CN115767879A - Structure and manufacturing method of PCB vertical circuit - Google Patents

Structure and manufacturing method of PCB vertical circuit Download PDF

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Publication number
CN115767879A
CN115767879A CN202211564140.2A CN202211564140A CN115767879A CN 115767879 A CN115767879 A CN 115767879A CN 202211564140 A CN202211564140 A CN 202211564140A CN 115767879 A CN115767879 A CN 115767879A
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China
Prior art keywords
pcb
insulating
insulating rod
circuit
layers
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CN202211564140.2A
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Chinese (zh)
Inventor
简祯祈
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Nanjing Taliang Technology Co ltd
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Nanjing Taliang Technology Co ltd
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Priority to CN202211564140.2A priority Critical patent/CN115767879A/en
Publication of CN115767879A publication Critical patent/CN115767879A/en
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Abstract

The invention relates to the technical field of circuit board manufacturing, in particular to a structure and a manufacturing method of a PCB vertical circuit, which comprises a conductive insulating rod, a plurality of layers of PCB circuits and a plurality of layers of insulating layers, wherein the plurality of layers of PCB circuits and the plurality of layers of insulating layers are alternately overlapped, the insulating rod is made of a hot-melt insulating material, the plurality of layers of PCB circuits and the plurality of layers of insulating layers which are alternately overlapped are placed on a drilling machine for drilling through holes, the through holes are obtained on the PCB circuits and the insulating layers, the insulating rod is embedded in the through holes by utilizing an embedded bar pressing device on the drilling machine, the conductive insulating rod is made after the insulating rod is subjected to conductive processing, the multi-layer PCB circuits are waited to be intercommunicated, the PCB vertical circuit is obtained, more than two in-hole circuits can be manufactured in each through hole, the number of added layers is effectively reduced, the problems of reliability and yield caused by added layers are solved, and the manufacturing efficiency of the structure of the PCB vertical circuit is improved.

