TWI824189B - 聚醯亞胺薄膜的製造方法 - Google Patents
聚醯亞胺薄膜的製造方法 Download PDFInfo
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- TWI824189B TWI824189B TW109137023A TW109137023A TWI824189B TW I824189 B TWI824189 B TW I824189B TW 109137023 A TW109137023 A TW 109137023A TW 109137023 A TW109137023 A TW 109137023A TW I824189 B TWI824189 B TW I824189B
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- Prior art keywords
- polyimide
- resin
- film
- high temperature
- temperature resistant
- Prior art date
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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Abstract
一種聚醯亞胺薄膜的製造方法包含:提供聚醯亞胺塗佈液;提供耐高溫聚酯基材;將聚醯亞胺塗佈液塗佈於耐高溫聚酯基材上,以於耐高溫聚酯基材上形成聚醯亞胺濕膜;實施第一烘烤步驟,其包含:對聚醯亞胺濕膜以介於60
oC至130
oC的溫度進行烘烤,以去除聚醯亞胺濕膜中部分的有機溶劑;實施第二烘烤步驟,其包含:對聚醯亞胺濕膜以介於140
oC至220
oC的溫度進行烘烤,以去除聚醯亞胺濕膜中殘餘的有機溶劑,從而於耐高溫聚酯基材上形成聚醯亞胺薄膜;以及將聚醯亞胺薄膜與耐高溫聚酯基材彼此分離。
Description
本發明涉及一種高分子膜的製造方法,特別是涉及一種聚醯亞胺薄膜的製造方法。
在顯示器的技術領域中,可撓式顯示器及可折疊式顯示器的技術發展越來越受到重視。一般傳統顯示器(如:一般的液晶顯示器)的覆蓋窗膜(cover window film)通常為玻璃膜(glass film)。然而,由於玻璃膜不具有可撓性,因此玻璃膜不適合用於做為可撓式顯示器或折疊式顯示器的覆蓋窗膜。
相對於玻璃膜,聚醯亞胺薄膜(polyimide film)具有高的透明度、低的霧度、及較佳的可撓性。聚醯亞胺薄膜被視為可撓式顯示器及可折疊式顯示器的關鍵材料之一。聚醯亞胺薄膜做為取代玻璃膜的材料,其需具備高硬度的特性。為了使得聚醯亞胺薄膜具備高硬度的特性,現有技術的加工方法主要是於聚醯亞胺薄膜的表面塗佈丙烯酸樹脂或環氧樹脂等硬度較高的塗層,以提升薄膜整體的硬度。然而,由於聚醯亞胺薄膜本身的硬度較低,因此硬塗層容易使薄膜表面產生捲曲的情況。再者,由於硬塗層的可撓性較差,因此硬塗層在被彎曲時容易產生裂痕。
於是,本發明人有感上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。
本發明所要解決的技術問題在於,針對現有技術的不足提供一種聚醯亞胺薄膜的製造方法。
