エポキシ樹脂の中でも、グリシジルアミノ基を有しないエポキシ樹脂が好ましい。接着剤層付き積層体の貯蔵安定性が向上するからである。また、電気特性に優れた接着剤組成物が得られることから、脂環骨格を有するエポキシ樹脂が好ましく、ジシクロペンタジエン骨格を有するエポキシ樹脂がより好ましい。
本発明に係る接着剤組成物は、ポリオレフィン系樹脂(A)、脂環式骨格含有樹脂(B)およびエポキシ樹脂(C)を含有し、周波数1GHzで測定した接着剤硬化物の誘電率(ε)が2.5未満であることを特徴としている。当該誘電率が2.5未満であれば、FPC関連製品への利用に好適である。また、周波数1GHzで測定した接着剤硬化物の誘電正接(tanδ)が、0.01未満であることが好ましい。当該誘電正接が0.01未満であれば、電気特性に優れるFPC関連製品を製造することができる。誘電率および誘電正接は、接着剤組成物中のポリオレフィン系樹脂(A)、脂環式骨格含有樹脂(B)およびエポキシ樹脂(C)の割合に応じて調整できるので、用途に応じて、種々の構成の接着剤組成物を設定することができる。なお、誘電率および誘電正接の測定方法は後述する。
本発明に係る接着剤組成物は、ポリオレフィン系樹脂(A)、脂環式骨格含有樹脂(B)およびエポキシ樹脂(C)を含有し、ポリオレフィン系樹脂(A)および脂環式骨格含有樹脂(B)の少なくとも一方がカルボキシル基及び/又はその誘導体を含有するため、温度40℃および湿度90%にて12時間加湿処理した後のはんだ耐熱性の温度を高めることができ、好ましくは240℃以上にすることができる。ポリオレフィン系樹脂(A)または脂環式骨格含有樹脂(B)の両方がカルボキシル基及び/又はその誘導体を含有する場合は、上記はんだ耐熱性の温度をより高めることができ、特に、ポリオレフィン系樹脂(A)と脂環式骨格含有樹脂(B)の含有量比[ポリオレフィン系樹脂(A)]:[脂環式骨格含有樹脂(B)]を5:95~95:5とした場合は、上記はんだ耐熱性の温度を240℃以上にすることができる。
上記接着剤組成物には、ポリオレフィン系樹脂(A)、脂環式骨格含有樹脂(B)およびエポキシ樹脂(C)に加えて、ポリオレフィン系樹脂(A)および脂環式骨格含有樹脂(B)以外の他の熱可塑性樹脂、紫外線吸収剤、粘着付与剤、難燃剤、硬化剤、硬化促進剤、カップリング剤、熱老化防止剤、レベリング剤、消泡剤、無機充填剤、顔料、および溶媒等を、接着剤組成物の機能に影響を与えない程度に含有することができる。
硬化剤の含有量は、エポキシ樹脂(C)100質量部に対して、1~100質量部であることが好ましく、5~70質量部であることがより好ましい。
ロピルトリメトキシシラン、p-スチリルトリメトキシシラン、3-メタクリロキシプロピルメチルジメトキシシラン、3-アクリロキシプロピルトリメトキシシラン、N-2-(アミノエチル)-3-アミノプロピルメチルジメトシキシラン、3-ウレイドプロピルトリエトキシシラン、3-メルカプトプロピルメチルジメトキシシラン、ビス(トリエトキシシリルプロピル)テトラスルフィド、3-イソシアネートプロピルトリエトキシシラン、イミダゾールシラン等のシラン系カップリング剤;チタネート系カップリング剤;アルミネート系カップリング剤;ジルコニウム系カップリング剤等が挙げられる。これらは、単独で用いてよいし、2種以上を組み合わせて用いてもよい。
上記熱老化防止剤の含有量は、上記ポリオレフィン系樹脂(A)および上記脂環式骨格含有樹脂(B)の含有量の合計100質量部に対して0.1~10質量部であることが好ましく、0.5~5質量部であることがより好ましい。この含有量が上記範囲内であることにより、電気特性および耐熱性を向上させることができる。
本発明によれば、本発明の接着剤組成物からなる接着剤層と、該接着剤層の少なくとも一方の面に接する基材フィルムとを備えた接着剤層付き積層体が得られ、前記接着剤層がBステージ状であることが好ましい。ここで、接着剤層がBステージ状であるとは、接着剤組成物の一部が硬化し始めた半硬化状態をいい、加熱等により、接着剤組成物の硬化が更に進行する状態をいう。
