CN101754590A - Making method of circuit board of built-in passive components - Google Patents
Making method of circuit board of built-in passive components Download PDFInfo
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- CN101754590A CN101754590A CN200810185967A CN200810185967A CN101754590A CN 101754590 A CN101754590 A CN 101754590A CN 200810185967 A CN200810185967 A CN 200810185967A CN 200810185967 A CN200810185967 A CN 200810185967A CN 101754590 A CN101754590 A CN 101754590A
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Abstract
The present invention relates to a making method of a circuit board of built-in passive components. Conductive adhesive or solder paster is printed on a first substrate, on which via holes and circuits are manufactured in advance, In order to arrange passive components on the first substrate. The passive components baked are electrically connected with the circuits on the first substrate. Holes corresponding to the passive components are formed on a dielectric material, and the dielectric material and a second substrate made with via holes and circuits are orderly overlapped on the first substrate. The circuit board of built-in passive components is made after the steps of pressing, drilling holes, making via holes and outer layer circuits, etc. The arrangement of the passive components in the circuit board with the technique above has the advantages of stable raw material supply, low manufacture cost, etc.
Description
Technical field
The invention relates to a kind of method of manufacturing circuit board, refer to especially a kind of in circuit board the manufacture method of built-in passive components.
Background technology
Because the circuit structure of electronic product is more and more accurate, function is more and more, but under the situation that never changes for the requirement of reduced volume, and be a requirement in order to satisfy, except circuit board must be changed into the multi-layer sheet form, many electronic components are required to be integrated in circuit board technology in the multi-ply construction of circuit board, with the density of further raising circuit.
Announce No. 395145 " flat resistance capacitance and manufacture method thereof (two) " patent of invention case and TaiWan, China is announced No. 421979 " built-in fingered flat capacitor resistance and manufacture method () thereof " patent of invention case etc. as applicant elder generation prerequisite Shen and the TaiWan, China of getting permission patent, all be in circuit board technology, cooperate the printing high resistance be the number conductive layers technology in case in circuit board built-in resistance.Although this kind cooperates the technology technology of printing special material simple, because the supply of special material is subject to particular vendor, thus supply of raw material and unstable, and the material cost costliness.
The originate passive device finished product of unexpected scarcity of direct employing is also arranged at present again, it is built in technology in the circuit board, for example " conductive paste puncture method ", its processing step is as described below:
At first as shown in Figure 6A, mainly be on a copper sheet 701, to utilize special conductive paste printing to form a kind of cone-shaped conduction column 702, then carry out pressing (shown in Fig. 6 B) with a dielectric layer 703 and another copper sheet 704, utilize levels copper sheet 701,704 to make circuit 705,706 respectively again, and the conduction column 702 formation conductings (shown in Fig. 6 C) by piercing through dielectric layer 703, constitute one first base material 71 thus.
Then on aforementioned first base material 71, print cone-shaped conduction column 707 with special conductive paste again, and on first base material 71, place electric capacity 73 (shown in Fig. 6 D), and further carry out pressing (shown in Fig. 6 E) with one second base material 72, in the process of pressing, conduction column 707 on first base material 71 will be except that will electrically contacting with electric capacity 73 formations, and part conduction column 707 also will constitute with the circuit on second base material 72 be electrically connected (shown in Fig. 6 F).
Aforementioned technology is to cooperate the conductive paste printing technology that passive device finished product (electric capacity) is built in the circuit board, because the supply of electric capacity finished product does not have anxiety, so have the stable advantage of raw material supply.But it is a special material that printing according to this forms the conductive paste of conduction column, also only by the particular vendor supply, thus still can't avoid problems such as feed instability, cost of material costliness, and technology is also comparatively complicated.
Summary of the invention
From the above, for in the multi-ply construction that the part passive device is built in circuit board to improve the density of circuit, with regard to existing technology, can take print process, conductive paste puncture method etc., but there are problems such as material cost height, supply of material shakiness or technology complexity simultaneously in it, so need to be further reviewed, and seek feasible solution.
Therefore, main purpose of the present invention is providing a kind of method of manufacturing circuit board of built-in passive components, and it has advantages such as cost of material is cheap, and the supply of material is stable, thereby effectively solves the problem of existing built-in passive components technology.
