TWI798848B - Fingerprint sensing module and display apparatus - Google Patents

Abstract

A fingerprint sensing module including a first substrate, a second substrate, a plurality of first micro-lenses, a first light shielding pattern layer, a plurality of second micro-lenses, a second light shielding pattern layer and a cavity is provided. The second substrate is opposite to the first substrate. The first micro-lenses and the second micro-lenses are disposed between the first substrate and the second substrate, and are respectively located on the first substrate and the second substrate. The first light shielding pattern layer is disposed between the first substrate and the first micro-lenses, and has a plurality of first openings corresponding to the first micro-lenses. The second light shielding pattern layer is disposed between the second substrate and the second micro-lenses, and has a plurality of second openings corresponding to the second micro-lenses. The cavity is disposed between the first micro-lenses and the second micro-lenses. A display apparatus adopting the fingerprint sensing module is also provided.

Description

Fingerprint sensing module and display device

The present invention relates to an image sensing module, and in particular to a fingerprint sensing module.

In order to increase the screen-to-body ratio of the display to achieve a narrow bezel design, under-display fingerprint sensing technology has become a trend. To put it simply, the under-screen fingerprint sensing technology is to configure the fingerprint sensing module under the display panel of the electronic device. After the electronic device detects that the user touches the display screen, the electronic device controls the display panel to emit light to illuminate the surface of the user's finger. The sensing light will be (diffusely) reflected by the user's finger into the fingerprint sensing module under the display panel, and the reflected light will be concentrated on the photosensitive element through multiple micro-lenses and collimating structures to convert it into a digital image signal. The fingerprint image of the user can be obtained.

However, this kind of fingerprint sensing module usually arranges the microlens on the side surface facing the display panel. During the assembly process of the fingerprint sensing module and the display panel, or the transfer process of the fingerprint sensing module In the process, it is easy to collide and cause damage to the microlens structure. In addition, the uniformity of the air gap between the fingerprint sensing module and the display panel is poor, which easily leads to the degradation of the quality of the fingerprint sensing signal. On the other hand, the design of the multi-layer hole array of the collimation structure will also increase the process complexity and production cost of the fingerprint sensing module.

The invention provides a fingerprint sensing module, which has better external force tolerance and lower production cost.

The invention provides a display device, the quality of the fingerprint sensing signal is better.

The fingerprint sensing module of the present invention includes a first substrate, a second substrate, a plurality of first microlenses, a first light-shielding pattern layer, a plurality of second microlenses, a second light-shielding pattern layer and a cavity. The second substrate is opposite to the first substrate. The first microlenses are disposed on the first substrate and located between the first substrate and the second substrate. The first light-shielding pattern layer is disposed between the first substrate and the first microlenses, and has a plurality of first openings corresponding to the first microlenses. The second microlenses are disposed on the second substrate and located between the first substrate and the second substrate. The second light-shielding pattern layer is disposed between the second substrate and the second microlenses, and has a plurality of second holes corresponding to the second microlenses. The cavity is disposed between the first microlenses and the second microlenses.

The display device of the present invention includes a display panel, the above-mentioned fingerprint sensing module, and an optical adhesive layer. The fingerprint sensing module is overlapped on the display panel. The optical adhesive layer is connected between the display panel and the fingerprint sensing module.

Based on the above, in the fingerprint sensing module according to an embodiment of the present invention, the plurality of microlenses respectively disposed on the first substrate and the second substrate can effectively reduce the number of light-shielding pattern layers that need to be configured. In other words, the manufacturing process of the fingerprint sensing module can be simplified. By arranging these micro-lenses between the first substrate and the second substrate, these micro-lenses can be prevented from being damaged by unexpected impact or scratches in the subsequent process, which helps to increase the production efficiency of the fingerprint sensing module. rate and process margin. In the display device using the above-mentioned fingerprint sensing module, since there is no microlens on the surface of the fingerprint sensing module facing the display panel, it is suitable to use a direct bond process to connect the display panel and the fingerprint The sensing module is used to reduce the phenomenon of multiple reflections of light between the display panel and the fingerprint sensing module, thereby greatly improving the fingerprint sensing signal of the display device.