前記溶媒を除去するときの乾燥温度は、40~250℃であることが好ましく、70~170℃であることがより好ましい。乾燥温度が40℃以上であることにより、溶剤の残存による電気特性の悪化を防止し易くなり、250℃以下であることにより、Bステージ状の接着剤層を得易くなる。乾燥は、接着剤組成物が塗布された積層体を、熱風乾燥、遠赤外線加熱、および高周波誘導加熱等がなされる炉の中を通過させることにより行われる。
なお、必要に応じて、接着剤層の表面には、保管等のため、離型性フィルムを積層してもよい。前記離型性フィルムとしては、ポリエチレンテレフタレートフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、シリコーン離型処理紙、ポリオレフィン樹脂コート紙、ポリメチルペンテン(TPX)フィルム、フッ素系樹脂フィルム等の公知のものが用いられる。
上記基材フィルムおよび接着剤層の厚さは用途により選択されるが、電気特性を向上させるために基材フィルムはより薄くなる傾向にある。一般的に基材フィルムの厚さが薄く、接着剤層の厚さが厚くなると、接着剤層付き積層体に反りが生じやすくなり、作業性が低下するが、本発明の接着剤層付き積層体は、基材フィルムの厚さが薄く、接着剤層の厚さが厚い場合でも、積層体の反りがほとんど生じない。本発明の接着剤層付き積層体において、接着剤層の厚さ(A)と、基材フィルムの厚さ(B)との比(A/B)は、1以上、10以下であることが好ましく、1以上、5以下であることがより好ましい。更に、接着剤層の厚さが、基材フィルムの厚さより厚いことが好ましい。
また、上記H/Lの下限値は、Hが0である場合、すなわち0である。
また、上記積層体の接着剤層を硬化させた後、周波数1GHzで測定した接着剤層付き積層体の誘電率(ε)が2.2以上であり、かつ、該誘電正接(tanδ)が0以上であることが好ましい。
本発明によれば、フレキシブル銅張積層板は、上記接着剤層付き積層体を用いて、基材フィルムと銅箔とを貼り合わせることにより得られる。即ち、得られたフレキシブル銅張積層板は、基材フィルム、接着層および銅箔の順に構成される。なお、接着層および銅箔は、基材フィルムの両面に形成されていてもよい。本発明の接着剤組成物は、銅を含む物品との接着性に優れるので、本発明により得られるフレキシブル銅張積層板は、一体化物として安定性に優れる。
本発明によれば、上記接着剤層付き積層体を用いて、基材フィルムと銅配線とを貼り合わせることにより、フレキシブルフラットケーブルが得られる。即ち、得られたフレキシブルフラットケーブルは、基材フィルム、接着層および銅配線の順に構成されたものである。なお、接着層および銅配線は、基材フィルムの両面に形成されていてもよい。本発明の接着剤組成物は、銅を含む物品との接着性に優れるので、本発明により得られるフレキシブルフラットケーブルは、一体化物として安定性に優れる。
(1)重量平均分子量
下記の条件で、GPC測定を行い、ポリオレフィン系樹脂(A)および脂環式骨格含有樹脂(B)のMwを求めた。Mwは、GPCにより測定したリテンションタイムを標準ポリスチレンのリテンションタイムを基準にして換算した。
装置:アライアンス2695(Waters社製)
カラム:TSKgel SuperMultiporeHZ-H 2本、TSKgel SuperHZ2500 2本、(東ソー社製)
カラム温度: 40℃
溶離液: テトラヒドロフラン 0.35ml/分
検出器: RI
ポリオレフィン系樹脂(A)または脂環式骨格含有樹脂(B)1gをトルエン30mlに溶解し、京都電子工業社製自動滴定装置「AT-510」にビュレットとして同社製「APB-510-20B」を接続したものを使用した。滴定試薬としては0.01mol/Lのベンジルアルコール性KOH溶液を用いて電位差滴定を行い、樹脂1gあたりのKOHのmg数を算出した。
