TWI803731B - 加工裝置 - Google Patents

加工裝置 Download PDF

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TWI803731B
TWI803731B TW109101876A TW109101876A TWI803731B TW I803731 B TWI803731 B TW I803731B TW 109101876 A TW109101876 A TW 109101876A TW 109101876 A TW109101876 A TW 109101876A TW I803731 B TWI803731 B TW I803731B
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waterproof pan
processing device
water
wall
processing
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TW202031412A (zh
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力石利康
片桐恭
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
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    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
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    • B23Q11/0067—Devices for removing chips chip containers located under a machine or under a chip conveyor
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    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/08—Protective coverings for parts of machine tools; Splash guards
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    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/12—Arrangements for cooling or lubricating parts of the machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Abstract

[課題]提供一種加工裝置，在設置需要防水盤之加工裝置時，不必額外設置防水盤。[解決手段] 一種加工裝置，包含：卡盤台，保持被加工物；加工單元，一邊對卡盤台所保持的被加工物供給加工水一邊施予加工；以及防水盤，固定在加工裝置的底部並承接漏水。

Description

加工裝置
本發明是關於一種加工裝置，其在底部具備承接漏水的防水盤。
IC、LSI等多個元件被交叉的多條分割預定線所劃分並形成於正面的晶圓，在藉由研削裝置研削背面而形成為預定厚度後，藉由切割裝置分割為各個元件，分割後的元件晶片被利用於行動電話、電腦等的電子設備。
研削裝置、切割裝置因為使用研削水、切割水等的加工水而有漏水的疑慮，在研削裝置、切割裝置等的裝置的正下方會有配設防水盤的情形，該防水盤是用來承接漏水，防止漏水漏出擴及至該裝置的周邊區域（例如參照專利文獻1）。 [習知技術文獻] [專利文獻]
[專利文獻1] 日本特開2016-221620號公報
