TWI805721B - 導電性糊 - Google Patents

導電性糊 Download PDF

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Publication number
TWI805721B
TWI805721B TW108109656A TW108109656A TWI805721B TW I805721 B TWI805721 B TW I805721B TW 108109656 A TW108109656 A TW 108109656A TW 108109656 A TW108109656 A TW 108109656A TW I805721 B TWI805721 B TW I805721B
Authority
TW
Taiwan
Prior art keywords
conductive
powder
conductive paste
transmittance
particles
Prior art date
Application number
TW108109656A
Other languages
English (en)
Chinese (zh)
Other versions
TW201942263A (zh
Inventor
福嶋泰基
Original Assignee
日商則武股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商則武股份有限公司 filed Critical 日商則武股份有限公司
Publication of TW201942263A publication Critical patent/TW201942263A/zh
Application granted granted Critical
Publication of TWI805721B publication Critical patent/TWI805721B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW108109656A 2018-03-30 2019-03-21 導電性糊 TWI805721B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018068733A JP6637097B2 (ja) 2018-03-30 2018-03-30 導電性ペースト
JP2018-068733 2018-03-30

Publications (2)

Publication Number Publication Date
TW201942263A TW201942263A (zh) 2019-11-01
TWI805721B true TWI805721B (zh) 2023-06-21

Family

ID=68059865

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109656A TWI805721B (zh) 2018-03-30 2019-03-21 導電性糊

Country Status (5)

Country Link
JP (1) JP6637097B2 (ja)
KR (1) KR102643293B1 (ja)
CN (1) CN111937089B (ja)
TW (1) TWI805721B (ja)
WO (1) WO2019188095A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7379899B2 (ja) * 2019-07-22 2023-11-15 Tdk株式会社 セラミック電子部品
CN113948236B (zh) * 2021-12-21 2022-03-29 西安宏星电子浆料科技股份有限公司 一种耐磨损高精度油位传感器用厚膜银钯导体浆料

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207083A (en) * 2010-04-19 2012-02-16 Sumitomo Metal Mining Co Method of making conductive paste

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4303715B2 (ja) 2005-10-31 2009-07-29 Tdk株式会社 導電性ペーストおよび積層型電子部品の製造方法
JP5982912B2 (ja) * 2011-03-22 2016-08-31 東レ株式会社 ペースト製造方法
WO2013157516A1 (ja) * 2012-04-19 2013-10-24 株式会社村田製作所 導電性ペースト、積層セラミック電子部品、および該積層セラミック電子部品の製造方法
EP3327730A4 (en) 2015-07-22 2019-04-03 Shoei Chemical Inc. BINDER RESIN FOR PASTES CONTAINING DISPERSED INORGANIC PARTICLES AND PASTE CONTAINING DISPERSIBLE INORGANIC PARTICLES

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207083A (en) * 2010-04-19 2012-02-16 Sumitomo Metal Mining Co Method of making conductive paste

Also Published As

Publication number Publication date
KR102643293B1 (ko) 2024-03-07
WO2019188095A1 (ja) 2019-10-03
JP6637097B2 (ja) 2020-01-29
JP2019179683A (ja) 2019-10-17
KR20200138331A (ko) 2020-12-09
CN111937089A (zh) 2020-11-13
TW201942263A (zh) 2019-11-01
CN111937089B (zh) 2021-11-19

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