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種聚醯亞胺薄膜的製造方法,其包括:提供一聚醯亞胺塗佈液,其包含:有機溶劑、及分散於所述有機溶劑中的聚醯亞胺樹脂及無機奈米粒子;提供一耐高溫聚酯基材,其包含:聚酯樹脂、及分散於所述聚酯樹脂中的耐高溫樹脂;將所述聚醯亞胺塗佈液塗佈於所述耐高溫聚酯基材上,以於所述耐高溫聚酯基材上形成一聚醯亞胺濕膜;實施一第一烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於60℃至130℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中部分的所述有機溶劑;實施一第二烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於140℃至220℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中殘餘的所述有機溶劑,從而於所述耐高溫聚酯基材上形成一聚醯亞胺薄膜;以及將所述聚醯亞胺薄膜與所述耐高溫聚酯基材彼此分離。
優選地,在所述聚醯亞胺塗佈液中,所述有機溶劑是選自由γ-丁內酯(GBL)、四氫呋喃(THF)、N,N-二甲基乙醯胺(DMAc)、六甲基磷醯胺(HMPA)、N-甲基-2-吡咯烷酮(NMP)、及1,3-二甲基咪唑啉酮(DMI)所組成的材料群組的至少其中之一。
優選地,所述聚醯亞胺樹脂是由芳香族二胺化合物單體與脂環族二酸酐化合物單體進行聚縮合反應而形成。
優選地,所述無機奈米粒子為金屬氧化物、矽氧化物、及硫酸鋇的至少其中之一,並且所述無機奈米粒子具有介於20奈米至120奈米之間的一粒徑範圍。
優選地,所述金屬氧化物為氧化鈣(CaO)、氧化鋅(ZnO)、
二氧化鈦(TiO2)、二氧化鋯(ZrO2)、二氧化錫(SnO2)、氧化鋁(Al2O3)、及氧化銦(In2O3)的至少其中之一。所述矽氧化物為二氧化矽(SiO2)。
優選地,基於所述聚醯亞胺塗佈液的總重為100wt.%,所述聚醯亞胺樹脂及所述無機奈米粒子的重量百分濃度的總和是介於10wt.%至30wt.%之間,並且所述有機溶劑的重量百分濃度的總和是介於70wt.%至90wt.%之間。
優選地,在所述聚醯亞胺塗佈液中,所述聚醯亞胺樹脂比上所述無機奈米粒子的重量比例範圍是介於95:5至50:50之間。
優選地,在所述耐高溫聚酯基材中,所述耐高溫樹脂是以介於50奈米至200奈米之間的粒徑尺寸分散,並且所述耐高溫樹脂於所述耐高溫聚酯基材中的含量範圍是介於10wt.%至50wt.%之間。
優選地,所述耐高溫樹脂具有介於180℃至400℃之間的一玻璃轉移溫度、一溶點、或一熱變形溫度;其中,所述耐高溫樹脂為聚醚醯亞胺(PEI)、聚碸(PSU)、液晶聚合物(LCP)、聚醚醚酮(PEEK)、及聚醯胺醯亞胺(PAI)的至少其中之一。
本發明的有益效果在於,本發明所提供的聚醯亞胺薄膜的製造方法,其能通過“聚醯亞胺塗佈液的材料選擇”、“耐高溫聚酯基材的材料選擇”、及“將所述聚醯亞胺塗佈液塗佈於所述耐高溫聚酯基材上,以於所述耐高溫聚酯基材上形成一聚醯亞胺濕膜;實施一第一烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於60℃至130℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中部分的所述有機溶劑;實施一第二烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於140℃至220℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中殘餘的所述有機溶劑,從而於所述耐高溫聚酯基材上形成一聚醯亞胺薄膜;以及將所述聚醯亞胺薄膜與所述耐高溫聚酯基材彼此分離”的技術方案,以使得所述