[發明所欲解決的課題] 在上述的加工裝置的下方設置防水盤的情況，分別準備加工裝置及防水盤，在設置加工裝置時，設置額外準備的防水盤，並在該防水盤上承載加工裝置。因此，舉例而言，一旦為不小心在未置有防水盤而設置加工裝置的情況，會變成暫時將該加工裝置吊起等使其從設置處所的地面上升，將防水盤設置在地上，再載置加工裝置，因此非常地麻煩。另外，即使預先將防水盤設置在加工裝置之下，在變更加工裝置位置的情況，必須使加工裝置及防水盤分別移動，亦有加工裝置及防水盤的位置調整耗時之問題。
因此，本發明的目的在於提供一種加工裝置，在設置需要防水盤之加工裝置時，不必額外設置防水盤。
[解決課題的技術手段] 根據本發明，提供一種加工裝置，其具備：卡盤台，保持被加工物；加工手段，一邊對該卡盤台所保持的被加工物供給加工水一邊施予加工；以及防水盤，固定在該加工裝置的底部並承接漏水。
較佳為，加工裝置進一步具備配設在該底部的多個腳部；該防水盤架設固定在該腳部。較佳為，該防水盤是以其底壁相對於水平面傾斜之方式固定，漏出至該防水盤的漏水集中於底壁的預定較低位置，在該預定較低位置配設有漏水感測器。進而，較佳為在對應該防水盤的該預定較低位置的位置配設排水手段。
再者，本發明中的「加工水」是包含在加工裝置使用的各種水，例如除了在切割裝置使用的切割水、在研削裝置使用的研削水等之外、亦包含清洗被加工物之清洗水。
[發明功效] 根據本發明的加工裝置，為了設置防水盤，不須實施以起重機等提起加工裝置後在設置處所插入防水盤等的大規模作業。
以下參照圖式詳細說明本發明的實施方式。
在圖1表示本實施方式的切割裝置（切割鋸）10的立體圖。切割裝置10具備：卡匣12，載置於裝置外殼2的預定位置並升降；搬出入手段14，將作為容納於卡匣12的被加工物之半導體晶圓W搬出，並將加工完成的半導體晶圓W搬入卡匣12；第1搬送手段16，將從卡匣12搬出的半導體晶圓W搬送至作為保持半導體晶圓W的卡盤台之卡盤台20；切割手段22，具備切割加工在卡盤台20保持的半導體晶圓W之切割刀片24及切割水供給手段26；清洗手段28，清洗切割加工後的半導體晶圓W；第2搬送手段18，從卡盤台20將半導體晶圓W搬送至清洗手段28的清洗區域；防水盤4，固定在切割裝置10的底部並承接漏水；以及腳部6，螺合於切割裝置10的底部的4角而配設。
藉由切割裝置10施予切割加工的半導體晶圓W，是例如透過保持台T支撐於環狀的框架F。半導體晶圓W是在卡匣12多段重疊收納並藉由搬出入手段14由卡匣12搬出，被第1搬送手段16吸附，藉由第1搬送手段16的旋轉動作而載置於卡盤台20上而被吸引保持。
使半導體晶圓W吸引保持於卡盤台20後，卡盤台20藉由未圖示移動手段的作用朝向切割手段22側移動，途中，實施對準半導體晶圓W與切割刀片24的對位手段，一邊使卡盤台20移動一邊藉由切割刀片24進行切割步驟。該切割步驟是以使半導體晶圓W上的所有元件被一個個分割之方式，直到半導體晶圓W的切割預定之所有分割預定線的切割結束為止，一邊變更卡盤台20及切割刀片24的相對位置及方向一邊反覆執行。此時，由切割水供給手段26對切割刀片24及半導體晶圓W上的切割位置供給切割水。
藉由上述切割步驟，當將半導體晶圓W分割為一個個的元件晶片之切割步驟結束時，移動卡盤台20並藉由第2搬送手段18將半導體晶圓W搬送至清洗手段28。在清洗手段28，將半導體晶圓W載置於保持台（省略圖示）而吸引保持之後，使該保持台旋轉並由清洗水供給手段（省略圖示）供給清洗水至半導體晶圓W上，使切割屑由半導體晶圓W洗出。之後，經過使半導體晶圓W乾燥之乾燥處理，半導體晶圓W藉由第1搬送手段16及搬出入手段14再次容納於卡匣12，結束切割步驟。