厚さ38μmの離型ポリエチレンテレフタレートフィルムを用意し、その一方の表面に、脂環式骨格含有樹脂(B)の有機溶剤溶液を、ロ-ル塗布した。次いで、この塗膜付きフィルムをオーブン内に静置して、90℃で3分間乾燥させて厚さ25μmの被膜を形成し、ボンディングシートを得た。次に、得られた積層フィルムからPETフィルムを剥がして、これをガラス転移温度測定用の試験片とした。この試験片を、動的粘弾性測定装置「EXSTAR DMS6100」(エスアイアイ・ナノテクノロジー製)により、昇温速度2℃/min、周波数1Hzの条件にて、引張モードで測定に供した。得られた曲線の損失正接の最大値をガラス転移温度(Tg)とした。
厚さ38μmの離型ポリエチレンテレフタレートフィルムを用意し、その一方の表面に、表1に記載の液状接着剤組成物を、ロ-ル塗布した。次いで、この塗膜付きフィルムをオーブン内に静置して、90℃で3分間乾燥させて厚さ25μmの被膜(接着性層)を形成し、ボンディングシートを得た。次に、厚さ62μmの片面銅張積層板(LCPフィルム50μm、圧延銅箔12μm)を用意し、LCP表面と前記ボンディングシートの接着剤層とを面接触するように重ね合わせ、温度150℃、圧力0.4MPa、および速度0.5m/分の条件でラミネ-トを行い、接着剤層付き片面銅張積層板を得た。その後、厚さ35μmの圧延銅箔と、接着剤層付き片面銅張積層板の接着剤層とを面接触するように重ね合わせ、温度150℃、圧力0.4MPa、および速度0.5m/分の条件でラミネ-トを行った。次いで、この積層体(片面銅張積層板/接着剤層/銅箔)を温度180℃、および圧力3MPaの条件で30分間加熱圧着し、フレキシブル銅張積層板Aを得た。このフレキシブル銅張積層板Aを切断して、所定の大きさの接着試験片を作製した。
接着性を評価するために、JIS C 6481「プリント配線板用銅張積層板試験方法」に準拠し、温度23℃および引張速度50mm/分の条件で、各接着試験片の銅箔をLCPフィルムから剥がすときの90゜はく離接着強さ(N/mm)を測定した。測定時の接着試験片の幅は10mmとした。
JIS C 6481「プリント配線板用銅張積層板試験方法」に準拠し、次の条件で試験を行った。フレキシブル銅張積層板Aを20mm角に裁断し試験片を作製した。その後、試験片について40℃、90%、12hrの湿熱負荷処理を行った。その後、リフローシミュレーターに片面銅張積層板の面を上にして試験片を投入し、接着試験片表面の発泡が見られる温度を観察した。
<評価基準>
○:260℃以上
△:240~260℃
×:240℃以下
フレキシブル銅張積層板Aについて、ESI社製UV-YAGレーザー Model5335を使用し、銅張積層板から接着剤層と圧延銅箔の境界までビア加工を行った。その後、ビア部の断面を光学顕微鏡にて観察し、接着剤層のケズレ長さを測定した。
<評価基準>
○:ケズレ長さ10μm以下
×:ケズレ長さ10μm以上
厚さ38μmの離型ポリエチレンテレフタレートフィルムを用意し、その一方の表面に、表1に記載の液状接着剤組成物を、ロ-ル塗布した。次いで、この塗膜付きフィルムをオーブン内に静置して、90℃で3分間乾燥させて厚さ50μmの被膜(接着性層)を形成し、ボンディングシートを得た。次に、このボンディングシートをオーブン内に静置して、180℃、30min加熱処理をした。その後、前記離型フィルムを剥がして、試験片(150×120mm)を作製した。誘電率(ε)および誘電正接(tanδ)は、ネットワークアナライザー85071E-300(アジレント社製)を使用し、スプリットポスト誘電体共振器法(SPDR法)で、温度23℃、周波数1GHzの条件で測定した。