聚醯亞胺薄膜在上述兩個烘烤步驟中、皆可以不需要與耐高溫聚酯基材分離。藉此,所述聚醯亞胺薄膜的製程良率可以被有效地提升,並且所述聚醯亞胺薄膜的製造成本可以被有效地降低。
更進一步來說,由於所述聚醯亞胺塗佈液中分散有無機奈米粒子,因此最終形成的聚醯亞胺薄膜的機械性質(如:鉛筆硬度及拉升強度)可以被提升,並且所述聚醯亞胺薄膜的光學特性(如:透明度及霧度)能維持在期望的效果。
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。
圖1為本發明實施例聚醯亞胺薄膜的製造方法的流程示意圖。
以下是通過特定的具體實施例來說明本發明所公開的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語
的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。
[聚醯亞胺薄膜的製造方法]
請參閱圖1所示,本發明實施例公開一種聚醯亞胺薄膜的製造方法。所述聚醯亞胺薄膜的製造方法包含步驟S110、步驟S120、步驟S130、步驟S140、步驟S150、及步驟S160。必須說明的是,本實施例所載之各步驟的順序與實際的操作方式可視需求而調整,並不限於本實施例所載。
所述步驟S110包含:提供一聚醯亞胺塗佈液。所述聚醯亞胺塗佈液包含:有機溶劑、聚醯亞胺樹脂、及無機奈米粒子,並且所述聚醯亞胺樹脂及無機奈米粒子是分散於所述有機溶劑中。
在本發明的一實施例中,所述有機溶劑是選自由γ-丁內酯(gamma-butyrolactone,GBL)、四氫呋喃(tetrahydrofuran,THF)、N,N-二甲基乙醯胺(N,N-dimethylacetamide,DMAc)、六甲基磷醯胺(hexamethylphosphoramide,HMPA)、N-甲基-2-吡咯烷酮(N-methyl-2-pyrrolidone,NMP)、及1,3-二甲基咪唑啉酮(1,3-dimethyl imidazolinone,DMI)所組成的材料群組的至少其中之一。藉此,所述聚醯亞胺樹脂及無機奈米粒子能均勻地分散於所述有機溶劑中。
在本發明的一實施例中,所述聚醯亞胺樹脂是由芳香族二胺化合物單體(aromatic diamine monomers)與脂環族二酸酐化合物單體(alicyclic dianhydride monomers)進行聚縮合反應而形成。由於所述芳香族二胺化合物單體的分子結構中具有多個苯環,因此所述聚醯亞胺樹脂能使得最終形成的聚醯亞胺薄膜具有較佳的硬度及剛性、但不會犧牲可撓性。
在本發明的一實施例中,所述無機奈米粒子為金屬氧化物、矽
氧化物、及硫酸鋇的至少其中之一。再者,所述無機奈米粒子的一粒徑範圍優選是介於20奈米至120奈米之間的,但本發明不受限於此。所述無機奈米粒子的添加能輔助最終形成的聚醯亞胺薄膜的硬度被有效地提升。
進一步地說,所述金屬氧化物為氧化鈣(calcium oxide,CaO)、氧化鋅(zinc oxide,ZnO)、二氧化鈦(titanium dioxide,TiO2)、二氧化鋯(zirconium dioxide,ZrO2)、二氧化錫(stannic oxide,SnO2)、氧化鋁(aluminium oxide,Al2O3)、及氧化銦(indium oxide,In2O3)的至少其中之一。再者,所述矽氧化物為二氧化矽(SiO2)。
為了讓所述聚醯亞胺塗佈液具有良好的塗佈效果及成膜效果,所述聚醯亞胺塗佈液中的成分具有一特定的重量比例範圍。
