TWI788685B - 用於電子顯示面板之金屬板設計 - Google Patents

用於電子顯示面板之金屬板設計 Download PDF

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TWI788685B
TWI788685B TW109124169A TW109124169A TWI788685B TW I788685 B TWI788685 B TW I788685B TW 109124169 A TW109124169 A TW 109124169A TW 109124169 A TW109124169 A TW 109124169A TW I788685 B TWI788685 B TW I788685B
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display panel
layer
metal layer
display
backplane
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TW202107172A (zh
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詣 陶
祁琪
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美商谷歌有限責任公司
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Abstract

本發明揭示一種組裝一顯示面板之方法,其包含將一背板層壓至一顯示層以形成一未修整顯示面板,該背板包含一金屬層,該金屬層包含具有比該金屬層之其他部分減少之金屬含量之由一或多個線段界定之一修整路徑。該方法進一步包含沿該一或多個線段修整該未修整顯示面板以界定該顯示面板之一或多個邊緣。針對沿由該等線段界定之該一或多個邊緣之各者之一或多個位置,該金屬層與該顯示面板之該對應邊緣齊平。

Description

用於電子顯示面板之金屬板設計
諸多平板顯示器包含層壓至一顯示層以對顯示層提供支撐及保護之一背板。背板通常包含層壓至一聚合物層之一保護金屬層。
製造此一電子顯示器通常涉及將顯示層修整至一預定大小。因為背板通常包含一硬材料(諸如一金屬層),所以背板可能難以修整。因此,背板通常經預修整,通常經預修整至稍小於顯示器之預定大小之一大小。依此方式,可在背板層壓至顯示層之後修整顯示面板,不必在修整程序期間切割背板。然而,保護層之一或多個邊緣與顯示面板之邊緣之間會產生一偏移以使顯示層之邊緣暴露而易受損壞。
揭示可易於在層壓至一顯示器之後修整之背板。因此,提供以背板與顯示面板之間少有或無偏移為特徵之顯示面板。例如,在一些實施例中,背板包含促進修整之一通孔陣列。孔之中心對準於顯示面板邊緣。背板首先層壓至顯示層,接著其與顯示層一起被修整,從而導致一「鼠嚙」圖案。具有此設計之經修整顯示面板可對顯示層之邊緣提供改良保護。一般而言,通孔可為圓形或其他形狀,諸如矩形孔、方形孔、橢圓形孔等等。
在一些實施方案中,背板可包含具有一局部薄化區域之一金屬層,亦稱為一墊層。薄化區域可比與包含具有均勻厚度之一金屬層之一背板更易於與顯示層一起修整。在修整之後,金屬層之邊緣將在左邊緣、上邊緣及右邊緣上與面板齊平以提供明顯改良保護。
實施方案亦可提供比使用習知背板提供之顯示面板薄之一顯示面板。例如,在特定顯示面板(例如特定OLED面板)中,通常存在支撐顯示層且層壓於顯示層與背板之金屬層之間的一聚合物(例如PET)層。因為所揭示之附接至一顯示層之一金屬層可對顯示層提供改良機械保護,所以可移除聚合物層。因此,可減小顯示面板層疊厚度。
一般而言,在一第一態樣中,一種組裝一顯示面板之方法包含將一背板層壓至一顯示層以形成一未修整顯示面板,該背板包含一金屬層,該金屬層包含具有比該金屬層之其他部分減少之金屬含量之由一或多個線段界定之一修整路徑。該方法進一步包含沿該一或多個線段修整該未修整顯示面板以界定該顯示面板之一或多個邊緣。針對沿由該等線段界定之該一或多個邊緣之各者之一或多個位置,該金屬層與該顯示面板之該對應邊緣齊平。
該方法之實施方案可包含以下特徵之一或多者。在一些實施方案中,該修整路徑包含沿一線配置之貫穿該金屬層之複數個通孔,各通孔與一相鄰通孔由該金屬層之一金屬條分離。其中該金屬層與該一或多個邊緣齊平之位置可對應於使該等相鄰通孔分離之該等條。該金屬層可在該等條之間的位置處自該一或多個邊緣凹入。
該等通孔之形狀可為圓形、方形、矩形或橢圓形。該等通孔具有自0.1mm至1mm之一範圍內之一最大尺寸。
在一些實施方案中,該修整路徑包含具有比該金屬層之該等其他部分減小之一厚度之一通道。在一些實施方案中,藉由形成該金屬層或蝕刻該金屬層來提供該通道。該金屬層可在其中該金屬層與該顯示面板之該一或多個邊緣齊平之位置處具有該減小厚度。
在其他實施方案中,該線包含三段且該層壓物品沿該等段之各者修整以界定該顯示面板之三個邊緣。該顯示面板可包含自該顯示面板之一第四邊緣延伸之一面板尾部且該背板可自該第四邊緣凹入。
