TWI801282B - 一種晶圓研磨設備 - Google Patents

一種晶圓研磨設備 Download PDF

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Publication number
TWI801282B
TWI801282B TW111125441A TW111125441A TWI801282B TW I801282 B TWI801282 B TW I801282B TW 111125441 A TW111125441 A TW 111125441A TW 111125441 A TW111125441 A TW 111125441A TW I801282 B TWI801282 B TW I801282B
Authority
TW
Taiwan
Prior art keywords
grinding device
wafer grinding
wafer
grinding
Prior art date
Application number
TW111125441A
Other languages
English (en)
Other versions
TW202241643A (zh
Inventor
徐全
Original Assignee
大陸商西安奕斯偉材料科技有限公司
大陸商西安奕斯偉矽片技術有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商西安奕斯偉材料科技有限公司, 大陸商西安奕斯偉矽片技術有限公司 filed Critical 大陸商西安奕斯偉材料科技有限公司
Publication of TW202241643A publication Critical patent/TW202241643A/zh
Application granted granted Critical
Publication of TWI801282B publication Critical patent/TWI801282B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW111125441A 2021-07-16 2022-07-07 一種晶圓研磨設備 TWI801282B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110805056.4A CN113352228B (zh) 2021-07-16 2021-07-16 一种晶圆研磨设备
CN202110805056.4 2021-07-16

Publications (2)

Publication Number Publication Date
TW202241643A TW202241643A (zh) 2022-11-01
TWI801282B true TWI801282B (zh) 2023-05-01

Family

ID=77539819

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111125441A TWI801282B (zh) 2021-07-16 2022-07-07 一種晶圓研磨設備

Country Status (2)

Country Link
CN (1) CN113352228B (zh)
TW (1) TWI801282B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115990825A (zh) * 2022-12-27 2023-04-21 西安奕斯伟材料科技股份有限公司 一种硅片双面抛光用的载具、双面抛光装置及硅片

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891894B2 (ja) * 1995-03-30 1999-05-17 大陽東洋酸素株式会社 基板回転装置
TW415878B (en) * 1995-11-27 2000-12-21 Shinetsu Handotai Kk Apparatus and method for double-side polishing semiconductor wafers
JP2003305637A (ja) * 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk 脆性薄板の研磨用ホルダ
KR100506814B1 (ko) * 2003-01-15 2005-08-09 삼성전자주식회사 웨이퍼 연마 장치
TW200849368A (en) * 2007-03-19 2008-12-16 Siltronic Ag Method for simultaneous grinding of a plurality of semiconductor wafers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2605230B2 (ja) * 1994-12-27 1997-04-30 弘至 川島 ラッピング装置およびその作製方法
JPH11138428A (ja) * 1997-10-31 1999-05-25 Kashiwara Machine Mfg Co Ltd ウエーハ研磨装置及びキャリア
JP2001138221A (ja) * 1999-11-12 2001-05-22 Toshiba Ceramics Co Ltd 半導体ウエハラッピング用キャリア
US6454635B1 (en) * 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
JP2004283929A (ja) * 2003-03-20 2004-10-14 Shin Etsu Handotai Co Ltd ウエーハ保持用キャリア並びにそれを用いた両面研磨装置及びウエーハの両面研磨方法
CN1993206A (zh) * 2004-08-02 2007-07-04 昭和电工株式会社 用于磁记录介质的抛光托架和硅基底的制造方法以及用于磁记录介质的硅基底
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
CN110871399A (zh) * 2018-08-29 2020-03-10 东泰高科装备科技（北京）有限公司 游星轮与抛光方法
CN110181355B (zh) * 2019-06-27 2021-08-17 西安奕斯伟硅片技术有限公司 一种研磨装置、研磨方法及晶圆
CN212062392U (zh) * 2020-05-26 2020-12-01 长江存储科技有限责任公司 测量装置
CN112454017A (zh) * 2020-11-25 2021-03-09 西安奕斯伟硅片技术有限公司 硅片抛光方法和硅片抛光设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891894B2 (ja) * 1995-03-30 1999-05-17 大陽東洋酸素株式会社 基板回転装置
TW415878B (en) * 1995-11-27 2000-12-21 Shinetsu Handotai Kk Apparatus and method for double-side polishing semiconductor wafers
JP2003305637A (ja) * 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk 脆性薄板の研磨用ホルダ
KR100506814B1 (ko) * 2003-01-15 2005-08-09 삼성전자주식회사 웨이퍼 연마 장치
TW200849368A (en) * 2007-03-19 2008-12-16 Siltronic Ag Method for simultaneous grinding of a plurality of semiconductor wafers

Also Published As

Publication number Publication date
TW202241643A (zh) 2022-11-01
CN113352228A (zh) 2021-09-07
CN113352228B (zh) 2022-06-24

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