JP7479072B2 - ウェハ出入アセンブリ及びそれに用いられるウェハ出入装置とウェハキャリア - Google Patents
ウェハ出入アセンブリ及びそれに用いられるウェハ出入装置とウェハキャリア Download PDFInfo
- Publication number
- JP7479072B2 JP7479072B2 JP2022166720A JP2022166720A JP7479072B2 JP 7479072 B2 JP7479072 B2 JP 7479072B2 JP 2022166720 A JP2022166720 A JP 2022166720A JP 2022166720 A JP2022166720 A JP 2022166720A JP 7479072 B2 JP7479072 B2 JP 7479072B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- block
- interlocking
- shaft rod
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 235000012431 wafers Nutrition 0.000 claims description 147
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
30 :台座
32 :長手溝
321:第一端部
323:第二端部
40 :軸棒
50 :連動板
52 :板体
54 :穿孔
60 :アーム
70 :伸縮ユニット
71 :連結側壁
72 :連行ブロック
721:スリーブ
73 :弾性部材
74 :ねじ切りボルト
75 :ボール
80 :ウェハ出入アセンブリ
90 :ウェハキャリア97:スロット
100:ウェハキャリア
W :ウェハ
Claims (11)
- 長手溝を有する台座と、
摺動可能に前記長手溝内に挿入されている軸棒と、
前記軸棒に被嵌された複数の連動板であって、各々が、板体と、前記板体に設けられて前記軸棒が挿通されている穿孔とを有する複数の連動板と、
各々が各前記連動板の前記板体の端部から延出している複数のアームと、
複数の連結側壁を含む伸縮ユニットであって、各前記連結側壁は、各前記連動板にそれぞれ設けられて隣接する前記連動板を互いに連結させ、且つ、各前記連結側壁は、伸縮することによって隣接する前記連動板の間の距離を変更可能である伸縮ユニットと、を備えるウェハ出入装置。 - 前記伸縮ユニットは、
上下移動可能に前記軸棒に設けられ、最上部の前記連動板を連行して上下移動させることができるように最上部の前記連動板に連結されている連行ブロックを更に含んでいる、請求項1に記載のウェハ出入装置。 - 前記伸縮ユニットは、
前記軸棒内に設けられて前記連行ブロックに当接している弾性部材を更に含んでいる、請求項2に記載のウェハ出入装置。 - 前記弾性部材は、前記連行ブロックを上方へ移動させるための回復力を前記連行ブロックに与える圧縮ばねである、請求項3に記載のウェハ出入装置。
- 前記弾性部材は、前記連行ブロックを下方へ移動させるための回復力を前記連行ブロックに与える引っ張りばねである、請求項3に記載のウェハ出入装置。
- 前記伸縮ユニットは、前記軸棒内に収容されたねじ切りボルトを更に含み、
前記連行ブロックは、前記軸棒と前記ねじ切りボルトとの間に位置するように前記軸棒内に挿設されたスリーブを含み、
前記ねじ切りボルトが回転すると前記連行ブロックは上下移動させられる、請求項2に記載のウェハ出入装置。 - 前記伸縮ユニットは、前記軸棒内に設けられて前記連行ブロックに当接している弾性部材を更に含んでいる、請求項6に記載のウェハ出入装置。
- 前記伸縮ユニットは、前記スリーブと前記ねじ切りボルトとの間に設けられた複数のボールを更に含んでいる、請求項6に記載のウェハ出入装置。
- ウェハを搬送するためのウェハ出入アセンブリであって、
請求項1から8のいずれか一項に記載のウェハ出入装置と、
前記ウェハ出入装置によってウェハが取り出されたり載置されたりするウェハキャリアと、を備え、
前記ウェハキャリアは複数のスロットを有している、ウェハ出入アセンブリ。 - 隣接する二つの前記スロットの間の距離は3mm~10mmの範囲にある、請求項9に記載のウェハ出入アセンブリ。
- 隣接する二つの前記スロットの間の距離は5mmである、請求項10に記載のウェハ出入アセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111240012.8 | 2021-10-25 | ||
CN202111240012.8A CN116031184A (zh) | 2021-10-25 | 2021-10-25 | 晶圆存取总成及其晶圆存取装置与晶圆载具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023064071A JP2023064071A (ja) | 2023-05-10 |
JP7479072B2 true JP7479072B2 (ja) | 2024-05-08 |
Family
ID=86056814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022166720A Active JP7479072B2 (ja) | 2021-10-25 | 2022-10-18 | ウェハ出入アセンブリ及びそれに用いられるウェハ出入装置とウェハキャリア |
Country Status (5)
Country | Link |
---|---|
US (1) | US11817342B2 (ja) |
JP (1) | JP7479072B2 (ja) |
KR (1) | KR20230059168A (ja) |
CN (1) | CN116031184A (ja) |
TW (1) | TWI826056B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022051281A (ja) * | 2020-09-18 | 2022-03-31 | 日本電産サンキョー株式会社 | 産業用ロボット |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000174099A (ja) | 1998-12-01 | 2000-06-23 | Koyo Thermo System Kk | 薄板状部材移載装置 |
