CN115734517A - Method for manufacturing circuit in PCB hole - Google Patents
Method for manufacturing circuit in PCB hole Download PDFInfo
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- CN115734517A CN115734517A CN202211517929.2A CN202211517929A CN115734517A CN 115734517 A CN115734517 A CN 115734517A CN 202211517929 A CN202211517929 A CN 202211517929A CN 115734517 A CN115734517 A CN 115734517A
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Abstract
The invention relates to the technical field of printed circuits, in particular to a method for manufacturing a circuit in a PCB hole; the manufacturing method comprises the following steps: designing and manufacturing a resistance and conduction rod for later use; drilling a through hole; carrying out first electroless copper plating and electro-coppering operation; clamping a standby electric resistance and conductivity rod; feeding the electric resistance and conductivity rod into the through hole; carrying out PCB standard dry film pressing and exposure developing processes; carrying out second copper electroplating and tin lead plating operation of PCB standard; confirming the position of the electric resistance and conduction rod; moving the electric conduction resistance rod out of the through hole; performing PCB standard operation of stripping a dry film and removing a tin-lead layer; can accomplish the interior circuit preparation of through-hole, on prior art's basis, add and hinder the preparation that the conduction stick realized the downthehole circuit of through-hole inside for can make the downthehole circuit more than 2 in every break-over, effectively reduce the quantity that increases the layer, thereby solve among the prior art because of increasing the reliability and the problem of yield that the layer appears.
Description
Technical Field
The invention relates to the technical field of printed circuits, in particular to a method for manufacturing a circuit in a PCB hole.
Background
In the layout technology of PCB circuit, the biggest bottleneck and limitation are the interconnection density of the circuit between the circuit board layers, although the interconnection density of the circuit can be achieved by successive layer increasing, for high-density PCB boards, the number of via holes cannot be increased, and the distance between via holes cannot be further reduced, and meanwhile, as the number of layers of the PCB board increases, the thickness of the PCB board increases, and the yield of drilling decreases accordingly, and drilling holes on a substrate with high thickness is difficult.
Disclosure of Invention
The invention aims to provide a method for manufacturing a circuit in a PCB hole, which aims to overcome the defect that the density of through holes of a PCB cannot be increased in the prior art.
In order to achieve the above object, the present invention provides a method for manufacturing a circuit in a PCB hole, the method comprising the steps of:
designing and manufacturing a resistance and conduction rod for later use;
placing a PCB on the table board of a drilling machine, and drilling a through hole with the aperture of more than 0.05mm on the PCB;
carrying out first electroless copper plating and electro-coppering operation on the PCB;
clamping the standby electric conduction resisting rod by using an auxiliary claw mechanism on the drilling machine;
positioning the through hole by using an image vision alignment system on the drilling machine, and sending the electric resistance and conductivity rod into the through hole;
carrying out PCB standard dry film pressing and exposure developing processes;
carrying out copper electroplating and tin lead plating operation for the second time according to the PCB standard;
confirming the position of the electric resistance and conduction rod by an image vision alignment system;
moving the conductive resistance rod out of the through hole by using a rod discharging device;
then, carrying out PCB standard operation of stripping a dry film and a tin lead layer on the PCB;
and the circuit manufacture in the through hole can be finished.
The method can directly reach the density of improving circuit interconnection under the existing via hole density, directly finish all circuits which need to be conducted up and down in each layer adding process, after the drilling of the through hole is finished, embed the resistance and conduction bars with well processed shapes into the through hole, and manufacture the conductive circuits in the hole according to the current standard flow of the electroplating through hole, thereby finishing the manufacture of circuits in the hole, and by adopting the mode, at least 2 circuits in the hole can be manufactured in one through hole, and the circuits in the hole which are more than 2 times can be increased to be used as the via hole under the same density, meanwhile, the number of added layers can be effectively reduced, and the design of reducing the added layers can effectively reduce the reliability and yield problems caused by the added layers,
the difference value between the diameter of the resistance and conduction rod and the diameter of the through hole is 0-0.3 mm, and the length of the resistance and conduction rod is the same as the thickness of the PCB or is larger than the thickness of the PCB by 0.1mm.