As used herein, "about," "approximately," "essentially," or "essentially" includes the stated value and averages within acceptable deviations from the particular value as determined by one of ordinary skill in the art, taking into account the The measurement in question and the specific amount of error associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or for example within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, "about", "approximately", "essentially" or "substantially" used herein can choose a more acceptable deviation range or standard deviation according to the nature of measurement, cutting or other properties, and can be Not one standard deviation applies to all properties.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" may mean that other elements exist between two elements.

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.

FIG. 1 is a schematic cross-sectional view of a fingerprint sensing module according to a first embodiment of the present invention. FIG. 2 is a partially enlarged schematic diagram of the fingerprint sensing module in FIG. 1 . Referring to FIG. 1 and FIG. 2 , the display device 10 includes a fingerprint sensing module 100 and a display panel 200 that are overlapped with each other. In this embodiment, the fingerprint sensing module 100 can be disposed on the back side of the display panel 200 . More specifically, the display device 10 may be a fingerprint on display (Fingerprint on display) device, but not limited thereto.

The fingerprint sensing module 100 includes a first substrate 101, a second substrate 102, a photosensitive element layer PSL, a first light-shielding pattern layer LS1, a second light-shielding pattern layer LS2, a plurality of first microlenses ML1 and a plurality of second microlenses ML2. The second substrate 102 is opposite to the first substrate 101 . These first microlenses ML1 are disposed on the first substrate 101 . These second microlenses ML2 are disposed on the second substrate 102 . The first light-shielding pattern layer LS1 is disposed between the first substrate 101 and the first microlenses ML1, and has a plurality of first holes LS1a disposed corresponding to the first microlenses ML1. The second light-shielding pattern layer LS2 is disposed between the second substrate 102 and the second microlenses ML2, and has a plurality of second holes LS2a disposed corresponding to the second microlenses ML2. Here, the corresponding relationship between the two components refers to the overlapping relationship of the two components along the direction Z. In this embodiment, the microlenses and the holes can be arranged in an array, for example, arranged in multiple columns and rows along the direction X and the direction Y respectively, but not limited thereto.

The photosensitive element layer PSL may have a plurality of active elements T and a plurality of photosensitive elements 115 , and the photosensitive elements 115 are electrically connected to the active elements T respectively. The active element T has a source SE, a drain DE, a gate GE and a semiconductor pattern SC. The semiconductor pattern SC has a drain region DR, a lightly doped drain region LDR, a channel region CH, a lightly doped source region LSR, and a source region SR, wherein the source SE and the drain DE are electrically connected to the semiconductor pattern SC respectively. The source region SR and the drain region DR, and the gate GE are overlapped in the channel region CH. In this embodiment, the gate GE may be selectively disposed above the semiconductor pattern SC to form a top-gate thin film transistor, but not limited thereto. In other embodiments, the gate GE may also be disposed under the semiconductor pattern SC to form a bottom-gate TFT.

For example, the step of forming the active device T may include: sequentially forming the buffer layer 110, the semiconductor pattern SC, the gate insulating layer 120, the gate GE, the interlayer insulating layer 130, the source SE and the drain DE on the substrate 101, The source SE and the drain DE penetrate through the interlayer insulating layer 130 and the gate insulating layer 120 to electrically connect two different regions of the semiconductor pattern SC, but not limited thereto. In this embodiment, the material of the semiconductor pattern SC is, for example, polysilicon (poly-silicon) semiconductor material, but not limited thereto.

On the other hand, the step of forming the photosensitive element 115 may include: sequentially forming the first electrode E1 , the photoelectric conversion layer PCL, the planarization layer 140 , the second electrode E2 and the planarization layer 150 on the interlayer insulating layer 130 . The material of the photoelectric conversion layer PCL is, for example, silicon-rich oxide (SRO). The first electrode E1 is, for example, a reflective electrode, and the material of the reflective electrode includes metal, alloy, nitride of metal material, oxide of metal material, oxynitride of metal material, or other suitable materials, or metal material Stacked layers with other conductive materials. The second electrode E2 is, for example, a light-transmitting electrode, and the material of the light-transmitting electrode includes metal oxides, such as: indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, or other suitable oxide, or a stacked layer of at least two of the above. In this embodiment, a passivation layer 160 may further be provided between the photosensitive element layer PSL and the second light-shielding pattern layer LS2 .

