KR20180005588A - Fingerprint Sensor, Fingerprint Sensor Package and Fingerprint Sensing System using light sources of display panel - Google Patents

Abstract

Disclosed are a fingerprint sensor using light sources on a display panel, a fingerprint sensor package and a fingerprint sensing system. The fingerprint sensor according to a technical aspect of the present invention comprises: a plurality of sensor pixels; an image sensor sensing the light reflected by a fingerprint to generate image information corresponding to the fingerprint input; and a plurality of pin holes, wherein each of the pin holes has a pin hole mask which forms focus for transferring the light reflected by the fingerprint to the image sensor, and the plurality of the pin holes form focus for the light which is emitted from a plurality of OLEDs having one or several colors and disposed inside the display panel, reflected by the fingerprint and transferred. The present invention is able to reduce manufacturing costs.

Description

Technical Field [0001] The present invention relates to a fingerprint sensor, a fingerprint sensor package, and a fingerprint sensing system using light sources of a display panel,

TECHNICAL FIELD [0002] The present invention relates to a fingerprint sensor, and more particularly, to an optical fingerprint sensor and a fingerprint sensor package using light sources of a display panel.

A fingerprint sensor or a fingerprint recognition sensor is a sensor that detects a fingerprint of a user. Recently, smart phones and wearable devices equipped with fingerprint sensors are widely used. The fingerprint sensor mounted on the smartphone and the wearable device can sense the fingerprint of the user by using an electrical measurement method or an optical measurement method.

In the case of an optical fingerprint sensor using an optical measurement method, a fingerprint image can be obtained as a principle of detecting light reflected by a valley between ridges and ridges of a fingerprint through an image sensor. In order to apply such a fingerprint sensor to a smart phone and a waferable device, it is necessary to reduce the size of the fingerprint sensor and improve the performance of the fingerprint recognition.

The technical idea of the present disclosure provides a fingerprint sensing system including an on-display fingerprint sensor and a fingerprint sensor package, and a fingerprint sensor.

According to an aspect of the present invention, a fingerprint sensor includes a plurality of sensor pixels, and generates image information corresponding to the fingerprint input by sensing light reflected by the fingerprint Wherein each of the plurality of pin holes has a pinhole mask forming a focus for transmitting light reflected by the fingerprint to the image sensor, A plurality of OLEDs having one or a plurality of colors located in the display panel emit light to form a focus for light reflected and transmitted to the fingerprint.

Meanwhile, in the fingerprint sensor package according to one aspect of the technical idea of the present disclosure, the fingerprint sensor package is attached to one surface of a display panel including a plurality of OLEDs and includes a package substrate, An image sensor for generating image data corresponding to a fingerprint input through signal processing on the electric signal, and an image sensor for generating image data corresponding to the fingerprint input by sensing the light reflected by the OLEDs and outputting an electric signal, And a pinhole mask positioned between the image sensor and a plurality of pinholes, the pinhole mask being formed by the plurality of OLEDs and forming a focus for transmitting light reflected by the fingerprint to the image sensor .

According to an aspect of the present invention, there is provided a fingerprint sensing system comprising: a display panel including light sources emitting light having one or a plurality of colors in association with a display operation; An image sensor for sensing light transmitted from the light sources by being reflected by a fingerprint placed on the other surface of the display panel and generating image information according to the sensing result, And a pinhole mask on which a plurality of pinholes are formed to form a focus of light reflected by the fingerprint. In the fingerprint sensing operation, the image sensor has a color of a part of the plurality of colors And the image information is generated by sensing light.

The optical fingerprint sensor, the fingerprint sensor package, and the fingerprint sensing system according to the technical idea of the present invention can be realized by minimizing the thickness of the fingerprint sensor package, thereby providing an ultra-thin fingerprint sensing system.

In addition, since the optical fingerprint sensor, the fingerprint sensor package, and the fingerprint sensing system according to the technical idea of the present disclosure use the light sources for the display operation provided in the display panel as the light sources for sensing the fingerprint of the optical system, There is an effect that the manufacturing cost can be reduced.

1 is a structural diagram showing an example of a fingerprint sensing system including a fingerprint sensor according to an embodiment of the present disclosure.
2 is a view showing the concept of the sensor pixel and the optical sensing area shown in Fig.
3 is a diagram showing an example of light propagation paths between a fingerprint pixel, a pinhole and a sensor pixel.
4 is a view showing an example in which a fingerprint sensor according to an embodiment of the present disclosure is attached to a display panel.
5 and 6 are perspective views illustrating a fingerprint sensing system including a fingerprint sensor according to one embodiment.
7 and 8 are views showing one embodiment of a pinhole mask according to an embodiment of the present disclosure.
9 is a view showing the structure of a fingerprint sensor package according to an embodiment of the present invention.
10A and 10B are views showing an example in which a fingerprint sensor package is attached to a display panel in a fingerprint sensing system.
11A and 11B are views showing another example in which the fingerprint sensor package is attached to the display panel in the fingerprint sensing system.
12 is a view showing another example in which the fingerprint sensor package is attached to the display panel in the fingerprint sensing system.
13A and 13B are structural diagrams showing another embodiment of the fingerprint sensing system.
Figs. 14 and 15 are views showing an embodiment of a fingerprint sensor in a form in which a pinhole mask is embedded in an image sensor. Fig.
16 is a view showing an example in which a fingerprint sensor package including a pinhole layer of a built-in structure is attached to a display panel.
17 to 24 are views showing various structures of the fingerprint sensor package according to the embodiments of the present invention.
25 is a view of a fingerprint sensor according to a variant embodiment of the present invention.
26 is a view showing the structure of a fingerprint sensor package according to a variant embodiment of the present invention.
27 is a view showing a structure of a fingerprint sensor package according to another variant embodiment of the present invention.
28A, 28B and 28C are views showing a fingerprint sensing system including a fingerprint sensor package to which a microlens array is applied.
29 is a view showing an example in which a fingerprint sensor package to which a microlens array is applied is mounted on a film.
Figures 30-32 illustrate a fingerprint sensing system in accordance with variant embodiments of the present invention.
33 is a block diagram illustrating a processing system including a fingerprint sensor or fingerprint sensor package in accordance with embodiments of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a structural diagram showing an example of a fingerprint sensing system including a fingerprint sensor according to an embodiment of the present disclosure.

Referring to FIG. 1, the fingerprint sensing system 10 may include a display panel 11 and a fingerprint sensor 12. The fingerprint sensor 12 shown in FIG. 1 may be an optical fingerprint sensor that recognizes a fingerprint by sensing light reflected by a valley between a ridge and a ridge of the fingerprint through the image sensor. According to one embodiment, the fingerprint sensor 12 includes a pinhole mask 12_1 for passing light reflected by a fingerprint and an image sensor 12_2 for sensing light passing through the pinhole mask 12_1 to generate an electric signal ). According to one embodiment, the pinhole mask 12_1 may be embodied as opaque material to allow light to pass through the pinhole while blocking light from passing through the area where no pinhole is formed. Further, according to one embodiment, the pinhole mask 12_1 can be realized with a material having a low reflectance.

The display panel 11 may be applied to various types of display panels. According to one embodiment, the display panel 11 may be an OLED display panel including an OLED layer formed with an OLED (Organic Light-Emitting Diode) that emits light having one or a plurality of colors to perform a display operation. However, the embodiment of the present invention need not be limited to this. The fingerprint sensing system 10 according to the embodiment of the present invention may be applied to various types of display panels such as an LCD display panel that performs a display operation using a general backlight or an OLED . Alternatively, when light from the light source of the display panel is reflected by the fingerprint in the back plane direction of the display panel (or in the direction of the fingerprint sensor 12) in addition to the OLED display panel and the LCD display panel, The display panel may be applied to the display panel 11 according to the embodiment of the present invention.

The fingerprint sensor 12 may be implemented as a semiconductor chip or a semiconductor package and may be attached to one side of the display panel 11. According to one embodiment, the image sensor 12_2 may be implemented as a semiconductor layer or a semiconductor chip in which a plurality of photoelectric conversion elements (for example, a photodiode, a phototransistor, a photogate, and a pinned photodiode) are formed. According to one embodiment, the image sensor 12_2 may be a semiconductor layer in which an image sensor such as a CIS (CMOS Image Sensor) or a CCD (Charge Coupled Device) is implemented. In the following description, it is assumed that the photoelectric conversion element in the image sensor 12_2 is implemented as a photodiode.

According to one embodiment, in implementing the fingerprint sensor 12, the pin hole mask 12_1 may be laminated to the image sensor 12_2 in the process of packaging the image sensor 12_2. Alternatively, in a process for implementing the image sensor 12_2, the pin hole mask 12_1 may be layered on the image sensor 12_2 in one or more layers constituting the image sensor 12_2. That is, the fingerprint sensor 12 can be implemented in a form in which the pinhole mask 12_1 is embedded in the image sensor 12_2, and the package process is performed on the image sensor 12_2 in which the pinhole mask 12_1 is embedded . That is, according to one embodiment, the pinhole mask 12_1 and the image sensor 12_2 may be integrally formed.

The pinhole mask 12_1 can be implemented by various methods using a material having a low light transmittance and a low reflectance. For example, the pinhole mask 12_1 may be implemented using a material that has a characteristic of blocking light and having a low reflectivity (or high absorption rate) and maintaining its hardness even with temperature or humidity change . For example, a pinhole mask 12_1 can be realized by forming a pinhole after applying a TiN (Titanium Nitride) material on a silicon material. Alternatively, non-silicon materials such as Black Nickel or Anodized Aluminum may be materials for pinholes.

According to one embodiment, the OLED layer and the pinhole mask 12_1 provided in the OLED display panel may be arranged substantially in parallel. Accordingly, the light from the plurality of OLEDs in the OLED layer can be transmitted in the direction of the fingerprint located in the cover glass, and the light reflected by the fingerprint can be transmitted through the pinhole in the pinhole mask 12_1, View can be transferred to the pinhole mask 12_1. Accordingly, in the fingerprint sensor according to the embodiments of the present invention, it is not necessary to provide a separate light guide means for controlling the path through which light is transmitted for fingerprint sensing.

The fingerprint sensor 12 senses a fingerprint that is on or near the display panel 11. In the fingerprint sensing system 10 according to the embodiments of the present invention, a fingerprint touched on a display of a wired device such as a smart phone can be recognized without requiring a separate button for fingerprint recognition. For example, when the display panel 11 corresponds to the OLED display panel, and the user's fingerprint is placed on the cover glass of the display panel 11, light from the OLED in the display panel 11 becomes a light source, The transmitted and reflected light may be transmitted through the panel back plane and transmitted to the image sensor 12_2 via the pin hole mask 12_1.

The image sensor 12_2 includes a plurality of sensor pixels, and each sensor pixel senses light reflected by different areas of the fingerprint and generates an electrical signal corresponding to the sensed light. Each sensor pixel may generate an electrical signal corresponding to light reflected on a ridge of a fingerprint or an electrical signal corresponding to light reflected on a valley between ridges. The amount of light sensed by the photodiode may vary depending on the type of the fingerprint reflected by the light and an electric signal having different levels may be generated depending on the amount of sensed light. That is, the electric signals from the plurality of sensor pixels may include lightness information (or image information), respectively, and a region corresponding to each sensor pixel may be ridged or scored through processing operations on the electric signal And the entire fingerprint image can be constructed by combining the judged information.