The diameter and the length of the resistance and conduction rod are manufactured according to the requirement of a PCB through hole, the relation between the diameter D0 of the resistance and conduction rod and the diameter D1 of the through hole is D0-D1, the subtraction result shows that the relation is between 0 and 0.3mm, the length of the resistance and conduction rod is the same as the thickness of the PCB, or is more than 0.1mm larger than the thickness of the PCB
Wherein, the resistance and conduction rod is a non-conductive material and is selected from at least one of glass fiber, glass and resin.
And the non-conductive material is adopted, so that the processing requirement of electroplating is met.
Wherein, the both ends of hindering the conduction stick are corner cut or fillet.
Wherein the drilling speed of the drilling machine is more than 6 ten thousand turns.
According to the manufacturing method of the PCB in-hole circuit, on the basis of the prior art, the resistance and conduction rod is additionally arranged to manufacture the in-hole circuit in the through hole, so that more than 2 in-hole circuits can be manufactured in each through hole, the number of added layers is effectively reduced, and the problems of reliability and yield caused by the added layers in the prior art are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a top view of a resistive and conductive bar provided by a method for manufacturing a circuit in a PCB hole of the present invention.
FIG. 2 is a side view of a resistive and conductive bar provided by a method for fabricating a circuit in a PCB hole of the present invention.
Fig. 3 is a top view of a PCB board provided by a method for manufacturing a circuit in a PCB hole of the present invention.
Fig. 4 is a cross-sectional view of a PCB board provided by a method for fabricating a circuit in a PCB hole of the present invention.
Fig. 5 is a schematic diagram of the preliminary preparation of the via drilling operation provided by the method for manufacturing the circuit in the PCB hole of the present invention.
Fig. 6 is a schematic diagram of a drilling process of the through hole drilling operation provided by the method for manufacturing the circuit in the PCB hole of the present invention.
Fig. 7 is a schematic top view of a PCB after completion of a via drilling operation provided by a method for fabricating a circuit in a PCB hole of the present invention.
Fig. 8 is a schematic cross-sectional view of a PCB board after completion of a via drilling operation provided by a method for manufacturing a circuit in a PCB hole of the present invention.
FIG. 9 is a schematic diagram of a copper plating operation provided by a method for forming a circuit in a PCB hole according to the present invention.
FIG. 10 is a schematic diagram of a circuit of a copper-plated and through-hole plating provided by a method for fabricating a circuit in a PCB hole according to the present invention.
FIG. 11 is a schematic cross-sectional view of a copper plated through hole and a plated through hole provided by a method for fabricating a circuit in a PCB hole according to the present invention.
Fig. 12 is a schematic diagram of the previous preparation of the auxiliary claw mechanism for grabbing the resistance-conductivity bar provided by the method for manufacturing the circuit in the PCB hole of the present invention.
Fig. 13 is a schematic diagram of the auxiliary claw mechanism provided by the method for manufacturing a circuit in a PCB hole of the present invention grabbing the resistance-conductivity bar and inserting the bar into the through hole.
Fig. 14 is a schematic diagram of a step of the auxiliary claw mechanism provided by the method for manufacturing the circuit in the PCB hole grabbing the resistance-conduction bar and completely embedding the resistance-conduction bar into the through hole.
Fig. 15 is a schematic top view of a PCB with a resistive and conductive bar fully embedded in a via hole according to a method for fabricating a circuit in a PCB hole of the present invention.
Fig. 16 is a schematic cross-sectional view of a PCB with a resistance-conduction bar fully inserted into a via hole according to a method for fabricating a circuit in a PCB hole of the present invention.
Fig. 17 is a schematic diagram of a standard dry film pressing and exposure and development operation of a PCB provided by the method for manufacturing a circuit in a PCB hole of the present invention.
FIG. 18 is a schematic diagram of standard secondary copper electroplating and tinning lead operations for a PCB provided by a method for fabricating circuits in PCB holes according to the present invention.