在覆蓋切割裝置10的下部整體之裝置外殼2的內部，除配設搬出入手段14、第1搬送手段16及移動卡盤台20之移動手段、以及使卡匣12升降的升降手段（省略圖示）等之外，亦配設有：切割水供給回路（省略圖示），將上述切割水供給至切割加工區域，將對切割加工供給的切割水排出至外部；及清洗水供給回路（省略圖示），對清洗手段供給清洗水，將對清洗供給的清洗水排出至外部。該切割水供給回路及該清洗水供給回路具備用於供給排出切割水或清洗水的水路、管路等。在一般的動作狀態，切割水及清洗水不會從切割水供給回路及清洗水供給回路外漏。但是，有可能會發生在任一處產生孔穴或龜裂等而切割水或清洗水流出至外部，或因為妨礙切割水、清洗水的流動之異物堵塞等而由意料之外處溢出的情形。這種情況，因為清洗水或切割水由切割水供給回路或清洗水供給回路漏出，沿著裝置外殼2內的任一路徑漏出於裝置外殼2的底部。
在切割裝置10的底部固定有用來承接漏水的防水盤4。更具體而言，防水盤4是固定在切割裝置10的裝置外殼2的底部且是架設固定在配設在該底部的4角之4個腳部6。在上述的裝置外殼2漏出的切割水、清洗水是藉由如此的防水盤4承接。
一邊參照圖2，一邊說明防水盤4的構造的一例。如圖2所示，固定在構成切割裝置10的下部之裝置外殼2的底部的防水盤4，具備：前壁41；側壁42及側壁43，連接於前壁41；後壁44，連接於側壁42及側壁43，配設在與前壁41對向的位置；以及底壁45，配設在被前壁41、側壁42、側壁43及後壁44圍繞的區域。前壁41、側壁42、側壁43及後壁44是立設於底壁45的外周緣。
防水盤4在固定於切割裝置10的底部之狀態下，成為底壁45相對於水平面而往圖中多個箭頭S所示方向傾斜。漏出至防水盤4的漏水沿著箭頭S流動，在底壁45集中於預定較低位置。在該預定較低位置配設漏水感測器70的檢測部72。如圖所示，底壁45為相對於水平面傾斜，故在後壁44及側壁43形成的角部的深度b會較在前壁41及側壁42、在前壁41及側壁43所形成的角部的深度a為深。另外，在後壁44配設漏水感測器70之預定較低位置形成側及側壁42所形成的角部的深度c，是設定為比該角部的深度b更深。漏水感測器70的構成並未特別限定，例如可採用藉由加工水接觸配設在檢測部72的2根電極附近而電流經由該加工水流通，檢測液體漏出至防水盤4內之構成。依據此構成，即使切割裝置10的底部任一位置發生漏水，漏出的加工水集中在配設有漏水感測器70的檢測部72之預定較低位置，可迅速檢測到漏水。再者，藉由預先形成適當的電路，由漏水感測器70檢測到漏水的情況，可使未圖示之蜂鳴器、警告燈的任一者或兩者作動，另外，作為電訊號傳送至切割裝置10的未圖示控制手段，可緊急停止切割加工。
在面對上述底壁45的配設漏水感測器70的檢測部72之預定較低位置的後壁44形成用來排出漏水的排水孔47。在後壁44配設有排水孔47之位置外側連結排水手段50。排水手段50具備排水管52及將該排水管52的管路進行開 關之旋塞54。在漏水積累於防水盤4的情況，開放該旋塞54，可從排水管52排出漏水。再者，在上述的實施方式中，雖在後壁44形成有排水孔47，但排水孔47並非限定於配設在後壁44，亦可配設在配設有漏水感測器70的位置之底壁45。另外，底壁45的最低位置並非一定限定為設於如圖2所示的後壁44側，可設定於任意位置。
如圖2所示，在防水盤4的內側的4角配設有固定用軸套46，其為用來將防水盤4固定於切割裝置10的底部。在本實施方式中，使用腳部6透過固定用軸套46將防水盤4固定於構成切割裝置10的裝置外殼2的底部。如圖所示，底壁45被傾斜固定，故前壁41、側壁42、側壁43及後壁44的高度依據其位置而有所不同，固定用軸套46的高度亦配合相鄰之壁的高度而有不同設定。
一邊參照圖2至圖4，一邊說明將防水盤4固定在裝置外殼2時的固定構造。再者，為了方便說明，圖3將前壁41及側壁42所形成的角部的局部切開來表示。腳部6具備：基台60，相接於設置切割裝置10之處的地面；螺桿部62，與基台60一體成形並形成為公螺桿；以及鎖緊螺帽64，螺合於螺桿部62。螺桿部62的軸方向的長度形成為較防水盤4的固定用軸套46的高度尺寸為長。