In this embodiment, the fingerprint sensing module 100 may further include a cladding layer 171 disposed between the plurality of first microlenses ML1 and the first light-shielding pattern layer LS1 and disposed between the plurality of second microlenses ML2 and the first light-shielding pattern layer LS1. The cladding layer 172 between the two light-shielding pattern layers LS2. The first microlenses ML1 are directly disposed on the surface 171s of the cladding layer 171 facing the second substrate 102 , and the second microlenses ML2 are directly disposed on the surface 172s of the cladding layer 172 facing the first substrate 101 . More specifically, the first microlenses ML1 and the second microlenses ML2 are disposed between the first substrate 101 and the second substrate 102 . The material of the cladding layer 171 is, for example, an organic photoresist material. For example, the materials of the first microlens ML1 , the second microlens ML2 , the cladding layer 171 and the cladding layer 172 can be optionally the same. That is, these microlenses can be made of organic photoresist material, but not limited thereto.

In this embodiment, the first microlens ML1 and the second microlens ML2 have a first curvature radius R ₁ and a second curvature radius R ₂ respectively, and the first curvature radius R ₁ and the second curvature radius R ₂ can be selected The ground is the same, but not limited to this.

For example, the display device 10 may also be provided with a cover plate 250 on the side of the display panel 200 facing away from the fingerprint sensing module 100 (or, the side of the first substrate 101 facing away from the second substrate 102), and the cover plate 250 There is a cover surface 250s away from the first substrate 101 (or the display panel 200 ). The first light-shielding pattern layer LS1 also has a surface LS1s facing the first substrate 101 . There is a distance D ₀ between the cover surface 250s of the cover 250 and the surface LS1s of the first light-shielding pattern layer LS1 , and a distance D ₁ between the surface 171s of the covering layer 171 and the surface LS1s of the first light-shielding pattern layer LS1 . The first holes LS1a and the first microlenses ML1 of the first light-shielding pattern layer LS1 respectively have a length L ₁ and a length L ₂ along the arrangement direction (for example, the direction X). The first microlens ML1 also has a height H ₁ along a direction perpendicular to the arrangement.

，且第一孔洞LS1a的長度L ₁可滿足以下關係式：

。 In a preferred embodiment, the first radius of curvature _R1 of the first microlens ML1 can satisfy the following relationship:

, and the length L ₁ of the first hole LS1a can satisfy the following relationship:

.

On the other hand, the second light-shielding pattern layer LS2 also has a surface LS2s facing the cavity CA. The photosensitive element 115 has a light receiving surface 115rs facing the cavity CA. There is a distance D ₅ between the surface 172s of the coating layer 172 and the surface LS2s of the second light-shielding pattern layer LS2 , and there is a distance D ₆ between the surface LS2s of the second light-shielding pattern layer LS2 and the light-receiving surface 115rs of the photosensitive element 115 . The second microlens ML2 and the second hole LS2a respectively have a length L ₃ and a length L ₄ (ie, the aperture) along the arrangement direction (eg, the direction X). The second microlens ML2 also has a height H ₂ along a direction perpendicular to the arrangement. The photosensitive element 115 has a length L ₅ along the direction X. The length _L5 here is, for example, defined by the length along the direction X of the interface between the second electrode E2 of the photosensitive element 115 and the photoelectric conversion layer PCL.

，且第二孔洞LS2a的長度L ₄可滿足以下關係式：

。 In a preferred embodiment, the second radius of curvature _R2 of the second microlens ML2 can satisfy the following relationship:

, and the length L ₄ of the second hole LS2a can satisfy the following relationship:

.

It should be noted that a plurality of spacers 180 are also provided between the cladding layer 171 and the cladding layer 172, and these spacers 180, the surface 171s of the cladding layer 171 and the surface 172s of the cladding layer 172 define an accommodating The cavity CA in which these microlenses are placed. More specifically, the first microlenses ML1 and the second microlenses ML2 are spaced apart from each other in the normal direction (eg, direction Z) of the surface 171 s of the cladding layer 171 due to the cavity CA. The cavity CA here may be a space filled with air, a specific gas, or in an approximate vacuum state.

