CN105142361A - Resin hole-plugging process for PCB through holes - Google Patents
Resin hole-plugging process for PCB through holes Download PDFInfo
- Publication number
- CN105142361A CN105142361A CN201510468652.2A CN201510468652A CN105142361A CN 105142361 A CN105142361 A CN 105142361A CN 201510468652 A CN201510468652 A CN 201510468652A CN 105142361 A CN105142361 A CN 105142361A
- Authority
- CN
- China
- Prior art keywords
- resin
- holes
- circuit board
- hole
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Abstract
The invention discloses a resin hole-plugging process for PCB through holes, and relates to the technical field of PCB manufacturing, mainly comprising: (1) cutting and drilling holes; (2) electroplating copper on a circuit board after being drilled holes; (3) electro-coppering on the whole board of the circuit board, covering all regions on the board except a thick-copper region by a dry film, electroplating by high current for a long time to enable the copper layer in the thick-copper region to meet thickness requirement; (4) stuffing resin in the through holes in the circuit board, and removing redundant resin around the through hole openings; (5) transferring a film image to the board of the outer layer circuit board; (6) electroplating the board of the circuit board and the non-resin holes; and (7) etching required circuits on the outer layer circuit board, and finishing the following working procedures and the like. The resin hole-plugging process for the PCB through holes overcomes the problems that the plugged holes are plugged incompletely, the resin and copper are separated into different layers and the like; and the resin hole-plugging process reduces the rejection rate in the production process and improves the productivity effect.
Description
Technical field
The present invention relates to PCB manufacture technology field, is more particularly a kind of PCB through hole filling holes with resin technique.
Background technology
The application of technological process in recent years inside PCB industry of filling holes with resin is more and more extensive, especially high in some numbers of plies, enjoys favor especially above the product that plank thickness is larger.People wish to use filling holes with resin to solve a series of use plugging green oil or pressing to fill out the problem that resin cann't be solved.But, because the characteristic of resin itself that this technique uses, making needs to overcome many difficulties, the quality of good filling holes with resin product can be obtained.
Summary of the invention
The object of the invention is to make up the deficiencies in the prior art, a kind of PCB through hole filling holes with resin technique is provided.
The object of the invention is to be achieved through the following technical solutions:
A kind of PCB through hole filling holes with resin technique, comprises the following steps:
(1) sawing sheet, boring;
(2) heavy Copper treatment is carried out to the wiring board after perforate;
(3) carry out electro-coppering metal to wiring board integral slab face, all covered with dry film the position outside Hou Tong district, the layers of copper that big current electroplates Shi Houtong district for a long time reaches thickness requirement;
(4) clog resin by the through hole on wiring board, and resin unnecessary for aperture is rooted out;
(5) by film image transfer on the plate face of outer-layer circuit plate;
(6) wiring board plate face and non-resin hole are electroplated;
(7) outside sandwich circuit board etches required circuit, rear operation.
The invention has the advantages that:
PCB through hole filling holes with resin technique of the present invention overcomes that consent is not full, the problem such as resin and copper layering, reduces the scrappage in production process, improves productivity effect.
Embodiment
A kind of PCB through hole filling holes with resin technique, comprises the following steps:
(1) sawing sheet, boring;
(2) heavy Copper treatment is carried out to the wiring board after perforate;
(3) carry out electro-coppering metal to wiring board integral slab face, all covered with dry film the position outside Hou Tong district, the layers of copper that big current electroplates Shi Houtong district for a long time reaches thickness requirement;
(4) clog resin by the through hole on wiring board, and resin unnecessary for aperture is rooted out;
(5) by film image transfer on the plate face of outer-layer circuit plate;
(6) wiring board plate face and non-resin hole are electroplated;
(7) outside sandwich circuit board etches required circuit, rear operation.
Claims (1)
1. a PCB through hole filling holes with resin technique, is characterized in that: comprise the following steps:
(1) sawing sheet, boring;
(2) heavy Copper treatment is carried out to the wiring board after perforate;
(3) carry out electro-coppering metal to wiring board integral slab face, all covered with dry film the position outside Hou Tong district, the layers of copper that big current electroplates Shi Houtong district for a long time reaches thickness requirement;
(4) clog resin by the through hole on wiring board, and resin unnecessary for aperture is rooted out;
(5) by film image transfer on the plate face of outer-layer circuit plate;
(6) wiring board plate face and non-resin hole are electroplated;
(7) outside sandwich circuit board etches required circuit, rear operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510468652.2A CN105142361A (en) | 2015-08-04 | 2015-08-04 | Resin hole-plugging process for PCB through holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510468652.2A CN105142361A (en) | 2015-08-04 | 2015-08-04 | Resin hole-plugging process for PCB through holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105142361A true CN105142361A (en) | 2015-12-09 |
Family
ID=54727521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510468652.2A Pending CN105142361A (en) | 2015-08-04 | 2015-08-04 | Resin hole-plugging process for PCB through holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105142361A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107347229A (en) * | 2016-05-06 | 2017-11-14 | 鹤山市中富兴业电路有限公司 | The process of wiring board selective resin consent |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602452A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Manufacturing method of circuit board |
| CN104717845A (en) * | 2013-12-13 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board |
| CN104812179A (en) * | 2015-04-21 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Hole copper preparation technology of printed circuit board and printed circuit board |
-
2015
- 2015-08-04 CN CN201510468652.2A patent/CN105142361A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602452A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Manufacturing method of circuit board |
| CN104717845A (en) * | 2013-12-13 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board |
| CN104812179A (en) * | 2015-04-21 | 2015-07-29 | 深圳崇达多层线路板有限公司 | Hole copper preparation technology of printed circuit board and printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107347229A (en) * | 2016-05-06 | 2017-11-14 | 鹤山市中富兴业电路有限公司 | The process of wiring board selective resin consent |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151209 |
|
| RJ01 | Rejection of invention patent application after publication |