TWI823650B - 移送裝置及安裝裝置 - Google Patents

移送裝置及安裝裝置 Download PDF

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Publication number
TWI823650B
TWI823650B TW111140729A TW111140729A TWI823650B TW I823650 B TWI823650 B TW I823650B TW 111140729 A TW111140729 A TW 111140729A TW 111140729 A TW111140729 A TW 111140729A TW I823650 B TWI823650 B TW I823650B
Authority
TW
Taiwan
Prior art keywords
nozzle
electronic component
bonding head
calibrator
imaging unit
Prior art date
Application number
TW111140729A
Other languages
English (en)
Chinese (zh)
Other versions
TW202324581A (zh
Inventor
冨樫徳和
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202324581A publication Critical patent/TW202324581A/zh
Application granted granted Critical
Publication of TWI823650B publication Critical patent/TWI823650B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
TW111140729A 2019-08-28 2020-08-17 移送裝置及安裝裝置 TWI823650B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019155618A JP7291577B2 (ja) 2019-08-28 2019-08-28 移送装置および実装装置
JP2019-155618 2019-08-28

Publications (2)

Publication Number Publication Date
TW202324581A TW202324581A (zh) 2023-06-16
TWI823650B true TWI823650B (zh) 2023-11-21

Family

ID=74677749

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109127885A TWI785365B (zh) 2019-08-28 2020-08-17 移送裝置及安裝裝置
TW111140729A TWI823650B (zh) 2019-08-28 2020-08-17 移送裝置及安裝裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109127885A TWI785365B (zh) 2019-08-28 2020-08-17 移送裝置及安裝裝置

Country Status (4)

Country Link
JP (1) JP7291577B2 (ja)
KR (2) KR102454031B1 (ja)
CN (1) CN112447569A (ja)
TW (2) TWI785365B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115881600A (zh) * 2021-09-30 2023-03-31 芝浦机械电子装置株式会社 铺贴装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726927B2 (ja) * 1986-04-18 1998-03-11 東芝メカトロニクス株式会社 半導体ペレツトピツクアツプ方法
JP2005032988A (ja) * 2003-07-14 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法ならびに較正用治具
JP2013055207A (ja) * 2011-09-03 2013-03-21 Tdk Corp ワーク搬送装置、並びにワーク処理装置及びワーク処理方法
JP2013168683A (ja) * 2013-06-03 2013-08-29 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置
TW201413863A (zh) * 2012-06-25 2014-04-01 Tokyo Ohka Kogyo Co Ltd 重疊裝置及重疊方法
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
TW201537804A (zh) * 2013-12-26 2015-10-01 Kateeva Inc 用於電子裝置之熱處理的設備與技術
TW201740472A (zh) * 2016-02-05 2017-11-16 Panasonic Ip Man Co Ltd 半導體裝置的製造裝置
TW201812286A (zh) * 2016-07-05 2018-04-01 佳能機械股份有限公司 缺陷檢測裝置、缺陷檢測方法、晶圓、半導體晶片、半導體裝置、黏晶機、接合方法、半導體製造方法及半導體裝置製造方法
TW201820671A (zh) * 2016-08-08 2018-06-01 日商尼康股份有限公司 基板處理裝置及基板處理方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
JP2004179517A (ja) 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
JP2005251978A (ja) * 2004-03-04 2005-09-15 Matsushita Electric Ind Co Ltd 電子部品装着装置および電子部品の装着方法
JP4571460B2 (ja) 2004-08-31 2010-10-27 芝浦メカトロニクス株式会社 電子部品の実装方法及び実装装置
JP4016982B2 (ja) * 2004-11-18 2007-12-05 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP4840862B2 (ja) 2006-08-29 2011-12-21 東レエンジニアリング株式会社 実装装置のチップ供給方法、及びその実装装置
JP4361572B2 (ja) * 2007-02-28 2009-11-11 株式会社新川 ボンディング装置及び方法
EP2075829B1 (en) * 2007-12-24 2011-10-12 ISMECA Semiconductor Holding SA A method and device for aligning components
JP2012094634A (ja) 2010-10-26 2012-05-17 Panasonic Corp 部品実装装置および部品実装方法
JP2015111613A (ja) 2013-12-06 2015-06-18 株式会社リコー 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
JP2019046836A (ja) 2017-08-30 2019-03-22 パナソニックＩｐマネジメント株式会社 生産システムおよび生産方法ならびに生産ライン管理装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726927B2 (ja) * 1986-04-18 1998-03-11 東芝メカトロニクス株式会社 半導体ペレツトピツクアツプ方法
JP2005032988A (ja) * 2003-07-14 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法ならびに較正用治具
JP2013055207A (ja) * 2011-09-03 2013-03-21 Tdk Corp ワーク搬送装置、並びにワーク処理装置及びワーク処理方法
TW201413863A (zh) * 2012-06-25 2014-04-01 Tokyo Ohka Kogyo Co Ltd 重疊裝置及重疊方法
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
JP2013168683A (ja) * 2013-06-03 2013-08-29 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置
TW201537804A (zh) * 2013-12-26 2015-10-01 Kateeva Inc 用於電子裝置之熱處理的設備與技術
TW201740472A (zh) * 2016-02-05 2017-11-16 Panasonic Ip Man Co Ltd 半導體裝置的製造裝置
TW201812286A (zh) * 2016-07-05 2018-04-01 佳能機械股份有限公司 缺陷檢測裝置、缺陷檢測方法、晶圓、半導體晶片、半導體裝置、黏晶機、接合方法、半導體製造方法及半導體裝置製造方法
TW201820671A (zh) * 2016-08-08 2018-06-01 日商尼康股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
TWI785365B (zh) 2022-12-01
JP2021034645A (ja) 2021-03-01
JP7291577B2 (ja) 2023-06-15
KR102547564B1 (ko) 2023-06-23
TW202109722A (zh) 2021-03-01
KR20210027162A (ko) 2021-03-10
CN112447569A (zh) 2021-03-05
KR102454031B1 (ko) 2022-10-12
KR20220139286A (ko) 2022-10-14
TW202324581A (zh) 2023-06-16

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