。當第一微透鏡ML1的第一曲率半徑R ₁、第二微透鏡ML2的第二曲率半徑R ₂以及第一微透鏡ML1和第二微透鏡ML2之間的距離D ₃設計在上述的範圍內時，多道指紋影像光線FPi在空腔CA內是以平行光的方式進行傳遞。因此，空腔CA的間隙寬度（例如距離D ₃）變異並不會影響指紋影像的訊號品質。 In this embodiment, the correspondingly arranged first microlens ML1 and second microlens ML2 are separated by a distance _D3 along the direction Z, and the distance _D3 satisfies the following relationship:

. When the first radius of curvature R ₁ of the first microlens ML1, the second radius of curvature R ₂ of the second microlens ML2 and the distance D ₃ between the first microlens ML1 and the second microlens ML2 are designed within the above range , the multiple fingerprint image light rays FPi transmit in the cavity CA in the form of parallel light. Therefore, the variation of the gap width (such as the distance D ₃ ) of the cavity CA will not affect the signal quality of the fingerprint image.

For example, the fingerprint image light FPi incident on the fingerprint sensing module 100 at an appropriate angle passes through the first hole LS1a of the first light-shielding pattern layer LS1 and is refracted by the first microlens ML1 and the second microlens ML2, and then passes through the The second hole LS2 a of the second light-shielding pattern layer LS2 is transmitted to the corresponding light-receiving surface 115 rs of the photosensitive element 115 . Here, the light receiving surface 115rs is defined by, for example, the surface of the second electrode E2 of the photosensitive element 115 facing the first substrate 101 . In other embodiments, it may also be defined by the surface of the photoelectric conversion layer PCL of the photosensitive element 115 facing the first substrate 101 .

On the contrary, the fingerprint image light uFPi (or unexpected external ambient light) entering the fingerprint sensing module 100 at a relatively large incident angle passes through the first hole LS1a of the first light-shielding pattern layer LS1 and passes through the first microlens ML1. After refraction, it will be blocked by the second light-shielding pattern layer LS2 and cannot be transmitted to the corresponding photosensitive element 115 . That is to say, the first microlens ML1 and the second microlens ML2 respectively disposed on the two substrates and corresponding to each other can reduce the incident angle of light transmitted to the photosensitive element 115 . That is to say, the matching design of the first microlens ML1 and the second microlens ML2 can limit the light receiving range of the fingerprint sensing module 100, and effectively suppress background noise (that is, the sensing signal generated by unexpected light), so as to Increase the signal-to-noise ratio (SNR) of the fingerprint signal. In addition, it can also replace part of the light-shielding pattern layers and the spacer layers (such as flat layers) used in general fingerprint sensing modules, which helps to simplify the manufacturing process of the fingerprint sensing module 100 .

On the other hand, since the first microlens ML1 and the second microlens ML2 of the present disclosure are disposed between the first substrate 101 and the second substrate 102, these microlenses can be prevented from being impacted by unexpected external forces in subsequent processes. Damaged by scratches or scratches, it helps to increase the production yield and process margin of the fingerprint sensor module.

In order to make the fingerprint sensing module 100 have an anti-counterfeiting function, a plurality of color filter patterns can also be selectively provided in some of the first holes LS1a of the first light-shielding pattern layer LS1, for example: a color filter pattern suitable for allowing red light to pass through. The light pattern 191 , the color filter pattern 192 suitable for passing green light, and the color filter pattern 193 suitable for passing blue light, but not limited thereto. In other embodiments, the fingerprint sensing module may not be provided with these color filter patterns.

In this embodiment, the display panel 200 is, for example, an organic light emitting diode (organic light emitting diode, OLED) panel, a micro light emitting diode (micro-LED) panel, a submillimeter light emitting diode ( mini light emitting diode, mini-LED) panel, or other suitable self-illuminating display panel. It is particularly noted that, in this embodiment, the display panel 200 can also be used as an illumination light source for fingerprint recognition. However, the present invention is not limited thereto. In other embodiments, the display panel may also be a non-self-illuminating display panel (such as a liquid crystal display panel), and the display device uses a backlight source to provide illumination light required for fingerprint recognition.

