KR102434952B1 - 프로세스 키트 링 어댑터 - Google Patents

프로세스 키트 링 어댑터 Download PDF

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Publication number
KR102434952B1
KR102434952B1 KR1020217041343A KR20217041343A KR102434952B1 KR 102434952 B1 KR102434952 B1 KR 102434952B1 KR 1020217041343 A KR1020217041343 A KR 1020217041343A KR 20217041343 A KR20217041343 A KR 20217041343A KR 102434952 B1 KR102434952 B1 KR 102434952B1
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South Korea
Prior art keywords
process kit
kit ring
ring adapter
adapter
end effector
Prior art date
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KR1020217041343A
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English (en)
Korean (ko)
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KR20210156339A (ko
Inventor
레온 볼포프스키
안드레아스 슈미드
데니스 마틴 쿠사우
니콜라스 마이클 코펙
스티븐 바바얀
더글라스 알. 맥칼리스터
헬더 리
제프리 허진스
데이먼 케이. 콕스
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어플라이드 머티어리얼스, 인코포레이티드
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Priority to KR1020227028237A priority Critical patent/KR102669235B1/ko
Publication of KR20210156339A publication Critical patent/KR20210156339A/ko
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    • H01L21/67363—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1908—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H01L21/67069—
    • H01L21/67383—
    • H01L21/67742—
    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020217041343A 2019-05-20 2020-05-20 프로세스 키트 링 어댑터 Active KR102434952B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227028237A KR102669235B1 (ko) 2019-05-20 2020-05-20 프로세스 키트 링 어댑터

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/417,369 2019-05-20
US16/417,369 US10964584B2 (en) 2019-05-20 2019-05-20 Process kit ring adaptor
PCT/US2020/033774 WO2020236916A1 (en) 2019-05-20 2020-05-20 Process kit ring adaptor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227028237A Division KR102669235B1 (ko) 2019-05-20 2020-05-20 프로세스 키트 링 어댑터

Publications (2)

Publication Number Publication Date
KR20210156339A KR20210156339A (ko) 2021-12-24
KR102434952B1 true KR102434952B1 (ko) 2022-08-19

Family

ID=73456142

Family Applications (2)

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KR1020217041343A Active KR102434952B1 (ko) 2019-05-20 2020-05-20 프로세스 키트 링 어댑터
KR1020227028237A Active KR102669235B1 (ko) 2019-05-20 2020-05-20 프로세스 키트 링 어댑터

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Country Status (6)

Country Link
US (2) US10964584B2 (https=)
JP (3) JP7125244B2 (https=)
KR (2) KR102434952B1 (https=)
CN (1) CN113853673B (https=)
TW (2) TWI803409B (https=)
WO (1) WO2020236916A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020232074A1 (en) * 2019-05-14 2020-11-19 Mattson Technology, Inc. Plasma processing apparatus having a focus ring adjustment assembly
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
US11211269B2 (en) 2019-07-19 2021-12-28 Applied Materials, Inc. Multi-object capable loadlock system
KR102888626B1 (ko) * 2020-01-23 2025-11-19 램 리써치 코포레이션 자동화된 회전 사전 정렬을 사용한 에지 링 이송
US12159795B2 (en) 2021-03-08 2024-12-03 Applied Materials, Inc. Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall
KR20220156138A (ko) * 2021-05-17 2022-11-25 세메스 주식회사 링 캐리어 및 기판 처리 시스템
KR102614918B1 (ko) * 2021-06-28 2023-12-20 세메스 주식회사 반송 어셈블리 및 이를 가지는 기판 처리 장치
JP7720235B2 (ja) * 2021-11-26 2025-08-07 株式会社安川電機 アライメント装置、基板搬送システム、アライメント方法、及びプログラム
KR102728371B1 (ko) * 2022-04-01 2024-11-08 세메스 주식회사 엔드 이펙터용 캐리어, 이를 포함하는 운반 장치 및 기판 처리 장치
US12528207B2 (en) * 2022-12-12 2026-01-20 Applied Materials, Inc. Carrier with rotation prevention feature
KR20250038242A (ko) * 2023-09-11 2025-03-19 세메스 주식회사 링 캐리어 및 이를 포함하는 용기
US12603261B2 (en) * 2024-04-04 2026-04-14 Applied Materials, Inc. Aligner station with lifting mechanism

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012216614A (ja) 2011-03-31 2012-11-08 Tokyo Electron Ltd 基板処理装置
US20140273505A1 (en) 2013-03-15 2014-09-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus with transportable edge ring for substrate transport
US20180068879A1 (en) 2015-10-22 2018-03-08 Lam Research Corporation Front Opening Ring Pod