基於所述聚醯亞胺塗佈液的總重為100wt.%,所述聚醯亞胺樹脂及無機奈米粒子的重量百分濃度的總和是介於10wt.%至30wt.%之間,並且所述有機溶劑的重量百分濃度的總和是介於70wt.%至90wt.%之間。
也就是說,在所述聚醯亞胺塗佈液中,所述有機溶劑的含量是佔70wt.%至90wt.%之間,並且其餘固體成分的含量(如:聚醯亞胺樹脂及無機奈米粒子)是佔10wt.%至30wt.%之間。
進一步地說,在所述聚醯亞胺塗佈液中,所述聚醯亞胺樹脂比上無機奈米粒子的重量比例範圍優選是介於95:5至50:50之間、且特優選是介於95:5至70:30之間,但本發明不受限於此。
在本實施例中,所述聚醯亞胺塗佈液呈液態、且具有流動性質。本實施例的聚醯亞胺塗佈液根據上述含量範圍的配置、能具有介於4,000cps至10,000cps(優選介於5,000cps至9,000cps)之間的一黏度,以使得所述聚醯亞胺塗佈液能容易地通過塗佈的方式(如:狹縫式塗佈或刮刀塗佈)被塗佈於一基材上。
若所述聚醯亞胺塗佈液中的各成分的含量範圍超出上述所界定的範圍,所述聚醯亞胺塗佈液的黏度可能會變得過於稀釋或過於濃稠,從而不容易被塗佈於基材上。也就是說,所述聚醯亞胺塗佈液可能無法具有良好的塗佈效果及成膜效果。
所述步驟S120包含:提供一耐高溫聚酯基材。所述耐高溫聚酯基材包含:聚酯樹脂及分散於所述聚酯樹脂中的耐高溫樹脂。
在所述耐高溫聚酯基材中,所述耐高溫樹脂是以介於50奈米至200奈米之間的粒徑尺寸分散於所述聚酯樹脂中,並且所述耐高溫樹脂於耐高溫聚酯基材中的含量範圍優選是介於10wt.%至50wt.%之間、且特優選是介於15wt.%至50wt.%之間。
為了使所述耐高溫聚酯基材具有耐高溫及耐彎折的特性,所述耐高溫樹脂是選自由聚醚醯亞胺(polyetherimide,PEI)、聚碸(polysulfone,PSU)、液晶聚合物(liquid crystal polymer,LCP)、聚醚醚酮(polyetheretherketon,PEEK)、及聚醯胺醯亞胺(polyamide-imide,PAI)所組成的材料群組中的至少其中一種材料。
在上述耐高溫樹脂材料中,聚醚醯亞胺為非結晶性樹脂材料、且具有大致為215℃的玻璃轉移溫度。聚碸為非結晶性樹脂材料、且具有大致為185℃的玻璃轉移溫度、及大致為280℃的熔點。液晶聚合物為結晶性樹脂材料、且具有大致介於180℃至260℃之間的熱變形溫度。聚醚醚酮為半結晶性樹脂材料、且具有大致為340℃的玻璃轉移溫度。聚醯胺醯亞胺為非結晶性樹脂材料、且具有大致介於280℃至290℃之間的玻璃轉移溫度。
也就是說,上述耐高溫樹脂材料可以例如是一結晶性樹脂材料、一半結晶性樹脂材料、或一非結晶性樹脂材料,並且該些耐高溫樹脂材料可以例如是具有介於180℃至400℃之間的一玻璃轉移溫度、一溶點、或一
熱變形溫度。
進一步地說,所述聚酯樹脂是由二元酸與二元醇或其衍生物通過縮合聚合反應而獲得的高分子聚合物。優選地,所述聚酯樹脂為聚對苯二甲酸乙二酯(PET)或聚萘二甲酸乙二醇酯(PEN),但本發明不受限於此。
在本實施例中,所述耐高溫聚酯基材整體的厚度是介於15微米至350微米之間,但本發明不受限於此。
所述步驟S130包含:將所述聚醯亞胺塗佈液塗佈於耐高溫聚酯基材上,以於所述耐高溫聚酯基材上形成一聚醯亞胺濕膜。
其中,所述聚醯亞胺塗佈液可以例如是以刮刀塗佈的方式塗佈於耐高溫聚酯基材上,以形成所述聚醯亞胺濕膜。再者,所述聚醯亞胺濕膜的厚度可以例如是介於100微米至500微米之間,但本發明不受限於此。
