TWI803409B - 處理套組環配接器 - Google Patents

處理套組環配接器 Download PDF

Info

Publication number
TWI803409B
TWI803409B TW111130214A TW111130214A TWI803409B TW I803409 B TWI803409 B TW I803409B TW 111130214 A TW111130214 A TW 111130214A TW 111130214 A TW111130214 A TW 111130214A TW I803409 B TWI803409 B TW I803409B
Authority
TW
Taiwan
Prior art keywords
processing
ring adapter
kit ring
adapter
treatment
Prior art date
Application number
TW111130214A
Other languages
English (en)
Chinese (zh)
Other versions
TW202247344A (zh
Inventor
里昂 沃福斯基
安德列亞斯 史密德
丹尼斯馬丁 庫薩
尼可拉斯麥克 庫佩克
史蒂芬 巴巴揚
特道格拉斯Ｒ 麥克艾力斯
海德 李
傑佛利 哈德俊
戴蒙Ｋ 卡克斯
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW202247344A publication Critical patent/TW202247344A/zh
Application granted granted Critical
Publication of TWI803409B publication Critical patent/TWI803409B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1908—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing substrates other than wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
TW111130214A 2019-05-20 2020-05-20 處理套組環配接器 TWI803409B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/417,369 2019-05-20
US16/417,369 US10964584B2 (en) 2019-05-20 2019-05-20 Process kit ring adaptor

Publications (2)

Publication Number Publication Date
TW202247344A TW202247344A (zh) 2022-12-01
TWI803409B true TWI803409B (zh) 2023-05-21

Family

ID=73456142

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111130214A TWI803409B (zh) 2019-05-20 2020-05-20 處理套組環配接器
TW109116647A TWI776153B (zh) 2019-05-20 2020-05-20 處理套組環配接器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109116647A TWI776153B (zh) 2019-05-20 2020-05-20 處理套組環配接器

Country Status (6)

Country Link
US (2) US10964584B2 (https=)
JP (3) JP7125244B2 (https=)
KR (2) KR102434952B1 (https=)
CN (1) CN113853673B (https=)
TW (2) TWI803409B (https=)
WO (1) WO2020236916A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020232074A1 (en) * 2019-05-14 2020-11-19 Mattson Technology, Inc. Plasma processing apparatus having a focus ring adjustment assembly
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
US11211269B2 (en) 2019-07-19 2021-12-28 Applied Materials, Inc. Multi-object capable loadlock system
KR102888626B1 (ko) * 2020-01-23 2025-11-19 램 리써치 코포레이션 자동화된 회전 사전 정렬을 사용한 에지 링 이송
US12159795B2 (en) 2021-03-08 2024-12-03 Applied Materials, Inc. Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall
KR20220156138A (ko) * 2021-05-17 2022-11-25 세메스 주식회사 링 캐리어 및 기판 처리 시스템
KR102614918B1 (ko) * 2021-06-28 2023-12-20 세메스 주식회사 반송 어셈블리 및 이를 가지는 기판 처리 장치
JP7720235B2 (ja) * 2021-11-26 2025-08-07 株式会社安川電機 アライメント装置、基板搬送システム、アライメント方法、及びプログラム
KR102728371B1 (ko) * 2022-04-01 2024-11-08 세메스 주식회사 엔드 이펙터용 캐리어, 이를 포함하는 운반 장치 및 기판 처리 장치
US12528207B2 (en) * 2022-12-12 2026-01-20 Applied Materials, Inc. Carrier with rotation prevention feature
KR20250038242A (ko) * 2023-09-11 2025-03-19 세메스 주식회사 링 캐리어 및 이를 포함하는 용기
US12603261B2 (en) * 2024-04-04 2026-04-14 Applied Materials, Inc. Aligner station with lifting mechanism

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101216686A (zh) * 2008-01-10 2008-07-09 上海微电子装备有限公司 一种晶片预对准平台及使用该平台的晶片预对准方法
CN109545642A (zh) * 2017-09-21 2019-03-29 应用材料公司 用于半导体工艺模块的原位设备