In particular, since the fingerprint sensor module 100 of the present disclosure does not have a microlens on the surface facing the display panel 200, it is suitable to use a direct bond process to connect the display panel 200 and the fingerprint sensor. Measuring module 100. In this way, the phenomenon of multiple reflections of light between the display panel 200 and the fingerprint sensing module 100 can be reduced, thereby greatly improving the fingerprint sensing signal of the display device 10 . For example, the fingerprint sensing module 100 and the display panel 200 are bonded together by an optical adhesive layer 220 distributed across the entire surface. The material of the optical adhesive layer 220 includes, for example, optical clear resin (OCR), optical clear adhesive (OCA), pressure sensitive adhesive (PSA), or other suitable adhesive materials.

Some other embodiments will be listed below to describe the present disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted.

FIG. 3 is a schematic cross-sectional view of a fingerprint sensing module according to a second embodiment of the present invention. Please refer to FIG _. 3, the difference between the display device 10A of this embodiment and the display device 10 of FIG. It is larger than the second curvature radius R ₂ of the second microlens ML2 to improve the image resolution of the fingerprint sensing module 100A. More specifically, the concentration of the fingerprint image light FPi-A received by the photosensitive element 115 in this embodiment on the surface 250 s of the cover (ie, the surface pressed by the finger) is improved. That is to say, the fingerprint sensing module 100A can perform image sensing with a small light receiving range, for example, use a point light source to receive light for sensing.

FIG. 4 is a schematic cross-sectional view of a fingerprint sensing module according to a third embodiment of the present invention. Please refer to FIG. 4 , the difference between the display device 10B of this embodiment and the display device 10 of FIG. 1 lies in that the design of the holes of the microlens and the light-shielding pattern layer is different. In this embodiment, the distance D ₃ ″ between the first microlens ML1-B and the second microlens ML2-B of the fingerprint sensing module 100B of the display device 10B can satisfy the following relationship: D ₃ ″≥4∙ R ₁ , so as to increase the incident light quantity of the fingerprint image light FPi-B received by the photosensitive element 115 .

It should be noted that, in this embodiment, in order to maximize the amount of incident fingerprint image light FPi-B incident on the front, for example: the multiple fingerprint image light rays FPi-B received by the photosensitive element 115 are roughly parallel to each other. The way of light is incident on the first microlens ML1-B and focused in the cavity CA between the first microlens ML1-B and the second microlens ML2-B, and these fingerprint image rays FPi-B pass through the second microlens After the lens ML2-B, parallel light is generally incident on the photosensitive element 115 . The length L1" (such as the aperture) of the first hole LS1a" of the first light-shielding pattern layer LS1-B and the length L2" (such as the circle diameter) of the first microlens ML1-B can be optionally the same, and the second microlens The length L3 ″ (such as the diameter of the hole) of the ML2-B and the length L4 ″ (such as the diameter of the circle) of the second holes LS2 a ″ of the second light-shielding pattern layer LS2-B can optionally be the same.

From another point of view, the fingerprint image light uFPi incident obliquely to the fingerprint sensing module 100B or unexpected external ambient light cannot be refracted by the first microlens ML1-B and the second microlens ML2-B and enter the photosensitive Element 115. Therefore, it can effectively suppress the crosstalk (crosstalk) or background noise (that is, the sensing signal generated by unexpected light) of the fingerprint image signal from the non-corresponding area, so as to further increase the signal-to-noise ratio of the fingerprint signal. ratio, SNR).

To sum up, in the fingerprint sensing module according to an embodiment of the present invention, the plurality of microlenses respectively disposed on the first substrate and the second substrate can effectively reduce the number of light-shielding pattern layers that need to be configured. In other words, the manufacturing process of the fingerprint sensing module can be simplified. By arranging these micro-lenses between the first substrate and the second substrate, these micro-lenses can be prevented from being damaged by unexpected impact or scratches in the subsequent process, which helps to increase the production efficiency of the fingerprint sensing module. rate and process margin. In the display device using the above-mentioned fingerprint sensing module, since there is no microlens on the surface of the fingerprint sensing module facing the display panel, it is suitable to use a direct bond process to connect the display panel and the fingerprint The sensing module is used to reduce the phenomenon of multiple reflections of light between the display panel and the fingerprint sensing module, thereby greatly improving the fingerprint sensing signal of the display device.

