CN111787715B - Method for manufacturing interconnection of inner layers of circuit board - Google Patents
Method for manufacturing interconnection of inner layers of circuit board Download PDFInfo
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- CN111787715B CN111787715B CN202010760562.1A CN202010760562A CN111787715B CN 111787715 B CN111787715 B CN 111787715B CN 202010760562 A CN202010760562 A CN 202010760562A CN 111787715 B CN111787715 B CN 111787715B
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- circuit board
- interconnection
- interconnected
- columnar piece
- core plates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a circuit board inner layer interconnection manufacturing method, which comprises the following steps: stacking the inner core plates and the bonding sheets at intervals in sequence to form a stacked structure; the columnar piece is obliquely placed in the superposed structure, and two ends of the columnar piece are respectively connected with two inner-layer core plates to be interconnected; carrying out pressing treatment on the superposed structure to obtain a multilayer circuit board; respectively carrying out depth control drilling treatment on the positions of the multilayer circuit board corresponding to the two ends of the columnar piece to obtain a via hole with two central axes not on the same straight line, wherein the two ends of the columnar piece are respectively communicated with the external environment through the corresponding via holes; removing the column; metallizing the interconnect hole; the central axes of the two via holes are not on the same straight line, and the two via holes and the inclined interconnecting channel jointly form an interconnecting hole penetrating through the multilayer circuit board, so that the interconnection of inner-layer core boards is realized, and the density of circuit laying and the level of inner-layer interconnection are effectively improved.
Description
Technical Field
The invention relates to the field of circuit board processing and manufacturing, in particular to a circuit board inner layer interconnection manufacturing method.
Background
With the rapid development of 5G technology, higher demands are made on the integration level of circuits. The density of electronic components required to be laid on the circuit board is increasing, the inner layer interconnection design of the circuit board is also more and more complex, the interconnection holes are smaller and smaller, and the density is higher and higher.
In the industry, in order to realize interconnection of different inner layer patterns at the same position, a buried hole, a back drill and other modes are generally adopted to realize local communication of layers, but the prior processes have the following functional limitations:
1. when the processing is carried out in a back drilling mode, the central line position of the hole, except the inner layer position needing to be communicated, needs to be back-drilled with a non-metalized large hole, so that the circuit is not allowed to be laid in the area, the circuit laying difficulty is increased, and the circuit laying density is reduced;
2. when the hole is buried, multiple times of pressing are needed, and certain requirements are met for the interconnection layers of the inner layers. Therefore, there are limitations in the design of the process cost and the laying of dense lines.
Therefore, a method for fabricating an interconnection of inner layers of a circuit board is needed to solve the above problems.
Disclosure of Invention
The invention aims to provide a circuit board inner layer interconnection manufacturing method, wherein central axes of two via holes are not on the same straight line, and the two via holes and an inclined interconnection channel jointly form an interconnection hole penetrating through a multilayer circuit board, so that interconnection of inner layer core boards is realized, and the density of circuit laying and the inner layer interconnection level are effectively improved.
In order to achieve the purpose, the invention discloses a circuit board inner layer interconnection manufacturing method, which comprises the following steps:
s1, providing a plurality of inner core plates and a plurality of bonding sheets which form the circuit board, and a columnar piece, wherein the columnar piece is a hard cylinder made of high polymer materials which are compatible with the circuit board base material and resin;
s2, manufacturing a circuit pattern layer for each chip inner layer chip;
s3, stacking the inner core plates and the bonding sheets at intervals in sequence to form a stacking structure;
s4, obliquely placing the columnar piece in the stacked structure, wherein two ends of the columnar piece are respectively connected with two inner-layer core plates to be interconnected;
s5, carrying out pressing treatment on the superposed structure and the two inner-layer core boards to be interconnected to obtain a multilayer circuit board;
s6, respectively carrying out depth control drilling treatment on the positions of the multilayer circuit board corresponding to the two ends of the columnar piece to obtain a via hole with two central axes not on the same straight line, wherein the two ends of the columnar piece are respectively communicated with the external environment through the corresponding via holes;
s7, removing the columnar piece to enable the multilayer circuit board to penetrate through to form an inclined interconnection channel, wherein the interconnection channel and the two via holes jointly form an interconnection hole;
and S8, metalizing the interconnection holes, so that the two core plates needing to be interconnected are interconnected through the metalized interconnection holes.
