TWI838055B - Pcb in-hole circuit manufacturing method - Google Patents

Abstract

A PCB in-hole circuit manufacturing method includes: designing and preparing a resistive conducting rod ready for use; performing a drilling operation; performing a first-time electroless copper plating and a copper plating; clamping the ready-to-use resistive conducting rod; sending the resistive conducting rod into a through hole; carrying out the standard PCB processes of dry film pressing and exposure and development; performing a second-time copper plating and a first-time electroless copper plating and a tin-lead plating of the PCB; confirming the position of the resistive conducting rod; removing the resistive conducting rod from the through hole; carrying out the standard PCB process of dry film stripping and tin-lead layer removal to complete the manufacture of the in-hole circuits. Based on the prior art, the resistive conducting rod is added to achieve the manufacture of the in-hole circuit in the through hole, so that two or more in-hole circuits can be manufactured in each through hole to effectively reduce the quantity of build-ups, so as to overcome the issues of reliability and yield due to the build-up of the related art.

Description

Method for making circuits in PCB holes

The present invention relates to the field of printed circuit technology, and in particular to a method for manufacturing circuits in PCB holes.

In the layout technology of PCB circuits, the biggest bottleneck and limitation lies in the interconnection density between circuit layers. Although the interconnection density of circuits can be achieved by gradually increasing the number of layers, for high-density PCB boards, the number of vias cannot be increased, and the distance between vias cannot be further reduced. At the same time, as the number of layers of the PCB board increases, its thickness also increases. In addition, the yield of drilling holes will also decrease. It is very difficult to drill small holes on thick substrates. In addition to the above problems, the cost of using layer-adding to solve the circuit solution is very high. With multiple layer-adding and layer-compression to achieve the conduction of the circuit between the upper and lower layers, the reliability of the material and the complexity of the process are greatly increased, which also reduces the yield.

Therefore, how to solve the above problems and deficiencies of existing technologies is a topic that relevant industries are eager to research and develop.

The main purpose of the present invention is to provide a method for manufacturing circuits in PCB holes to improve the disadvantage of the prior art that the density of PCB vias cannot be increased.

To achieve the above-mentioned purpose, the present invention provides a method for manufacturing a circuit in a PCB hole, the manufacturing method comprising the following steps: designing and manufacturing a copper resist generating rod for use, the copper resist generating rod being a non-conductive material selected from at least one of glass fiber, glass and resin; placing a PCB board on a drilling machine table, and drilling a through hole with a hole diameter of more than 0.05 mm on the PCB board; performing a first chemical copper plating and electrolytic copper plating operation on the PCB board; using a secondary claw mechanism on the drilling machine to drill a through hole; Clamp the copper resist rod for use; use the image vision alignment system on the drilling machine to locate the through hole, and send the copper resist rod into the through hole; perform the PCB standard dry film pressing and exposure and development process; perform the PCB standard second electroplating copper and tin-lead plating operations; use the image vision alignment system to confirm the position of the copper resist rod; use the rod ejector to move the copper resist rod out of the through hole; perform the PCB standard operations of stripping the dry film and removing the tin-lead layer on the PCB board; complete the production of the circuit in the through hole.

In one embodiment of the present invention, the density of circuit interconnection can be increased directly at the existing via density, and all the lines that must be connected up and down can be completed directly in each layer-increasing process. At each via position, after the drilling of the via is completed, the copper resist generating rod with a processed shape is embedded in the via, and the conductive line in the hole is made according to the current standard process of electroplating vias to complete the production of the circuit in the hole. In this way, at least two in-hole lines can be made in one via. At the same density, the number of in-hole lines used as vias can be increased by more than 2 times. At the same time, the number of layers to be added can be effectively reduced. The design of reducing the number of layers can effectively reduce the reliability and yield problems caused by the increase in layers.

