TWI838606B - 資訊處理裝置、檢測方法、程式、基板處理系統及物品之製造方法 - Google Patents

資訊處理裝置、檢測方法、程式、基板處理系統及物品之製造方法 Download PDF

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TWI838606B
TWI838606B TW110103938A TW110103938A TWI838606B TW I838606 B TWI838606 B TW I838606B TW 110103938 A TW110103938 A TW 110103938A TW 110103938 A TW110103938 A TW 110103938A TW I838606 B TWI838606 B TW I838606B
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sensors
control
abnormality
control units
unit
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TW110103938A
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Chinese (zh)
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TW202208996A (zh
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増田充宏
鮫島裕紀
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日商佳能股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49215—Regulate temperature of coolant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computational Linguistics (AREA)
  • Computing Systems (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Artificial Intelligence (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Factory Administration (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
TW110103938A 2020-04-13 2021-02-03 資訊處理裝置、檢測方法、程式、基板處理系統及物品之製造方法 TWI838606B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-071692 2020-04-13
JP2020071692A JP7423396B2 (ja) 2020-04-13 2020-04-13 情報処理装置、検出方法、プログラム、基板処理システム、及び物品の製造方法

Publications (2)

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TW202208996A TW202208996A (zh) 2022-03-01
TWI838606B true TWI838606B (zh) 2024-04-11

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TW110103938A TWI838606B (zh) 2020-04-13 2021-02-03 資訊處理裝置、檢測方法、程式、基板處理系統及物品之製造方法

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JP (1) JP7423396B2 (sv)
KR (1) KR20210127089A (sv)
CN (1) CN113539885A (sv)
TW (1) TWI838606B (sv)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023102218A (ja) * 2022-01-11 2023-07-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、基板処理装置管理方法および基板処理装置管理プログラム
JP2023103123A (ja) * 2022-01-13 2023-07-26 株式会社Ｓｃｒｅｅｎホールディングス 適正判定装置および適正判定方法
JP2023105744A (ja) * 2022-01-19 2023-07-31 株式会社Ｓｃｒｅｅｎホールディングス 支援装置、支援方法および支援プログラム
WO2023162856A1 (ja) * 2022-02-22 2023-08-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、支援装置、基板処理装置、チャンバ間性能比較方法およびチャンバ間性能比較プログラム
JP2023127946A (ja) * 2022-03-02 2023-09-14 株式会社Ｓｃｒｅｅｎホールディングス 制御支援装置および制御支援方法
JP2023132914A (ja) * 2022-03-11 2023-09-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置管理システム、管理装置、基板処理装置、基板処理装置管理方法および基板処理装置管理プログラム
CN115798167B (zh) * 2023-01-05 2023-04-21 石家庄市惠源淀粉有限公司 用于淀粉葡萄糖生产工艺的设备异常报警方法及装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015145500A1 (ja) * 2014-03-27 2015-10-01 日本電気株式会社 システム分析装置、分析モデル生成方法、システム分析方法およびシステム分析プログラム
JP2019101495A (ja) * 2017-11-28 2019-06-24 横河電機株式会社 診断装置、診断方法、プログラム、および記録媒体
TW202002121A (zh) * 2018-06-14 2020-01-01 日商佳能股份有限公司 資訊處理設備、判斷方法、程式、微影系統及製造物的方法

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JP2000243678A (ja) 1998-12-24 2000-09-08 Toshiba Corp モニタリング装置とその方法
US7065422B1 (en) 2002-06-28 2006-06-20 Advanced Micro Devices, Inc. Method and apparatus for system state classification
JP2005136004A (ja) 2003-10-28 2005-05-26 Nikon Corp 露光装置、およびデバイス製造方法
JP2007219692A (ja) 2006-02-15 2007-08-30 Omron Corp プロセス異常分析装置およびプロセス異常分析システム並びにプログラム
JP6853617B2 (ja) 2015-07-14 2021-03-31 中国電力株式会社 故障予兆監視方法
JP6615963B1 (ja) 2018-08-31 2019-12-04 株式会社日立パワーソリューションズ 異常予兆診断装置及び異常予兆診断方法
JP7181033B2 (ja) 2018-09-20 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス データ処理方法、データ処理装置、および、データ処理プログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015145500A1 (ja) * 2014-03-27 2015-10-01 日本電気株式会社 システム分析装置、分析モデル生成方法、システム分析方法およびシステム分析プログラム
JP2019101495A (ja) * 2017-11-28 2019-06-24 横河電機株式会社 診断装置、診断方法、プログラム、および記録媒体
TW202002121A (zh) * 2018-06-14 2020-01-01 日商佳能股份有限公司 資訊處理設備、判斷方法、程式、微影系統及製造物的方法

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Publication number Publication date
CN113539885A (zh) 2021-10-22
TW202208996A (zh) 2022-03-01
JP7423396B2 (ja) 2024-01-29
JP2021168364A (ja) 2021-10-21
KR20210127089A (ko) 2021-10-21

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