10, 10A, 10B: display device 100, 100A, 100B: fingerprint sensing module 101: first substrate 102: second substrate 110: buffer layer 115: photosensitive element 115rs: light receiving surface 120: gate insulating layer 130: interlayer Insulating layer 140, 150: flat layer 160: passivation layer 171, 172: cladding layer 171s, 172s, LS1s, LS2s: surface 180: spacer 191, 192, 193: color filter pattern 200: display panel 220: optical glue Layer 250: cover plate 250s: cover plate surface CA: cavity CH: channel area D ₀ , D ₁ , D ₃ , D ₅ , D ₆ , D ₃ ”: distance DE: drain DR: drain area E1: first First electrode E2: second electrode FPi, uFPi, FPi-A, FPi-B: fingerprint image light GE: gate H ₁ , H ₂ : height L ₁ , L ₂ , L ₃ , L ₄ , L ₅ , L ₁ ”, L ₂ ”, L ₃ ”, L ₄ ”: length LDR: lightly doped drain region LSR: lightly doped source region LS1, LS1-B: first light-shielding pattern layer LS2, LS2-B: second Shading pattern layer LS1a, LS1a ": first hole LS2a, LS2a ": second hole ML1, ML1-A, ML1-B: first microlens ML2, ML2-B: second microlens PCL: photoelectric conversion layer PSL: Photosensitive element layer R ₁ , R1': first radius of curvature R ₂ : second radius of curvature SC: semiconductor pattern SE: source SR: source region T: active element X, Y, Z: direction

FIG. 1 is a schematic cross-sectional view of a fingerprint sensing module according to a first embodiment of the present invention. FIG. 2 is a partially enlarged schematic diagram of the fingerprint sensing module in FIG. 1 . FIG. 3 is a schematic cross-sectional view of a fingerprint sensing module according to a second embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a fingerprint sensing module according to a third embodiment of the present invention.

10: Display device

100:Fingerprint sensing module

101: The first substrate

102: Second substrate

115: photosensitive element

115rs: receiving surface

160: passivation layer

171, 172: cladding layer

171s, 172s, LS1s, LS2s: surface

180: spacer

191, 192, 193: color filter pattern

200: display panel

220: optical glue layer

250: cover plate

250s: cover surface

CA: cavity

D ₀ , D ₁ , D ₃ , D ₅ , D ₆ : distance

FPi, uFPi: fingerprint image light

H ₁ , H ₂ : height

L ₁ , L ₂ , L ₃ , L ₄ , L ₅ : Length

LS1: The first shading pattern layer

LS2: Second shading pattern layer

LS1a: First Hole

LS2a: second hole

ML1: the first microlens

ML2: second microlens

PSL: photosensitive element layer

R ₁ : the first radius of curvature

R ₂ : Second radius of curvature

X, Y, Z: direction

Claims (9)

A fingerprint sensing module, comprising: a first substrate; a second substrate disposed opposite to the first substrate; a plurality of first microlenses disposed on the first substrate and located between the first substrate and the first substrate Between the second substrates; a first light-shielding pattern layer, disposed between the first substrate and the first microlenses, and having a plurality of first holes corresponding to the first microlenses; a plurality of first microlenses Two microlenses, arranged on the second substrate and located between the first substrate and the second substrate, wherein each of the first microlenses has a first radius of curvature _R1 greater than or equal to each of the second microlenses A second radius of curvature R ₂ of the lens; a second light-shielding pattern layer disposed between the second substrate and the second microlenses, and having a plurality of second holes corresponding to the second microlenses; and a cavity disposed between the first microlenses and the second microlenses. The fingerprint sensing module as claimed in claim 1, wherein there is a distance D ₃ ″ between the first microlenses and the second microlenses, and each of the first microlenses has a first radius of curvature R ₁ , and the fingerprint sensing module satisfies the following relationship: D ₃ ”

