TWI826056B - 晶圓存取總成及其晶圓存取裝置與晶圓載具 - Google Patents

晶圓存取總成及其晶圓存取裝置與晶圓載具 Download PDF

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TWI826056B
TWI826056B TW111139651A TW111139651A TWI826056B TW I826056 B TWI826056 B TW I826056B TW 111139651 A TW111139651 A TW 111139651A TW 111139651 A TW111139651 A TW 111139651A TW I826056 B TWI826056 B TW I826056B
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wafer
access device
shaft
driving block
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潘世峰
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大立鈺科技有限公司
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    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract

本發明係一種晶圓存取總成及其晶圓存取裝置與晶圓載具，其包含有一底座、一軸桿、複數連動板、複數手臂、以及一伸縮組件，該底座具有一長槽，該軸桿可滑動地伸入於該長槽中，該些連動板套設於該軸桿，每一連動板具有一板體、以及一穿孔，該穿孔設於該板體供該軸桿穿過，每一該手臂由該連動板之板體的一端延伸而出，該伸縮組件包含複數連接側壁設於該些連動板並使相鄰之連動板連接在一起，該些連接側壁可進行伸縮以改變相鄰連動板之間的距離。藉此，晶圓載具的體積可縮減一半，且晶圓存取裝置可同時真空吸附複數晶圓，達到更高的晶圓存取效率。