Description

Structure and manufacturing method of PCB vertical circuit
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a structure and a manufacturing method of a PCB vertical circuit.
Background
At present, in the layout of a circuit of a PCB, the biggest bottleneck and limitation are the interconnection density of a vertical circuit, and the interconnection density of the vertical circuit can be achieved through a successive layer-adding mode, but for the packaging of an Array, the number of through holes and the occupied space cannot be increased any more, but the distance between the through holes cannot be reduced, and in addition, the cost for solving the solution of a vertical circuit scheme by using the layer-adding mode is quite high.
In the layer-adding mode, the circuit is conducted between the upper layer and the lower layer along with multiple layer-adding and layer-pressing, the reliability of materials and the complexity of the manufacturing process are greatly improved, and therefore the manufacturing efficiency of the structure of the PCB vertical circuit is reduced.
Disclosure of Invention
The invention aims to provide a structure and a manufacturing method of a PCB vertical circuit, and aims to solve the technical problems that in the prior art, the circuit is conducted between an upper layer and a lower layer along with multiple layer adding and laminating, the reliability of materials and the complexity of manufacturing processes are greatly improved, and the yield of the vertical circuit is reduced.
In order to achieve the purpose, the structure of the vertical circuit of the PCB comprises a conductive insulating rod, a plurality of layers of PCB circuits and a plurality of layers of insulating layers, wherein the plurality of layers of PCB circuits and the plurality of layers of insulating layers are alternately overlapped, the overlapped top layer is the PCB circuit, the overlapped bottom layer is the insulating layer, and the conductive insulating rod respectively penetrates through the PCB circuit and the insulating layers.
The invention also provides a manufacturing method of the structure of the PCB vertical circuit, which comprises the following steps:
manufacturing an insulating rod by using a hot-melt insulating material;
placing the multilayer PCB circuit and the multilayer insulating layer which are alternately overlapped on a drilling machine, and performing through hole drilling treatment to obtain through holes on the PCB circuit and the insulating layer;
embedding the insulating rod into the through hole by using an embedded rod pressing device on a drilling machine;
and conducting the insulating rod to obtain the conducting insulating rod, and waiting for the circuit intercommunication of the multiple layers of the PCB boards to obtain a vertical PCB circuit.
Wherein, in the step of manufacturing the insulating rod by using the hot-melt insulating material, the manufacturing process of the insulating rod is as follows:
carrying out CNC machining on the male die and the female die of the insulating rod to obtain a die-casting die;
and (3) injecting the hot-melt insulating material into a die-casting die, and demolding after cooling to obtain the insulating rod.
Wherein, in the step of using the hot-melt insulating material to make the insulating rod, the making process of the conductive insulating rod is as follows:
injecting the hot-melt insulating material into an injection mold, and extruding the insulating material;
and cutting the insulating material by using a cutter, and then carrying out CNC turning and milling processing to obtain the insulating rod.
The method comprises the following steps of preparing the conductive insulating rod after conducting the insulating rod, and waiting for the circuit intercommunication of the multiple layers of PCBs to obtain a vertical PCB circuit:
the conductive mode is one or a combination of a plurality of modes of chemical plating, electroplating, sputtering and attaching a conductive film.
The method comprises the following steps of preparing the conductive insulating rod after the insulating rod is subjected to conductive treatment, waiting for the circuit intercommunication of a plurality of layers of PCBs, and obtaining a PCB vertical circuit:
the conductive material is one or a combination of more of copper, silver and tin, and the conductive insulating rod is obtained.
Wherein, the step of embedding the conductive insulating rod in the through hole by using an embedded rod pressing device on a drilling machine comprises the following steps:
the fitting method is one or a combination of pressing and beating.
According to the structure and the manufacturing method of the PCB vertical circuit, the multiple layers of PCB circuit and the multiple layers of insulating layers are alternately overlapped, the conductive insulating rod penetrates through the PCB circuit and the insulating layers respectively, the through hole positions are directly completed in each layer adding process, after the through hole is drilled, the insulating rod is embedded into the through hole, the conductive insulating rod is obtained after the insulating rod in the through hole is completed with the conductive circuit, the conductive insulating rod is conducted with each layer circuit due to conduction, and the structure of the PCB vertical circuit can be manufactured, so that more than two in-hole circuits can be manufactured in each through hole, the number of added layers is effectively reduced, the problems of reliability and yield caused by the added layers are solved, and the manufacturing efficiency of the structure of the PCB vertical circuit is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of the structure of a PCB vertical circuit of the present invention.
FIG. 2 is a flow chart of the steps of example 1 of the present invention.
Fig. 3 is a flowchart of the steps of embodiment 2 of the present invention.
Fig. 4 is a schematic diagram of the PCB vertical circuit of the present invention without drilling.
Fig. 5 is a schematic diagram of the structure in the vertical circuit drilling of the PCB of the present invention.
Fig. 6 is a schematic diagram of the structure of the PCB of the present invention after vertical circuit drilling.
Fig. 7 is a schematic diagram of the structure of the PCB vertical circuit of the present invention without conduction.
Fig. 8 is a schematic view of the structure of the insulating rod of the present invention.
Fig. 9 is a view showing a structure of the electrical conductivity of the electrically conductive insulating rod of the present invention.
Fig. 10 is a schematic view of the structure of the electrically conductive insulating rod of the present invention.