4. R ₁ . The fingerprint sensing module as claimed in item 2, wherein a length of each of the first holes of the first light-shielding pattern layer along a direction is equal to a length of each of the first microlenses along the direction, And a length of each of the second holes of the second light-shielding pattern along the direction is equal to a length of each of the second microlenses along the direction. The fingerprint sensing module according to claim 1, further comprising: a cladding layer disposed between the first light-shielding pattern layer and the first microlenses, and having a first surface facing the cavity , wherein the side of the first substrate facing away from the second substrate is provided with a cover plate, the cover plate has a cover plate surface away from the first substrate, and the first light-shielding pattern layer also has a first light-shielding pattern layer facing the first substrate Two surfaces, a distance D ₀ between the surface of the cover plate and the second surface, a distance D ₁ between the first surface and the second surface, and the first holes of the first light-shielding pattern layer There is a length L ₁ along a direction, each of the first microlenses has a length L ₂ along this direction, and the fingerprint sensing module satisfies the following relationship: L ₂

L ₁

(

). _L2 . The fingerprint sensing module according to claim 1, further comprising: a cladding layer disposed between the second light-shielding pattern layer and the second microlenses, and having a first surface facing the cavity and a plurality of photosensitive elements disposed between the second substrate and the second light-shielding pattern layer, wherein the second light-shielding pattern layer also has a second surface facing the cavity, and each of the photosensitive elements has a second surface facing the cavity A light receiving surface of the cavity, there is a distance D ₅ between the first surface and the second surface, there is a distance D ₆ between the second surface and the light receiving surface, and each of the second microlenses is along the A direction has a length L ₃ , each of the second holes of the second light-shielding pattern layer has a degree L ₄ along the direction, each of the photosensitive elements has a length L ₅ along the direction, and the fingerprint sensor The measurement module satisfies the following relationship: L ₃

L ₄

(

). L ₃

_L5 . The fingerprint sensing module according to claim 1, further comprising: a cladding layer disposed between the first light-shielding pattern layer and the first microlenses, and having a first surface facing the cavity , wherein the side of the first substrate facing away from the second substrate is provided with a cover plate, the cover plate has a cover plate surface away from the first substrate, and the first light-shielding pattern layer also has a first light-shielding pattern layer facing the first substrate Two surfaces, a distance D ₀ between the surface of the cover plate and the second surface, a distance D ₁ between the first surface and the second surface, and each of the first microlenses has a first radius of curvature R ₁ , a length L ₂ along a direction, and a height H ₁ perpendicular to the direction, the direction is parallel to the first substrate, and the fingerprint sensing module satisfies the following relationship:

R 1

. The fingerprint sensing module according to claim 1, further comprising: a cladding layer disposed between the second light-shielding pattern layer and the second microlenses, and having a first surface facing the cavity and a plurality of photosensitive elements disposed between the second substrate and the second light-shielding pattern layer, wherein the second light-shielding pattern layer also has a second surface facing the cavity, and each of the photosensitive elements has a second surface facing the cavity There is a distance D ₅ between the first surface and the second surface on a light-receiving surface of the cavity, and there is a distance D ₆ between the second surface and the light-receiving surface, and each of the second microlenses has A second curvature radius R ₂ , a length L ₃ along a direction, and a height H ₂ perpendicular to the direction, the direction is parallel to the second substrate, and the fingerprint sensing module satisfies the following relationship:

R 2

. The fingerprint sensing module as claimed in claim 1, wherein each of the first microlenses has a first curvature radius R ₁ , a length L ₂ along a direction, and a height H ₁ perpendicular to the direction, Each of the second microlenses has a second radius of curvature R ₂ , a length L ₃ along the direction, and a height H ₂ perpendicular to the direction, and the first microlenses and the second microlenses have A distance D ₃ perpendicular to the direction, the direction is parallel to the first substrate, and the fingerprint sensing module satisfies the following relationship: D ₃

2

, where R 1

, and R 2

. A display device, comprising: a display panel; the fingerprint sensing module according to any one of claim 1 to claim 8, which is overlapped with the display panel; and an optical adhesive layer, connected between the display panel and the display panel. between the fingerprint sensing modules.

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