Description

晶圓存取總成及其晶圓存取裝置與晶圓載具
本發明係關於一種存取晶圓及運送晶圓的技術，特別是指一種既省時又能減少運送體積的晶圓存取總成及其晶圓存取裝置與晶圓載具。
晶圓是半導體製程中主要的基材，由於晶圓易碎，且一旦已經完成曝光、顯影、蝕刻等製程並等待進行切割的晶圓受到污染，所造成的損失更是令人咋舌，因此在運送晶圓的過程中往往需要使用經過特別設計的密封容器來保護。習知技術係透過機械手臂(wafer robot)抓取晶圓使其於「運送晶圓盒」與「晶圓傳輸系統」之間取出或置入，因此，為了配合生產線的機台，習知晶圓盒的固定肋(slit)間距大約為10mm左右，使得25片裝的晶圓盒具有一定體積，另一方面，機械手臂來回在「運送晶圓盒」與「晶圓傳輸系統」之間一次僅抓取一片晶圓，效率顯然不高，當大量的晶圓需跨廠區運送時，其所佔用的倉儲體積、運送時間與運送成本相當可觀。
有鑑於此，本發明目的之一在於提供一種晶圓存取總成及其晶圓存取裝置與晶圓載具，其存取晶圓的效率較高，且可大幅縮減晶圓載具在運送晶圓時的所佔體積。
為達上述目的，本發明揭露一種晶圓存取裝置，其包含有一底座、一軸桿、複數連動板、複數手臂、以及一伸縮組件，該底座具有一長槽，該軸桿可滑動地伸入於該長槽中，該些連動板套設於該軸桿，每一連動板具有一板體、 以及一穿孔穿設於該板體供該軸桿穿過，每一該手臂由該連動板之板體的一端延伸而出，該伸縮組件包含複數連接側壁設於該些連動板並使相鄰之連動板連接在一起，該伸縮組件可進行伸縮以改變相鄰連動板之間的距離。
為達上述目的，本發明另揭露一種晶圓載具，用以供一上述之晶圓存取裝置將晶圓取出或置入，該晶圓載具包含有複數插槽。
為達上述目的，本發明另揭露一種晶圓存取總成，包含有一上述之晶圓存取裝置、以及一上述之晶圓載具，該晶圓存取裝置將晶圓取出或置入該晶圓載具。
如此一來，該晶圓載具放置晶圓的所佔體積相較於習知結構可大幅縮減一半，尤其當大量的晶圓需跨廠區運送時，其所佔用的倉儲體積也僅為習知的一半；另一方面，由於該晶圓存取裝置具有複數手臂，因此可同時真空吸附複數晶圓進行運送，相較於習知結構的機械手臂一次只能吸取一片晶圓，該晶圓存取裝置更能省下不少晶圓的真空吸附與運送時間，達到更高的晶圓存取效率。
10:晶圓存取裝置
30:底座
32:長槽
321:第一端
323:第二端
40:軸桿
50:連動板
52:板體
54:穿孔
60:手臂
70:伸縮組件
71:連接側壁
72:帶動塊
721:襯套
73:彈力件
74:螺柱
75:滾珠
80:晶圓存取總成
90:晶圓載具
97:插槽
100:晶圓載具
W:晶圓
圖1為本發明一較佳實施例之晶圓存取裝置的立體圖；
圖2為本發明一較佳實施例之晶圓存取裝置的剖視圖；
圖3為本發明一較佳實施例之晶圓存取裝置的局部立體圖；
圖4為本發明一較佳實施例之晶圓存取總成的立體圖；
圖5為習知晶圓載具與本發明一較佳實施例之晶圓存取裝置的立體圖；
圖6至圖11為本發明一較佳實施例之晶圓存取裝置的作動圖。
請參考圖1、2，係本發明一較佳實施例所提供之晶圓存取裝置10，其具有一底座30、一軸桿40、複數連動板50、複數手臂60、以及一伸縮組件70。
該底座30具有一長槽32，該長槽32具有一第一端321以及一第二端323，該底座30具有可平移及旋轉之功能，該軸桿40可滑動地伸入於該長槽32中。
該些連動板50套設於該軸桿40，每一連動板50具有一板體52、以及一穿孔54穿設於該板體52，各該穿孔54供該軸桿40穿過而使各該連動板50皆套設於該軸桿40。於本實施例中，該些連動板50的數量為25個，於其他可能的實施例中，該些連動板50的數量可視需求改變。
每一手臂60係由其中一連動板50之板體52的一端延伸而出，故可理解的是，該些手臂60的數量應與該些連動板50的數量相同，於本實施例中，該些手臂60的數量亦為25個。每一手臂60可用來真空吸附一片晶圓W。
該伸縮組件70包含複數連接側壁71設於該些連動板50並使相鄰之連動板50連接在一起、一帶動塊72可上下移動地設於該軸桿40、一彈力件73設於該軸桿40內且貼抵該帶動塊72、以及一螺柱74容設於該軸桿40內，該些連接側壁71可進行伸縮以改變相鄰連動板50之間的距離，當該些連接側壁71處於一伸展狀態時，該相鄰二連動板50之間的距離為最大，當該些連接側壁71處於一壓縮狀態時，該相鄰二連動板50之間的距離為最小。於本實施例中，如圖3所示，該連接側壁71包含有一第一側壁711、一第二側壁712與該第一側壁711樞接在一起，該第一側壁711、該第二側壁712係樞設於同一連動板50之板體52，且每一板體52之第二側壁712同時樞接於相鄰板體52上之第一側壁711，當該些第一側壁 711與該些第二側壁712由伸展狀態調整為壓縮狀態時，該些相鄰二連動板50之相鄰板體52也隨之互相縮短距離。
該帶動塊72和位於最頂層之連動板50連接且可帶動該連動板50朝上位移或朝下位移，該帶動塊72包含有一襯套721伸入該軸桿40內且位於該軸桿40與該螺柱74之間，當該螺柱74旋轉可驅使該帶動塊72朝上或下移動，此外，該伸縮組件70更包含有有複數滾珠75設於該襯套721與該螺柱74之間，也就是該襯套721的內緣與該螺柱74的外緣皆凹設有內紋供該些滾珠75容設並滾動。透過該些連接側壁71的伸縮，當該相鄰二板體52之間的距離變大時，可有助於承載物件(如晶圓)之取放方便，當該相鄰二板體52之間的距離變小時，該晶圓存取裝置10整體的體積可有效縮減，進而節省作業空間。該伸縮組件70的結構可任意變化，只要可藉由伸縮來改變各該板體52之間的距離即可。