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749469A (en) 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
JPH0995783A (ja) 1995-10-04 1997-04-08 Sony Corp スパッタ装置
JP3899570B2 (ja) 1996-12-06 2007-03-28 株式会社日立ハイテクノロジーズ 基板処理装置及び液晶パネルの製造方法
USD407073S (en) 1997-12-24 1999-03-23 Applied Materials, Inc. Electrostatic chuck with improved spacing and charge migration reduction mask
US6199291B1 (en) 1998-07-29 2001-03-13 Sony Corporation Alignment fixture
JP3234576B2 (ja) * 1998-10-30 2001-12-04 アプライド マテリアルズ インコーポレイテッド 半導体製造装置におけるウェハ支持装置
US7040487B2 (en) 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
US7641247B2 (en) 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
USD489739S1 (en) 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US7792350B2 (en) 2003-11-10 2010-09-07 Brooks Automation, Inc. Wafer center finding
US7230702B2 (en) * 2003-11-13 2007-06-12 Applied Materials, Inc. Monitoring of smart pin transition timing
DE102004053906A1 (de) * 2004-11-05 2006-05-11 Leica Microsystems Semiconductor Gmbh Adaptervorrichtung für eine Substrat-Arbeitsstation
JP4559317B2 (ja) 2005-07-21 2010-10-06 株式会社岡本工作機械製作所 半導体基板の搬送方法
US7727800B2 (en) * 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. High precision die bonding apparatus
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
JP2009095783A (ja) 2007-10-17 2009-05-07 Recs:Kk 液塗布装置
WO2009059433A1 (en) 2007-11-09 2009-05-14 The Royal Institution For The Advancement Of Learning/Mcgill University Quantification of an absorber through a scattering medium
WO2010026955A1 (ja) * 2008-09-08 2010-03-11 芝浦メカトロニクス株式会社 基板保持部材、基板処理装置、基板処理方法
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
KR101778519B1 (ko) 2009-01-11 2017-09-15 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조시에 기판을 이송하기 위한 로봇 시스템, 장치 및 방법
US8397739B2 (en) 2010-01-08 2013-03-19 Applied Materials, Inc. N-channel flow ratio controller calibration
US8567837B2 (en) 2010-11-24 2013-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Reconfigurable guide pin design for centering wafers having different sizes
USD684546S1 (en) 2011-02-04 2013-06-18 Panasonic Corporation Electroluminescence module
JP6003011B2 (ja) 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
CN106941087B (zh) 2011-08-12 2020-03-10 恩特格里斯公司 晶片载具
US9579788B2 (en) 2012-02-10 2017-02-28 Ascent Ventures, Llc Automated testing and verification of a robotic system
US10842461B2 (en) 2012-06-21 2020-11-24 Globus Medical, Inc. Systems and methods of checking registrations for surgical systems
WO2014008403A1 (en) 2012-07-03 2014-01-09 Visa International Service Association Data protection hub
US9462732B2 (en) 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
US9425077B2 (en) 2013-03-15 2016-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus with transportable edge ring for substrate transport
KR101597211B1 (ko) 2014-08-05 2016-03-07 주식회사 엘지실트론 웨이퍼 정렬 장치 및 방법
US20170263478A1 (en) 2015-01-16 2017-09-14 Lam Research Corporation Detection System for Tunable/Replaceable Edge Coupling Ring
US11605546B2 (en) 2015-01-16 2023-03-14 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10041868B2 (en) 2015-01-28 2018-08-07 Lam Research Corporation Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber
US10014198B2 (en) 2015-08-21 2018-07-03 Lam Research Corporation Wear detection of consumable part in semiconductor manufacturing equipment
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US20170115657A1 (en) * 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US10124492B2 (en) 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US10985078B2 (en) 2015-11-06 2021-04-20 Lam Research Corporation Sensor and adjuster for a consumable
CN108369922B (zh) 2016-01-26 2023-03-21 应用材料公司 晶片边缘环升降解决方案
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US10438833B2 (en) 2016-02-16 2019-10-08 Lam Research Corporation Wafer lift ring system for wafer transfer
US10312121B2 (en) 2016-03-29 2019-06-04 Lam Research Corporation Systems and methods for aligning measurement device in substrate processing systems
US11011353B2 (en) 2016-03-29 2021-05-18 Lam Research Corporation Systems and methods for performing edge ring characterization
US11211274B2 (en) 2016-05-26 2021-12-28 Entegris, Inc. Latching mechanism for a substrate container
JP6635888B2 (ja) 2016-07-14 2020-01-29 東京エレクトロン株式会社 プラズマ処理システム
JP2018054500A (ja) 2016-09-29 2018-04-05 東京エレクトロン株式会社 位置検出システム及び処理装置
JP6812224B2 (ja) 2016-12-08 2021-01-13 東京エレクトロン株式会社 基板処理装置及び載置台
US9947517B1 (en) 2016-12-16 2018-04-17 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US10553404B2 (en) 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
JP6812264B2 (ja) 2017-02-16 2021-01-13 東京エレクトロン株式会社 真空処理装置、及びメンテナンス装置
US11404249B2 (en) 2017-03-22 2022-08-02 Tokyo Electron Limited Substrate processing apparatus
JP6656200B2 (ja) 2017-04-12 2020-03-04 東京エレクトロン株式会社 位置検出システム及び処理装置
TWI843457B (zh) 2017-04-26 2024-05-21 日商東京威力科創股份有限公司 電漿處理裝置
JP7300817B2 (ja) 2018-09-21 2023-06-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
US11247330B2 (en) * 2018-10-19 2022-02-15 Asm Ip Holding B.V. Method for teaching a transportation position and alignment jig
KR20200102612A (ko) * 2019-02-21 2020-09-01 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101216686A (zh) * 2008-01-10 2008-07-09 上海微电子装备有限公司 一种晶片预对准平台及使用该平台的晶片预对准方法
CN109545642A (zh) * 2017-09-21 2019-03-29 应用材料公司 用于半导体工艺模块的原位设备