Areas of the fingerprint that are optically sampled in the fingerprint sensing system 10 can be defined. As an example, a plurality of fingerprint pixels W _FP may be defined corresponding to a plurality of sensor pixels of the image sensor 12_2, and each fingerprint pixel W _FP may include one pin hole and one sensor pixel As shown in FIG. Various factors include the distance between the display panel 11 and the pinhole mask 12_1, the distance between the pinhole mask 12_1 and the image sensor 12_2, the thickness of the pinhole mask 12_1, the diameter and shape of the pinhole 12_1, The shape and size of the fingerprint pixels W _FP corresponding to the respective pin holes can be determined.

Each of the fingerprint pixels W _FP may correspond to one pin hole in the pin hole mask 12_1. An area that reflects light that can pass through one pinhole in each fingerprint pixel W _FP may be included and the area may be defined as an optical sampling area. Depending on the optical sampling region, an optical sensing region corresponding to the optical sampling region can also be defined in the image sensor 12_2. As an example, the optical sensing region may comprise sensor pixels.

In FIG. 1, the fingerprint pixels W _FP are positioned on the entire area of the display panel 11, but the embodiment of the present invention need not be limited thereto. As an example, the fingerprint pixels W _FP may be located only for a part of the area of the display panel 11, so that if the user's fingerprint is located in a specific area of the display panel 11, the fingerprint may be sensed There will be.

Further, each of the plurality of pin holes in the pinhole mask 12_1 may correspond to each of a plurality of sensor pixels in the image sensor 12_2. For example, one sensor pixel corresponding to one pinhole may include one photodiode PD. Alternatively, one sensor pixel corresponding to one pinhole may include two or more photodiodes (PD). In Fig. 1, an example is shown in which one sensor pixel includes a plurality of photodiodes (PD), and a sensor pixel in the optical sensing region includes a plurality of photodiodes (PD). That is, a plurality of pin holes of the pinhole mask 12_1 are formed so as to be mapped to a plurality of pixels of the image sensor 12_2, and the light reflected from the fingerprint pixels in the optical sampling area is incident on one or more photodiodes And the entire image of the fingerprint can be reconstructed by processing the electrical signals from the plurality of sensor pixels.

According to one embodiment, there is a region in the fingerprint-pixel (W _FP) image sensor (12_2) corresponding to each can be defined, the region corresponding to the fingerprint-pixel (W _FP), each of which may comprise a plurality of photodiodes have. Further, the sensor pixel may correspond to an area including at least a part of a plurality of photodiodes corresponding to the fingerprint pixel W _FP . That is, one sensor pixel needs to sense the light corresponding to the corresponding fingerprint pixel W _FP , and the light corresponding to the other fingerprint pixel W _FP needs to be prevented from overlapping. In the example of Fig. 1, an area corresponding to each of the fingerprint pixels W _FP includes 5 * 5 photodiodes, and the sensor pixel includes 3 * 3 photodiodes as a part thereof, and the fingerprint pixels A fingerprint image (or partial fingerprint image) can be constructed based on the electrical signals from the 3 * 3 photodiodes for the area corresponding to each of the pixels W _FP .

In the above embodiment, the fingerprint sensing system 10 senses the fingerprint of the user, but the embodiment of the present invention need not be limited thereto. For example, when a predetermined object is positioned on the display panel 11, the fingerprint sensor 12 may sense the light reflected from the predetermined object to generate the sensing result. When each fingerprint pixel of the fingerprint sensor 12 generates image data as a result of sensing, the image of the object located on the display panel 11 using the image data from each fingerprint pixel of the fingerprint sensor 12 It can be reconfigured.

2 is a view showing the concept of the sensor pixel and the optical sensing area shown in Fig. In Fig. 2, a sensor pixel corresponding to one fingerprint pixel is shown, and it is assumed that each sensor pixel includes a plurality of photodiodes.

In the example of FIG. 2 (a), one sensor pixel includes 3 * 3 photodiodes, and in the example of FIG. 2 (b), one sensor pixel includes 2 * 2 photodiodes . Assuming, for example, that a plurality of photodiodes constitute one sensor pixel, the region corresponding to each photodiode may be referred to as a sensor subpixel.

According to an embodiment of the present invention, the center of the sensor pixel or the center of the optical sensing area may be aligned to the center of the pinhole. In addition, the optical sensing area where the reflected light is transmitted in the optical sampling area of the fingerprint pixel may be located over a plurality of photodiodes. For example, the diameter of the optical sensing region may have a value corresponding to Fd. The diameter Fd of the optical sensing area can be controlled through various parameters such as the distance between the display panel and the pinhole mask, the distance between the pinhole mask and the image sensor, and the shape of the pinhole. As described above, the diameter Fd of the optical sensing area needs to be determined such that light from two or more fingerprint pixels is not overlapped on each sensor pixel.

Depending on the diameter Fd of the optical sensing area, the number of photodiodes in which the actual light is sensed in a sensor pixel can be determined. An electrical signal corresponding to one fingerprint pixel may be generated according to a result of sensing from the plurality of photodiodes, and in accordance with an embodiment, a data value for a plurality of photodiodes included in one sensor pixel may be merged the electric signal may be generated through a merging process.

FIGS. 3A and 3B are views showing an example of a light propagation path between a fingerprint pixel (or an optical sampling region), a pinhole, and a sensor pixel (or an optical sensing region). Fig. 3A shows an example in which one sensor pixel includes one photodiode PD, and Fig. 3B shows an example in which one sensor pixel includes a plurality of photodiodes PD.

3a and 3b, one pinhole is located between a fingerprint pixel on the display panel and a sensor pixel on the image sensor, and the pinhole can form a focus of light transmitted between the fingerprint pixel and the sensor pixel. The light from the light source is reflected to some area (e.g., an optical sampling area) of the fingerprint located in the fingerprint pixel, passes through the pin hole, and light passing through the pin hole is provided to the sensor pixel corresponding to the fingerprint pixel. The photodiode included in the sensor pixel senses light passing through the pinhole and generates an electrical signal corresponding to the sensed light. In the case of FIG. 3A, one photodiode PD is formed in one sensor pixel, and contrast data corresponding to the fingerprint pixel is generated through a processing operation on an electrical signal from one photodiode PD .

Assuming that the size of the photodiode PD is fixed, the number of photodiodes (PD) included in one sensor pixel may vary depending on the arrangement of fingerprint pixels, pinholes, and sensor pixels. For example, when the pinhole is located close to the sensor pixel, the size of the sensor pixel corresponding to one fingerprint pixel is reduced, and in some cases, one photodiode PD may be disposed in one sensor pixel. On the other hand, as shown in FIG. 3B, when the distance between the pinhole and the sensor pixel is increased, the size of the sensor pixel is increased. Accordingly, a plurality of photodiodes (PD) are arranged in one sensor pixel . As an example, FIG. 3B shows an example in which one sensor pixel includes four photodiodes (PD). One sensor pixel may generate an electrical signal that includes image information corresponding to one fingerprint pixel, for example, by merging the respective sensing results by four photodiodes (PDs) An electric signal corresponding to the fingerprint pixel of the fingerprint image can be generated. Brightness or image data corresponding to each fingerprint pixel can be generated through a processing operation on the electric signal thus generated.

4 is a view showing an example in which a fingerprint sensor according to an embodiment of the present disclosure is attached to a display panel. As described above, the fingerprint sensor 12 may include a pinhole mask 12_1 and an image sensor 12_2. When the pinhole mask 12_1 and the image sensor 12_2 are manufactured by a semiconductor process, (12) may correspond to a semiconductor device. In the form of the fingerprint shown in Fig. 4, the portion that touches the display panel 11 corresponds to the ridge of the fingerprint, and the portion that does not touch corresponds to the fingerprint.

In some of the following embodiments, a predetermined spacing between fingerprint pixels will be shown for ease of illustration of the light propagation path, but embodiments of the invention need not be so limited. For example, fingerprint pixels may be defined such that their interface faces each other so that the entire image of the fingerprint can be constructed as shown in FIG.

4, the fingerprint sensor 12 may be attached to the back plane of the display panel 11. For example, the fingerprint sensor 12 may include an image sensor 12_2 such as a CIS (CMOS Image Sensor) Or the like. A plurality of sensor pixels including a plurality of photodiodes PD are formed on the image sensor 12_2. For example, the photodiodes PD may be formed on the semiconductor substrate Sub through an ion implantation process. In the example of Fig. 4, an example is shown for an optical sampling area corresponding to one fingerprint pixel and an optical sensing area corresponding to a sensor pixel area composed of one photodiode (PD).

On the other hand, the pinhole mask 12_1 may be positioned between the display panel 11 and the image sensor 12_2. The pinhole mask 12_1 may be referred to as a pinhole mask layer as it is implemented as a separate layer. In the example of FIG. 4, a pin hole mask 12_1 having pin holes of a 5 * 5 structure is shown for convenience of illustration, but a substantially larger number of pin holes may be formed in the pin hole mask 12_1 as an array structure There will be. As an example, in consideration of the size of the fingerprint, a pinhole mask 12_1 including pinholes of approximately 200 * 200 array structures may be used.

According to one embodiment, a pinhole mask 12_1 may be deposited on the image sensor 12_2 within a process for implementing the image sensor 12_2, wherein the pinhole mask 12_1 and the image sensor 12_2 A transparent passivation layer through which light can be transmitted, and an intermediate layer such as an oxide layer may be interposed. That is, when the pinhole mask 12_1 is embodied as being embedded in the image sensor 12_2, the image sensor 12_2 can be described as including the pinhole mask 12_1. Further, the distance between the pinhole and the sensor pixel can be defined based on the thickness of the intermediate layer in the above-described built-in structure, and based on this, the size of the sensor pixel corresponding to one fingerprint pixel can be defined.

The display panel 11 may correspond to various kinds of display panels that generate light toward the fingerprint and light reflected by the fingerprint can be transmitted in the direction of the backplane (or fingerprint sensor direction) of the display panel 11 have. According to one embodiment, the display panel 11 may be an OLED panel, and may include a plurality of OLEDs as light sources. For example, a plurality of OLEDs may emit light in various colors by themselves, and a plurality of OLEDs emitting red color (R), green color (G), and blue color (B) may be included in the display panel . At least some of the plurality of OLEDs included in the display panel 11 may be used as a light source for fingerprint sensing.

Although not shown in FIG. 4, when RGB OLEDs are all used for fingerprint sensing, white light is generated from the display panel 11, and each photodiode PD senses light corresponding to a specific color Color filters (not shown) may be further implemented in the image sensor 12_2. For example, red, green, and blue filters may be implemented corresponding to a plurality of photodiodes PD.

According to one embodiment, a plurality of pinholes formed in the pinhole mask 12_1 are aligned to a plurality of sensor pixels of the image sensor 12_2. The distance between the pinhole mask 12_1 and the fingerprint, that is, the pinhole-to-fingerprint distance D1 and the distance between the pinhole mask 12_1 and the image sensor 12_2, The pinhole-to-sensor distance D2 and the diameter of the pinhole and the thickness of the pinhole mask, the diameter W1 of the optical sampling area including the size of the fingerprint pixels and the size The diameter W2 of the optical sensing area including the diameter of the optical sensing area can be determined. In addition, the pitch Wpitch between the fingerprint pixels can also be considered when determining the diameter Wl of the optical sampling area. According to one embodiment of the present disclosure, a pinhole mask 12_1 including a plurality of pinholes is used instead of the lens as the focus forming means in the image sensor 12_2, and the image sensor 12_2 ).