In one embodiment of the present invention, the difference between the diameter of the copper resist generating rod and the diameter of the through hole is 0-0.3 mm, and the length of the copper resist generating rod is the same as the thickness of the PCB board, or greater than the thickness of the PCB board by 0.1 mm.

In one embodiment of the present invention, the diameter and length of the copper resist rod are made according to the requirements of the PCB through hole. The relationship between the diameter D0 of the copper resist rod and the through hole diameter D1 is D0-D1, and the subtraction result is between 0 and 0.3 mm. The length of the copper resist rod is the same as the thickness of the PCB board, or is greater than the thickness of the PCB board by more than 0.1 mm.

In one embodiment of the present invention, non-conductive materials are used to meet the processing requirements of electroplating.

In one embodiment of the present invention, the two ends of the copper-resistance generating rod are chamfered or rounded.

In one embodiment of the present invention, the drilling speed of the drilling machine is more than 60,000 revolutions.

In summary, the present invention provides a method for making a PCB in-hole circuit. On the basis of the existing technology, a copper resist generating rod is added to realize the production of the in-hole circuit inside the through hole, so that more than two in-hole circuits can be made in each conductive hole, effectively reducing the number of added layers, thereby solving the reliability and yield problems caused by adding layers in the existing technology.

The following detailed description is based on specific embodiments, which will make it easier to understand the purpose, technical content, features and effects of the present invention.

S1, S2, S3, S4, S5, S6, S7, S8, S9, S10, S11: Steps

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

The first figure is a flow chart of a method for manufacturing a circuit in a PCB hole according to the present invention.

The second figure is a top view of the copper barrier rod provided by the method for making a circuit in a PCB hole of the present invention.

The third figure is a side view of a copper resist generating rod provided by a method for manufacturing a circuit in a PCB hole of the present invention.

The fourth figure is a top view of a PCB board provided by a method for manufacturing a circuit in a PCB hole of the present invention.

The fifth figure is a cross-sectional view of a PCB board provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 6 is a schematic diagram of the preliminary preparation for drilling a through hole provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 7 is a schematic diagram of the drilling process of a through-hole drilling operation provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 8 is a schematic top view of a PCB board after the through-hole drilling operation is completed, provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 9 is a schematic cross-sectional view of a PCB board after the through-hole drilling operation is completed in a method for manufacturing a circuit in a PCB hole provided by the present invention.

Figure 10 is a schematic diagram of the one-step copper plating operation provided by a method for making a circuit in a PCB hole of the present invention.

Figure 11 is a schematic diagram of the circuit of a PCB hole provided by the method of manufacturing the circuit in the hole of the present invention, which includes copper plating and through-hole plating.

Figure 12 is a cross-sectional schematic diagram of a method for manufacturing a circuit in a PCB hole provided by the present invention, showing a single copper plating and a through-hole plating.

Figure 13 is a schematic diagram of the preliminary preparation of the auxiliary claw mechanism grabbing the copper resist generating rod provided by the method for manufacturing the circuit in the PCB hole of the present invention.

Figure 14 is a schematic diagram of a method for making a circuit in a PCB hole provided by the present invention, in which a secondary claw mechanism grabs a copper resist generating rod and embeds it into a through hole.

Figure 15 is a schematic diagram of the steps of grabbing the copper resist generating rod and completely embedding it into the through hole provided by the auxiliary claw mechanism of the present invention in a method for manufacturing a circuit in a PCB hole.

Figure 16 is a top view schematic diagram of a PCB with a copper resist generating rod fully embedded in a through hole provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 17 is a cross-sectional view of a PCB with a copper resist generating rod fully embedded in a through hole provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 18 is a schematic diagram of the PCB standard lamination and exposure and development process provided by a method for manufacturing circuits in PCB holes of the present invention.

Figure 19 is a schematic diagram of the PCB standard secondary copper plating and tin-lead plating operations provided by a method for manufacturing circuits in PCB holes of the present invention.

Figure 20 is a top view schematic diagram of a PCB standard lamination and exposure and development step provided by a method for manufacturing a PCB hole circuit of the present invention.