Also Published As

Publication number Publication date
JP2022525248A (ja) 2022-05-11
KR102434952B1 (ko) 2022-08-19
US10964584B2 (en) 2021-03-30
US11842917B2 (en) 2023-12-12
JP7565984B2 (ja) 2024-10-11
JP2022160683A (ja) 2022-10-19
KR20210156339A (ko) 2021-12-24
TWI776153B (zh) 2022-09-01
TW202107611A (zh) 2021-02-16
JP7125244B2 (ja) 2022-08-24
WO2020236916A1 (en) 2020-11-26
CN113853673A (zh) 2021-12-28
KR20220118561A (ko) 2022-08-25
US20200373194A1 (en) 2020-11-26
KR102669235B1 (ko) 2024-05-23
US20210217650A1 (en) 2021-07-15
CN113853673B (zh) 2022-12-27
TW202247344A (zh) 2022-12-01
JP2024102307A (ja) 2024-07-30

Similar Documents

Publication Publication Date Title
TWI803409B (zh) 處理套組環配接器
TWI527149B (zh) 慣性晶圓定心末端作用器及輸送裝置
US9728436B2 (en) Transfer mechanism with multiple wafer handling capability
TWI895386B (zh) 外殼系統層架
TWI824149B (zh) 處理套組外殼系統
CN1291345A (zh) 用在处理系统晶片搬运器上的端部操作装置
US11211269B2 (en) Multi-object capable loadlock system
KR20250002830A (ko) 교체 부품 저장 컨테이너의 맵핑
CN103377973B (zh) 多腔室基片处理设备
JP7805401B2 (ja) 基板処理システムキャリア
CN115244674A (zh) 基板处理设备
WO2021016115A1 (en) Multi-object capable loadlock system
US20070057322A1 (en) Substrate carrier having reduced height
US20030002970A1 (en) End effector for lifting semiconductor wafer carrier
TWM680882U (zh) 端效器