For reaching the major technique means that aforementioned purpose takes is to make preceding method comprise the following steps:
One first base material and one second base material are provided, and this first, second base material mainly is that the one side respectively at a dielectric layer is provided with a copper sheet, and its another side then is formed with circuit, and this circuit is to constitute conducting by interlayer conduction on the dielectric layer and copper sheet;
On aforementioned first base material, place passive device, and circuit on passive device and first base material is constituted be electrically connected;
One tabular dielectric material is provided, is formed with more than one perforate on this dielectric material, this perforate is corresponding to the passive device on first base material;
Make the aforementioned dielectric material and second base material superimposed in regular turn on first base material, and carry out pressing, wherein the passive device on first base material is to be positioned between the perforate of dielectric material;
Utilize the copper sheet on first, second base material outside to make outer-layer circuit;
The aforementioned superimposed structure that is made of first base material, dielectric material and second base material is holed, and make via, to be electrically connected the circuit on first, second base material; So far can constitute the circuit board of a built-in passive components.
Utilize aforementioned technology except that the circuit board that can be made into built-in passive components, owing to be to adopt ready-made passive device product, cooperate technology such as pressing operation, thin plate etching, thin plate plating, can finish and make the circuit board that is built-in with passive device, it possesses, and sources of supply is stable, cost is low, the process efficiency advantages of higher.
Description of drawings
Relevant characteristics and implementation of the present invention, following conjunction with figs. and preferred embodiment describe in detail as after, wherein:
Figure 1A, Figure 1B are the process schematic representations that a preferred embodiment of the present invention is made base material.
Fig. 2 A-C makes passive device constitute the process schematic representation that is electrically connected with base material in a preferred embodiment of the present invention.
Fig. 3 A-C makes passive device constitute the process schematic representation that is electrically connected with base material in a preferred embodiment of the present invention.
Fig. 4 A-E is that the another preferred embodiment of the present invention is made base material and made base material constitute the process schematic representation that is electrically connected with passive device.
Fig. 5 A-C makes passive device constitute the process schematic representation that is electrically connected with base material in a preferred embodiment of the present invention.
Fig. 6 A-F is the existing processing step schematic diagram that utilizes the conductive paste puncture method in the circuit board built-in passive components.
Embodiment
About the processing step of a preferred embodiment of the present invention, detailed (please cooperate consult shown in Figure 1) as described below:
One first base material 10 is provided, this first base material 10 mainly be in the upper and lower surface of a dielectric layer 13 respectively pressing one copper sheet 11,12 (shown in Figure 1A) is arranged, wherein a copper sheet 11 is used to be made into circuit 110, on this dielectric layer 13 and be formed with via 130, circuit 110 must be constituted with copper sheet 12 by via 130 be electrically connected (shown in Figure 1B), this circuit 110 also includes component contacts 111.
On aforementioned first base material 10, place passive device, and circuit on passive device and first base material 10 is constituted be electrically connected; In present embodiment, this passive device is a ceramic condenser, its with first base material 10 on set circuit 110 constitute mode of being electrically connected can be as shown in Figure 2:
Printing conductive jelly 112 on the component contacts 111 of aforementioned first base material 10 (shown in Fig. 2 A), this conduction jelly 112 can be conducting resinl or tin cream;
Place ceramic condenser 30 (shown in Fig. 2 B) on the component contacts 111 of aforementioned first base material 10 printing conductive jelly 112, these ceramic condenser 30 two ends have an electrode 31 respectively, and the corresponding respectively component contacts 111 that is positioned on first base material 10;
Aforementioned first base material 10 of having placed ceramic condenser 30 is toasted, make conduction jelly 112 fusions (shown in Fig. 2 C), and then make circuit 110 formations on ceramic condenser 30 and first base material 10 be electrically connected;
The dielectric material 40 of one second base material 20 and a tool thickness then is provided, and (as shown in Figure 3A, it is identical with first base material 10 that this second base material 20 has, and mainly is that pressing has a copper sheet 22 on the one side of a dielectric layer 23, and another side then is formed with circuit 210; Dielectric material 40 sizes are and first base material, 10 couplings again, are formed with more than one perforate 41 on it, and this perforate 41 is corresponding to the ceramic condenser 30 on first base material 10;
Then that dielectric material 40, second base material 20 is superimposed in regular turn on first base material 10, and make ceramic condenser 30 right positions on first base material 10 in the perforate 41 of dielectric material 40, subsequently aforementioned three being carried out pressing, the structure after its pressing is shown in Fig. 3 B; Then utilize the copper sheet 12,22 on aforementioned first, second base material 10,20 relative lateral surfaces to make outer-layer circuit 120,220, and hole;
After boring is finished, promptly electroplate boring to form via 42 (shown in Fig. 3 C), utilize via 42 to make internal layer circuit 110,210 and outer-layer circuit 120,220 constitute conducting.