メタロセン触媒を重合触媒として製造した、プロピレン単位97モル%およびエチレン単位3モル%からなるプロピレン-エチレンランダム共重合体100質量部、無水マレイン酸1.0質量部、メタクリル酸ラウリル0.5質量部およびジ-t-ブチルパーオキサイド0.8質量部を、シリンダー部の最高温度を170℃に設定した二軸押出機を用いて混練反応した。その後、押出機内にて減圧脱気を行い、残留する未反応物を除去して、変性オレフィン系エラストマーを製造した。この変性オレフィン系エラストマーは、重量平均分子量が15万、酸価が10mgKOH/gであった。
(2)ポリオレフィン系樹脂a2(オレフィン系エラストマー)
メタロセン触媒を重合触媒として製造した、プロピレン単位97モル%およびエチレン単位3モル%からなるプロピレン-エチレンランダム共重合体を用いた。
(3)スチレン系エラストマー
旭化成ケミカルズ社製の商品名「タフテックM1913」(マレイン酸変性スチレン-エチレンブチレン-スチレンブロック共重合体)を用いた。この共重合体の酸価は10mgKOH/gであり、スチレン/エチレンブチレン比は30/70であり、重量平均分子量は15万である。
(1)脂環式骨格含有樹脂b1
環状オレフィン樹脂(日本ゼオン製 商品名「ゼオノア1060R」100質量部を、4つ口フラスコ中、窒素雰囲気下でキシレン400質量部に加熱溶解させた後、系内温度を140℃に保って攪拌下、無水マレイン酸8質量部とラジカル発生剤としてジクミルパーオキサイド3質量部をそれぞれ2時間かけて加え、その後6時間反応させた。反応終了後、得られた反応物を多量のアセトン中に投入し、樹脂を析出させた。この樹脂をさらにアセトンで数回洗浄し、未反応の無水マレイン酸を除去した後、減圧乾燥して脂環式骨格含有樹脂b1を得た。脂環式骨格含有樹脂b1は、酸価10mgKOH/g、Tg=100℃であった。
旭化成製「タフテックH1041」(スチレン-エチレンブチレン-スチレンブロック共重合体)100質量部に対して、シクロヘキサン400質量部を加え、さらに水素化触媒としてニッケル-アルミナ触媒(日揮化学社製)7質量部を加え、水素により5MPaに加圧して攪拌しながら温度200℃まで加温した後、4時間水素化反応させた。その後、水素化触媒を除去し、酸化防止剤(チバスペシャリティ・ケミカルズ製「イルガノックス1010」)を0.5質量部添加して溶解させた。次いで、溶媒であるシクロヘキサン及びその他の揮発成分を除去しつつ溶融状態で押出機からストランド状に押出し、冷却後ペレット化してペレットを回収した。そして得られたスチレン-エチレンブチレン-スチレンブロック共重合体の水素化物100質量部に対して、無水マレイン酸4質量部、ジクミルパーオキシド2質量部、tert-ブチルベンゼン230質量部を配合し、オートクレーブ中にて135℃、6時間反応を行った後、多量のイソプロピルアルコール中に注いで析出させ、濾別して回収した。回収した樹脂を100℃、1Torr以下で48時間乾燥させ、脂環式骨格含有樹脂b2を得た。脂環式骨格含有樹脂b2は、酸価10mgKOH/mg、Tg=70℃であった。
日本ゼオン製 商品名「ゼオネックス330R」を使用した。本製品は、酸価0mgKOH/g、Tg=120℃であった。
4-1.エポキシ樹脂
(1)エポキシ樹脂c1
DIC社製 商品名「EPICLON HP-7200」(ジシクロペンタジエン骨格含有エポキシ樹脂)を用いた。
(2)エポキシ樹脂c2
DIC社製 商品名「EPICLON N-655EXP」(クレゾールノボラック型エポキシ樹脂)を用いた。
(1)硬化促進剤
四国化成社製 商品名「キュアゾールC11-Z」(イミダゾール系硬化促進剤)を用いた。
(2)熱老化防止剤
ADEKA製 商品名「アデカスタブ AO-60」を用いた。
(3)紫外線吸収剤
BASF製 商品名「Uvinul3049」を用いた。
メチルシクロヘキサン250質量部、トルエン250質量部、及びメチルエチルケトン50質量部を混合して用いた。
撹拌装置付き1000mlフラスコに、上記の原料を表1に示す割合で添加し、室温下で6時間撹拌して溶解することにより、液状接着剤組成物を調製し評価した。結果を表1に示す。
