TWI836404B - 材料沉積設備、在基板上沉積材料的方法及材料沉積系統 - Google Patents

材料沉積設備、在基板上沉積材料的方法及材料沉積系統 Download PDF

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Publication number
TWI836404B
TWI836404B TW111115016A TW111115016A TWI836404B TW I836404 B TWI836404 B TW I836404B TW 111115016 A TW111115016 A TW 111115016A TW 111115016 A TW111115016 A TW 111115016A TW I836404 B TWI836404 B TW I836404B
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TW
Taiwan
Prior art keywords
substrate
heater assembly
processing drum
material deposition
heater
Prior art date
Application number
TW111115016A
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English (en)
Chinese (zh)
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TW202305160A (zh
Inventor
塔瑪拉 漢茨
史帝芬 班傑
蘇雷許 曼尼寇特柯拉洛特
拉姆戈帕爾 查卡拉瓦蒂拉馬薩米
Original Assignee
美商應用材料股份有限公司
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0421—Methods of deposition of the material involving vapour deposition
    • H01M4/0423—Physical vapour deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H01M4/139—Processes of manufacture
    • H01M4/1395—Processes of manufacture of electrodes based on metals, Si or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW111115016A 2021-04-21 2022-04-20 材料沉積設備、在基板上沉積材料的方法及材料沉積系統 TWI836404B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163177491P 2021-04-21 2021-04-21
US63/177,491 2021-04-21

Publications (2)

Publication Number Publication Date
TW202305160A TW202305160A (zh) 2023-02-01
TWI836404B true TWI836404B (zh) 2024-03-21

Family

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TW111115016A TWI836404B (zh) 2021-04-21 2022-04-20 材料沉積設備、在基板上沉積材料的方法及材料沉積系統

Country Status (7)

Country Link
US (2) US12203164B2 (enExample)
EP (1) EP4326919A4 (enExample)
JP (1) JP7663714B2 (enExample)
KR (1) KR102800920B1 (enExample)
CN (1) CN117120659A (enExample)
TW (1) TWI836404B (enExample)
WO (1) WO2022225731A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117966102B (zh) * 2024-03-11 2026-07-24 北京卫蓝新能源科技股份有限公司 一种用于真空镀膜的阶梯型坩埚

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101061731B1 (ko) * 2008-10-15 2011-09-02 주식회사 디알테크넷 필름상 박막형성장치 및 방법
CN103782201A (zh) * 2011-09-07 2014-05-07 应用材料公司 用于制造在触控面板中使用的透明主体的方法和系统
TW201533257A (zh) * 2013-12-10 2015-09-01 Applied Materials Inc 應用於真空處理裝置之基板塗佈裝置,具基板塗佈裝置之真空處理裝置及其操作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0311302B1 (en) * 1987-10-07 1992-06-24 THORN EMI plc Apparatus and method for the production of a coating on a web
JP2004315861A (ja) * 2003-04-14 2004-11-11 Matsushita Electric Ind Co Ltd 薄膜形成装置及び薄膜形成方法
JP2005029895A (ja) * 2003-07-04 2005-02-03 Agfa Gevaert Nv 蒸着装置
EP2053663A1 (en) 2007-10-25 2009-04-29 Applied Materials, Inc. Hover cushion transport for webs in a web coating process
JP5081712B2 (ja) 2008-05-02 2012-11-28 富士フイルム株式会社 成膜装置
MX344096B (es) * 2012-01-18 2016-12-05 Nuvosun Inc Sistemas para la formacion de celdas fotovoltaicas en substratos flexibles.
JP6375387B2 (ja) * 2014-04-02 2018-08-15 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 真空処理システム、及び処理システムを取り付けるための方法
US9953829B2 (en) * 2015-08-27 2018-04-24 Toshiba Memory Corporation Image processing apparatus with improved slide printout based on layout data
JP6851143B2 (ja) * 2016-04-05 2021-03-31 株式会社アルバック 蒸発源、真空蒸着装置および真空蒸着方法
CN109477203A (zh) * 2016-07-01 2019-03-15 应用材料公司 用于涂布柔性基板的沉积设备和涂布柔性基板的方法
EP3272901A1 (en) 2016-07-18 2018-01-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Deposition arrangement and method for depositing
US10156009B2 (en) * 2016-12-05 2018-12-18 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Silver copper indium gallium selenide reactive sputtering method and apparatus, and photovoltaic cell containing same
JPWO2018199169A1 (ja) * 2017-04-26 2019-06-27 株式会社アルバック 成膜装置及び成膜方法
JP7054055B2 (ja) 2018-05-23 2022-04-13 住友金属鉱山株式会社 ガス放出ロール及びその製造方法並びにガス放出ロールを用いた処理装置
WO2020078557A1 (en) * 2018-10-18 2020-04-23 Applied Materials, Inc. Deposition apparatus, system and method for depositing a material on a substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101061731B1 (ko) * 2008-10-15 2011-09-02 주식회사 디알테크넷 필름상 박막형성장치 및 방법
CN103782201A (zh) * 2011-09-07 2014-05-07 应用材料公司 用于制造在触控面板中使用的透明主体的方法和系统
TW201533257A (zh) * 2013-12-10 2015-09-01 Applied Materials Inc 應用於真空處理裝置之基板塗佈裝置,具基板塗佈裝置之真空處理裝置及其操作方法

Also Published As

Publication number Publication date
EP4326919A4 (en) 2025-08-20
WO2022225731A1 (en) 2022-10-27
JP2024514679A (ja) 2024-04-02
JP7663714B2 (ja) 2025-04-16
TW202305160A (zh) 2023-02-01
US20220341031A1 (en) 2022-10-27
US12203164B2 (en) 2025-01-21
US20250101573A1 (en) 2025-03-27
KR20230170951A (ko) 2023-12-19
KR102800920B1 (ko) 2025-05-12
EP4326919A1 (en) 2024-02-28
CN117120659A (zh) 2023-11-24

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