值得一提的是,在所述步驟S130中,所述聚醯亞胺濕膜的成分包含:有機溶劑、聚醯亞胺樹脂、及無機奈米粒子。其中,所述有機溶劑將於後續的烘烤步驟中被移除,以使得所述聚醯亞胺濕膜形成為一聚醯亞胺薄膜。也就是說,所述聚醯亞胺薄膜的主要成分為聚醯亞胺樹脂分散於所述聚醯亞胺樹脂中的無機奈米粒子。
所述步驟S140包含:實施一第一烘烤步驟。所述第一烘烤步驟包含:對所述聚醯亞胺濕膜以介於60℃至130℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中部分的所述有機溶劑。在此步驟中,所述聚醯亞胺濕膜能大致成形於耐高溫聚酯基材上,但該薄膜中還有殘餘的有機溶劑需要被移除。
其中,所述第一烘烤步驟的一烘烤時間優選是介於10分鐘至45分鐘之間、且特優選是介於15分鐘至30分鐘之間,但本發明不受限於此。
所述步驟S150包含:實施一第二烘烤步驟。所述第二烘烤步驟包含:對所述聚醯亞胺濕膜以介於140℃至220℃的溫度進行烘烤,以去除所
述聚醯亞胺濕膜中殘餘的所述有機溶劑,從而於所述耐高溫聚酯基材上形成所述聚醯亞胺薄膜。
其中,所述第二烘烤步驟的一烘烤時間優選是介於10分鐘至45分鐘之間、且特優選是介於15分鐘至30分鐘之間,但本發明不受限於此。
所述步驟S160包含:將所述聚醯亞胺薄膜與耐高溫聚酯基材彼此分離,以完成所述聚醯亞胺薄膜的製備。其中,所述聚醯亞胺薄膜整體的厚度是介於15微米至70微米之間、且優選介於25微米至60微米之間,但本發明不受限於此。
值得一提的是,在本實施例中,所述聚醯亞胺薄膜在步驟S140中的第一烘烤步驟及步驟S150中的第二烘烤步驟中、皆是緊貼於所述耐高溫聚酯基材。也就是說,所述聚醯亞胺薄膜在上述兩個烘烤步驟中、皆未與耐高溫聚酯基材分離。
更具體地說,由於本實施例所選用的聚酯基材為耐高溫聚酯基材,其能忍受介於140℃至220℃的高溫,因此所述耐高溫聚酯基材在第二烘烤步驟中不會產生翹曲的現象。藉此,所述聚醯亞胺薄膜在上述兩個烘烤步驟中、皆可以不需要與耐高溫聚酯基材彼此分離,從而所述聚醯亞胺薄膜的製程良率可以被有效地提升,並且所述聚醯亞胺薄膜的製造成本可以被有效地降低。
另外,由於本實施例所選用的塗佈基材為聚酯基材,因此所述聚醯亞胺薄膜在製造的過程中可以被撓曲,例如:通過捲對捲加工(roll-to-roll process)。藉此,所述聚醯亞胺薄膜在製造上的加工性可以被有效地提升。
再者,由於本實施例的聚醯亞胺塗佈液中分散有無機奈米粒子,因此最終形成的聚醯亞胺薄膜的機械性質(如:鉛筆硬度及拉升強度)可以被提升,並且所述聚醯亞胺薄膜的光學特性(如:透明度及霧度)皆不
致於受到影響。所述聚醯亞胺薄膜在製造的過程中不會產生翹曲的現象。
[實施例的有益效果]
本發明的有益效果在於,本發明所提供的聚醯亞胺薄膜的製造方法,其能通過“聚醯亞胺塗佈液的材料選擇”、“耐高溫聚酯基材的材料選擇”、及“將所述聚醯亞胺塗佈液塗佈於所述耐高溫聚酯基材上,以於所述耐高溫聚酯基材上形成一聚醯亞胺濕膜;實施一第一烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於60℃至130℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中部分的所述有機溶劑;實施一第二烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於140℃至220℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中殘餘的所述有機溶劑,從而於所述耐高溫聚酯基材上形成一聚醯亞胺薄膜;以及將所述聚醯亞胺薄膜與所述耐高溫聚酯基材彼此分離”的技術方案,以使得所述聚醯亞胺薄膜在上述兩個烘烤步驟中、皆可以不需要與耐高溫聚酯基材分離。藉此,所述聚醯亞胺薄膜的製程良率可以被有效地提升,並且所述聚醯亞胺薄膜的製造成本可以被有效地降低。