Fig. 11 is a front view of the structure of the electrically conductive insulating rod of the present invention.
1-conductive insulating rod, 2-PCB circuit, 3-insulating layer, 4-through hole and 5-insulating rod.
Detailed Description
Referring to fig. 1, fig. 1 is a schematic structural diagram of a vertical circuit structure of a PCB.
The invention provides a structure of a PCB vertical circuit, which comprises a conductive insulating rod 1, a plurality of layers of PCB circuits 2 and a plurality of layers of insulating layers 3, wherein the plurality of layers of PCB circuits 2 and the plurality of layers of insulating layers 3 are alternately overlapped, the overlapped top layer is the PCB circuit 2, the overlapped bottom layer is the insulating layer 3, and the conductive insulating rod 1 respectively penetrates through the PCB circuit 2 and the insulating layer 3.
In this embodiment, the multilayer PCB circuit 2 and the multilayer insulating layer 3 are alternately stacked, the conductive insulating rod 1 penetrates through the PCB circuit 2 and the insulating layer 3, and the conductive insulating rod 1 is electrically conducted with each interlayer circuit, so that the structure of the PCB vertical circuit can be manufactured.
Embodiment 1, please refer to fig. 2, fig. 4, fig. 5, fig. 6, fig. 7, fig. 8, fig. 9, fig. 10, and fig. 11, wherein fig. 2 is a flowchart of steps of embodiment 1, fig. 4 is a schematic diagram of a structure of a PCB vertical circuit when no hole is drilled, fig. 5 is a schematic diagram of a structure of a PCB vertical circuit during drilling, fig. 6 is a schematic diagram of a structure of a PCB vertical circuit after drilling, fig. 7 is a schematic diagram of a structure of a PCB vertical circuit when no electric conduction is performed, fig. 8 is a schematic diagram of an insulating rod, fig. 9 is a schematic diagram of a conductive structure of a conductive insulating rod, fig. 10 is a schematic diagram of a structure of a conductive insulating rod, and fig. 11 is a front view of a structure of a conductive insulating rod.
The invention provides a method for manufacturing a structure of a PCB vertical circuit, which comprises the following steps:
s1: carrying out CNC machining on the male die and the female die of the insulating rod 5 to obtain a die-casting die;
s2: injecting the hot-melt insulating material into a die-casting die, and demolding after cooling to obtain an insulating rod 5;
s3: placing the multilayer PCB circuit 2 and the multilayer insulating layer 3 which are alternately overlapped on a drilling machine, and drilling a through hole 4 to obtain the through hole 4 on the PCB circuit 2 and the insulating layer 3;
s4: embedding the insulating rod 5 in the through hole 4 by using an embedded rod pressing device on a drilling machine, wherein the embedding mode is one or combination of pressing and beating;
s5: and conducting treatment is carried out on the insulating rod 5, the conducting mode is one or combination of a plurality of modes of chemical plating, electroplating, sputtering and attaching of a conducting film, the conducting material is one or combination of a plurality of modes of copper, silver and tin, the conducting insulating rod 1 is obtained, and after a plurality of layers of PCB circuit 2 are communicated, the PCB vertical circuit is obtained.
In the embodiment, firstly, CNC processing is carried out on a male die and a female die of an insulating rod 5 to obtain a die-casting die, then a hot-melt insulating material is injected into the die-casting die, demoulding is carried out after cooling to obtain the insulating rod 5, then a plurality of layers of the PCB circuit 2 and the insulating layers 3 which are alternately overlapped are placed on a drilling machine, through hole 4 drilling is carried out, through holes 4 are obtained on the PCB circuit 2 and the insulating layers 3, an embedded rod pressing device on the drilling machine is utilized to embed the conductive insulating rod 1 in the through hole 4 in a way of one or a combination of pressing and beating, the insulating rod 5 is subjected to conductive processing, the conductive processing is one or a combination of a plurality of ways of chemical plating, electroplating, sputtering and attaching a conductive film, the conductive material is one or a combination of a plurality of copper, silver and tin, obtaining the conductive insulating rod 1, finally waiting for the intercommunication of a plurality of layers of PCB circuit 2 to obtain a PCB vertical circuit, wherein the plurality of layers of PCB circuit 2 and a plurality of layers of insulating layers 3 are alternately overlapped, the conductive insulating rod 1 respectively penetrates through the PCB circuit 2 and the insulating layers 3, the position of each through hole 4 is directly completed in each layer adding process, after the drilling of the through hole 4 is completed, the insulating rod 5 is embedded into the through hole 4, the conductive insulating rod 1 is obtained after the conductive circuit is completed by the insulating rod 5 in the through hole 4, the conductive insulating rod 1 is mutually communicated with each layer circuit due to the conduction, and the manufacture of the structure of the PCB vertical circuit can be completed, so that more than two in-hole circuits can be manufactured in each through hole 4, the number of added layers is effectively reduced, and the problems of reliability and yield caused by the added layers are solved, the manufacturing efficiency of the structure of the PCB vertical circuit is improved.
Embodiment 2 please refer to fig. 3 to 11, wherein fig. 3 is a flowchart of steps of embodiment 2, fig. 4 is a schematic structural diagram of a PCB vertical circuit without drilling, fig. 5 is a schematic structural diagram of a PCB vertical circuit during drilling, fig. 6 is a schematic structural diagram of a PCB vertical circuit after drilling, fig. 7 is a schematic structural diagram of a PCB vertical circuit without conduction, fig. 8 is a schematic structural diagram of an insulating rod, fig. 9 is a structural diagram of a conductive insulating rod, fig. 10 is a schematic structural diagram of a conductive insulating rod, and fig. 11 is a structural front view of the conductive insulating rod.
The invention provides a method for manufacturing a structure of a PCB vertical circuit, which comprises the following steps:
s1: injecting the hot-melt insulating material into an injection mold, and extruding the insulating material;
s2: cutting off the insulating material by using a cutter, and then performing CNC turning and milling to obtain an insulating rod 5;