Specifically, when the user's fingerprint is placed on the display panel 11, light from the OLED light source in the display panel 11 is radiated in the direction of the cover glass of the display panel 11, and the emitted light is positioned on the cover glass Reflected by the ridges and ridges of the fingerprint and transmitted to the backplane of the display panel 11 and the image sensor 12_2 senses the light transmitted through the rear surface of the display panel 11 and the pinholes. Thus, the image of the fingerprint can be captured by the image sensor 12_2. According to the embodiment of the present invention, the fingerprint sensor 12 can be implemented as a very thin ultra-thin optical sensor, and thus, in the absence of a lens for collecting focus, the image capture ).

On the other hand, in aligning the fingerprint pixels, the pinholes, and the sensor pixels, the diameter d and the thickness T of the pinhole are determined based on the angles of view of the upper and lower surfaces with respect to the pinhole, And the like. The distance D1 between the pinhole mask 12_1 and the fingerprint and the distance D2 between the pinhole mask 12_1 and the image sensor 12_2 together with the determined angle of view include the size of the fingerprint pixel And may correspond to a parameter that determines the diameter W2 of the optical sensing area including the diameter W1 of the optical sampling area and the size of the sensor pixel. The diameter W1 of the optical sampling area corresponding to the size of the fingerprint pixel and the diameter W2 of the optical sensing area corresponding to the sensor pixel size are calculated as shown in the equation , Where M can be defined as D2 / D1 as Magnification.

The fingerprint sensor and the fingerprint sensing system shown in the above embodiments can be applied to various fields. The application field of the present disclosure is applicable to a system including a display panel, and as an example, light from a light source included in the display panel can be applied to a system having a transmittance in the back direction of the panel. In addition, embodiments of the present invention may be applied to a smart phone (including a tablet) or a wearable device (e.g., a Smart Watch) as an example of an application field. Alternatively, the fingerprint sensor and the fingerprint sensor package according to embodiments of the present invention may be applied to an ultra-thin camera field of the Internet of Things (IOT).

5 and 6 are perspective views illustrating a fingerprint sensing system including a fingerprint sensor according to one embodiment.

Referring to FIG. 5, the fingerprint sensing system 100 may include a display panel 110 and a fingerprint sensor. The display panel 110 may include a plurality of pixels 111 for implementing an image, and each of the pixels 111 may include a light source in the above-described embodiment. For example, the light source included in each of the pixels 111 may be an OLED for expressing a predetermined color.

Meanwhile, the fingerprint sensor may be implemented using a semiconductor wafer. As illustrated in FIG. 5, the fingerprint sensor may include one or more layers (for example, first and second layers (120a, 120b) and a device layer 130 on which a photodiode is formed. Each of the first and second layers 120a and 120b may include metal interconnects 121a and 121b formed of a material that does not allow light to pass therethrough, And can be used for blocking light reflected and transmitted by the fingerprint. Meanwhile, according to the above-described embodiment, a plurality of pin holes 122 may be formed to penetrate the first and second layers 120a and 120b to form a focus of light reflected and transmitted by the fingerprint.

 In one embodiment, the metal wires 121a and 121b are formed in various shapes on the first and second layers 120a and 120b, thereby preventing light from passing through the region except for the pin holes 122. [ For example, the metal interconnection 121a formed in the first layer 120a is arranged in parallel in the first direction, and the metal interconnection 121b formed in the second layer 120b is arranged in parallel in the second direction perpendicular to the first direction . According to the embodiment shown in FIG. 5, the pinhole mask may not be formed as a separate layer in the fingerprint sensor 120, and pinholes 122 may be formed in a plurality of layers in which the metal wiring 121 is formed .

As an example, the metal wirings 121a and 121b may be additionally formed independently of the wiring for transferring electrical signals for actual operation of the image sensor. In addition, the first and second layers 120a and 120b may be additionally provided in addition to the layer in which the wires for actual operation of the image sensor are formed. A device layer 130 having a photodiode may be disposed under the pinholes 122. At this time, as the pin holes 122 are implemented in the semiconductor process for implementing the fingerprint sensor, the pin holes 122 can be defined as being embedded in the fingerprint sensor.

6, the fingerprint sensing system 200 may include a display panel 210, a pinhole mask layer 220, and a device layer 230, wherein the pinhole mask layer 220 and / The device layer 230 may constitute a fingerprint sensor according to an embodiment of the present invention. In addition, the display panel 210 may include a plurality of light sources similar to the above-described embodiments. For example, each light source may be an OLED.

As an example, the pinhole mask layer 220 may be implemented as a silicon wafer, a metal layer, or any layer of material that does not pass through the light, and may include a plurality of pinholes 221. The device layer 230 may correspond to a configuration in which an electric signal is generated by sensing light passing through the plurality of pinholes 221 as an image sensor layer in which a photodiode is formed. As described above, the pinhole mask layer 220 and the device layer 230 may be formed of different layers. According to one embodiment, the pinhole mask layer 220 may include a semiconductor May be deposited on the device layer 230 in the process. In one embodiment, the pinhole mask layer 220 may be positioned to align with the device layer 230.

7 and 8 are views showing one embodiment of a pinhole mask according to an embodiment of the present disclosure.

Referring to FIG. 7, the pinhole mask may include a plurality of pinholes arranged in an array, and the cross-section of each pinhole may be circular. The diameter d1 of each pinhole and the thickness T1 of the pinhole mask can be variously changed depending on the crystal angle of view.

Figure 8 shows another embodiment of a pinhole mask. Referring to FIG. 8, the pinhole mask may include a plurality of pinholes arranged in an array, and the cross-section of each pinhole may be a square. The diagonal line d2 of each pinhole and the thickness T2 of the pinhole mask can be variously changed depending on the crystal angle of view. The embodiments of the present invention are not limited to the examples shown in Figs. 7 and 8, and the arrangement of the pinholes formed in the pinhole mask is not limited to the square image in which the adjacent pinholes are positioned at the same distance in the vertical, In addition, it may be formed in a rhombus or an arbitrary polygonal shape, and a cross section may be formed in a hexagonal shape or an arbitrary polygonal shape in addition to a circle, a square, or an elliptical shape.

9 is a view showing the structure of a fingerprint sensor package according to an embodiment of the present invention. The fingerprint sensor package can be generated through a packaging process for the fingerprint sensor in the above-described embodiments. The fingerprint sensor package 300 shown in Fig. 9 is attached to the display panel, so that a screen-integrated fingerprint sensor can be realized. The fingerprint sensor package 300 may be mounted on a board (not shown) as a sensor IC, and the image data corresponding to the fingerprint sensing result generated from the fingerprint sensor package 300 may be transferred to an external device or system Can be provided.

9, the fingerprint sensor package 300 includes a package substrate 310, an image sensor 320 mounted on the package substrate 310, a pinhole mask 340 positioned on the image sensor 320, . The pinhole mask 340 may be embodied according to the embodiments described above. For example, the pinhole mask 340 may be embodied as a layer of any material that does not pass through the region except for the pinhole, A plurality of pin holes may be formed for passing light. A support base 330 for supporting the pinhole mask 340 may be formed on the image sensor 320 and the pinhole mask 340 may be stacked and supported on the support base 330.

According to the above structure, an air gap having a length corresponding to the height of the supporter 330 may be formed in the fingerprint sensor package 300. The distance between the image sensor 320 and the pinhole mask 340 can be adjusted according to the height of the air gap so that the height of the support member 330 corresponds to the size of the optical sensing area corresponding to the size of the sensor pixel It may correspond to a parameter for determining the diameter.

The image sensor 320 includes a light receiving region 321 for sensing light transmitted through a plurality of pin holes of the pinhole mask 340 and a logic region 322 for generating image data through logic processing on the electrical signal from the light receiving portion. Lt; RTI ID = 0.0 > 322 < / RTI > The light receiving region 321 and the logic region 322 may be formed on different wafers (or semiconductor substrates) different from each other and the light receiving region 321 and the logic region 322 may be classified as separate chips . Alternatively, as another embodiment, the light receiving region 321 and the logic region 322 may be embodied in one semiconductor chip.

The light receiving region 321 may include a plurality of sensor pixels referred to in the above-described embodiments, and each sensor pixel may include one or more photodiodes. As light is reflected by the ridges or valleys, a difference occurs in the amount of light that is sensed in the sensor pixels, and the light receiving region 321 provides an electrical signal to the logic region 322 that is different for each sensor pixel. The logic circuits included in the logic region 322 generate processing operations such as analog-to-digital conversion on the electrical signal to generate contrast or partial image data of the fingerprint pixel unit used to construct the entire fingerprint image, Thereby constituting a fingerprint image. In addition, the fingerprint image thus generated may be provided to an external device or system through the package substrate 310. [

On the other hand, in the embodiment shown in FIG. 9, an external structure in which the pinhole mask 340 is laminated on the image sensor 320 in the packaging process for the image sensor 320 is exemplified. Accordingly, the pinhole mask 340 and the image sensor 320 are manufactured through separate processes, and the process of assembling the pinhole mask 340 and the image sensor 320 into one package can be performed.

10A and 10B show an example in which a fingerprint sensor package is attached to a display panel in a fingerprint sensing system. Fig. 10B shows an embodiment of an adhesive element for combining the fingerprint sensor package and the display panel shown in Fig. 10A. It is assumed that the fingerprint sensor package is implemented in the form of the package shown in Fig. 9 in the following embodiments, including the present embodiment.

10A, the fingerprint sensing system 400A includes a fingerprint sensor package 410A and also includes a display panel 420 to which the fingerprint sensor package 410A is attached and a board 420 for mounting the fingerprint sensor package 410A. (Not shown).

The fingerprint sensor package 410A includes a package substrate 411, an image sensor 412 mounted on the package substrate 411, a support 413 formed on the image sensor 412, and a plurality of pin holes And may include a pinhole mask 414. An air gap may be formed between the image sensor 412 and the pinhole mask 414 in the same or similar manner as described above. The board 430 may correspond to a mother board such as a PCB such as a smart phone and the fingerprint sensor package 410A may be connected to the board 430 so that the fingerprint sensor package 410A may be connected to the chip on board chip on board. In addition, image data may be provided to the board 430 via connection terminals formed on one side of the fingerprint sensor package 410A, and image data may be provided to the board 430 in a plurality of To provide image data to the board 430 via solder balls.

The fingerprint sensor package 410A may further include a molding 416A and the fingerprint sensor package 410A may be attached to the display panel 420 via the adhesive element 415A. The adhesive element 415A may be an adhesive agent in the form of an adhesive film or a liquid (or resin), and an element capable of maintaining the adhesive force even in a variation of temperature, humidity, etc. may be applied. Film (Optical Clear Adhesive, OCA).