該帶動塊72可令該些連接側壁71進行伸縮，於本實施例中，該螺柱74可受到驅動而旋轉，且該螺柱74可為一滾珠螺桿，當該螺柱74旋轉時可帶動該襯套721上下移動進而使該帶動塊72跟著上下移動，由於該帶動塊72和位於最頂層之連動板50連接，因此當螺柱74旋轉(順時針或逆時針之一)使得該帶動塊72向上移動時，該帶動塊72可拉動該最頂層之連動板50，進而帶動該些連接側壁71伸展，使得各該連動板50之間的距離變大，相反地，當該螺柱74旋轉(順時針或逆時針之另一)使得該帶動塊72向下移動時，該帶動塊72可壓抵該最頂層之連動板50，進而促使該些連接側壁71閉合，使得各該連動板50之間的距離變小；由於該帶動塊72係受到該螺柱74旋轉而被帶動，故在此情況下，具有彈力之彈力件73無須提供該帶動塊72向上或向下的彈性回復力，故該彈力件73可省略不設。需特 別說明的是，該螺柱74為一滾珠螺桿的結構和原理與習知技術無特殊差異，故在此不再贅述。
於其他可能的實施例中，該帶動塊72可自備或受到其他外部動力而向上移動，在此情況下，該彈力件73可為一拉伸彈簧，當所述外部動力減弱或消失時，便可提供該帶動塊72一朝下位移之回復力，換言之，該帶動塊72係受到所述自備或其他外部動力而向上移動，進而使得各該連動板50之間的距離變大，且可受到該拉伸彈簧的彈性回復力而使該帶動塊72朝下位移，進而使得各該連動板50之間的距離變小；或者，該帶動塊72可自備或受到其他外部動力而向下移動，在此情況下，該彈力件73可為一壓縮彈簧，當所述外部動力減弱或消失時，便可提供該帶動塊72一朝上位移之回復力，換言之，該帶動塊72係受到所述自備或其他外部動力而向下移動，進而使得各該連動板50之間的距離變小，且可受到該壓縮彈簧的彈性回復力而使該帶動塊72朝上位移，進而使得各該連動板50之間的距離變大；由於該帶動塊72並非受到所述滾珠螺桿的驅動而移動，因此於此實施例中該螺柱74、該些滾珠75可省略不設。
另一方面，於其他可能的實施例中，該帶動塊72可自備或受到其他外部動力而兼具向上、向下移動功能，也就是說，該帶動塊72係受到所述自備或其他外部動力而向上移動，進而使得各該連動板50之間的距離變大，且係受到所述自備或其他外部動力而向下移動，進而使得各該連動板50之間的距離變小；由於該帶動塊72本身兼具向上、向下移動功能，因此於此實施例中該彈力件73可省略不設，且該帶動塊72並非受到所述滾珠螺桿的驅動而移動，因此該螺柱74與該些滾珠75亦可省略不設。
請參考圖4，係本發明一較佳實施例所提供之晶圓存取總成80，其具有一如上所述之晶圓存取裝置10、以及一晶圓載具90，該晶圓載具90用以供該晶圓存取裝置10將晶圓W取出或置入，該晶圓載具90之結構與習知結構大致相同，該晶圓載具90具有複數插槽97，每一插槽97係供一片晶圓W置入存放，於本實施例中，該晶圓載具90與習知結構最大的差異在於相鄰兩插槽97之間的距離為5mm，於其他可能的實施例中，相鄰兩插槽97之間的距離可介在3mm以上且小於10mm的範圍內。
請參考圖5，圖式左方的晶圓載具100為習知的晶圓載具，可以是晶圓盒或產線機台等，因此詳細結構不再贅述，習知的晶圓載具100共可裝載25片晶圓，且每片晶圓之間的間距為10mm，為了方便說明及圖式精簡化，圖式中的晶圓數量係以3片作為示範。以下將進一步說明該晶圓存取裝置10將晶圓W由習知的晶圓載具100取出並置入於該晶圓載具90的流程。
請搭配前述圖式並參考圖6~11，首先，該晶圓存取裝置10係位於習知的晶圓載具100與該晶圓載具90之間，且該底座30之長槽32的第一端321較靠近習知的晶圓載具100、該第二端323較靠近該晶圓載具90；各該連動板50之間的距離為5mm，接著，該帶動塊72可開始向上移動而拉動該最頂層之連動板50，帶動該些連接側壁71伸展，使得各該連動板50之間的距離變大至10mm，符合習知晶圓載具100的結構規格，此時，該軸桿40開始沿該長槽32朝該第一端321平移滑動，該軸桿40在平移滑動的同時則驅使該些連動板50連同該些手臂60一起朝該晶圓載具100的方向移動，各該手臂60伸入於該晶圓載具100中，並各自真空吸附一片晶圓W之後，接著，該軸桿40沿該長槽32朝該第二端323平移滑動，此時該些手臂60與吸附的晶圓W也退離該晶圓載具100，接著，該底座30原地旋轉， 使該些手臂60所吸附的晶圓W係朝向該晶圓載具90的方向平移，該帶動塊72可開始向下移動壓抵該最頂層之連動板50，帶動該些連接側壁71閉合，使得各該連動板50之間的距離縮小至5mm，亦即各晶圓W之間的距離為5mm，使該些手臂60可伸入於該晶圓載具90中，並將真空吸附的晶圓W置入於所對應的該些插槽97中，該底座30便可朝遠離該晶圓載具90的方向平移，而驅使該些手臂60退離該晶圓載具90，如此便完成了該晶圓存取裝置10將晶圓W由習知的晶圓載具100取出並置入於該晶圓載具90的流程。
由於該晶圓載具90相鄰兩插槽97之間的距離為5mm，因此放置在該晶圓載具90中的每一晶圓W之間的距離僅為5mm，故相較於習知結構，該晶圓載具90放置25片晶圓的所佔體積可大幅縮減50%，尤其當大量的晶圓需跨廠區運送時，其所佔用的倉儲體積也僅為習知的一半；該晶圓存取裝置10可令各晶圓W之間的距離快速地由10mm縮小至5mm，過程簡易不繁瑣，而輕鬆達到上述減少所佔體積之功效；另一方面，由於該晶圓存取裝置10具有複數手臂60，更詳細地說，該晶圓存取裝置10可具有25個手臂60，因此可以在同一時間真空吸附25片晶圓進行運送，相較於習知結構的機械手臂一次只能吸取一片晶圓，該晶圓存取裝置10更能省下不少晶圓的真空吸附與運送時間，達到更高的晶圓存取效率，甚至，該晶圓存取裝置10也可用來存取半導體晶圓以外的其他物件或是運用在其他領域，例如該晶圓存取裝置10也可同時存取複數擴片環、光罩等，或是面板產業的玻璃基板等，而不侷限在半導體之晶圓。舉凡其他可輕易思及的結構變化，均應為本發明申請專利範圍所涵蓋。
10:晶圓存取裝置
30:底座
32:長槽
321:第一端
323:第二端
40:軸桿
50:連動板
60:手臂
70:伸縮組件
71:連接側壁
711:第一側壁
712:第二側壁
72:帶動塊

