TWI795615B - 樹脂成形裝置以及樹脂成形品的製造方法 - Google Patents

樹脂成形裝置以及樹脂成形品的製造方法 Download PDF

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Publication number
TWI795615B
TWI795615B TW108144207A TW108144207A TWI795615B TW I795615 B TWI795615 B TW I795615B TW 108144207 A TW108144207 A TW 108144207A TW 108144207 A TW108144207 A TW 108144207A TW I795615 B TWI795615 B TW I795615B
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TW
Taiwan
Prior art keywords
pressure
clamping
resin
detection value
mold
Prior art date
Application number
TW108144207A
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English (en)
Chinese (zh)
Other versions
TW202021771A (zh
Inventor
小河冬彦
奥西祥人
Original Assignee
日商Towa股份有限公司
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Publication date
Application filed by 日商Towa股份有限公司 filed Critical 日商Towa股份有限公司
Publication of TW202021771A publication Critical patent/TW202021771A/zh
Application granted granted Critical
Publication of TWI795615B publication Critical patent/TWI795615B/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/77Measuring, controlling or regulating of velocity or pressure of moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/7653Measuring, controlling or regulating mould clamping forces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76498Pressure

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW108144207A 2018-12-05 2019-12-04 樹脂成形裝置以及樹脂成形品的製造方法 TWI795615B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-227785 2018-12-05
JP2018227785A JP7068148B2 (ja) 2018-12-05 2018-12-05 樹脂成形装置、及び樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
TW202021771A TW202021771A (zh) 2020-06-16
TWI795615B true TWI795615B (zh) 2023-03-11

Family

ID=70993594

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108144207A TWI795615B (zh) 2018-12-05 2019-12-04 樹脂成形裝置以及樹脂成形品的製造方法

Country Status (4)

Country Link
JP (1) JP7068148B2 (ja)
KR (1) KR102267109B1 (ja)
CN (1) CN111267314B (ja)
TW (1) TWI795615B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7360369B2 (ja) * 2020-08-28 2023-10-12 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7360374B2 (ja) * 2020-11-04 2023-10-12 Towa株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7432925B2 (ja) * 2020-12-04 2024-02-19 アピックヤマダ株式会社 圧力監視装置、樹脂封止装置、及び圧力監視方法
JP7447047B2 (ja) * 2021-03-24 2024-03-11 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP2023063177A (ja) * 2021-10-22 2023-05-09 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509715B (zh) * 2008-07-17 2015-11-21 Besi Netherlands Bv 用於以可控制之封閉作用力封裝電子元件的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0414419A (ja) * 1990-05-08 1992-01-20 Yamada Seisakusho Co Ltd トランスファモールド装置
JPH05237863A (ja) * 1991-02-05 1993-09-17 Mitsubishi Electric Corp 半導体素子のモールド封止方法
JP3144699B2 (ja) * 1991-11-30 2001-03-12 アピックヤマダ株式会社 樹脂モールド製品の樹脂モールド方法及び樹脂モールド装置
JPH06204379A (ja) * 1992-12-28 1994-07-22 Sharp Corp 半導体装置の製造方法
JP2736757B2 (ja) * 1995-03-16 1998-04-02 日精樹脂工業株式会社 射出成形機の型締力制御方法
JPH08309783A (ja) * 1995-05-18 1996-11-26 Mitsubishi Electric Corp 樹脂封止装置の射出機構及びその制御方法
JP3746357B2 (ja) * 1997-08-21 2006-02-15 アピックヤマダ株式会社 樹脂モールド装置
JP5625673B2 (ja) 2010-09-24 2014-11-19 日本電気株式会社 射出成形方法及び装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509715B (zh) * 2008-07-17 2015-11-21 Besi Netherlands Bv 用於以可控制之封閉作用力封裝電子元件的方法

Also Published As

Publication number Publication date
CN111267314B (zh) 2022-03-15
KR20200068582A (ko) 2020-06-15
JP2020090010A (ja) 2020-06-11
KR102267109B1 (ko) 2021-06-21
CN111267314A (zh) 2020-06-12
JP7068148B2 (ja) 2022-05-16
TW202021771A (zh) 2020-06-16

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