Through finishing the multilayer circuit board of a built-in passive components after the previous process steps, if built-in passive components in the number of plies of palpus increase circuit board or the further stromatolithic structure that increases only must repeat abovementioned steps and get final product.
See also shown in Figure 4 again, it is the another preferred embodiment of the present invention, its processing step and last embodiment are roughly the same, as Fig. 4 A-Fig. 4 E is that preface discloses first base material 10 that making has laser via 130 and circuit 110, warp is in the component contacts 111 printing conductive jellies 112 of first base material 10, and promptly toast after placing ceramic condenser 30, ceramic condenser 30 is electrically connected with circuit 110 formations on first base material 10.
Different with last embodiment be in: be to replace dielectric materials 40 between this first base material 10 and second base material 20 with a central layer (core) 50, be still before its pressing and on central layer 50, form earlier perforate 51 (shown in Fig. 5 A), this perforate 51 and corresponding to the ceramic condenser 30 on first base material 10; Then then that central layer 50, second base material 20 is superimposed in regular turn on first base material 10, and make ceramic condenser 30 right positions on first base material 10 in the perforate 51 of central layer 50, be still subsequently aforementioned three is carried out pressing, the structure after the pressing is shown in Fig. 5 B; Then utilize the copper sheet 12,22 on aforementioned first, second base material 10,20 relative lateral surfaces to make outer-layer circuit 120,220, and hole;
After boring is finished, promptly electroplate boring to form via 52 (shown in Fig. 5 C), utilize via 52 to make internal layer circuit 110,210 and outer-layer circuit 120,220 constitute conducting.
From the above, the detailed content of various embodiments of the present invention technology, utilize these technology passive device finished products such as resistance or electric capacity can be built in the multi-ply construction of circuit board, owing to be the finished product that adopts passive device, with regard to the obtaining of passive device, do not have the problem of the supply of material, and it is low to involve in threshold with regard to technology, can carry out volume production easily, so can reduce manufacturing cost, improve production capacity efficient.
Claims (12)
1. the method for manufacturing circuit board of a built-in passive components comprises the following steps:
One first base material and one second base material are provided, and this first, second base material mainly is provided with a copper sheet respectively at the one side of a dielectric layer, and its another side then is formed with circuit, and interlayer conduction and copper sheet that this link tester is crossed on the dielectric layer constitute conducting;
On aforementioned first base material, place passive device, and circuit on passive device and first base material is constituted be electrically connected;
One tabular dielectric material is provided, is formed with more than one perforate on this dielectric material, this perforate is corresponding to the passive device on first base material;
Make the aforementioned dielectric material and second base material superimposed in regular turn on first base material, and carry out pressing, wherein the passive device on first base material is positioned between the perforate of dielectric material;
Utilize the copper sheet on first, second base material outside to make outer-layer circuit;
The aforementioned superimposed structure that is made of first base material, dielectric material and second base material is holed, and make via, to be electrically connected the circuit on first, second base material.
2. the method for manufacturing circuit board of built-in passive components as claimed in claim 1, circuit on this first base material comprises component contacts, be printed with the conduction jelly on this component contacts, this passive device is positioned on the component contacts of first base material, make the melting of conduction jelly through baking, passive device is constituted with component contacts be electrically connected.
3. the method for manufacturing circuit board of built-in passive components as claimed in claim 2, this conduction jelly is conducting resinl or tin cream.