更進一步來說,由於所述聚醯亞胺塗佈液中分散有無機奈米粒子,因此最終形成的聚醯亞胺薄膜的機械性質(如:鉛筆硬度及拉升強度)可以被提升,並且所述聚醯亞胺薄膜的光學特性(如:透明度及霧度)能維持在期望的效果。
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。
Claims (5)
- 一種聚醯亞胺薄膜的製造方法,其包括:提供一聚醯亞胺塗佈液,其包含:有機溶劑、及分散於所述有機溶劑中的聚醯亞胺樹脂及無機奈米粒子;其中,所述聚醯亞胺樹脂是由芳香族二胺化合物單體與脂環族二酸酐化合物單體進行聚縮合反應而形成;其中,基於所述聚醯亞胺塗佈液的總重為100wt.%,所述聚醯亞胺樹脂及所述無機奈米粒子的重量百分濃度的總和介於10wt.%至30wt.%之間,所述有機溶劑的重量百分濃度介於70wt.%至90wt.%之間;所述聚醯亞胺樹脂比上所述無機奈米粒子的重量比例範圍介於95:5至70:30之間;所述聚醯亞胺塗佈液具有介於5,000cps至9,000cps之間的一黏度;並且所述無機奈米粒子具有介於20奈米至120奈米的一粒徑範圍;提供一耐高溫聚酯基材,其包含:聚酯樹脂、及分散於所述聚酯樹脂中的耐高溫樹脂;其中,所述耐高溫樹脂具有180℃至400℃間的一玻璃轉移溫度、一溶點、或一熱變形溫度;所述耐高溫樹脂為聚醚醯亞胺、聚碸、液晶聚合物、聚醚醚酮、及聚醯胺醯亞胺的至少其中之一;將所述聚醯亞胺塗佈液塗佈於所述耐高溫聚酯基材上,以於所述耐高溫聚酯基材上形成有一聚醯亞胺濕膜;其中,所述聚醯亞胺濕膜的厚度介於100微米至500微米之間;實施一第一烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於60℃至130℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中部分的所述有機溶劑;實施一第二烘烤步驟,其包含:對所述聚醯亞胺濕膜以介於140℃至220℃的溫度進行烘烤,以去除所述聚醯亞胺濕膜中殘餘的所述有機溶劑,從而於所述耐高溫聚酯基材上形成 一聚醯亞胺薄膜;以及將所述聚醯亞胺薄膜與所述耐高溫聚酯基材彼此分離。
- 如請求項1所述的聚醯亞胺薄膜的製造方法,其中,在所述聚醯亞胺塗佈液中,所述有機溶劑是選自由γ-丁內酯(GBL)、四氫呋喃(THF)、N,N-二甲基乙醯胺(DMAc)、六甲基磷醯胺(HMPA)、N-甲基-2-吡咯烷酮(NMP)、及1,3-二甲基咪唑啉酮(DMI)所組成的材料群組的至少其中之一。
- 如請求項1所述的聚醯亞胺薄膜的製造方法,其中,所述無機奈米粒子為金屬氧化物、矽氧化物、及硫酸鋇的至少其中之一。
- 如請求項3所述的聚醯亞胺薄膜的製造方法,其中,所述金屬氧化物為氧化鈣(CaO)、氧化鋅(ZnO)、二氧化鈦(TiO2)、二氧化鋯(ZrO2)、二氧化錫(SnO2)、氧化鋁(Al2O3)、及氧化銦(In2O3)的至少其中之一;其中,所述矽氧化物為二氧化矽(SiO2)。
- 如請求項1所述的聚醯亞胺薄膜的製造方法,其中,在所述耐高溫聚酯基材中,所述耐高溫樹脂是以介於50奈米至200奈米之間的粒徑尺寸分散,並且所述耐高溫樹脂於所述耐高溫聚酯基材中的含量範圍是介於10wt.%至50wt.%之間。
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