Fig. 19 is a schematic top view of a PCB standard dry film pressing and exposing and developing step provided by the method for manufacturing a circuit in a PCB hole of the present invention.
Fig. 20 is a schematic cross-sectional view of a PCB after a standard dry film pressing and exposure developing step provided by a method for manufacturing a circuit in a PCB hole of the present invention.
FIG. 21 is a schematic diagram of the operation of the image vision alignment system for confirming the position of the conductive barrier bars in the PCB hole circuit manufacturing method of the present invention.
FIG. 22 is a schematic diagram of the operation of the bar remover provided by the method for fabricating a circuit in a PCB hole of the present invention in preparation for pushing out the resistive-conductive bar.
FIG. 23 is a schematic diagram of the operation of pushing out the resistive and conductive rods by the rod remover part provided by the method for manufacturing the circuit in the PCB hole of the present invention.
FIG. 24 is a schematic cross-sectional view of a PCB with a conductive bar removed according to a method for fabricating a circuit in a PCB hole of the present invention.
Fig. 25 is a schematic diagram of the dry film stripping and tin-lead layer removing operation provided by the method for manufacturing the circuit in the PCB hole of the present invention.
Fig. 26 is a schematic diagram of an in-via circuit fabrication operation provided by a method for fabricating an in-hole circuit of a PCB of the present invention.
Fig. 27 is a schematic cross-sectional view of a PCB board after a circuit fabrication operation within a via hole provided by a method for fabricating a circuit within a PCB hole of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout.
The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present invention and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
In addition, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 3 to 27, the present invention provides a method for manufacturing a circuit in a PCB hole, the method comprising the steps of:
designing and manufacturing a resistance and conductivity rod for later use;
placing a PCB on the table board of a drilling machine, and drilling a through hole with the aperture of more than 0.05mm on the PCB;
carrying out first electroless copper plating and electro-coppering operation on the PCB;
clamping the standby electric conduction resisting rod by using an auxiliary claw mechanism on the drilling machine;
positioning the through hole by using an image vision alignment system on the drilling machine, and sending the electric resistance and conductivity rod into the through hole;
carrying out PCB standard dry film pressing and exposure developing processes;
carrying out second copper electroplating and tin lead plating operation of PCB standard;
confirming the position of the electric resistance and conduction rod by an image vision alignment system;
moving the conductive resistance rod out of the through hole by using a rod discharging device;
then carrying out PCB standard operation of stripping a dry film and removing a tin lead layer on the PCB;
and the circuit manufacture in the through hole can be finished.
In the embodiment, the method can directly reach the density of circuit interconnection improvement under the existing via hole density, directly finish all the lines which need to be conducted up and down in each layer adding process, embed the resistance and conduction bars with well-processed shapes into the via holes at the positions of the via holes after the drilling of the via holes is finished, and manufacture the conductive lines in the via holes according to the standard flow of the current electroplating via holes, thereby completing the manufacture of circuits in the via holes, and by adopting the method, at least 2 lines in the via holes can be manufactured, and the lines in the via holes with more than 2 times can be used as the via holes under the same density, and simultaneously, the number of the added layers can be effectively reduced, and the reliability and yield problems caused by the added layers can be effectively reduced by reducing the design of the added layers,
referring to fig. 1 to fig. 2, which are structures of resistive and conductive bars according to the present application, it should be noted that the shape of the resistive and conductive bar in the present application is related to a convergent design of a PCB circuit, and should not be construed as a limitation to the shape structure of the resistive and conductive bar according to the accompanying drawings.
Further, the difference value between the diameter of the electric resistance and conduction rod and the diameter of the through hole is 0-0.3 mm, and the length of the electric resistance and conduction rod is the same as the thickness of the PCB or is larger than the thickness of the PCB by 0.1mm.
In the embodiment, the diameter and the length of the electrical resistance and conduction rod are made according to the requirement of the PCB through hole, the relation between the diameter D0 of the electrical resistance and conduction rod and the diameter D1 of the through hole is D0-D1, the subtraction result shows that the relation is between 0 and 0.3mm, the length of the electrical resistance and conduction rod is the same as the thickness of the PCB, or is more than 0.1mm larger than the thickness of the PCB
Furthermore, the electric resistance and conduction rod is made of non-conductive materials and is selected from at least one of glass fiber, glass and resin.