As an example, an adhesive element 415A may be disposed on the upper surface of the fingerprint sensor package 410A. Alternatively, in the packaging process for the fingerprint sensor, the adhesive element 415A may be disposed on one side of the fingerprint sensor package 410A, wherein the fingerprint sensor package 410A further comprises a layer of adhesive element 415A . The adhesive element 415A may serve as a buffer support when attaching the fingerprint sensor package 410A to the display panel 420 and the thickness of the adhesive element 415A may be influenced by the distance between the fingerprint pixel and the pinhole . The thicker the adhesive element 415A, the larger the area of the fingerprint pixels seen by the pinhole, and the thickness of the adhesive element 415A can be adjusted so long as the different fingerprint pixels do not overlap with each other.

10B, the bonding element 415A such as a light adhesive film can be implemented using a transparent or semitransparent element, and according to an embodiment, the bonding element 415A can be mounted on the fingerprint sensor package 410A But may be implemented in the form of a top-covering surface. That is, the adhesive element 415A is formed to cover the area where the pinholes of the pinhole mask 414 are located in the fingerprint sensor package 410A to adhere the fingerprint sensor package 410A and the display panel 420 have. Further, the distance between the pinhole mask 414 and the fingerprint pixel can be adjusted according to the thickness of the adhesive element 415A, so that the thickness of the adhesive element 415A is smaller than the diameter of the optical sampling area corresponding to the fingerprint pixel size May be included in the parameters that determine the < / RTI >

11A and 11B show another example in which a fingerprint sensor package is attached to a display panel in a fingerprint sensing system. 11B shows another embodiment of the adhesive element for bonding the display panel to the fingerprint sensor package shown in Fig. 11A. In describing the configuration of the fingerprint sensing system including the fingerprint sensor package shown in Figs. 11A and 11B, the same components as those shown in Figs. 10A and 10B will not be described in detail.

The fingerprint sensing system 400B includes a fingerprint sensor package 410B and the fingerprint sensing system 400B includes a display panel 420 to which the fingerprint sensor package 410B is attached and a fingerprint sensor package 410B for mounting the fingerprint sensor package 410B. And may further include a board 430. In addition, the fingerprint sensor package 410B may include a package substrate 411, an image sensor 412, a support 413, and a pinhole mask 414. In addition, the fingerprint sensor package 410B may further include a bonding element 415B and a molding 416B. According to one embodiment, the adhesive element 415B may be disposed along the outer area, or edge area, of the upper surface of the fingerprint sensor package 410B, thereby adhering the fingerprint sensor package 410B and the display panel 420 together. 11A, the thicknesses of the pinhole mask 414, the support 413, and the adhesive element 415B may be the same or similar to those shown in Fig. 10A.

11B, an adhesive element 415B, such as a light adhesive film (OCA), may be implemented using a transparent or translucent element or an opaque element, and according to one embodiment, the adhesive element 415B may have a window frame shape The hole can be formed corresponding to the region where the pin holes are located. Accordingly, the light reflected by the fingerprint can be provided to the image sensor 412 through the air gap (or the air layer) without passing through the adhesive element 415B, and the adhesive element 415B can be provided using the opaque element . Further, since the transmittance of light through the air is higher than that in the case of passing through a bonding element embodied by a transparent or semi-transparent material, the image sensor 412 has sensitivity for sensing light transmitted by being reflected by a fingerprint .

12 shows another example in which the fingerprint sensor package is attached to the display panel in the fingerprint sensing system. In describing the configuration of the fingerprint sensing system including the fingerprint sensor package shown in FIG. 12, detailed description of the same configuration as that shown in FIGS. 10A and 11A will be omitted.

The fingerprint sensing system 400C includes a fingerprint sensor package 410C and the fingerprint sensing system 400C includes a display panel 420 and a fingerprint sensor package 410C for mounting the fingerprint sensor package 410C to which the fingerprint sensor package 410C is attached. And may further include a board 430. The fingerprint sensor package 410C may also include a package substrate 411, an image sensor 412, a support 413, a pinhole mask 414 and a molding 416C. 12, the thicknesses of the pinhole mask 414 and the support base 413 and the like may be the same or similar to those shown in Figs. 10A and 11A.

In the case of this embodiment, the adhesive element in the above-described embodiment in the fingerprint sensing system 400C can be removed. At this time, the height of the molding 416C provided in the fingerprint sensor package 410C may be larger than that shown in FIGS. 10A and 11A. The height of the edge of the fingerprint sensor package 410C becomes large so that the molding 416C positioned in the edge region of the fingerprint sensor package 410C can be brought into contact with one surface of the display panel 420. [ As the height of the molding 416C becomes larger, an air gap 417 may be formed between one surface of the display panel 420 and the pinhole mask 414, The image sensor 412 via the pin hole 417 and the pin hole.

13A and 13B are structural diagrams showing another embodiment of the fingerprint sensing system. 13A and 13B show an example in which the fingerprint sensor package is mounted on a film in the form of a chip on film (COF).

The fingerprint sensing system 500 includes a fingerprint sensor package 510 and the fingerprint sensing system 500 further includes a display panel 520 to which the fingerprint sensor package 510 is attached, And may further include a film 530 for mounting the package 510. The film 530 may include an interface wiring. In addition, the fingerprint sensor package 510 may include an image sensor 511, a support 512, a pinhole mask 513, and an adhesive element 514. Although not shown in FIG. 13A, the fingerprint sensor package 510 may further include a molding.

The film 530 may be implemented using a flexible device, and wirings for electrical transmission of signals may be formed on at least one side of the film 530. Further, a wiring through the film 530 may be further formed in the film 530 to transmit a signal from one side of the film 530 to the other side. As an example, when the fingerprint sensor package 510 is attached to the display panel 520, the face of the film 530 facing the display panel 520 is referred to as the first face, and the opposite face to the second face .

As one example, the fingerprint sensor package 510 may be implemented in the same or similar manner as the fingerprint sensor package shown in the above embodiment. In the above-described embodiments, the image sensor is mounted on one side of the package substrate, and the solder ball is formed on the other side of the package substrate, so that image data is provided to the board through the solder ball. However, In the embodiment, an example is shown in which the image data is provided in a film 530 including interface wiring instead of a package substrate. 13A, the thickness of the pinhole mask 513 and the film 530 in the fingerprint sensor package 510 are the same, but the thickness of the pinhole mask 513 is thinner than that of the film 530 Or the thickness of the pinhole mask 513 may be thicker than the film 530.

13B, the film 530 may be formed with a hole 531 of a size through which the fingerprint sensor package 510 can pass, and the fingerprint sensor package 510 may be formed on the film 530, And may be attached to the display panel 520 through the opening 531. According to one embodiment, the film 530 is provided with a hole 531 through which the upper portion of the fingerprint sensor package 510 (for example, the area where the pinhole mask 513 is located) The upper portion of the package 510 may pass through the hole 531 of the film 530 and be attached to the display panel 520. [ The fingerprint sensor package 510 may be attached to the display panel 520 via the adhesive element 514 and the adhesive element 514 may be attached to the display panel 520 in various forms, , A surface shape, a window frame shape). Further, the adhesive element 514 may be embodied as a transparent or translucent element.

13A, the upper surface of the adhesive element 514 and the upper surface of the fingerprint sensor package 510 are shown approximately the same size for convenience of illustration, but the embodiment of the present invention need not be limited thereto. For example, according to one embodiment, the adhesive element 514 is implemented larger than the hole 531, and the edge area of the adhesive element 514 is attached to the periphery of the hole 531 of the film 530, 520, respectively.

On the other hand, the signals generated in the fingerprint sensor package 510 may be transmitted to an external device or system through a plurality of wires in the film 530. As an example, signals (e.g., image data) from the fingerprint sensor package 510 may be delivered to a second side of the film 530. The connection terminal ct may be disposed on the logic region of the image sensor 511 and the connection terminal ct may be electrically connected to the wiring formed on the second surface of the film 530. [ The film 530 may be provided with a connector 532 for electrical connection with another device or system. For example, the image data from the fingerprint sensor package 510 may be transferred to the main board (not shown) To an external device or system mounted on the base station.

According to the above-described embodiment, the transfer path of the image data from the fingerprint sensor package 510 can be flexibly implemented through the film 530, so that the ease of placement of the devices in the fingerprint sensing system 500 can be improved . Further, the overall thickness of the fingerprint sensor package 510 mounted in the form of a chip on film (COF) on the film 530 can be reduced.

Figs. 14 and 15 are views showing an embodiment of a fingerprint sensor in a form in which a pinhole mask is embedded in an image sensor. Fig. As an example, in a semiconductor process for implementing an image sensor, holes are formed in at least one layer in the same or similar form as the pinholes in the above-described embodiment, and a layer in which holes are formed is formed on the upper portion of the layer on which the photodiode is formed Can be stacked. For example, a sustain wafer in which a plurality of holes are formed can perform the function of the pinhole mask in the above-described embodiment, so that in the following embodiments, the sustain wafer may be referred to as a pinhole mask.

FIG. 14 is a sectional view showing a fingerprint sensor of an FSI (Front Side Illumination) method according to an embodiment of the present disclosure.

Referring to FIG. 14, the fingerprint sensor 600A according to the present embodiment can be implemented by the FSI method. Specifically, the fingerprint sensor 600A may include a plurality of wafers for implementing the image sensor and the pinhole mask. For example, the device wafer 610A and the device wafer 610A on which the image sensor is implemented And a sustain wafer 620A positioned thereon. A plurality of pin holes may be formed in the sustain wafer 620A corresponding to regions where the sensor pixels (or photodiodes) are formed on the device wafer 610A. For example, each of the plurality of pin holes may be formed on the device wafer 610A ) Of the respective sensor pixels.

In one embodiment, the device wafer 610A may include a semiconductor substrate (e.g., P-Sub) and one or more layers formed thereon, and may include one or more layers that grow, for example, An epitaxial layer can be formed.

One or more photoelectric conversion regions for sensing the light reflected from the fingerprint in the image sensor may be formed in the epitaxial layer. As one example, photodiodes PD in the above-described embodiments may be formed in the photoelectric conversion regions through an ion implantation process. As a possible modification, various kinds of photoelectric conversion elements such as a phototransistor, a photogate, and a pinned photodiode may be formed in the photoelectric conversion regions.

Meanwhile, as the fingerprint sensor is implemented by the FSI (Front Side Illumination) method, one or more metal layers may be formed on the epitaxial layer on which the photodiodes PD are formed. 14 shows an example in which five metal layers M1 to M5 are formed, and a dielectric for electrical insulation between the metal layers M1 to M5 may be implemented. In one embodiment, the dielectric may be formed in the form of an inter-layer dielectric or inter level dielectric (ILD) or an intermetal dielectric (IMD), and an oxide or nitride- . In addition, metal lines and contacts may be formed in each of the metal layers M1 to M5.

Meanwhile, the sustain wafers 620A may be disposed on top of the metal layers M1 to M5. The sustain wafers 620A may be used to hold or support an epitaxial layer, and pinholes formed in the sustain wafer 620A according to an embodiment of the present invention may be used to focus Can be formed. The fingerprint sensor 600A including the device wafer 610A and the device wafer 610A may be packaged and attached to one side of the display panel and the packaging process for the fingerprint sensor 600A is described in detail in the above- Can be performed in the same manner as the packaging process. The packaged fingerprint sensor 600A may be mounted in a COB form on the board or may be mounted on the packaged fingerprint sensor 600A. Can be mounted on the film in the form of COF. In Fig. 14, a display panel is shown above the sustain wafer 620A for convenience of illustration, but a substantially packaged fingerprint sensor 600A may be attached to the display panel through the adhesive element in the above-described embodiments.