s3: placing the multilayer PCB circuit 2 and the multilayer insulating layer 3 which are alternately overlapped on a drilling machine, and performing through hole 4 drilling treatment to obtain through holes 4 on the PCB circuit 2 and the insulating layer 3;
s4: embedding the insulating rod 5 in the through hole 4 by using an embedded rod pressing device on a drilling machine, wherein the embedding mode is one or combination of pressing and beating;
s5: and conducting treatment is carried out on the insulating rod 5, the conducting mode is one or combination of a plurality of modes of chemical plating, electroplating, sputtering and attaching of a conducting film, the conducting material is one or combination of a plurality of modes of copper, silver and tin, the conducting insulating rod 1 is obtained, and after a plurality of layers of PCB circuit 2 are communicated, the PCB vertical circuit is obtained.
In the embodiment, firstly, injecting a hot-melt insulating material into an injection mold, extruding the insulating material, cutting the insulating material by using a cutter, performing CNC turning and milling to obtain insulating rods 5, then placing a plurality of layers of the PCB circuit 2 and a plurality of layers of the insulating layer 3 which are alternately overlapped on a drilling machine, performing through hole 4 drilling treatment, obtaining through holes 4 on the PCB circuit 2 and the insulating layer 3, embedding the insulating rods 5 into the through holes 4 by using an embedded bar press on the drilling machine, wherein the embedding mode is one or a combination of pressing and striking, performing conductive treatment on the insulating rods 5, the conductive mode is one or a combination of chemical plating, electroplating, sputtering and conductive film bonding, the conductive material is one or a combination of copper, silver and tin, obtaining the conductive insulating rods 1, finally, waiting for the plurality of layers of the PCB circuit 2 to be mutually communicated to obtain a vertical circuit of the PCB circuit, the plurality of layers of the PCB circuit 2 and the plurality of insulating layers 3 are alternately overlapped, the conductive insulating rods 1 respectively penetrate through the insulating layer 2 and the insulating layer 3, reducing the conductive through hole 4 and the conductive reliability of the circuit, and completing the circuit manufacturing process, wherein the conductive through hole 4 is formed in the vertical circuit, the insulating rod 1 and the insulating rod 4 can be manufactured, and the insulating rod manufacturing process is completed in the vertical circuit can be completed, the manufacturing efficiency of the structure of the PCB vertical circuit is improved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. A structure of PCB vertical circuit is characterized in that,
including electrically conductive insulating rod, multilayer PCB board circuit and multilayer insulating layer overlap the setting in turn, and the top layer that overlaps does PCB board circuit, the bottom that overlaps do the insulating layer, electrically conductive insulating rod runs through respectively PCB board circuit with the insulating layer.
2. A method for fabricating a structure of a PCB vertical circuit as claimed in claim 1, comprising the steps of:
manufacturing an insulating rod by using a hot-melt insulating material;
placing the multilayer PCB circuit and the multilayer insulating layer which are alternately overlapped on a drilling machine, and performing through hole drilling treatment to obtain through holes on the PCB circuit and the insulating layer;
embedding the insulating rod into the through hole by using an embedded rod pressing device on a drilling machine;
and conducting the insulating rod to obtain the conducting insulating rod, and waiting for the circuit intercommunication of the multiple layers of the PCB boards to obtain the PCB vertical circuit.
3. The method for fabricating a structure of a vertical circuit of PCB as claimed in claim 2, wherein in the step of fabricating the insulating rod using the hot-melt insulating material, the insulating rod fabricating process is:
carrying out CNC machining on the male die and the female die of the insulating rod to obtain a die-casting die;
and (3) injecting the hot-melt insulating material into a die-casting die, and demolding after cooling to obtain the insulating rod.
4. The method for fabricating a structure of a vertical circuit of PCB of claim 2, wherein in the step of fabricating the insulating rod using the hot-melt insulating material, the insulating rod fabricating process is:
injecting the hot-melt insulating material into an injection mold, and extruding the insulating material;
and cutting the insulating material by using a cutter, and then carrying out CNC turning and milling processing to obtain the insulating rod.
5. The method for manufacturing the structure of the PCB vertical circuit of claim 2, wherein the conductive insulating rod is manufactured after the insulating rod is conducted, and the step of obtaining the PCB vertical circuit by waiting for the interconnection of the plurality of layers of the PCB circuits is:
the conductive mode is one or a combination of a plurality of modes of chemical plating, electroplating, sputtering and attaching of a conductive film.
6. The method for manufacturing the structure of the PCB vertical circuit of claim 2, wherein the conductive insulating rod is manufactured after the insulating rod is conducted, and the PCB vertical circuit is obtained after a plurality of layers of the PCB circuits are intercommunicated:
the conductive material is one or a combination of more of copper, silver and tin, and the conductive insulating rod is obtained.
7. The method for fabricating a vertical circuit structure of PCB according to claim 2, wherein the step of fitting the insulating rod into the through hole using an embedded rod press on a drilling machine comprises:
the embedding mode is one or more of pressing and beating.
CN202211564140.2A 2022-12-07 2022-12-07 Structure and manufacturing method of PCB vertical circuit Pending CN115767879A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211564140.2A CN115767879A (en) 2022-12-07 2022-12-07 Structure and manufacturing method of PCB vertical circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211564140.2A CN115767879A (en) 2022-12-07 2022-12-07 Structure and manufacturing method of PCB vertical circuit

Publications (1)

Publication Number Publication Date
CN115767879A true CN115767879A (en) 2023-03-07

Family

ID=85344036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211564140.2A Pending CN115767879A (en) 2022-12-07 2022-12-07 Structure and manufacturing method of PCB vertical circuit

Country Status (1)

Country Link
CN (1) CN115767879A (en)

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