Claims (12)

  1. 一種晶圓存取裝置，包含有：
    一底座，具有一長槽；
    一軸桿，可滑動地伸入於該長槽中；
    複數連動板，套設於該軸桿，每一連動板具有一板體、以及一穿孔，該穿孔設於該板體供該軸桿穿過；
    複數手臂，每一手臂由該連動板之板體的一端延伸而出；以及
    一伸縮組件，包含複數連接側壁設於該些連動板並使相鄰之連動板連接在一起，且該些連接側壁可進行伸縮以改變相鄰連動板之間的距離。
  2. 如請求項1所述之晶圓存取裝置，其中該伸縮組件更包含一帶動塊可上下移動地設於該軸桿，該帶動塊和位於最頂層之連動板連接且可帶動該連動板朝上位移或朝下位移。
  3. 如請求項2所述之晶圓存取裝置，其中該伸縮組件更包含有一彈力件設於該軸桿內且貼抵該帶動塊。
  4. 如請求項3所述之晶圓存取裝置，其中該彈力件為一壓縮彈簧，提供該帶動塊一朝上位移之回復力。
  5. 如請求項3所述之晶圓存取裝置，其中該彈力件為一拉伸彈簧，提供該帶動塊一朝下位移之回復力。
  6. 如請求項2所述之晶圓存取裝置，其中該伸縮組件更包含有一螺柱容設於該軸桿內，該帶動塊包含有一襯套伸入該軸桿內且位於該軸桿與該螺柱之間，當該螺柱旋轉可驅使該帶動塊上下移動。
  7. 如請求項6所述之晶圓存取裝置，其中該伸縮組件更包含有一彈力件設於該軸桿內且抵頂於該帶動塊。
  8. 如請求項6所述之晶圓存取裝置，其中該伸縮組件更包含有複數滾珠設於該襯套與該螺柱之間。
  9. 一種晶圓載具，用以供一如請求項1至8中任一項所述之晶圓存取裝置將晶圓取出或置入，該晶圓載具包含有複數插槽。
  10. 如請求項9所述的晶圓載具，其中相鄰兩插槽之間的距離為3mm以上且小於10mm。
  11. 如請求項10所述的晶圓載具，其中相鄰兩插槽之間的距離為為5mm。
  12. 一種晶圓存取總成，用以運送晶圓，該晶圓存取總成包含有：
    一如請求項1至8中任一項所述之晶圓存取裝置；以及
    一如請求項9至11任一項所述之晶圓載具；
    其中，該晶圓存取裝置將晶圓取出或置入該晶圓載具。
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