JP2001210696A (ja) | 2000-01-28 | 2001-08-03 | Ohkura Electric Co Ltd | ウェーハ移載機のピッチ変換機構 |
WO2013021645A1 (ja) | 2011-08-10 | 2013-02-14 | 川崎重工業株式会社 | エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット |
JP2020061400A (ja) | 2018-10-05 | 2020-04-16 | 川崎重工業株式会社 | 基板保持装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH085555Y2 (ja) * | 1987-08-26 | 1996-02-14 | 国際電気株式会社 | ウェ−ハ移載機 |
JP2889657B2 (ja) * | 1990-05-28 | 1999-05-10 | 東京エレクトロン株式会社 | 板状体搬送装置 |
KR0155172B1 (ko) * | 1990-10-31 | 1998-12-01 | 이노우에 다케시 | 판형상체 반송장치 |
KR100280947B1 (ko) * | 1993-10-04 | 2001-02-01 | 마쓰바 구니유키 | 판 형상체 반송장치 |
JPH088326A (ja) * | 1994-06-21 | 1996-01-12 | M C Electron Kk | ピッチ変換装置および基板搬送装置 |
US6293749B1 (en) | 1997-11-21 | 2001-09-25 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
JP4022461B2 (ja) | 2002-10-11 | 2007-12-19 | 株式会社ジェーイーエル | 搬送アーム |
EP1902465A2 (en) | 2005-07-08 | 2008-03-26 | Asyst Technologies, Inc. | Workpiece support structures and apparatus for accessing same |
JP2008135630A (ja) | 2006-11-29 | 2008-06-12 | Jel:Kk | 基板搬送装置 |
US8950998B2 (en) | 2007-02-27 | 2015-02-10 | Brooks Automation, Inc. | Batch substrate handling |
US8277165B2 (en) | 2007-09-22 | 2012-10-02 | Dynamic Micro System Semiconductor Equipment GmbH | Transfer mechanism with multiple wafer handling capability |
JP5231274B2 (ja) * | 2009-02-06 | 2013-07-10 | 日本電産サンキョー株式会社 | 産業用ロボット |
JP5504641B2 (ja) | 2009-02-13 | 2014-05-28 | 株式会社安川電機 | 基板搬送用ロボット及びそれを備えた基板搬送装置、半導体製造装置 |
US8641350B2 (en) | 2011-02-18 | 2014-02-04 | Asm International N.V. | Wafer boat assembly, loading apparatus comprising such a wafer boat assembly and method for loading a vertical furnace |
US9371196B2 (en) * | 2012-04-27 | 2016-06-21 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Transportation method and transportation device of liquid crystal panel |
KR102190010B1 (ko) | 2013-09-27 | 2020-12-11 | 마쓰모토유시세이야쿠 가부시키가이샤 | 강화섬유용 사이징제 및 그 용도 |
WO2016152721A1 (ja) * | 2015-03-25 | 2016-09-29 | 株式会社日立国際電気 | 基板処理装置および半導体装置の製造方法 |
TWI682484B (zh) | 2017-04-20 | 2020-01-11 | 家登精密工業股份有限公司 | 卡匣結構轉載容器 |
JP7037379B2 (ja) * | 2018-02-06 | 2022-03-16 | ローツェ株式会社 | 薄板状基板保持装置、及び保持装置を備える搬送ロボット |
CN112292488B (zh) | 2018-06-29 | 2023-12-29 | 三菱化学株式会社 | 上浆剂、增强纤维束、纤维增强树脂成型材料及纤维增强复合材料 |
TWI746014B (zh) * | 2020-06-16 | 2021-11-11 | 大立鈺科技有限公司 | 晶圓存取總成及其晶圓存取裝置與晶圓載具 |
JP2022051281A (ja) * | 2020-09-18 | 2022-03-31 | 日本電産サンキョー株式会社 | 産業用ロボット |
-
2021
- 2021-10-25 CN CN202111240012.8A patent/CN116031184A/zh active Pending
-
2022
- 2022-10-18 JP JP2022166720A patent/JP7479072B2/ja active Active
- 2022-10-19 TW TW111139651A patent/TWI826056B/zh active