Compared with the prior art, the columnar piece is obliquely arranged in the stacked structure, after the stacked structure is subjected to press-fitting treatment, the through holes with two central shafts not on the same straight line are obtained through depth control drilling treatment, the two ends of the columnar piece are respectively communicated with the external environment through the corresponding through holes, then the columnar piece is removed, so that the multilayer circuit board forms oblique interconnection holes, and the interconnection holes are metalized, so that interconnection of the inner-layer core boards is realized, on one hand, because the central shafts of the two through holes are not on the same straight line, and the two through holes and the oblique interconnection channels jointly form interconnection holes penetrating through the multilayer circuit board, the central shaft direction of the two through holes corresponding to the multilayer circuit board can be used for laying lines, and the density of the lines is effectively improved; on the other hand, the method carries out pressing treatment after the columnar piece is arranged to obtain the multilayer circuit board, and directly processes the multilayer circuit board in subsequent operation, only one pressing is needed, so that the process flow is effectively simplified, and the production cost is reduced.
Preferably, the step (4) specifically includes the following steps:
and S41, perforating the bonding sheet between the two inner core boards to be interconnected or the bonding sheet between the two inner core boards to be interconnected and the inner core board to form a first inclined positioning channel, and placing and positioning the columnar piece in the stacked structure through the first positioning channel.
Specifically, the hole opening process is performed by means of laser or mechanical drilling.
Preferably, connectors are respectively arranged at two ends of the columnar member, and the step (4) specifically comprises the following steps:
and S42, pre-drilling two inner-layer core plates needing to be interconnected respectively to obtain positioning grooves matched with the connectors, and inserting the two ends of the columnar piece into the corresponding positioning grooves respectively so as to be placed and positioned in the superposed structure.
Specifically, the step (42) further comprises the steps of:
s421, perforating the bonding sheet between the two inner core boards to be interconnected or the bonding sheet between the two inner core boards to be interconnected and the inner core board to form a first inclined positioning channel, and placing the columnar piece into the stacked structure through the first positioning channel.
Preferably, the step (6) specifically includes the following steps:
and S61, performing depth-control drilling treatment along the direction vertical to the surface of the multilayer circuit board.
Specifically, the polymer material is a weak base intolerant material.
Specifically, the step (7) specifically includes the following steps:
and S71, carrying out weak base solution soaking or horizontal assembly line soaking treatment on the multilayer circuit board to dissolve the columnar piece.
Preferably, the step (8) specifically includes the following steps:
and S81, performing copper deposition and electroplating treatment on the interconnection holes to metalize the interconnection holes.
Drawings
Fig. 1 is a flow chart of a method for manufacturing an interconnection of inner layers of a circuit board according to the present invention.
FIG. 2 is a schematic view of a multi-layer circuit board with a post of the present invention.
Fig. 3 is a schematic structural view of a post-like member according to still another preferred embodiment of the present invention, which is embedded in a multilayer circuit board.
Fig. 4 is a schematic structural view of the inner core board provided with positioning grooves.
Fig. 5 is a schematic structural view of the multilayer circuit board of the present invention after forming the interconnection holes.
Fig. 6 is a schematic diagram of the structure of fig. 5 after metallization of the interconnect holes.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1-6, the method for manufacturing the inner layer interconnection of the circuit board of the present embodiment includes the following steps:
s1, providing the plurality of inner core boards 10 and the plurality of bonding sheets 20 constituting the circuit board, and the column members 30.
S2, forming a circuit pattern layer for each of the chip on board 10. At least one of the front and back surfaces of the circuit layer of each inner core board 10 is provided with a circuit layer, and each circuit layer is manufactured according to a preset circuit, so as to ensure that the circuit layer is not damaged in the subsequent drilling and slotting operation process.
S3, stacking the inner core panels 10 and the bonding sheets 20 at intervals in sequence to form a stacked structure, so that the adjacent inner core panels 10 can be bonded and fixed by the bonding sheets 20. The present embodiment may have only two inner core boards 10, or may have more than two inner core boards 10, and the number of the inner core boards 10 is determined according to the production requirement, so as to meet different circuit requirements.
