TWI803755B - 基板處理裝置以及基板處理方法 - Google Patents

基板處理裝置以及基板處理方法 Download PDF

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Publication number
TWI803755B
TWI803755B TW109119765A TW109119765A TWI803755B TW I803755 B TWI803755 B TW I803755B TW 109119765 A TW109119765 A TW 109119765A TW 109119765 A TW109119765 A TW 109119765A TW I803755 B TWI803755 B TW I803755B
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TW
Taiwan
Prior art keywords
substrate
aforementioned
liquid
processing liquid
processing
Prior art date
Application number
TW109119765A
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English (en)
Chinese (zh)
Other versions
TW202115773A (zh
Inventor
中井仁司
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202115773A publication Critical patent/TW202115773A/zh
Application granted granted Critical
Publication of TWI803755B publication Critical patent/TWI803755B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW109119765A 2019-07-19 2020-06-12 基板處理裝置以及基板處理方法 TWI803755B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019133864A JP7372068B2 (ja) 2019-07-19 2019-07-19 基板処理装置および基板処理方法
JP2019-133864 2019-07-19

Publications (2)

Publication Number Publication Date
TW202115773A TW202115773A (zh) 2021-04-16
TWI803755B true TWI803755B (zh) 2023-06-01

Family

ID=74193125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109119765A TWI803755B (zh) 2019-07-19 2020-06-12 基板處理裝置以及基板處理方法

Country Status (5)

Country Link
JP (1) JP7372068B2 (ja)
KR (1) KR102636437B1 (ja)
CN (1) CN114008756A (ja)
TW (1) TWI803755B (ja)
WO (1) WO2021014772A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023045549A (ja) * 2021-09-22 2023-04-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081064A (ja) * 1994-06-20 1996-01-09 Dainippon Screen Mfg Co Ltd 回転処理装置
JP2008021983A (ja) * 2006-06-16 2008-01-31 Tokyo Electron Ltd 液処理装置および液処理方法
US20150114561A1 (en) * 2013-10-30 2015-04-30 Tokyo Electron Limited Liquid processing apparatus
TW201741032A (zh) * 2016-05-18 2017-12-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TW201816833A (zh) * 2016-09-12 2018-05-01 日商斯庫林集團股份有限公司 基板處理方法以及基板處理裝置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8936368B2 (en) 2010-01-29 2015-01-20 Nec Display Solutions, Ltd. Illumination optical system and projector using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081064A (ja) * 1994-06-20 1996-01-09 Dainippon Screen Mfg Co Ltd 回転処理装置
JP2008021983A (ja) * 2006-06-16 2008-01-31 Tokyo Electron Ltd 液処理装置および液処理方法
US20150114561A1 (en) * 2013-10-30 2015-04-30 Tokyo Electron Limited Liquid processing apparatus
TW201741032A (zh) * 2016-05-18 2017-12-01 斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TW201816833A (zh) * 2016-09-12 2018-05-01 日商斯庫林集團股份有限公司 基板處理方法以及基板處理裝置

Also Published As

Publication number Publication date
KR102636437B1 (ko) 2024-02-14
TW202115773A (zh) 2021-04-16
JP2021019092A (ja) 2021-02-15
WO2021014772A1 (ja) 2021-01-28
CN114008756A (zh) 2022-02-01
KR20220024748A (ko) 2022-03-03
JP7372068B2 (ja) 2023-10-31

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