14 shows an example in which at least one layer is further disposed between the metal layers M1 to M5 and the sustain wafers 620A. As an example, at least one layer formed of silicon carbon nitride (SiCN) The sustain wafers 620A can be stacked on top of the sustain wafers 620A. In addition, as an example, the transparency of the sustain wafer 620A can be variously adjusted. According to the embodiment described above, a material for reducing the light transmittance is applied to a wafer of silicon material so that the sustain wafer 620A .

According to the fingerprint sensor 600A implemented as described above, the sustain wafer 620A corresponding to the pin hole mask can be stacked on the device wafer 610A in the process for implementing the image sensor. Accordingly, in the packaging process for the image sensor, the process of laminating a separate pinhole layer on the image sensor can be omitted. Further, in the packaged fingerprint sensor package, the entire thickness of the fingerprint sensor package can be reduced since there is no need to provide a holder for fixing a separate pinhole layer.

15 is a cross-sectional view showing a back side illumination (BSI) type fingerprint sensor according to an embodiment of the present disclosure. In explaining the structure of the fingerprint sensor 600B shown in Fig. 15, the same structures as those shown in the embodiment of Fig. 14 described above are not described in detail.

Referring to FIG. 15, the fingerprint sensor 600B according to the present embodiment can be implemented in a BSI scheme. As an example, the fingerprint sensor 600B may include a device wafer 610B on which an image sensor is implemented and a sustain wafer 620B on top of the device wafer 610B. Also, a plurality of pin holes may be formed in the sustain wafer 620B.

In one embodiment, the image sensor in the fingerprint sensor 600B is implemented in the BSI scheme, so that the layer (e.g., the epitaxial layer) in which the photodiodes PD are formed in the image sensor is formed by the sustain wafer 620B, And may be located between the layers M1 to M5. Accordingly, the light reflected by the fingerprint and passing through the pin holes of the sustain wafer 620B can be provided to the photodiodes PD without passing through the metal layers M1 to M5. A separate wafer for the same or similar function as the support or holding function of the above-described sustain wafers may be disposed below the metal layers M1 to M5 in the drawing.

Similar to the above-described embodiment, the plurality of pin holes of the sustain wafer 620B can form a focus of light reflected and transmitted by the fingerprint. 15, the distance between the pin holes of the sustain wafer 620B and the photodiodes PD may be shorter than in the embodiment shown in Fig. 14 as the image sensor is implemented in the BSI scheme , So an implementation of an image sensor such as FSI or BSI can influence the size of the sensor pixel.

16 is a view showing an example in which a fingerprint sensor package including a pinhole layer of a built-in structure is attached to a display panel. In FIG. 16, a surface type adhesive element and a COB type mounting example are shown. However, as mentioned above, the fingerprint sensing system to which the pinhole layer of the built-in structure is applied can be implemented by various other methods.

Referring to FIG. 16, the fingerprint sensing system 700 may include a fingerprint sensor package 710, a display panel 720, and a board 730. In addition, the fingerprint sensor package 710 may include a package substrate 711, an image sensor 712 mounted on the package substrate 711, and a molding 713. Further, the fingerprint sensor package 710 may be attached to the display panel 720 through the adhesive element 714. [

The image sensor 712 may include a light receiving area 712_1 and a logic area 712_2. The light receiving area 712_1 may be implemented according to the embodiments shown in FIG. 14 or 15 described above, so that the light receiving area 712_1 is stacked on top of the photodiodes in the image sensor process, (Sustain W / F) formed on the substrate. In addition, the logic region 712_2 may generate image data through logic processing on the electrical signal from the light receiving region 712_1 and provide the generated image data to the board 730 through the package substrate 711 . According to the above structure, the process for laminating the pinhole mask on the image sensor 712 in the packaging process according to the present embodiment can be omitted.

17 to 24 are views showing various structures of the fingerprint sensor package according to the embodiments of the present invention. 17 to 24, the pinhole mask according to the above-described embodiments may be arranged externally on the image sensor in the fingerprint sensor package, or may be embodied as the above-mentioned sustain wafer or the like A layer capable of performing a pinhole mask function can be embedded in the image sensor.

The image sensor included in the fingerprint sensor includes a light receiving area for sensing light reflected by the fingerprint and generating an electric signal corresponding thereto, and a logic area for generating image data through logic processing on the electrical signal from the light receiving area can do. According to one embodiment, the light receiving region and the logic region are fabricated as separate chips (e.g., chips in a die unit) on different semiconductor substrates, and the sensor chip including the light receiving region and the logic chip including the logic region are one Of the semiconductor package. Alternatively, the light receiving region and the logic region may be fabricated on one semiconductor substrate and packaged in an image sensor chip. According to the above-described embodiments, a separate pinhole mask (not shown) can be laminated on top of the sensor chip in the packaging process. Alternatively, according to the above-described embodiments, a sustain wafer in which pin holes are formed in a semiconductor process for manufacturing a sensor chip may be stacked on top of the photodiode.

Hereinafter, for the sake of convenience of description, in explaining the features of the embodiments of the present invention, an example in which the light receiving region and the logic region are manufactured on the same substrate will be referred to. Accordingly, a chip manufactured on the same semiconductor substrate as the sensor region and the logic region will be referred to as an image sensor chip. However, the embodiments of the present invention need not be limited to such a term. For example, a chip including both a sensor region and a logic region may be referred to as a sensor chip.

Referring to the fingerprint sensor package 800 of FIG. 17, the image sensor chip 801 may be mounted on a package PCB. Since the sensor region 810 and the logic region 850 included in the image sensor chip 801 do not have a stacked structure, one or more layers may be located on the same plane. Alternatively, when the sensor region 810 and the logic region 850 are made of separate chips, the chips can be mounted on a package PCB (PCB) on the same plane. 17, an example in which the sensor region 810 and the logic region 850 are electrically connected to the package substrate through the bonding wire 830 is shown.

In the example of FIG. 17, an example in which the sensor region 810 is implemented by the FSI scheme in the above-described embodiment is shown, so that the sensor region 810 is formed by a plurality of photodiodes (PD), and one or more metal layers 812 on which metal lines 812_1 are formed. In addition, light reflected by the fingerprint can be transmitted to the photodiodes PD through the pinhole layer (not shown) and the metal layers 812.

The fingerprint sensor package 800 may be mounted in the form of a chip on board according to the embodiment described above. A connection terminal for transmitting a signal between the sensor region 810 and the logic region 850 and the board 820 in the fingerprint sensor package 800 may be formed on one side of the package substrate. An example in which a plurality of solder balls 840 are attached to one side of the package substrate is shown.

As the sensor region 810 is implemented by the FSI method, a pad for electrical connection to the outside exists at the uppermost portion of the sensor region 810, and the sensor region 810 has a pad And the package substrate may be electrically connected to the metal line 812_1 located on the upper side. As an example, the pad of the sensor region 810 and the package substrate may be electrically connected via a bonding wire 830. An electrical signal from the sensor region 810 in the fingerprint sensor package 800 may be provided to the logic region 850 and image data from the logic region 850 may be provided through the solder balls 840 and the board 820 Can be provided as an external system.

18 shows another example in which the image sensor chip is mounted on the package substrate. The sensor region 910 in the image sensor chip 901 shown in FIG. 18 is implemented by the BSI method, and the fingerprint sensor package 900 is mounted in the form of a chip on board according to the above-described embodiment An example is shown.

18, the image sensor chip 901 of the fingerprint sensor package 900 includes a sensor region 910 and a logic region 950, and as the sensor region 910 is implemented by the BSI scheme, One or more metal layers 912 having a semiconductor substrate 911 on which the photodiodes PD of the photodiodes PD are formed and a metal line 912_1 formed on the photodiodes PD on the sensor region 910, Can be located. A pad may be positioned at the bottom of sensor region 910 and sensor region 910 may be positioned on one side of the package substrate through a pad and connection terminal (e.g., bump 930) As shown in FIG. An electrical signal from the sensor region 910 may also be transmitted to the board 920 via bump 930 and a connection terminal (e.g., solder ball 940) attached to the other side of the package substrate.

According to the above-described embodiments, the thickness of the fingerprint sensor package can be reduced since the sensor region and the logic region do not have a laminated structure in the fingerprint sensor package. 18, since the sensor region 910 can be connected to the package substrate through the bumps 930 without using wire bonding, the sensor region 910 can be connected to the package substrate through the bump 930, The thickness of the package 900 may be prevented from increasing.

19 and 20 are block diagrams showing one embodiment of a fingerprint sensor package having a stacked structure of a sensor chip and a logic chip. 19 and 20 show an example in which the sensor chip and the logic chip are fabricated on separate semiconductor substrates. In Fig. 19, the sensor chip is implemented by the FSI method, while in Fig. 20, the sensor chip is implemented by the BSI method. 19 and 20, the pinhole mask according to the embodiment of the present invention is omitted for the sake of convenience. However, the pinhole mask may be embodied or embodied in the above-described embodiments, May be provided in the sensor package.

19, the fingerprint sensor package 1000 may include a sensor chip 1010 having a photodiode PD and a logic chip 1020 having a logic circuit formed thereon. The sensor chip 1010 and the logic chip 1020 may have a laminate structure in the fingerprint sensor package 1000. [ 19 shows an example in which the sensor chip 1010 is implemented by the FSI method and thus the semiconductor substrate 1011 in which the plurality of photodiodes PD are formed is positioned at the bottom of the sensor chip 1010, Layers 1012 may be located at the top of the sensor chip 1010.

According to one embodiment, within the fingerprint sensor package 1000, the sensor chip 1010 may be stacked on top of the logic chip 1020. The sensor chip 1010 can generate an electric signal by sensing the light reflected by the fingerprint, and the electric signal is transmitted through the metal line formed in the upper metal layer among the one or more metal layers 1012 in the sensor chip 1010 To the logic chip 1020 through the logic chip 1020. According to one embodiment, a BVS (Back Via Stack) 1060 penetrating the semiconductor substrate 1011 of the sensor chip 1010 from at least one metal layer of the sensor chip 1010 is formed on the sensor chip 1010, The electrical signal from the sensor chip 1010 may be provided to the logic chip 1020 via the BVS 1060.

Meanwhile, the logic chip 1020 may include various circuits for processing the electrical signals to generate image data, and may include a plurality of metal layers for implementing various logic circuits. The electrical signal transmitted through the BVS 1060 may be provided as at least one metal layer within the logic chip 1020.

The logic chip 1020 may be mounted on a package PCB and electrically connected to the package substrate. According to one embodiment, one or more metal layers may be deposited on the semiconductor substrate of the logic chip 1020 and thus electrically connected to the package substrate through a pad present at the top of the logic chip 1020 . As an example, the logic chip 1020 may be electrically connected to the package substrate via a pad and a bonding wire 1040.

The fingerprint sensor package 1000 is mounted on the board 1030 in the form of a chip on board and the logic chip 1020 can be connected to the board 1030 through the solder balls 1050 as an example. In addition, the logic chip 1020 may provide image data to an external system (e.g., a device that reconstructs fingerprints) through a package substrate, solder balls 1050, and a board 1030.

19, when the sensor chip 1010 in which the photodiode PD is formed and the logic chip 1020 in which the logic circuit is formed have a laminated structure and the sensor chip 1010 is implemented by the FSI method The sensor chip 1010 and the logic chip 1020 can be connected through the BVS 1060 to minimize the thickness increase of the fingerprint sensor package 1000 in the laminated structure of the sensor chip 1010 and the logic chip 1020 . Even if the logic chip 1020 is connected to the package substrate via the bonding wire 1040, since the sensor chip 1010 is stacked on the logic chip 1020, a thickness increase due to the bonding wire 1040 itself is not generated .

According to the laminated structure of the sensor chip 1010 and the logic chip 1020, since the fingerprint sensor package 1000 needs to recognize the entire fingerprint of the finger, the sensor chip 1010 The area of the fingerprint sensor package 1000 can be prevented from increasing due to the logic circuits other than the sensor chip 1010. [

20, the fingerprint sensor package 1100 may include a sensor chip 1110 having a laminated structure and a logic chip 1120 having a logic circuit formed thereon. The sensor chip 1110 may be formed by a BSI method Can be implemented. The semiconductor substrate 1111 on which the plurality of photodiodes PD are formed is positioned on the sensor chip 1110 and one or more metal layers 1112 on which the metal lines are formed are disposed under the semiconductor substrate 1111 Can be located.

The logic chip 1120 may include various circuits for logic processing the electrical signals from the sensor chip 1110 to generate image data. The logic chip 1120 may include a plurality of metal layers Can be stacked. In addition, the logic chip 1120 may be mounted on a package substrate, and the fingerprint sensor package 1100 may be connected to the board 1130 through a solder ball 1150. In addition, the pad of the logic chip 1120 may be at the top, and the logic chip 1120 and the package substrate may be electrically connected to each other through the bonding wire 1140.

On the other hand, when the sensor chip 1110 is implemented by the BSI method, the metal layers 1112 of the sensor chip 1110 are positioned at the bottom, while the metal layers of the logic chip 1120 are positioned at the top do. In this case, the metal line of the sensor chip 1110 (e.g., the metal line of the lowest metal layer) and the metal line of the logic chip 1120 (e.g., the metal line of the uppermost metal layer) As shown in FIG. A separate layer 1170 such as an interposer is disposed between the sensor chip 1110 and the logic chip 1120 and the electric signal generated by the sensor chip 1110 passes through a separate layer 1170 And may be provided to at least one metal layer within the logic chip 1120 via TSV 1160.

20, the sensor chip 1110 and the logic chip 1120 can be electrically connected through the TSV 1160 without using a bonding wire, and thus, the sensor chip 1110 and the logic chip 1120 can be electrically connected through the TSV 1160. Accordingly, It is possible to minimize the thickness increase in the laminated structure of the first electrode 1120.

Figs. 21 to 24 are block diagrams showing implementations in which the fingerprint sensor package is mounted in a COF form. Fig. When the COF method is applied, the fingerprint sensor package can be directly connected to the film through a connection terminal such as a bump. That is, in the embodiments shown in FIGS. 21 to 24, the sensor chips or logic chips may be directly connected to the film through one or more connection terminals without having to be mounted on a separate package substrate.

21 and 22 illustrate a case where the sensor region and the logic region are fabricated on the same semiconductor substrate, and FIGS. 23 and 24 illustrate a case where the sensor chip and the logic chip have a stacked structure in the semiconductor package .

21A, the image sensor chip 1201 of the fingerprint sensor package 1200 may include a sensor region 1210 and a logic region 1250, and the sensor region 1210 may include an FSI ≪ / RTI > The sensor region 1210 may include a plurality of photodiodes PD formed on a semiconductor substrate 1211 and one or more metal layers 1212 stacked on the photodiodes PD. A pad is formed at the top of the image sensor chip 1201 so that the sensor region 1210 can be electrically connected to the film 1220 through a connection terminal such as a bump. The sensor region 1210 may sense light transmitted through the metal layers 1212 and provide an electrical signal based on the sensing result to the film 1220.

In such an embodiment, the sensor region 1210 may be attached to a display panel (not shown) with the film 1220 positioned below the film 1220, And may be provided to the photodiodes PD via the metal layers 1212. [ According to one embodiment, a hole 1221 may be formed in a region (or an area through which light passes) corresponding to the photodiodes PD in the film 1220, as shown in FIG. 21 (b) have. The fingerprint sensor package 1200 may be connected to the film 1220 such that the photodiodes PD formed on the semiconductor substrate 1211 are located in areas corresponding to the holes 1221 formed in the film 1220. [ Also, for signal transmission through the film 1220, a wiring 1222 may be formed on at least one side of the film 1220, and a wiring line may be formed through both sides of the film 1220 . In addition, the film 1220 may include a connector 1223 for connection to other devices or systems.

22, the image sensor chip 1301 of the fingerprint sensor package 1300 may include a sensor region 1310 and a logic region 1350, and the sensor region 1310 may be implemented by a BSI method .

The sensor region 1310 is implemented by the BSI method so that the semiconductor substrate 1311 having the plurality of photodiodes PD formed thereon is positioned on the image sensor chip 1301 and the one or more metal layers (1312) may be located under the semiconductor substrate 1311. [ The pad of the image sensor chip 1301 is located at the lowermost position so that one or more metal lines below the sensor region 1310 are connected to the pad and the connection terminal (e.g., the bump 1330) Lt; RTI ID = 0.0 > 1320 < / RTI > According to one embodiment, the sensor region 1310 may be attached to a display panel (not shown) with the sensor region 1310 positioned on top of the film 1320, May be provided directly to the photodiodes (PD) without passing through the photodiodes (1312).

22, since the light reflected by the fingerprint is provided to the photodiodes PD without passing through the film 1320, a separate hole for the light propagation path is formed in the film 1320 Need not be formed.

23 and 24 illustrate an example of a fingerprint sensor package having a stacked structure of a sensor chip and a logic chip, and a COF method.

23, the fingerprint sensor package 1400 may include a sensor chip 1410 and a logic chip 1420, and the sensor chip 1410 may be implemented by an FSI method. In addition, the logic chip 1420 may include a plurality of metal layers to implement a logic circuit for processing image data from the sensor chip 1410 by logic processing, Chip 1410 and logic chip 1420 may be electrically connected to each other via BVS 1440. [

The logic chip 1420 in the fingerprint sensor package 1400 can be electrically connected to the film 1430 so that the logic chip 1420 generates image data based on the electrical signal from the sensor chip 1410 And transmit the generated image data to the film 1430. As an example, a plurality of metal layers of the logic chip 1420 may be stacked on a semiconductor substrate, and at least one metal layer (e.g., a top metal Layer may be connected to the film 1430 through a connection terminal (e.g., bump 1450). That is, the logic chip 1420 can receive electrical signals from the sensor chip 1410 through the metal lines formed on the BVS 1440 and the uppermost metal layer and provide them to the underlying metal layers, May be transferred to the film 1430 through the metal line and bonding 1450 formed in the topmost metal layer.

According to the embodiment shown in Fig. 23, a hole having an area enough for the sensor chip 1410 to pass through the film 1430 is formed, and the sensor chip 1410 is inserted into the hole of the film 1430 . ≪ / RTI > Thus, in mounting the fingerprint sensor package 1400 having the structure in which the sensor chip 1410 and the logic chip 1420 are laminated on the film 1430, the overall thickness can be reduced.

Referring to FIG. 24, the fingerprint sensor package 1500 may include a sensor chip 1510 and a logic chip 1520, and the sensor chip 1510 may be implemented by a BSI method. In addition, the logic chip 1520 may include a plurality of metal layers for processing image data by logic processing the electrical signal from the sensor chip 1510. According to the above structure, the sensor chip 1510 and the logic The chips 1520 may be electrically connected to each other via the TSV 1540. Although not shown in FIG. 24, a separate layer (not shown) such as an interposer in which a TSV 1540 is formed may be disposed between the sensor chip 1510 and the logic chip 1520.

The metal lines formed on at least one metal layer (e.g., the topmost metal layer) of the logic chip 1520 may be electrically connected to the film 1530 through the bumps 1550, as in the previous embodiments. The film 1530 may have a structure in which a hole having an area enough for the sensor chip 1510 to pass therethrough is formed and the sensor chip 1510 is inserted into the hole of the film 1530.

In the above-described embodiments, a hole is formed in the film when the fingerprint sensor package having a laminated structure is connected to the film, but the embodiment of the present invention need not be limited thereto. For example, a fingerprint sensor package having the above-described laminated structure may be connected to a film on which a hole is not formed as shown in Fig. 22 described above. At this time, when the area where the sensor chip is located corresponds to the upper area of the fingerprint sensor package, the upper area of the fingerprint sensor package may be attached to one side of the display panel.

25 is a view of a fingerprint sensor according to a variant embodiment of the present invention. Fig. 25 shows a configuration of the fingerprint sensor 1600, which includes a plurality of layers for implementing the sensor chip. According to the above-described embodiments, a logic chip (not shown) in which a logic circuit is formed may further be provided in the fingerprint sensor 1600. [

The fingerprint sensor 1600 may include a semiconductor substrate 1610 on which a photodiode PD is formed, and one or more metal layers 1620 stacked on the semiconductor substrate 1610. In addition, a dielectric formed in the form of an ILD or IMD may be disposed between the metal layers 1620, and each of the metal layers may include metal lines and contacts. In addition, the dielectric material may be embodied as a transparent or translucent material capable of transmitting light.

According to one embodiment, the function of the pinhole can be realized through the arrangement of the metal lines in the metal layers 1620, without the pinhole layer being separately formed in the fingerprint sensor 1600. For example, when the sensor chip of the fingerprint sensor 1600 is implemented by the FSI method, the light reflected by the fingerprint can be transmitted to the photodiode PD through the metal layers. At this time, since the metal lines formed on the metal layers are formed of a material that does not allow light to pass through, the light can be transmitted through spaces between the metal lines. According to the above-described embodiment, the diameter and height of the pinhole can serve as parameters for determining the sizes of the fingerprint pixels and the sensor pixels, and by the space between the metal lines, functions similar to the pinholes in the above- , And a function of transmitting the brightness of the reflected light to the photodiode) can be performed.

26 is a view showing the structure of a fingerprint sensor package according to a variant embodiment of the present invention.

Referring to Fig. 26, the fingerprint sensor package 1700 may include a package substrate 1710, an image sensor 1720 mounted on the package substrate 1710, and a molding 1730 corresponding to the package cover. In addition, the image sensor 1720 may include a sensor chip and a logic chip, and the image sensor 1720 may be electrically connected to the package substrate 1710 through a connecting element such as a bonding wire.

According to one embodiment, one or more holes 1731 may be formed in the region located above the image sensor 1720 in the molding 1730 of the fingerprint sensor package 1700. For example, the thickness of the moldings 1730 on top of the fingerprint sensor package 1700 may have a value that is appropriate for forming the focus of light in accordance with the embodiments described above, and holes 1731 are formed in the moldings 1730 May correspond to a region where photodiodes (not shown) are formed in the image sensor 1720. [ According to one embodiment, the moldings 1730 can be implemented using devices with low light transmittance, e.g., the moldings 1730 can be implemented with epoxy resins such as EMC molding compounds.