Figure 21 is a schematic cross-sectional view of a PCB board after standard PCB lamination and exposure and development steps provided by a method for manufacturing circuits in PCB holes of the present invention.

Figure 22 is a schematic diagram of the process of using image vision to confirm the position of the copper resist generating rod in a bit system provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 23 is a schematic diagram of the process of a rod remover preparing to push out the copper blocking rod provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 24 is a schematic diagram of the operation of the rod remover part pushing out the copper blocking rod provided by the method for manufacturing the circuit in the PCB hole of the present invention.

Figure 25 is a schematic cross-sectional view of a PCB board after the copper resist generating rod is separated, provided by a method for manufacturing a circuit in a PCB hole of the present invention.

Figure 26 is a schematic diagram of the film stripping and tin-lead removal operations provided by a method for manufacturing circuits in PCB holes of the present invention.

Figure 27 is a schematic diagram of the through-hole circuit manufacturing process provided by a PCB through-hole circuit manufacturing method of the present invention.

Figure 28 is a schematic cross-sectional view of a PCB board after the through-hole circuit manufacturing process provided by a method for manufacturing a PCB through-hole circuit of the present invention.

In order to solve the problems of previous technologies, the inventor has conducted years of research and development to improve the shortcomings of existing products. The following will introduce in detail how this invention uses a method for manufacturing circuits in PCB holes to achieve the most efficient functional requirements.

The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

Please refer to the first figure, the fourth figure to the twenty-eighth figure. The present invention provides a method for manufacturing a circuit in a PCB hole. The manufacturing method includes the following steps: Step S1: designing and manufacturing a copper resist generating rod for standby use. The copper resist generating rod is a non-conductive material selected from at least one of glass fiber, glass and resin; Step S2: placing a PCB board on a drilling machine table, and drilling a through hole with a hole diameter of more than 0.05 mm on the PCB board; Step S3: performing the first chemical copper plating and electroplating of the PCB board; Step S4: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S5: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S6: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S7: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S8: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S9: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S10: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S11: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S12: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S13: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S14: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S15: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S16: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S17: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S18: using the auxiliary claw mechanism on the drilling machine to clamp the standby copper resist generating rod; Step S19: using the auxiliary claw mechanism on Copper resist rod; Step S5: Position the through hole with the image vision alignment system on the drilling machine, and send the copper resist rod into the through hole; Step S6: Perform the PCB standard dry film pressing and exposure and development process; Step S7: Perform the PCB standard second electroplating copper and tin-lead plating operations; Step S8: Confirm the position of the copper resist rod with the image vision alignment system; Step S9: Use the rod ejector to move the copper resist rod out of the through hole; Then, Step S10: Perform the PCB standard operations of stripping the dry film and removing the tin-lead layer on the PCB board; Step S11: The circuit production in the through hole can be completed.

In this implementation, the present invention can directly achieve the goal of increasing the density of circuit interconnection under the existing through-hole density, and all the lines that must be connected up and down are directly completed in each layer-adding process. At each through-hole position, after the through-hole drilling is completed, the copper resist generating rod with a processed shape is embedded in the through-hole, and the conductive line in the hole is made according to the current standard process of electroplating through-holes to complete the production of the circuit in the hole. In this way, at least two through-hole lines can be made in one through-hole. At the same density, the through-hole lines can be increased by more than twice as much as the through-holes used as through-holes. At the same time, the number of layers to be added can be effectively reduced. The design of reducing the number of layers to be added can effectively reduce the reliability and yield problems caused by the layer addition.

Please refer to the second to third figures, which are the structures of the copper resist generating rods described in the present invention. It should be noted that the appearance of the copper resist generating rods in the present invention is related to the integrated design of the PCB circuit, and the attached figures should not be interpreted as a limitation of the appearance structure of the copper resist generating rods in the present invention.