如圖2及圖3所示，將防水盤4安裝於切割裝置10的底部時，首先，將腳部6的螺桿部62由下方插入至固定用軸套46。固定用軸套46的孔內徑形成為稍微大於螺桿部62的直徑，螺桿部62直接貫穿固定用軸套46。在裝置外殼2的下表面側的4角，在對應固定用軸套46的位置分別形成有固定用螺孔2H，該固定用螺孔2H形成有母螺紋。如圖4(a)所示，將貫穿固定用軸套46的螺桿部62的前端部定位在裝置外殼2的固定用螺孔2H，藉由使基台60旋轉並螺入以將4個腳部6固定在裝置外殼2的下表面4角。再者，腳部6相對於固定用螺孔2H的螺入量可自由設定，藉由該螺入量可進行在設置切割裝置10時的高度的微調整，亦可進行切割裝置10的水平調整。
如圖(4)所示，使鎖緊螺帽64螺合在腳部6的螺桿部62，在開始將腳部6安裝於裝置外殼2時，該鎖緊螺帽64被定位於基台60側。在這狀態下，防水盤4雖是藉由腳部6支撐在切割裝置10的底部，但在前壁41、側壁42、側壁43及後壁44的上方形成有間隙P。
若將腳部6及防水盤4一同安裝於裝置外殼2的底部，則如圖4(b)所示，使鎖緊螺帽64旋轉，藉此與鎖緊螺帽64一同使防水盤4上升，密合於裝置外殼2的底部，在防水盤4的內部及裝置外殼2的底部形成密閉空間。藉由以上，防水盤4固定在切割裝置10的底部。
根據本實施方式，在切割裝置10的底部固定有承接漏水的防水盤4，故不需要準備額外的防水盤來進行設置的作業。因此，為了設置防水盤，不須實施以起重機等提起切割裝置10後在設置處所插入防水盤等的大規模作業。另外，防水盤4因為架設固定在腳部6，可將腳部6安裝於切割裝置10藉此簡單安裝防水盤4。進而，防水盤4是以其底壁45相對於水平面傾斜之方式固定，在防水盤4的底壁45的漏水集中之預定較低位置配設漏水感測器70的檢測部72，故即使在切割裝置10的任一處發生漏水亦可迅速檢測漏水。
根據本發明，並不限於上述實施方式，可提供各種變形例。例如，上述實施方式中，雖例示將本發明適用於切割裝置10，但本發明並不限於此，例如，可適用於研削裝置、研磨裝置等使用加工水的各種加工裝置。
2:裝置外殼 4:防水盤 41:前壁 42、43:側壁 44:後壁 45:底壁 47:排水孔 6:腳部 60:基台 62:螺桿部 64:鎖緊螺帽 10:切割裝置 20:卡盤台 22:切割手段 24:切割刀片 26:切割水供給手段 28:清洗手段 50:排水手段 52:排水管 54:旋塞 70:漏水感測器 72:檢測部
圖1係具備防水盤的切割裝置之立體圖。 圖2係分解圖1的切割裝置的局部之立體圖。 圖3係表示在切割裝置的底部安裝防水盤的態樣之局部放大立體圖。 圖4（a）係表示在切割裝置安裝腳部及防水盤的狀態之局部放大剖面圖，圖4（b）係表示在切割裝置的底部固定防水盤的態樣之局部放大剖面圖。
2:裝置外殼
2H:固定用螺孔
4:防水盤
41:前壁
42、43:側壁
44:後壁
45:底壁
46:固定用軸套
47:排水孔
6:腳部
60:基台
62:螺桿部
64:鎖緊螺帽
10:切割裝置
12:卡匣
14:搬出入手段
16:第1搬送手段
18:第2搬送手段
20:卡盤台
22:切割手段
24:切割刀片
26:切割水供給手段
28:清洗手段
50:排水手段
52:排水管
54:旋塞
70:漏水感測器
72:檢測部
F:框架
T:保持台
W:半導體晶圓

Claims (3)

  1. 一種加工裝置，其具備：卡盤台，保持被加工物；以及加工手段，一邊對該卡盤台所保持的被加工物供給加工水一邊施予加工；在該加工裝置的底部安裝有防水盤，該防水盤架設在配設於該底部且支撐該加工裝置之多個腳部並承接漏水，該防水盤藉由底壁與圍繞該底壁且高度相異之前壁、側壁及後壁所構成，並且以架設在該腳部且安裝在該加工裝置的底部之狀態升降自如，且構成為可沿著該腳部上升並使該前壁、側壁及後壁密合且固定於該加工裝置的底部。
  2. 如請求項1之加工裝置，其中，該防水盤是以其底壁相對於水平面傾斜之方式固定，漏出至該防水盤的漏水集中於底壁的預定較低位置，在該預定較低位置配設漏水感測器。
  3. 如請求項2之加工裝置，其中，在對應該防水盤的該預定較低位置的位置配設有排水手段。
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