The fingerprint sensor package 1700 implemented as shown in Fig. 26 can be attached to the display panel in various manners. As an example, the fingerprint sensor package 1700 may be attached to the display panel through a transparent or translucent adhesive element having a surface shape. Or, as an example, the fingerprint sensor package 1700 may be attached to the display panel through a transparent, translucent, or opaque adhesive element having a window frame shape. The height of the edge region in the molding 1730 of the fingerprint sensor package 1700 may be higher than the height of the region in which the holes 1731 are formed so that the molding 1730 of the fingerprint sensor package 1700, May be attached to the display panel.

27 is a view showing a structure of a fingerprint sensor package according to another variant embodiment of the present invention.

27, the fingerprint sensor package 1800 includes a package substrate 1810, an image sensor 1820 mounted on the package substrate 1810, and a pinhole mask 1840 located on the image sensor 1820 . In addition, a support table 1830 may be formed on the image sensor 1820 to support the pinhole mask 1840. [ In the same or similar manner as described above, the image sensor 1820 may include a sensor chip and a logic chip, and a molding corresponding to the package cover may be formed in the fingerprint sensor package 1800. Further, the fingerprint sensor package 1800 may be attached to a display panel including a light source such as an OLED.

According to one embodiment, the fingerprint sensor package 1800 may further include a light-intensity boosting micro lens array 1850 for amplifying the light amount. The microlens array 1850 may be located on top of the fingerprint sensor package 1800 and may include a plurality of microlenses corresponding to the plurality of pinholes included in the pinhole mask 1840. As an example, a plurality of microlenses included in the microlens array 1850 may be aligned in the pin holes. Also, a molding positioned in the edge region in the fingerprint sensor package 1800 can be used as a means for supporting the microlens array 1850, and as an example, the microlens array 1850 can be used as a mold for positioning in the edge region .

27, light from a light source (e.g., an OLED) of the display panel is reflected by the fingerprint and transmitted to the image sensor 1820 through the microlens array 1850 and the pinhole mask 1840 . At this time, in the path of the light transmitted to the image sensor 1820, a focus by the pinhole mask 1840 can be formed while a focus by the microlens array 1850 is formed. That is, the light collected by the microlens array 1850 is transmitted to the pinhole mask 1840, and the amount of light sensed by the image sensor 1820 can be increased.

In addition, since two focal points are formed in the path of light propagation to the image sensor 1820, the image reversal that occurs when passing through the focal point occurs twice so that the image sensed by the image sensor 1820 is the original It may correspond to a fingerprint image. Further, when the distance between the fingerprint pixels and the pinhole mask 1840 is long, the ratio of the diameter to the thickness of the pinhole needs to be small. However, according to the embodiment, the condensing effect is generated by the microlens array 1850, The hole mask 1840 can pass the light from the nearby microlens array 1850, thereby increasing the angle of view of the pinhole. That is, the thickness of the pinhole mask 1840 can be reduced because the ratio of the diameter to the thickness of the pinhole can be reduced according to the embodiment. As a result, the manufacturing process of the pinhole mask 1840 can be made easier.

On the other hand, when the pinhole mask 1840 is implemented as an opaque element, the pinhole mask 1840 blocks other lights (lights not related to fingerprint sensing) transmitted through the area other than the microlens array 1850 Function can be performed together.

In addition, according to one embodiment, the microlenses of the microlens array 1850 may be positioned to align with the sensor pixels of the image sensor 1820, along with the pinholes of the pinhole mask 1840. According to one embodiment, when the microlenses of the microlens array 1850 are not aligned to the sensor pixel, the image sensor 1820 performs a compensation operation on the offset between the microlenses and the sensor pixel in software . For example, the sensor pixel includes a plurality of photodiodes (or a plurality of subpixels), and the center of the pinhole can be determined by sensing light provided to the sensor pixel, and the offset compensation operation is performed in software So that corresponding electrical signals (or image data) can be generated when the sensor pixel is aligned to the center of the pinhole.

In the above-described embodiment, the pin hole mask 1840 is attached on the image sensor 1820 during the packaging process as an external method, but the embodiment can be variously modified. As an example, in the embodiment using the above-described microlens array 1850, the pinhole mask 1840 may be embedded in the image sensor 1820 in the process for the implementation of the image sensor 1820, According to the embodiment, a sustain wafer having a plurality of holes as the built-in method can perform the function of the pinhole mask 1840.

In addition, the fingerprint sensor packages 1700 and 1800 of FIGS. 26 and 27 may be mounted on a board in the form of a chip on board (COB) according to the above-described embodiments. Alternatively, the fingerprint sensor packages 1700 and 1800 may be mounted in a COF (Chip On Film) form on a film in which a wire having an arbitrary shape (for example, a large square) is formed so that light can be transmitted through the sensor surface .

28A, 28B and 28C are views showing a fingerprint sensing system including a fingerprint sensor package to which a microlens array is applied.

Referring to FIG. 28A, the fingerprint sensing system may include the fingerprint sensor package 1800 in the above-described embodiment. The fingerprint sensing system may also include a display panel 1801 to which the fingerprint sensor package 1800 is attached and a board 1802 for mounting the fingerprint sensor package 1800. [ Since the microlens array 1850 is located on the upper side of the fingerprint sensor package 1800, the microlens array 1850 can be attached to one side of the display panel 1801. Although not shown in FIG. 28A, the microlens array 1850 can be attached to one surface of the display panel 1801 through a bonding element having a surface shape or a window frame shape.

On the other hand, FIGS. 28B and 28C illustrate a light transmission path in the fingerprint sensor package 1800 of the fingerprint sensing system. Fig. 28B shows an example in which positions of microlenses, pinholes, and sensor pixels are aligned. As shown in FIG. 28B, light emitted from the OLED as a light source of the display panel 1801 is reflected by the fingerprint of the user and is transmitted to the backplane direction and is provided to the microlens array 1850. In addition, as the microlens array 1850 and the pinhole mask 1840 are disposed in the fingerprint sensor package 1800, the focus of the light formed by the microlens array 1850 is formed by the pinhole mask 1840 There is a focal point of light. In addition, the diameter and height of the pinhole can be determined in consideration of a relatively short distance to the microlens array 1850, regardless of the distance between the pinhole and the fingerprint of the user. In this embodiment, The pinhole mask 1840 can be easily implemented. Alternatively, as shown in FIG. 28C, the pinhole may be arranged so as to be located at a focus height created by the microlens. In this case, the overall height from the microlens to the sensor pixel may be reduced as compared with the embodiment of FIG. 28B.

29 is a diagram showing an example in which a fingerprint sensor package to which a microlens array is applied is mounted on a film in which wiring lines are embedded.

29, the fingerprint sensing system 1900 may include a fingerprint sensor package 1910, a display panel 1920, and a film 1930 for mounting the fingerprint sensor package 1910. The fingerprint sensor package 1910 may include an image sensor 1911, a pinhole mask 1912 and a microlens array 1913. The film 1930 on which the fingerprint sensor package 1910 is mounted is provided with a hole having a size enough to allow the fingerprint sensor package 1910 to pass therethrough, and on at least one side of the film 1930, Wiring for transmission can be formed.

According to one embodiment, the fingerprint sensor package 1910 may be attached to the display panel 1920 through a hole in the film 1930. In addition, although not shown in FIG. 29, a fingerprint sensing system 1900 may further include a surface-type or window-shaped adhesive element for attaching the fingerprint sensor package 1910 and the display panel 1920. In addition, the image sensor 1911 may include a light receiving area and a logic area. When the light receiving area and the logic area are implemented as separate chips, the image sensor 1911 includes a sensor chip including a light receiving area and a logic area Lt; / RTI > chip. The image sensor 1911 may be electrically connected to one side of the film 1930 through bonding.

Figures 30-32 illustrate a fingerprint sensing system in accordance with variant embodiments of the present invention.

Referring to FIG. 30, the fingerprint sensing system 2000 includes a display panel 2010 including a plurality of OLEDs, a pinhole mask 2020 having a plurality of pinholes, and an image sensor 2030 including a plurality of sensor pixels. . ≪ / RTI > Each of the sensor pixels may include one or more photodiodes. In addition, a plurality of OLEDs may be located in the OLED layer of the display panel 2010.

The plurality of OLEDs of the display panel 2010 may be elements that emit light having different colors and wavelength bands. For example, the display panel 2010 may include an OLED that emits a red (R) color, an OLED that emits a blue (B) color, and an OLED that emits a green (G) color. When OLEDs emit light with different colors, the wavelengths of light in each color can have different values.

According to one embodiment, OLEDs emitting any one of the OLEDs emitting a plurality of colors can be selectively used in conjunction with the fingerprint sensing operation. For example, light from an OLED that emits a red (R) color may be reflected by the fingerprint and provided to the image sensor 2030 through the pinhole mask 2020. At this time, when only the OLED emitting red (R) color is selectively activated in relation to the fingerprint sensor, a separate color filter need not be disposed in the image sensor 2030. Alternatively, as a mono filter for filtering only one color corresponding to a plurality of photodiodes, only a red color filter may be implemented in the image sensor 2030 corresponding to an OLED that selectively emits red (R) have. That is, a color filter that passes only the same color depending on the color of the selected light source may be used, or the filter may not be disposed in the image sensor 2030.

When OLEDs emitting a plurality of colors are used, a difference in focal distance due to chromatic aberration occurs for each wavelength of light. In this case, sharpness may deteriorate in the sensing result as the focus can not be converged have. On the other hand, according to the embodiment, since the fingerprint sensing operation according to the exemplary embodiment of the present invention is performed by selectively using only the OLED that emits light having the same wavelength among the plurality of OLEDs, A uniform focus is formed on the plurality of pinholes, and the sharpness of the fingerprint sensing result can be improved.

31A and 31B show another example in which the sensing sharpness is improved as in the above-described embodiment.

31A, the fingerprint sensing system 2100 includes a display panel 2110 and a fingerprint sensor 2120 and the fingerprint sensor 2120 can include a pinhole mask 2121 and an image sensor 2122 have. According to the above-described embodiments, the fingerprint sensor 2120 can be packaged and attached to one side of the display panel 2110. [

The pinhole mask 2121 includes a plurality of pinholes, and each pinhole can form a focus of light reflected and transmitted by the fingerprint. In addition, the display panel 2110 may include OLEDs that emit light of a plurality of colors without a backlight, and OLEDs that emit light of at least some of the plurality of OLEDs may be used for the fingerprint sensing operation have.

The image sensor 2122 includes a plurality of sensor pixels corresponding to a plurality of pin holes, and each sensor pixel may include one or more photodiodes (PD). Also, according to one embodiment, a color filter may be formed corresponding to each of the plurality of sensor pixels, and the same color filter (or a filter that passes light of the same wavelength) may be formed corresponding to the sensor pixels . In the embodiment of FIG. 31A, an example is shown in which a red color filter CF_R is formed above the photodiodes in the image sensor corresponding to the sensor pixels.

31A, even though light from all the OLEDs of the display panel 2110 is reflected to the fingerprint, the color of the same color (or the same color) is transmitted through the mono filter, which filters the same color in the image sensor 2122, Wavelength) can be selectively provided to the photodiodes (PD) in the sensor pixel, the sharpness of the result of the fingerprint sensing can be improved similarly to the above-described embodiment.