- 2022-10-25 US US17/972,946 patent/US11817342B2/en active Active
- 2022-10-25 KR KR1020220138402A patent/KR20230059168A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000174099A (ja) | 1998-12-01 | 2000-06-23 | Koyo Thermo System Kk | 薄板状部材移載装置 |
JP2001210696A (ja) | 2000-01-28 | 2001-08-03 | Ohkura Electric Co Ltd | ウェーハ移載機のピッチ変換機構 |
WO2013021645A1 (ja) | 2011-08-10 | 2013-02-14 | 川崎重工業株式会社 | エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット |
JP2020061400A (ja) | 2018-10-05 | 2020-04-16 | 川崎重工業株式会社 | 基板保持装置 |
Also Published As
Publication number | Publication date |
---|---|
US20230128509A1 (en) | 2023-04-27 |
US11817342B2 (en) | 2023-11-14 |
TWI826056B (zh) | 2023-12-11 |
JP2023064071A (ja) | 2023-05-10 |
CN116031184A (zh) | 2023-04-28 |
KR20230059168A (ko) | 2023-05-03 |
TW202318557A (zh) | 2023-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102385670B1 (ko) | 기판 반송 방법 및 기판 처리 장치 | |
JP7479072B2 (ja) | ウェハ出入アセンブリ及びそれに用いられるウェハ出入装置とウェハキャリア | |
US5049029A (en) | Handling apparatus for transferring a semiconductor wafer or LCD | |
KR0162102B1 (ko) | 반도체 제조장치 | |
TWI408766B (zh) | Vacuum processing device | |
WO2011040301A1 (ja) | 被処理体の搬送方法及び被処理体処理装置 | |
TWI427729B (zh) | The method of exchanging the substrate and a substrate processing apparatus | |
JP5336885B2 (ja) | 基板搬送装置及び基板搬送方法 | |
JP2007005582A (ja) | 基板搬送装置及びそれを搭載した半導体基板製造装置 | |
CN102034726A (zh) | 处理模块、基片处理装置以及基片运送方法 | |
JP5518550B2 (ja) | 被処理体処理装置 | |
JP2007335556A (ja) | 搬送システム | |
US10229847B2 (en) | Substrate transfer chamber and container connecting mechanism with lid opening mechanisms | |
JP2015076433A (ja) | 基板搬送方法 | |
US9199805B2 (en) | Processing system and processing method | |
TW201140732A (en) | Method for transferring target object and apparatus for processing target object | |
KR100281454B1 (ko) | 로드로크용 로드암 | |
TWI744916B (zh) | 矽片輸運裝置 | |
KR100566697B1 (ko) | 반도체 소자 제조용 멀티 챔버 시스템 및 이를 이용한반도체 소자의 제조방법 | |
JP2011129610A (ja) | 搬送装置及びこの搬送装置を備えた被処理体処理装置 | |
KR102438612B1 (ko) | 웨이퍼 이송 장치 | |
JP2003309159A (ja) | 基板搬送処理装置 | |
JP2005333076A (ja) | ロードロック装置、処理システム及びその使用方法 | |
JP2006205270A (ja) | 保持装置 | |
KR100309698B1 (ko) | 스탠더드 메커니컬 인터페이스 시스템의 그리퍼 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221018 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221019 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20231116 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20231212 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240229 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240402 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240416 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7479072 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |