TWI799445B - 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組 - Google Patents

電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組 Download PDF

Info

Publication number
TWI799445B
TWI799445B TW107131739A TW107131739A TWI799445B TW I799445 B TWI799445 B TW I799445B TW 107131739 A TW107131739 A TW 107131739A TW 107131739 A TW107131739 A TW 107131739A TW I799445 B TWI799445 B TW I799445B
Authority
TW
Taiwan
Prior art keywords
manufacturing
adhesive film
circuit connection
storage set
connection structure
Prior art date
Application number
TW107131739A
Other languages
English (en)
Other versions
TW201920554A (zh
Inventor
森尻智樹
大當友美子
Sunao Kudou
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW201920554A publication Critical patent/TW201920554A/zh
Application granted granted Critical
Publication of TWI799445B publication Critical patent/TWI799445B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW107131739A 2017-09-11 2018-09-10 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組 TWI799445B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-173941 2017-09-11
JP2017173941 2017-09-11

Publications (2)

Publication Number Publication Date
TW201920554A TW201920554A (zh) 2019-06-01
TWI799445B true TWI799445B (zh) 2023-04-21

Family

ID=65634086

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107131739A TWI799445B (zh) 2017-09-11 2018-09-10 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組

Country Status (5)

Country Link
JP (1) JP7264054B2 (zh)
KR (2) KR20230074287A (zh)
CN (1) CN111051456B (zh)
TW (1) TWI799445B (zh)
WO (1) WO2019050011A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022009846A1 (zh) * 2020-07-07 2022-01-13
JP2022072297A (ja) * 2020-10-29 2022-05-17 デクセリアルズ株式会社 異方性導電フィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201318952A (zh) * 2011-08-18 2013-05-16 Hitachi Chemical Co Ltd 接著材捲筒、阻塞抑制方法、接著材捲筒的交換方法、接著材帶的抽出方法、接著材捲筒的製造方法、設置結束標誌的方法、捲筒套件及包裝體
TW201422745A (zh) * 2012-08-03 2014-06-16 Dexerials Corp 異向性導電膜及其製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3873651B2 (ja) 2001-04-23 2007-01-24 ソニーケミカル＆インフォメーションデバイス株式会社 帯電防止剤組成物
CN101483080A (zh) 2003-12-04 2009-07-15 旭化成电子材料元件株式会社 各向异性的导电粘合片材及连接结构体
JP5067355B2 (ja) * 2007-12-17 2012-11-07 日立化成工業株式会社 回路接続材料及び回路部材の接続構造
JP4897778B2 (ja) * 2008-11-20 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
JP2010199087A (ja) * 2010-05-11 2010-09-09 Sony Chemical & Information Device Corp 異方性導電膜及びその製造方法、並びに、接合体及びその製造方法
CN202414504U (zh) 2010-12-27 2012-09-05 日立化成工业株式会社 包装袋
KR20120076187A (ko) * 2010-12-29 2012-07-09 제일모직주식회사 이방 도전성 필름
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
JP6792319B2 (ja) 2014-10-22 2020-11-25 昭和電工マテリアルズ株式会社 異方導電フィルム巻

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201318952A (zh) * 2011-08-18 2013-05-16 Hitachi Chemical Co Ltd 接著材捲筒、阻塞抑制方法、接著材捲筒的交換方法、接著材帶的抽出方法、接著材捲筒的製造方法、設置結束標誌的方法、捲筒套件及包裝體
TW201422745A (zh) * 2012-08-03 2014-06-16 Dexerials Corp 異向性導電膜及其製造方法

Also Published As

Publication number Publication date
CN111051456A (zh) 2020-04-21
JPWO2019050011A1 (ja) 2020-08-20
KR102533475B1 (ko) 2023-05-19
WO2019050011A1 (ja) 2019-03-14
CN111051456B (zh) 2022-08-05
TW201920554A (zh) 2019-06-01
JP7264054B2 (ja) 2023-04-25
KR20230074287A (ko) 2023-05-26
KR20200052281A (ko) 2020-05-14

Similar Documents

Publication Publication Date Title
TWI799415B (zh) 半導體裝置的製造方法及可擴展膠帶
KR20180084762A (ko) 비정질 투명 도전성 필름, 그리고, 결정질 투명 도전성 필름 및 그 제조 방법
SE1650380A1 (sv) Oxygen barrier film and laminate and methods of manufacturing the same
EP3287819A4 (en) PROCESS FOR MANUFACTURING MULTILAYER FILM AND MULTILAYER FILM
PT3572478T (pt) Uso de película adesiva e processo de fabrico de aparelho eletrónico
SG11201601300TA (en) Adhesive film and method for manufacturing semiconductor device
KR102276146B9 (ko) 박막 트랜지스터 기판 및 이의 제조 방법
JP2015186128A5 (zh)
TWI563668B (en) Thin film transistor, method of manufacturing thereof, and application thereof
EP3296432A4 (en) Porous nickel thin film and manufacturing method thereof
KR20180084932A (ko) 다층 구조용 접착 필름
TWI799375B (zh) 零件製造用膜及零件的製造方法
GB201717453D0 (en) Thin film transistor array substrate and manufacturing method thereof
TWI799445B (zh) 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組
TWI800487B (zh) 固體攝像元件及製造方法、以及電子機器
KR20180084929A (ko) 회로 접속용 접착제 조성물 및 구조체
EP3306669A4 (en) Thin film transistor and manufacturing method thereof
TWI799478B (zh) 半導體裝置、及半導體裝置之製造方法
SG11202007053XA (en) Manufacturing method for semiconductor device, and adhesive film
SG11202004352PA (en) Laminated film and method for producing semiconductor element
SG11202002552PA (en) Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device
EP3626335A4 (en) POROUS RESIN FILM ON A FLUORINE BASE AND PRODUCTION METHOD THEREFOR
TWI799544B (zh) 黏著膠帶及半導體裝置的製造方法
TWI799419B (zh) 相位差薄膜及製造方法
DE112016006352A5 (de) Folienherstellungsverfahren, folienherstellungsanordnung und kunststofffolie