Furthermore, the difference between the diameter of the copper resist generating rod and the diameter of the through hole is 0-0.3 mm, and the length of the copper resist generating rod is the same as the thickness of the PCB board, or is greater than the thickness of the PCB board by 0.1 mm.

In this embodiment, the diameter and length of the copper resist rod are made according to the requirements of the PCB through hole. The relationship between the diameter D0 of the copper resist rod and the through hole diameter D1 is D0-D1, and the result of the subtraction is between 0 and 0.3 mm. The length of the copper resist rod is the same as the thickness of the PCB board, or is greater than the thickness of the PCB board by more than 0.1 mm.

Furthermore, the copper-resistance generating rod is a non-conductive material selected from at least one of glass fiber, glass and resin.

In this embodiment, non-conductive materials are used to meet the processing requirements of electroplating.

Furthermore, the two ends of the copper-resisting generating rod are cut or rounded.

Furthermore, the drilling speed of the drilling machine is more than 60,000 revolutions.

Furthermore, the preparation of the copper resist generating rod includes the following steps: processing the male and female molds of the copper resist generating rod with a CNC machine tool; injecting the hot melt copper resist generating rod material into the mold, waiting for it to cool down and then demolding it to complete the production of the copper resist generating rod; further, the preparation of the copper resist generating rod also includes the following steps: manufacturing an injection mold, and then injecting the hot melt copper resist generating rod material into the injection mold; after the material is extruded from the mold, Cut it with a cutter to complete the production of the copper resisting rod; further, the preparation of the copper resisting rod also includes the following steps: the copper resisting rod material is placed on a CNC machine tool, and milling is performed in the CNC machine tool according to the shape of the copper resisting rod to complete the production of the copper resisting rod. It can be understood that this application only proposes some preparation methods of the copper resisting rod, and other processing methods for making rods not mentioned in this application still fall within the scope of this application.

In summary, the present invention provides a method for making a PCB in-hole circuit. On the basis of the existing technology, a copper resist generating rod is added to realize the production of the in-hole circuit inside the through hole, so that more than two in-hole circuits can be made in each conductive hole, effectively reducing the number of added layers, thereby solving the reliability and yield problems caused by adding layers in the existing technology.

However, the above is only a preferred embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Therefore, all equivalent changes or modifications based on the features and spirit described in the scope of the present invention should be included in the scope of the patent application of the present invention.

S1, S2, S3, S4, S5, S6, S7, S8, S9, S10, S11: Steps

Claims (4)

A method for manufacturing a circuit in a PCB hole includes: designing and manufacturing a copper resist generating rod for use after the copper resist generating rod is a non-conductive material selected from at least one of glass fiber, glass and resin; placing a PCB board on the table of a drilling machine, and drilling a through hole with a hole diameter of more than 0.05 mm on the PCB board; performing the first chemical copper plating and electrolytic copper plating operations on the PCB board; and using a secondary claw mechanism on the drilling machine to clamp the copper resist generating rod for use; Use the image vision alignment system on the drilling machine to locate the through hole, and send the copper resist rod into the through hole; perform the PCB standard dry film and exposure and development process; perform the PCB standard second electroplating copper and tin-lead plating operations; use the image vision alignment system to confirm the position of the copper resist rod; use the rod ejector to move the copper resist rod out of the through hole; perform the PCB standard operations of stripping the dry film and removing the tin-lead layer on the PCB board; and complete the production of the circuit in the through hole. The method for manufacturing a circuit in a PCB hole as described in claim 1, wherein the difference between the diameter of the copper resist generating rod and the diameter of the through hole is 0-0.3mm, and the length of the copper resist generating rod is the same as the thickness of the PCB board, or is greater than the thickness of the PCB board by 0.1mm. The method for making a circuit in a PCB hole as described in claim 1, wherein the two ends of the copper resist generating rod are cut or rounded. The method for making circuits in PCB holes as described in claim 1, wherein the drilling speed of the drilling machine is more than 60,000 revolutions.

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