And S4, obliquely placing the column-shaped piece 30 in the stacked structure, and respectively connecting two ends of the column-shaped piece 30 with two inner core plates 10 which need to be interconnected, so as to ensure that the two ends of the column-shaped piece 30 can be respectively abutted to the corresponding inner core plates 10.
And S5, performing a pressing process on the stacked structure and the two inner-layer core boards 10 to be interconnected to obtain the multilayer circuit board 40, wherein the columnar member 30 is pressed and fixed in the multilayer circuit board 40.
S6, drilling holes with controlled depth at positions of the multilayer circuit board 40 corresponding to two ends of the pillar 30, respectively, to obtain via holes 50 with two central axes not in the same straight line, wherein the two ends of the pillar 30 are respectively communicated with the external environment through the corresponding via holes 50.
S7, removing the pillar 30 to make the multilayer circuit board 40 penetrate to form an inclined interconnection channel, wherein the interconnection channel and the two via holes 50 together form an interconnection hole 60. Because the central axes of the two via holes 50 are not in the same straight line, and the two via holes 50 are communicated through the inclined interconnecting channel to form the interconnecting hole 60, the central axes of the two ends of the interconnecting hole 60 are not in the same straight line, so that the inner core plate 10 below the central axis of any via hole 50 does not need to be perforated, and therefore, the inner core plate can be used for laying lines, and the density of the lines is effectively improved.
And S8, metalizing the interconnection holes 60, so that the two inner-layer core plates 10 required to be interconnected are interconnected through the metalized interconnection holes 60.
Preferably, the step (4) specifically includes the following steps:
s41, the bonding sheet 20 between the two inner core boards 10 to be interconnected, or the bonding sheet 20 between the two inner core boards 10 to be interconnected and the inner core boards 10 are perforated to form first positioning channels in an inclined shape, through which the pillars 30 are inserted and positioned in the stacked structure as shown in fig. 2. Specifically, when two inner core boards 10 to be interconnected are adjacent, only the bonding sheet 20 between the two inner core boards 10 needs to be perforated; when two core boards 10 to be interconnected are not adjacent, that is, the bonding sheet 20 and the other core boards 10 are still interposed between the two core boards 10 to be interconnected, it is necessary to perform a hole opening process on the bonding sheet 20 and the other core boards 10 between the two core boards 10 to be interconnected.
Specifically, the hole is opened by laser or mechanical drilling to form a first inclined positioning channel matching with the pillar 30, and the pillar 30 is inserted into the first positioning channel, so that the pillar 30 is fixed in the stacked structure.
In another preferred embodiment, two ends of the column 30 are respectively provided with a connector, and the step (4) specifically includes the following steps:
s42, pre-drilling the two inner core plates 10 to be interconnected to obtain positioning slots 11 matching with the connectors as shown in fig. 4, and inserting the two ends of the column 30 into the corresponding positioning slots 11 to be placed and positioned in the stacked structure. The pre-drilling process is performed by laser or mechanical drilling.
Specifically, the step (42) further comprises the steps of:
s421, performing a hole opening process on the bonding sheet 20 between the two inner core boards 10 to be interconnected, or the bonding sheet 20 between the two inner core boards 10 to be interconnected and the inner core board 10 to form a first positioning channel in an inclined shape, and the column 30 is inserted into and positioned in the stacked structure through the first positioning channel as shown in fig. 3. Specifically, when two inner core boards 10 to be interconnected are adjacent, only the bonding sheet 20 between the two inner core boards 10 needs to be perforated; when two core boards 10 to be interconnected are not adjacent, that is, the bonding sheet 20 and the other core boards 10 are still interposed between the two core boards 10 to be interconnected, it is necessary to perform a hole opening process on the bonding sheet 20 and the other core boards 10 between the two core boards 10 to be interconnected.
Preferably, the step (6) specifically includes the following steps:
s61, drilling the via hole 50 vertically on the surface of the multi-layer circuit board 40 along a direction perpendicular to the surface of the multi-layer circuit board 40, and ensuring that the via hole 50 reaches the pillar 30, so that the corresponding portion of the pillar 30 cannot be communicated with the external environment through the via hole 50 due to insufficient depth of the via hole 50, and the inner core 10 and the circuit pattern layer cannot be damaged due to excessive depth of the via hole 50.
Preferably, the column 30 is a hard cylinder made of a polymer material, and the polymer material is compatible with a circuit board substrate and resin.
Specifically, the polymer material is a weak base intolerant material.