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749469A (en) 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
JPH0995783A (ja) 1995-10-04 1997-04-08 Sony Corp スパッタ装置
JP3899570B2 (ja) 1996-12-06 2007-03-28 株式会社日立ハイテクノロジーズ 基板処理装置及び液晶パネルの製造方法
USD407073S (en) 1997-12-24 1999-03-23 Applied Materials, Inc. Electrostatic chuck with improved spacing and charge migration reduction mask
US6199291B1 (en) 1998-07-29 2001-03-13 Sony Corporation Alignment fixture
JP3234576B2 (ja) * 1998-10-30 2001-12-04 アプライド マテリアルズ インコーポレイテッド 半導体製造装置におけるウェハ支持装置
US7040487B2 (en) 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
US7641247B2 (en) 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
USD489739S1 (en) 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US7792350B2 (en) 2003-11-10 2010-09-07 Brooks Automation, Inc. Wafer center finding
US7230702B2 (en) * 2003-11-13 2007-06-12 Applied Materials, Inc. Monitoring of smart pin transition timing
DE102004053906A1 (de) * 2004-11-05 2006-05-11 Leica Microsystems Semiconductor Gmbh Adaptervorrichtung für eine Substrat-Arbeitsstation
JP4559317B2 (ja) 2005-07-21 2010-10-06 株式会社岡本工作機械製作所 半導体基板の搬送方法
US7727800B2 (en) * 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. High precision die bonding apparatus
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
JP2009095783A (ja) 2007-10-17 2009-05-07 Recs:Kk 液塗布装置
WO2009059433A1 (en) 2007-11-09 2009-05-14 The Royal Institution For The Advancement Of Learning/Mcgill University Quantification of an absorber through a scattering medium
CN101216686B (zh) * 2008-01-10 2010-08-25 上海微电子装备有限公司 一种晶片预对准平台及使用该平台的晶片预对准方法
WO2010026955A1 (ja) * 2008-09-08 2010-03-11 芝浦メカトロニクス株式会社 基板保持部材、基板処理装置、基板処理方法
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
KR101778519B1 (ko) 2009-01-11 2017-09-15 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조시에 기판을 이송하기 위한 로봇 시스템, 장치 및 방법
US8397739B2 (en) 2010-01-08 2013-03-19 Applied Materials, Inc. N-channel flow ratio controller calibration
US8567837B2 (en) 2010-11-24 2013-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Reconfigurable guide pin design for centering wafers having different sizes
USD684546S1 (en) 2011-02-04 2013-06-18 Panasonic Corporation Electroluminescence module
CN106941087B (zh) 2011-08-12 2020-03-10 恩特格里斯公司 晶片载具
US9579788B2 (en) 2012-02-10 2017-02-28 Ascent Ventures, Llc Automated testing and verification of a robotic system
US10842461B2 (en) 2012-06-21 2020-11-24 Globus Medical, Inc. Systems and methods of checking registrations for surgical systems
WO2014008403A1 (en) 2012-07-03 2014-01-09 Visa International Service Association Data protection hub
US9462732B2 (en) 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
KR101597211B1 (ko) 2014-08-05 2016-03-07 주식회사 엘지실트론 웨이퍼 정렬 장치 및 방법
US20170263478A1 (en) 2015-01-16 2017-09-14 Lam Research Corporation Detection System for Tunable/Replaceable Edge Coupling Ring
US11605546B2 (en) 2015-01-16 2023-03-14 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10041868B2 (en) 2015-01-28 2018-08-07 Lam Research Corporation Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber
US10014198B2 (en) 2015-08-21 2018-07-03 Lam Research Corporation Wear detection of consumable part in semiconductor manufacturing equipment
US20170115657A1 (en) * 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US10124492B2 (en) 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US10985078B2 (en) 2015-11-06 2021-04-20 Lam Research Corporation Sensor and adjuster for a consumable
CN108369922B (zh) 2016-01-26 2023-03-21 应用材料公司 晶片边缘环升降解决方案
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US10438833B2 (en) 2016-02-16 2019-10-08 Lam Research Corporation Wafer lift ring system for wafer transfer
US10312121B2 (en) 2016-03-29 2019-06-04 Lam Research Corporation Systems and methods for aligning measurement device in substrate processing systems
US11011353B2 (en) 2016-03-29 2021-05-18 Lam Research Corporation Systems and methods for performing edge ring characterization
US11211274B2 (en) 2016-05-26 2021-12-28 Entegris, Inc. Latching mechanism for a substrate container
JP6635888B2 (ja) 2016-07-14 2020-01-29 東京エレクトロン株式会社 プラズマ処理システム
JP2018054500A (ja) 2016-09-29 2018-04-05 東京エレクトロン株式会社 位置検出システム及び処理装置
JP6812224B2 (ja) 2016-12-08 2021-01-13 東京エレクトロン株式会社 基板処理装置及び載置台
US9947517B1 (en) 2016-12-16 2018-04-17 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US10553404B2 (en) 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
JP6812264B2 (ja) 2017-02-16 2021-01-13 東京エレクトロン株式会社 真空処理装置、及びメンテナンス装置
US11404249B2 (en) 2017-03-22 2022-08-02 Tokyo Electron Limited Substrate processing apparatus
JP6656200B2 (ja) 2017-04-12 2020-03-04 東京エレクトロン株式会社 位置検出システム及び処理装置
TWI843457B (zh) 2017-04-26 2024-05-21 日商東京威力科創股份有限公司 電漿處理裝置
US11075105B2 (en) * 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
JP7300817B2 (ja) 2018-09-21 2023-06-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
US11247330B2 (en) * 2018-10-19 2022-02-15 Asm Ip Holding B.V. Method for teaching a transportation position and alignment jig
KR20200102612A (ko) * 2019-02-21 2020-09-01 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012216614A (ja) 2011-03-31 2012-11-08 Tokyo Electron Ltd 基板処理装置
US20140273505A1 (en) 2013-03-15 2014-09-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus with transportable edge ring for substrate transport
US20180068879A1 (en) 2015-10-22 2018-03-08 Lam Research Corporation Front Opening Ring Pod

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