4. the method for manufacturing circuit board of built-in passive components as claimed in claim 3, this passive device is electric capacity or resistance.
5. the method for manufacturing circuit board of built-in passive components as claimed in claim 4, this electric capacity further is a ceramic condenser, its two ends have electrode, correspond respectively to the component contacts on first base material.
6. the method for manufacturing circuit board of built-in passive components as claimed in claim 5, the via on this first, second base material is a laser via.
7. the method for manufacturing circuit board of a built-in passive components comprises the following steps:
One first base material and one second base material are provided, and this first, second base material mainly is provided with a copper sheet respectively at the one side of a dielectric layer, and its another side then is formed with circuit, and interlayer conduction and copper sheet that this link tester is crossed on the dielectric layer constitute conducting;
On aforementioned first base material, place passive device, and circuit on passive device and first base material is constituted be electrically connected;
One central layer is provided, is formed with more than one perforate on this central layer, this perforate is corresponding to the passive device on first base material;
Make the aforementioned central layer and second base material superimposed in regular turn on first base material, and carry out pressing, wherein the passive device on first base material is positioned between the perforate of central layer;
Utilize the copper sheet on first, second base material outside to make outer-layer circuit;
The aforementioned superimposed structure that is made of first base material, central layer and second base material is holed, and make via, to be electrically connected the circuit on first, second base material.
8. the method for manufacturing circuit board of built-in passive components as claimed in claim 7, circuit on this first base material comprises component contacts, be printed with the conduction jelly on this component contacts, this passive device is positioned on the component contacts of first base material, make the melting of conduction jelly through baking, passive device is constituted with component contacts be electrically connected.
9. the method for manufacturing circuit board of built-in passive components as claimed in claim 8, this conduction jelly is conducting resinl or tin cream.
10. the method for manufacturing circuit board of built-in passive components as claimed in claim 9, this passive device is electric capacity or resistance.
11. the method for manufacturing circuit board of built-in passive components as claimed in claim 10, this electric capacity further are a ceramic condenser, its two ends have electrode, correspond respectively to the component contacts on first base material.
12. the method for manufacturing circuit board of built-in passive components as claimed in claim 11, the via on this first, second base material are laser vias.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101859676A CN101754590B (en) | 2008-12-18 | 2008-12-18 | Making method of circuit board of built-in passive components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101859676A CN101754590B (en) | 2008-12-18 | 2008-12-18 | Making method of circuit board of built-in passive components |
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| Publication Number | Publication Date |
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| CN101754590A true CN101754590A (en) | 2010-06-23 |
| CN101754590B CN101754590B (en) | 2012-01-11 |
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| CN2008101859676A Expired - Fee Related CN101754590B (en) | 2008-12-18 | 2008-12-18 | Making method of circuit board of built-in passive components |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906371A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
| CN111371977A (en) * | 2020-03-17 | 2020-07-03 | Oppo广东移动通信有限公司 | Electronic device and camera module thereof |
| CN112271170A (en) * | 2020-10-27 | 2021-01-26 | 苏州通富超威半导体有限公司 | Packaging substrate, flip chip packaging structure and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6686827B2 (en) * | 2001-03-28 | 2004-02-03 | Protectronics Technology Corporation | Surface mountable laminated circuit protection device and method of making the same |
| US20030024111A1 (en) * | 2001-08-02 | 2003-02-06 | Aem, Inc. | Dot penetration method for inter-layer connections of electronic components |
| CN1735318A (en) * | 2004-08-11 | 2006-02-15 | 健鼎科技股份有限公司 | Flush type resistance manufacturing method and printed circuit board with the same |
-
2008
- 2008-12-18 CN CN2008101859676A patent/CN101754590B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906371A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
| CN111371977A (en) * | 2020-03-17 | 2020-07-03 | Oppo广东移动通信有限公司 | Electronic device and camera module thereof |
| CN112271170A (en) * | 2020-10-27 | 2021-01-26 | 苏州通富超威半导体有限公司 | Packaging substrate, flip chip packaging structure and manufacturing method thereof |
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| CN101754590B (en) | 2012-01-11 |
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Granted publication date: 20120111 Termination date: 20161218 |