In the present embodiment, a non-conductive material is used to meet the processing requirements of electroplating.
Furthermore, both ends of the resistance and conduction rod are corner cuts or fillets.
Further, the drilling speed of the drilling machine is more than 6 thousands of turns.
Further, the preparation of the resistance-conductivity rod comprises the following steps:
processing a resistance and conductivity rod male and female die by a numerical control machine;
injecting the hot-melted electric resistance and conduction rod material into a mold, and demolding after the electric resistance and conduction rod material is cooled to complete the manufacturing of the electric resistance and conduction rod;
further, the preparation of the electric conduction resistance rod further comprises the following steps:
manufacturing an injection mold, and then injecting a hot-melt anti-conduction rod material into the injection mold;
after the material is extruded from the die, the material is cut off by a cut-off knife, and then the manufacturing of the electric resistance and conduction rod can be completed;
further, the preparation of the electric conduction resistance rod further comprises the following steps:
the resistance and conductivity rod material is placed on a numerical control machine tool, and turning and milling are carried out in the numerical control machine tool according to the appearance of the resistance and conductivity rod, so that the resistance and conductivity rod can be manufactured.
According to the manufacturing method of the PCB in-hole circuit, on the basis of the prior art, the resistance and conduction rod is additionally arranged to manufacture the in-hole circuit in the through hole, so that more than 2 in-hole circuits can be manufactured in each through hole, the number of added layers is effectively reduced, and the problems of reliability and yield caused by the added layers in the prior art are solved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. A method for manufacturing a circuit in a PCB hole is characterized in that,
the manufacturing method comprises the following steps:
designing and manufacturing a resistance and conduction rod for later use;
placing a PCB on the table board of a drilling machine, and drilling a through hole with the aperture of more than 0.05mm on the PCB;
carrying out first electroless copper plating and electro-coppering operation on the PCB;
clamping the standby electric resistance and conduction rod by using an auxiliary claw mechanism on the drilling machine;
positioning the through hole by using an image vision alignment system on the drilling machine, and sending the electric resistance and conductivity rod into the through hole;
carrying out PCB standard dry film pressing and exposure developing processes;
carrying out second copper electroplating and tin lead plating operation of PCB standard;
confirming the position of the electric resistance and conduction rod by an image vision alignment system;
moving the conductive resistance rod out of the through hole by using a rod discharging device;
then carrying out PCB standard operation of stripping a dry film and removing a tin lead layer on the PCB;
and the circuit manufacture in the through hole can be finished.
2. The method of claim 1, wherein the PCB is provided with a plurality of holes,
the difference value between the diameter of the electric resistance and conduction rod and the diameter of the through hole is 0-0.3 mm, and the length of the electric resistance and conduction rod is the same as the thickness of the PCB or is larger than the thickness of the PCB by 0.1mm.
3. The method of claim 1, wherein the PCB is provided with a plurality of holes,
the electric resistance and conduction rod is made of non-conductive materials and is selected from at least one of glass fiber, glass and resin.
4. The method of claim 1, wherein the PCB is formed with a plurality of vias,
and two ends of the resistance and conduction rod are provided with corner cuts or fillets.
5. The method of claim 1, wherein the PCB is provided with a plurality of holes,
the drilling speed of the drilling machine is more than 6 thousands of turns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211517929.2A CN115734517A (en) | 2022-11-30 | 2022-11-30 | Method for manufacturing circuit in PCB hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211517929.2A CN115734517A (en) | 2022-11-30 | 2022-11-30 | Method for manufacturing circuit in PCB hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115734517A true CN115734517A (en) | 2023-03-03 |
Family
ID=85299315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211517929.2A Pending CN115734517A (en) | 2022-11-30 | 2022-11-30 | Method for manufacturing circuit in PCB hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115734517A (en) |
-
2022
- 2022-11-30 CN CN202211517929.2A patent/CN115734517A/en active Pending
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