Specifically, the step (7) specifically includes the following steps:
s71, the multilayer circuit board 40 is soaked in weak alkali solution or horizontal line to dissolve the pillar 30. Since the column 30 is a hard cylindrical material that is weak base-intolerant, the weak base solution will not corrode the inner core plate 10 and the bonding sheet 20, i.e., the weak base solution only acts on the column 30. Therefore, the multi-layer circuit board 40 is soaked by using a weak base solution soaking or horizontal line soaking treatment, so that the columnar member 30 can be effectively dissolved and removed, and other parts of the multi-layer circuit board 40 are not damaged. In actual production, the column-shaped member 30 is dissolved mainly by using a weak base solution soaking mode, the processing cost of weak base solution soaking is low, the process is simple, a good dissolving effect can be obtained, and the production cost can be effectively reduced.
Preferably, the step (8) specifically includes the following steps:
s81, performing a copper deposition and electroplating process on the interconnection holes 60 to metalize the interconnection holes 60.
So far, the multilayer circuit board 40 with the interconnected inner layers is obtained through the steps, and then the multilayer circuit board 40 is processed according to a conventional process, so that the cost circuit board can be obtained, and further description on the subsequent process steps is omitted.
It should be noted that the conductive metal coated in the metallized interconnection hole 60 can be used to electrically connect with the metal layer of each core board, and the circuit pattern layers of different core boards are reasonably arranged, so as to satisfy the electrical connection of other core boards except the two core boards 10 in the inner layers that need to be interconnected, and facilitate to more pointedly satisfy the more complicated circuit design requirement in the actual circuit design.
With reference to fig. 1 to 6, according to the present invention, the column-shaped element 30 is obliquely inserted into the stacked structure, and after the stacked structure is subjected to a press-fitting process, the via holes 50 with two central axes not on the same straight line are obtained by a depth control drilling process, two ends of the column-shaped element 30 are respectively communicated with an external environment through the corresponding via holes 50, and then the column-shaped element 30 is removed, such that the multilayer circuit board 40 forms the oblique interconnection holes 60, and the interconnection holes 60 are metalized, thereby implementing interconnection of the inner core boards 10, on one hand, since the central axes of the two via holes 50 are not on the same straight line, and the two via holes 50 and the oblique interconnection channels together form the interconnection holes 60 penetrating through the multilayer circuit board 40, such that the multilayer circuit board 40 can be used for laying circuits corresponding to the central axis directions of the two via holes 50, and the density of the circuits is effectively improved; on the other hand, the method carries out pressing treatment after the columnar member 30 is arranged to obtain the multilayer circuit board 40, and directly processes the multilayer circuit board 40 in subsequent operation, only one pressing is needed, so that the process flow is effectively simplified, and the production cost is reduced.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (9)
1. A circuit board inner layer interconnection manufacturing method is characterized by comprising the following steps:
providing a plurality of inner core plates and a plurality of bonding sheets which form the circuit board, and a columnar piece, wherein the columnar piece is a hard cylinder made of a high polymer material, and the high polymer material is compatible with a base material and resin of the circuit board;
manufacturing a circuit pattern layer for each chip internal layer chip;
stacking the inner core plates and the bonding sheets at intervals in sequence to form a stacked structure;
the columnar piece is obliquely placed in the superposed structure, and two ends of the columnar piece are respectively connected with two inner-layer core plates to be interconnected;
carrying out pressing treatment on the superposed structure and the two inner-layer core boards to be interconnected to obtain a multilayer circuit board;
respectively carrying out depth control drilling treatment on the positions of the multilayer circuit board corresponding to the two ends of the columnar piece to obtain a via hole with two central axes not on the same straight line, wherein the two ends of the columnar piece are respectively communicated with the external environment through the corresponding via holes;
removing the columnar piece to enable the multilayer circuit board to penetrate through to form an inclined interconnection channel, wherein the interconnection channel and the two via holes jointly form an interconnection hole;
and metalizing the interconnection holes so that the two inner-layer core plates needing to be interconnected are interconnected through the metalized interconnection holes.