On the other hand, Fig. 31B shows an example using a process of forming a color filter on the entire surface of the sensor region as well as on the upper side of the photodiode according to the modified embodiment of the present invention.

Meanwhile, in the above-described embodiments, an example in which the pinhole mask is provided in an external form is shown, but a pinhole mask having an internal structure in the above-described embodiment may be provided. For example, in the embodiment of FIGS. 31A and 31B, when a sustain wafer is stacked on the photodiodes PD in the image sensor 2122 process to perform a pinhole mask function, the pinhole is divided into a red color filter CF_R and a photo It may be located between the diodes PD.

32, an example of increasing the spatial resolution in the fingerprint sensor is shown.

Referring to FIG. 32, a sensor pixel corresponding to one pinhole may be divided into a plurality of subpixels. In the example of FIG. 32 (a), one sensor pixel is divided into four sub-pixels SP1 to SP4, and in the example of FIG. 32, one sensor pixel is divided into nine sub-pixels SP1 to SP9 Is shown. In addition, the portion indicated by a circle in the sensor pixel of Fig. 32 may correspond to the optical sensing region of each sensor pixel. In addition, each of the subpixels may generate an electrical signal according to the result of sensing the light.

In order to obtain additional resolution of the fingerprint image, it is necessary to reduce the pitch of the fingerprint pixels. To do this, it is necessary to reduce the diameter of each pin hole to reduce the angle of view and reduce the pitch between the pin holes. However, there may be a manufacturing process limitation in increasing the resolution by reducing the diameter or pitch of the pinholes.

According to the embodiment of the present invention shown in FIG. 32, the resolution of the result of the fingerprint sensing can be increased, thereby obtaining a high-resolution fingerprint image. For example, the sensing results from when the 2 ^N of corresponding to the pin holes 2 ^N of sensor pixels are arranged on the image sensor, each sensor pixel be divided into one 2 ^M sub-pixels, the total 2 ^{N + M} subpixels An electric signal can be generated. That is, even if 2 ^N pinholes are arranged, since the resolution of the entire image data according to the sensing result corresponds to N + M bits, the resolution can be increased by M bits without increasing the number of pinholes.

33 is a block diagram illustrating a processing system including a fingerprint sensor or fingerprint sensor package in accordance with embodiments of the present invention.

Referring to FIG. 33, the fingerprint sensing system 2200 may include a display panel 2210 and a processing system 2220. The display panel 2210 may include a cover glass CG, a touch panel TP including a plurality of sensing units, a display area including a plurality of OLEDs, and a backplane BP. The touch panel TP is disposed to sense a touch operation of the user. For example, when a touch panel TP of a capacitance type is applied, the touch panel TP may have a capacitance value Sensing units.

The processing system 2220 may include a display drive circuit 2221, a touch screen controller 2222, and a fingerprint sensor 2223. The display driving circuit 2221 may perform various control operations to implement an image on the display panel 2210 and may provide the display panel 2210 with gray scale data related to image implementation, for example. Also, the touch screen controller 2222 can detect the capacitance change of the sensing units of the touch panel TP and generate the touch sensing result. As an example, the touch screen controller 2222 may provide a driving signal for driving the touch panel TP, and may receive and process an electric signal according to the capacitance variation of the sensing units in the touch panel TP. Further, the fingerprint sensor 2223 may correspond to any of the above-described various embodiments, and may generate a fingerprint image by using OLEDs as a light source and sensing light reflected by the user's fingerprint.

On the other hand, according to one embodiment, the processing system 2220 may be implemented as a single semiconductor chip. As one example, the functions of the display driver circuit 2221, the touch screen controller 2222, and the fingerprint sensor 2223 can be integrated on one semiconductor substrate. According to one embodiment, the fingerprint sensor 2223 may be implemented to include at least some of the various functions mentioned in the above embodiments. For example, the fingerprint sensor 2223 may include a light receiving area as it includes a photodiode, or may further include a logic area for generating the image data described in the above-described embodiments.

According to one embodiment, the display driver circuit 2221, the touch screen controller 2222, and the fingerprint sensor 2223 can be formed in the same semiconductor chip to transmit and receive various information and signals. For example, the operation of the fingerprint sensor 2223 can be controlled by the display driver circuit 2221 and / or the touch screen controller 2222. [ For example, the sensing timing of the fingerprint sensor 2223 and the power and control signals necessary for the sensing operation may be generated by the display driver circuit 2221 and / or the touch screen controller 2222.

In the embodiment shown in FIG. 33, the display driver circuit 2221, the touch screen controller 2222, and the fingerprint sensor 2223 are integrated on one semiconductor chip, but the embodiment of the present invention is not limited thereto none. The fingerprint sensor 2223 may be implemented in the same semiconductor chip as the display drive circuit 2221 or the fingerprint sensor 2223 may be implemented in the same semiconductor chip as the touch screen controller 2222 It may be implemented as a separate semiconductor chip.

While the embodiments of the present invention have been described with reference to the accompanying drawings, the fingerprint sensor, the fingerprint sensor package, or the fingerprint sensing system according to the embodiment of the present invention may be constructed by combining two or more embodiments.

The technical idea of the present disclosure is for a fingerprint recognition field which is one of the most widely used biometrics fields where market demand is increasing, and provides an on-display fingerprint sensor structure for a smartphone or a wearable device. For example, most smartphones currently have a fingerprint sensor on the bottom center button or on the back of the phone. According to the embodiments of the present disclosure, it is possible to provide an optical type sensor structure for eliminating a finger bottom sensor mounted on the lower bottom center home button or the back face and directly recognizing the fingerprint on the display of the smart phone.

 As described above, exemplary embodiments have been disclosed in the drawings and specification. Although the embodiments have been described herein with reference to specific terms, it should be understood that they have been used only for the purpose of describing the technical idea of the present disclosure and not for limiting the scope of the present disclosure as defined in the claims . Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of protection of the present disclosure should be determined by the technical idea of the appended claims.

Claims (20)

An image sensor that includes a plurality of sensor pixels and generates image information corresponding to the fingerprint input by sensing light reflected by the fingerprint; And
And a plurality of pinholes, each pinhole having a pinhole mask forming a focus for transmitting light reflected by the fingerprint to the image sensor,
Wherein the plurality of pinholes emit light from a plurality of OLEDs having one or a plurality of colors located in the display panel to form a focus for light reflected and transmitted to the fingerprint. 2. The image sensor according to claim 1,
A light receiving region for sensing light by photodiodes formed on the plurality of sensor pixels and outputting an electric signal having the image information; And
A logic area for generating image data through signal processing for the electrical signal, and for composing and outputting a fingerprint image through the generated image data. The method according to claim 1,
The fingerprint sensor is attached to one surface of an OLED display panel in which the plurality of OLEDs are formed between a cover glass and a backplane and is irradiated from the plurality of OLEDs in the direction of the cover glass, Sensing the light reflected in the direction of the fingerprint sensor. The method of claim 3,
Wherein the image sensor generates the image information by sensing light generated in the plurality of OLEDs having a plurality of colors and reflected by the fingerprint. The method of claim 3,
Wherein the pinhole mask is positioned between the OLED display panel and the image sensor. The method of claim 3,
The image sensor may include a color filter for selectively passing light of the same color corresponding to the plurality of sensor pixels to selectively sense light having the same color and wavelength band among the plurality of OLEDs Features fingerprint sensor. The method according to claim 1,
Wherein the pinhole mask is created in the process of manufacturing the image sensor and embedded in the image sensor,
The image sensor includes a semiconductor substrate on which a plurality of photodiodes are formed, and one or more metal layers stacked on the semiconductor substrate,
Wherein the pinhole mask corresponds to one or more metal layers, and the plurality of pinholes are formed in a region where the metal lines are not located in the metal layers. The method according to claim 1,
Wherein the pinhole mask is created in the process of manufacturing the image sensor and embedded in the image sensor,
Wherein the image sensor comprises a semiconductor substrate on which a plurality of photodiodes are formed and one or more metal layers,
Wherein the pinhole mask is a sustain wafer having a plurality of pinholes stacked on the semiconductor substrate or the metal layers. The method according to claim 1,
The fingerprint sensor may be a semiconductor package in which the pinhole mask is stacked on a semiconductor chip on which the image sensor is implemented in a packaging process and further includes a support for supporting the pinhole mask on the semiconductor chip Features fingerprint sensor. A fingerprint sensor package, wherein the fingerprint sensor package is attached to one side of a display panel including a plurality of OLEDs,
A package substrate;
A light receiving region which is stacked on the package substrate and is generated by the OLEDs and senses the light reflected by the fingerprint to output an electric signal and generates image data corresponding to the fingerprint input through signal processing for the electric signal An image sensor; And
A pin that is positioned between the plurality of OLEDs and the image sensor and includes a plurality of pinholes and forms a focus for transmitting light reflected by the plurality of OLEDs to the image sensor, And a hole mask is provided on the fingerprint sensor package. 11. The method of claim 10,
A support formed on the image sensor and supporting the pinhole mask layer; And
Further comprising a molding for forming an outer edge of the fingerprint sensor package. 12. The method of claim 11,
Wherein an air gap is formed between the image sensor and the pinhole mask layer inside the fingerprint sensor package, based on the height of the support. 12. The method of claim 11,
Further comprising an adhesive element formed on the pinhole mask for attaching the fingerprint sensor package to the display panel. 14. The method of claim 13,
Wherein the adhesive element has a surface shape so that light reflected by the fingerprint is provided to the image sensor through the adhesive element,
Wherein the adhesive element is embodied as a transparent material. 14. The method of claim 13,
Wherein the adhesive element has a window frame shape in which a hole is formed in a portion corresponding to an area where the pinholes are formed, so that light reflected by the fingerprint is provided to the image sensor without passing through the adhesive element,
Wherein the adhesive element is embodied as a transparent or opaque material. 11. The method of claim 10,
Wherein the fingerprint sensor package is mounted on a board in the form of a chip on board (COB). 11. The method of claim 10,
The fingerprint sensor package is mounted on a film with wiring embedded therein in the form of a chip on film (COF)
Wherein the upper surface of the fingerprint sensor package is attached to the display panel through a hole formed in the film. 11. The image sensor according to claim 10,
A sensor chip including the light receiving region; And
And a logic chip having a laminated structure with the sensor chip, the logic chip processing the electrical signal from the sensor chip to generate the image data,
Wherein when the sensor chip is implemented by an FSI (Front Side Illumination) method, the sensor chip and the logic chip are electrically connected through BVS (Back Via Stack). 11. The image sensor according to claim 10,
A sensor chip including the light receiving region; And
And a logic chip having a laminated structure with the sensor chip, the logic chip processing the electrical signal from the sensor chip to generate the image data,
Wherein the sensor chip and the logic chip are electrically connected through a through silicon via (TSV) when the sensor chip is implemented by a BSI (Back Side Illumination) method. 11. The method of claim 10,
Further comprising a microlens array disposed on the pinhole mask and having a plurality of microlenses corresponding to the plurality of pinholes,
Wherein the light reflected by the fingerprint is transmitted to the image sensor through a focus formed by at least one of the microlens array and the pinhole mask.

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