TWI814298B - 基板乾燥裝置及基板處理裝置 - Google Patents

基板乾燥裝置及基板處理裝置 Download PDF

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Publication number
TWI814298B
TWI814298B TW111110812A TW111110812A TWI814298B TW I814298 B TWI814298 B TW I814298B TW 111110812 A TW111110812 A TW 111110812A TW 111110812 A TW111110812 A TW 111110812A TW I814298 B TWI814298 B TW I814298B
Authority
TW
Taiwan
Prior art keywords
substrate
drying
liquid
processed
heating
Prior art date
Application number
TW111110812A
Other languages
English (en)
Chinese (zh)
Other versions
TW202240742A (zh
Inventor
埀野陽子
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202240742A publication Critical patent/TW202240742A/zh
Application granted granted Critical
Publication of TWI814298B publication Critical patent/TWI814298B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
TW111110812A 2021-03-31 2022-03-23 基板乾燥裝置及基板處理裝置 TWI814298B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021059075A JP7726653B2 (ja) 2021-03-31 2021-03-31 基板乾燥装置及び基板処理装置
JP2021-059075 2021-03-31

Publications (2)

Publication Number Publication Date
TW202240742A TW202240742A (zh) 2022-10-16
TWI814298B true TWI814298B (zh) 2023-09-01

Family

ID=83405199

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110812A TWI814298B (zh) 2021-03-31 2022-03-23 基板乾燥裝置及基板處理裝置

Country Status (5)

Country Link
US (1) US20220319875A1 (https=)
JP (2) JP7726653B2 (https=)
KR (1) KR102806621B1 (https=)
CN (1) CN115148627B (https=)
TW (1) TWI814298B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7625458B2 (ja) * 2021-03-22 2025-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN116153801A (zh) * 2022-12-31 2023-05-23 华海清科股份有限公司 一种光学测量装置和减薄设备

Citations (2)

* Cited by examiner, † Cited by third party
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US20170338131A1 (en) * 2016-05-18 2017-11-23 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US20190287823A1 (en) * 2012-11-26 2019-09-19 Applied Materials, Inc. Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures

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US6127279A (en) * 1994-09-26 2000-10-03 Semiconductor Energy Laboratory Co., Ltd. Solution applying method
JP3976084B2 (ja) * 1998-07-03 2007-09-12 大日本スクリーン製造株式会社 基板処理方法及び基板処理装置
KR100992803B1 (ko) 2002-07-25 2010-11-09 도쿄엘렉트론가부시키가이샤 기판 처리 용기
JP4698407B2 (ja) * 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2008034779A (ja) 2006-06-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5043406B2 (ja) 2006-11-21 2012-10-10 大日本スクリーン製造株式会社 基板乾燥方法および基板乾燥装置
JP5820709B2 (ja) 2011-11-30 2015-11-24 東京エレクトロン株式会社 基板処理方法、この基板処理方法を実行するためのコンピュータプログラムが記録された記録媒体、および基板処理装置
US9075266B2 (en) 2012-04-19 2015-07-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Device for prebaking alignment film by using temperature-controllable pin to support substrate and method thereof
JP6400919B2 (ja) * 2013-03-07 2018-10-03 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6455962B2 (ja) * 2013-03-18 2019-01-23 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6351993B2 (ja) * 2013-03-18 2018-07-04 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6426927B2 (ja) * 2013-09-30 2018-11-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6503194B2 (ja) 2015-02-16 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6742708B2 (ja) 2015-09-29 2020-08-19 芝浦メカトロニクス株式会社 基板処理方法
JP6563762B2 (ja) 2015-09-29 2019-08-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6737666B2 (ja) * 2016-09-12 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 犠牲膜形成方法、基板処理方法および基板処理装置
JP6825956B2 (ja) * 2017-03-28 2021-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法および紫外線照射手段の選択方法
CN111630636B (zh) 2018-01-29 2024-03-22 东京毅力科创株式会社 基片干燥装置、基片干燥方法和存储介质
JP7100564B2 (ja) * 2018-11-09 2022-07-13 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
KR102433558B1 (ko) * 2019-07-11 2022-08-19 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190287823A1 (en) * 2012-11-26 2019-09-19 Applied Materials, Inc. Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures
US20170338131A1 (en) * 2016-05-18 2017-11-23 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
KR102806621B1 (ko) 2025-05-13
JP2022155713A (ja) 2022-10-14
US20220319875A1 (en) 2022-10-06
JP2025163234A (ja) 2025-10-28
CN115148627A (zh) 2022-10-04
KR20220136194A (ko) 2022-10-07
JP7726653B2 (ja) 2025-08-20
TW202240742A (zh) 2022-10-16
CN115148627B (zh) 2025-10-10

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