JP7379372B2 - オールアルミニウムヒーター - Google Patents

オールアルミニウムヒーター Download PDF

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Publication number
JP7379372B2
JP7379372B2 JP2020558053A JP2020558053A JP7379372B2 JP 7379372 B2 JP7379372 B2 JP 7379372B2 JP 2020558053 A JP2020558053 A JP 2020558053A JP 2020558053 A JP2020558053 A JP 2020558053A JP 7379372 B2 JP7379372 B2 JP 7379372B2
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JP
Japan
Prior art keywords
plate member
vias
heater
aluminum material
layer
Prior art date
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Application number
JP2020558053A
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English (en)
Japanese (ja)
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JP2021522649A5 (https=
JP2021522649A (ja
JPWO2019204433A5 (https=
Inventor
パトリック マルガヴィオ，
カート イングリッシュ，
Original Assignee
ワトロー エレクトリック マニュファクチュアリング カンパニー
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Application filed by ワトロー エレクトリック マニュファクチュアリング カンパニー filed Critical ワトロー エレクトリック マニュファクチュアリング カンパニー
Publication of JP2021522649A publication Critical patent/JP2021522649A/ja
Publication of JP2021522649A5 publication Critical patent/JP2021522649A5/ja
Publication of JPWO2019204433A5 publication Critical patent/JPWO2019204433A5/ja
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Publication of JP7379372B2 publication Critical patent/JP7379372B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
JP2020558053A 2018-04-17 2019-04-17 オールアルミニウムヒーター Active JP7379372B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862658768P 2018-04-17 2018-04-17
US62/658,768 2018-04-17
PCT/US2019/027865 WO2019204433A1 (en) 2018-04-17 2019-04-17 All aluminum heater

Publications (4)

Publication Number Publication Date
JP2021522649A JP2021522649A (ja) 2021-08-30
JP2021522649A5 JP2021522649A5 (https=) 2022-03-31
JPWO2019204433A5 JPWO2019204433A5 (https=) 2022-03-31
JP7379372B2 true JP7379372B2 (ja) 2023-11-14

Family

ID=66476829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020558053A Active JP7379372B2 (ja) 2018-04-17 2019-04-17 オールアルミニウムヒーター

Country Status (5)

Country Link
US (1) US20190320501A1 (https=)
JP (1) JP7379372B2 (https=)
KR (1) KR102735500B1 (https=)
TW (2) TWI801559B (https=)
WO (1) WO2019204433A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012195A (ja) 1998-06-29 2000-01-14 Ibiden Co Ltd セラミックヒータ
JP2004031631A (ja) 2002-06-26 2004-01-29 Kyocera Corp ウェハ加熱装置
JP2004528677A (ja) 2000-11-29 2004-09-16 サーモセラミックス インコーポレイテッド 抵抗加熱器及びその使用法
JP2005026082A (ja) 2003-07-02 2005-01-27 Ibiden Co Ltd セラミックヒータ
JP2006225260A (ja) 2005-02-16 2006-08-31 Ngk Insulators Ltd 接合体及びその製造方法
WO2008065930A1 (fr) 2006-11-30 2008-06-05 Creative Technology Corporation Corps chauffant en feuille
JP2014502408A (ja) 2010-11-18 2014-01-30 サン−ゴバン グラス フランス 温度監視機能付きパネルヒータ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US955431A (en) 1909-09-16 1910-04-19 Arthur Priddle Machine for slitting and flanging metal bars.
JPS63157401A (ja) * 1986-12-22 1988-06-30 アルプス電気株式会社 発熱抵抗体およびこれを用いたサ−マルヘツド
DE4338539A1 (de) * 1993-11-11 1995-05-18 Hoechst Ceram Tec Ag Verfahren zum Herstellen von keramischen Heizelementen
JP3567678B2 (ja) * 1996-05-05 2004-09-22 征一郎 宮田 通電発熱体
JP2001244320A (ja) * 2000-02-25 2001-09-07 Ibiden Co Ltd セラミック基板およびその製造方法
US7763831B2 (en) * 2006-12-15 2010-07-27 Ngk Insulators, Ltd. Heating device
JP4791571B2 (ja) * 2009-11-26 2011-10-12 田中電子工業株式会社 超音波ボンディング用アルミニウムリボン
TWI411346B (zh) * 2010-01-26 2013-10-01 Betacera Inc 鰭片式陶瓷加熱器
WO2013033340A1 (en) 2011-08-30 2013-03-07 Watlow Electric Manufacturing Company Thermal array system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012195A (ja) 1998-06-29 2000-01-14 Ibiden Co Ltd セラミックヒータ
JP2004528677A (ja) 2000-11-29 2004-09-16 サーモセラミックス インコーポレイテッド 抵抗加熱器及びその使用法
JP2004031631A (ja) 2002-06-26 2004-01-29 Kyocera Corp ウェハ加熱装置
JP2005026082A (ja) 2003-07-02 2005-01-27 Ibiden Co Ltd セラミックヒータ
JP2006225260A (ja) 2005-02-16 2006-08-31 Ngk Insulators Ltd 接合体及びその製造方法
WO2008065930A1 (fr) 2006-11-30 2008-06-05 Creative Technology Corporation Corps chauffant en feuille
JP2014502408A (ja) 2010-11-18 2014-01-30 サン−ゴバン グラス フランス 温度監視機能付きパネルヒータ

Also Published As

Publication number Publication date
KR102735500B1 (ko) 2024-11-29
TWI829577B (zh) 2024-01-11
TW202332315A (zh) 2023-08-01
TWI801559B (zh) 2023-05-11
WO2019204433A1 (en) 2019-10-24
US20190320501A1 (en) 2019-10-17
JP2021522649A (ja) 2021-08-30
TW201944845A (zh) 2019-11-16
KR20210016521A (ko) 2021-02-16

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