TWI801559B - 鋁製加熱器 - Google Patents

鋁製加熱器 Download PDF

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Publication number
TWI801559B
TWI801559B TW108113401A TW108113401A TWI801559B TW I801559 B TWI801559 B TW I801559B TW 108113401 A TW108113401 A TW 108113401A TW 108113401 A TW108113401 A TW 108113401A TW I801559 B TWI801559 B TW I801559B
Authority
TW
Taiwan
Prior art keywords
plate
aluminum material
groove
vias
heater
Prior art date
Application number
TW108113401A
Other languages
English (en)
Chinese (zh)
Other versions
TW201944845A (zh
Inventor
派翠克 馬格維奧
庫特 英格利
Original Assignee
美商瓦特洛威電子製造公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商瓦特洛威電子製造公司 filed Critical 美商瓦特洛威電子製造公司
Publication of TW201944845A publication Critical patent/TW201944845A/zh
Application granted granted Critical
Publication of TWI801559B publication Critical patent/TWI801559B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
TW108113401A 2018-04-17 2019-04-17 鋁製加熱器 TWI801559B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862658768P 2018-04-17 2018-04-17
US62/658,768 2018-04-17

Publications (2)

Publication Number Publication Date
TW201944845A TW201944845A (zh) 2019-11-16
TWI801559B true TWI801559B (zh) 2023-05-11

Family

ID=66476829

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108113401A TWI801559B (zh) 2018-04-17 2019-04-17 鋁製加熱器
TW112113460A TWI829577B (zh) 2018-04-17 2019-04-17 鋁製加熱器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112113460A TWI829577B (zh) 2018-04-17 2019-04-17 鋁製加熱器

Country Status (5)

Country Link
US (1) US20190320501A1 (https=)
JP (1) JP7379372B2 (https=)
KR (1) KR102735500B1 (https=)
TW (2) TWI801559B (https=)
WO (1) WO2019204433A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560851A (en) * 1993-11-11 1996-10-01 Hoechst Ceramtec Aktiengesellschaft Process for producing ceramic heating elements
US6507006B1 (en) * 2000-02-25 2003-01-14 Ibiden Co., Ltd. Ceramic substrate and process for producing the same
TW201127181A (en) * 2010-01-26 2011-08-01 Betacera Inc Finned ceramic heater

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US955431A (en) 1909-09-16 1910-04-19 Arthur Priddle Machine for slitting and flanging metal bars.
JPS63157401A (ja) * 1986-12-22 1988-06-30 アルプス電気株式会社 発熱抵抗体およびこれを用いたサ−マルヘツド
JP3567678B2 (ja) * 1996-05-05 2004-09-22 征一郎 宮田 通電発熱体
JP2000012195A (ja) * 1998-06-29 2000-01-14 Ibiden Co Ltd セラミックヒータ
CN100493267C (zh) * 2000-11-29 2009-05-27 萨莫希雷梅克斯公司 具有控制电阻率的电阻加热器及其制备方法
JP3929840B2 (ja) * 2002-06-26 2007-06-13 京セラ株式会社 ウェハ加熱装置
JP2005026082A (ja) * 2003-07-02 2005-01-27 Ibiden Co Ltd セラミックヒータ
TW200633947A (en) * 2005-02-16 2006-10-01 Ngk Insulators Ltd Joined body and manufacturing method for the same
JPWO2008065930A1 (ja) * 2006-11-30 2010-03-04 株式会社クリエイティブ テクノロジー シート状ヒータ
US7763831B2 (en) * 2006-12-15 2010-07-27 Ngk Insulators, Ltd. Heating device
JP4791571B2 (ja) * 2009-11-26 2011-10-12 田中電子工業株式会社 超音波ボンディング用アルミニウムリボン
KR101520201B1 (ko) * 2010-11-18 2015-05-13 쌩-고벵 글래스 프랑스 온도 모니터링 기능을 갖춘 패널 히터
WO2013033340A1 (en) 2011-08-30 2013-03-07 Watlow Electric Manufacturing Company Thermal array system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560851A (en) * 1993-11-11 1996-10-01 Hoechst Ceramtec Aktiengesellschaft Process for producing ceramic heating elements
US6507006B1 (en) * 2000-02-25 2003-01-14 Ibiden Co., Ltd. Ceramic substrate and process for producing the same
TW201127181A (en) * 2010-01-26 2011-08-01 Betacera Inc Finned ceramic heater

Also Published As

Publication number Publication date
KR102735500B1 (ko) 2024-11-29
TWI829577B (zh) 2024-01-11
TW202332315A (zh) 2023-08-01
JP7379372B2 (ja) 2023-11-14
WO2019204433A1 (en) 2019-10-24
US20190320501A1 (en) 2019-10-17
JP2021522649A (ja) 2021-08-30
TW201944845A (zh) 2019-11-16
KR20210016521A (ko) 2021-02-16

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