2. The method for manufacturing interconnection of inner layers of circuit board according to claim 1, wherein the pillar is obliquely inserted into the stacked structure, and two ends of the pillar are respectively connected to two inner layer core boards to be interconnected, comprising the steps of:
and perforating the bonding sheet between the two inner core plates to be interconnected or the bonding sheet between the two inner core plates to be interconnected and the inner core plates to form a first inclined positioning channel, wherein the columnar piece is placed in and positioned in the superposed structure through the first positioning channel.
3. The method of claim 2, wherein: and (4) performing hole opening treatment by means of laser or mechanical drilling.
4. The method for interconnecting and manufacturing inner layers of circuit boards according to claim 1, wherein two ends of the columnar member are respectively provided with a connector, the columnar member is obliquely arranged in the stacked structure, and two ends of the columnar member are respectively connected with two inner layer core boards to be interconnected, specifically comprising the following steps:
and pre-drilling two inner-layer core plates needing to be interconnected respectively to obtain positioning grooves matched with the connectors, wherein two ends of the columnar piece are inserted into the corresponding positioning grooves respectively so as to be placed and positioned in the superposed structure.
5. The method for interconnecting and manufacturing inner layers of circuit boards according to claim 4, wherein the two inner core boards to be interconnected are pre-drilled to obtain positioning grooves matched with the connectors, and two ends of the column-shaped member are inserted into the corresponding positioning grooves respectively to be placed and positioned in the stacked structure, further comprising the steps of:
and perforating the bonding sheet between the two inner core plates to be interconnected or the bonding sheet between the two inner core plates to be interconnected and the inner core plates to form a first inclined positioning channel, wherein the columnar piece is placed in the stacked structure through the first positioning channel.
6. The method according to claim 1, wherein the deep hole drilling is performed at positions of the multilayer circuit board corresponding to two ends of the pillar, so as to obtain two via holes with central axes not on the same straight line, and the two ends of the pillar are respectively communicated with an external environment through the corresponding via holes, and the method comprises the following steps:
and carrying out depth control drilling treatment along the direction vertical to the surface of the multilayer circuit board.
7. The method of claim 1, wherein: the high polymer material is weak base intolerant material.
8. The method of claim 1, wherein: the method comprises the following steps of removing the columnar piece to enable the multilayer circuit board to penetrate through to form an inclined interconnection channel, wherein the interconnection channel and the two via holes jointly form an interconnection hole, and the method specifically comprises the following steps:
and carrying out weak alkali solution soaking or horizontal assembly line soaking treatment on the multilayer circuit board so as to dissolve the columnar piece.
9. The method for manufacturing interconnection of inner layers of circuit board according to claim 1, wherein the metallization of the interconnection holes allows interconnection of two inner layer core boards to be interconnected through the metallized interconnection holes, and the method comprises the following steps:
and carrying out copper deposition and electroplating treatment on the interconnection holes to metalize the interconnection holes.
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| CN202010760562.1A CN111787715B (en) | 2020-07-31 | 2020-07-31 | Method for manufacturing interconnection of inner layers of circuit board |
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| CN202010760562.1A CN111787715B (en) | 2020-07-31 | 2020-07-31 | Method for manufacturing interconnection of inner layers of circuit board |
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| CN111787715B true CN111787715B (en) | 2022-07-12 |
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| WO2024168871A1 (en) * | 2023-02-17 | 2024-08-22 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method therefor, and display module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009032936A (en) * | 2007-07-27 | 2009-02-12 | Kyocera Corp | Wiring board for x-ray detecting element mounting, and x-ray detecting device |
| JP2009054668A (en) * | 2007-08-24 | 2009-03-12 | Kyocera Corp | Wiring board having x ray detecting element mounted thereon, and x ray detecting device |
| CN102065651A (en) * | 2011-01-12 | 2011-05-18 | 广州兴森快捷电路科技有限公司 | Production method of high-density laminated printed circuit board of high-frequency material |
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2020
- 2020-07-31 CN CN202010760562.1A patent/CN111787715B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009032936A (en) * | 2007-07-27 | 2009-02-12 | Kyocera Corp | Wiring board for x-ray detecting element mounting, and x-ray detecting device |
| JP2009054668A (en) * | 2007-08-24 | 2009-03-12 | Kyocera Corp | Wiring board having x ray detecting element mounted thereon, and x ray detecting device |
| CN102065651A (en) * | 2011-01-12 | 2011-05-18 | 广州兴森快捷电路科技有限公司 | Production method of high-density laminated printed circuit board of high-frequency material |
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