上記接着剤組成物を用いて、接着剤層付き積層体を製造し評価した。結果を表1に示す。
Claims (15)
- ポリオレフィン系樹脂(A)と、脂環式骨格含有樹脂(B)と、エポキシ樹脂(C)とを含有し、前記ポリオレフィン系樹脂(A)及び前記脂環式骨格含有樹脂(B)の少なくとも一方がカルボキシル基及び/又はその誘導体を含有し、硬化物の誘電率が、2.5未満であることを特徴とする接着剤組成物。
- 前記ポリオレフィン系樹脂(A)及び前記脂環式骨格含有樹脂(B)の含有量の合計が、接着剤組成物の固形分100質量部に対して50質量部以上であり、
前記エポキシ樹脂(C)の含有量が、前記ポリオレフィン系樹脂(A)及び前記脂環式骨格含有樹脂(B)の含有量の合計100質量部に対して1~20質量部である、請求項1に記載の接着剤組成物。 - 前記ポリオレフィン系樹脂(A)と前記脂環式骨格含有樹脂(B)の含有量比が、質量比で[ポリオレフィン系樹脂(A)]:[脂環式骨格含有樹脂(B)]=5:95~95:5である、請求項1又は2に記載の接着剤組成物。
- 前記ポリオレフィン系樹脂(A)がカルボキシル基及び/又はその誘導体を含有し、該ポリオレフィン系樹脂の酸価が、0.1~50mgKOH/gである請求項1~3のいずれか1項に記載の接着剤組成物。
- 前記ポリオレフィン系樹脂(A)が、エチレン-プロピレン共重合体、プロピレン-ブテン共重合体及びエチレン-プロピレン-ブテン共重合体からなる群より選択される少なくとも1種である請求項1~4のいずれか1項に記載の接着剤組成物。
- 前記脂環式骨格含有樹脂(B)がカルボキシル基及び/又はその誘導体を含有し、該脂環式骨格含有樹脂(B)の酸価が、0.1~50mgKOH/gである請求項1~5のいずれか1項に記載の接着剤組成物。
- 前記脂環式骨格含有樹脂(B)が、側鎖に脂環式骨格を有する、請求項1~6のいずれか1項に記載の接着剤組成物。
- 前記エポキシ樹脂(C)が、ジシクロペンタジエン骨格を含有する多官能のエポキシ樹脂である、請求項1~7のいずれか1項に記載の接着剤組成物。
- 周波数1GHzで測定した前記硬化物の誘電正接が、0.01未満である、請求項1~8のいずれか1項に記載の接着剤組成物。
- 温度40℃及び湿度90%にて12時間加湿処理した後のはんだ耐熱性の温度が260℃以上である、請求項1~9のいずれか1項に記載の接着剤組成物。
- さらに、紫外線吸収剤を含有する、請求項1~10のいずれか1項に記載の接着剤組成物。
- フレキシブル銅張積層板用である、請求項1~11のいずれか1項に記載の接着剤組成物。
- フレキシブルフラットケーブル用である、請求項1~12のいずれか1項に記載の接着剤組成物。
- 請求項1~13のいずれか1項に記載の接着剤組成物を用いて得られた接着性層が、ポリイミドフィルム、ポリエーテルエーテルケトンフィルム、ポリフェニレンサルファイドフィルム、アラミドフィルム、ポリエチレンナフタレートフィルム、液晶ポリマーフィルム、ポリエチレンテレフタレートフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、TPXフィルム、及びフッ素系樹脂フィルムより選択される1種のフィルムの少なくとも片面に形成されてなることを特徴とするカバーレイフィルム。
- 請求項1~14のいずれか1項に記載の接着剤組成物を用いて得られた接着性層が、離型性フィルムの少なくとも片面に形成されてなることを特徴とするボンディングシート。
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JP2019038902A (ja) * | 2017-08-23 | 2019-03-14 | 藤森工業株式会社 | 接着性樹脂組成物及び積層体 |
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