在一些實施方案中,使用一雷射修整該顯示面板。在其他實施方案中,藉由放電加工(EDM)修整該顯示面板。在其他實施方案中,藉由劃線修整該顯示面板。
該顯示面板可包含一有機發光二極體(OLED)層。該顯示面板可進一步包含支撐該OLED層之一聚合物膜。
在一些實施方案中,該背板進一步包含一發泡體層及一壓敏黏著層。
在另一態樣中,本發明以一種顯示面板為特徵,該顯示面板包含一顯示層,該顯示層包含一有機發光二極體(OLED)層。該顯示面板亦包含層壓至該顯示層之一背板,該背板包含具有在一或多個位置處與該顯示面板之一對應邊緣齊平之至少一邊緣之一金屬層。
在一些實施方案中,該金屬層在該一或多個位置處包含隔開金屬條,該金屬層自該等隔開條之間的該顯示面板之該對應邊緣凹入。該等條可隔開1mm或更小。
在一些實施方案中,該金屬層在該至少一邊緣處具有比其他位置處之該金屬層之一厚度減小之一厚度。在其他實施方案中,該金屬 層在一或多個位置處與該顯示面板之三個邊緣齊平。該金屬層可自該顯示面板之一第四邊緣凹入。該顯示面板可進一步包含在該第四邊緣處自該顯示面板延伸之一面板尾部。
在一些實施方案中,該顯示面板之該背板可進一步包含該金屬層與該顯示層之間的一發泡體層。在其他實施方案中,該顯示面板之該顯示層包含該背板與該OLED層之間的一聚合物膜。
在其他優點中,實施例以比組裝一習知顯示面板之方法快之組裝一顯示面板之方法為特徵。即,因為附接至一顯示層之一背板之一金屬層具有沿一修整路徑之減少金屬含量,所以修整該金屬層比修整一習知電子顯示面板之一金屬層花更少時間。
可由一雷射或一放電加工機執行修整。兩種機器產生會損壞電子顯示器之熱。所揭示之方法可減少修整時間以因此減少熱損壞電子顯示器之機會。
作為另一優點,儘管習知顯示面板包含背板之金屬層與顯示層之邊緣之間的一偏移,但所揭示之顯示面板包含具有一修整路徑之一金屬層,該修整路徑經選擇使得金屬層實質上與顯示層之邊緣齊平。與顯示層之邊緣齊平之金屬層提供比與不延伸至顯示層之邊緣之一金屬層增加之保護。
其他優點將自[實施方式]、圖式及申請專利範圍明白。
100:修整前顯示面板
102:發光層/顯示面板
104:玻璃層
106:聚合物層
110:顯示層
112:金屬層/金屬板
112a:犧牲部分
112b:金屬層
114:連接層
120:背板
130:孔
140:修整路徑
140a:修整路徑
140b:修整路徑
200:顯示面板
201:下邊緣
202:下邊緣
204:面板尾部
300A:顯示面板
300B:顯示面板
312:金屬層
312a:下邊緣
320:背板
340:修整路徑
342:通道
400A:顯示面板
400B:顯示面板
410:顯示層
412:金屬層
420:背板
440:修整路徑
440a:修整路徑
440b:修整路徑
500:電子控制模組
502:信號匯流排
510:處理器
520:記憶體
530:顯示驅動器
540:信號產生器
550:輸入/輸出(I/O)模組
560:網路/通信模組
d:距離
r:半徑
Wc:寬度
圖1A係修整之前的包含一金屬層之一顯示面板之一橫截面圖。
圖1B係由沿一修整路徑對準之一組孔貫穿之一金屬層之一 平面圖。
圖2A係包含圖1A至圖1B之金屬層之一部分之一顯示面板之一平面圖。
圖2B係圖2A之顯示面板之一橫截面圖。
圖3A係展示沿一修整路徑對準之一通道的包含一金屬層之一實例性顯示面板之一橫截面圖。
圖3B係已沿圖3A之修整路徑修整圖3A之金屬層之後的一顯示面板之一平面圖。
圖4A係無聚合物層之一顯示面板之一橫截面圖。
圖4B係無聚合物層之一顯示面板之一平面圖。
圖5係一行動裝置之一實例性電子控制模組。
各種圖式中之相同元件符號指示相同元件。
參考圖1A,展示於橫截面中(即,在所提供之笛卡爾(Cartesian)座標系之xz平面中)之一修整前顯示面板100包含層壓至一背板120之一顯示層110。顯示層110包含在一側上由一聚合物層106支撐且在對置側上由一玻璃層104覆蓋之一像素化發光層102或簡稱發射層102(例如由有機發光二極體(OLED)及相關聯驅動電路系統構成之像素)。聚合物層106係支撐及保護顯示面板102且對面板提供電絕緣之一聚合物膜。例如,聚合物層106可為聚對苯二甲酸乙二酯。
背板120包含一金屬層112及將金屬層112接合至聚合物層106之一表面之一連接層114。金屬層112通常由一金屬(例如銅或鋁)或一合金(例如鋼)形成。一般而言,金屬層112足夠厚(即,在z方向上),使得 層對顯示面板100提供足夠機械強度,同時未不必要地增加顯示面板之重量、成本及總厚度。在一些實施方案中,金屬層112具有約0.2mm或更小(例如0.15mm或更小、0.12mm或更小、0.1mm或更小、0.08mm或更小、0.05mm或更小)之一厚度,諸如0.01mm或更大。
連接層114可為一壓敏黏著劑(PSA)。背板120可包含額外層,諸如一層發泡體。
亦參考圖1B,金屬層112由沿一修整路徑140對準之一組孔130貫穿。金屬板112在xy平面中呈矩形形狀,具有圓角。修整路徑140沿對應於顯示面板之上邊緣及側邊緣之矩形邊緣之三者延伸。
在附接至聚合物層106之前,貫穿金屬層112以形成孔130,各孔與相鄰孔由一金屬條分離。一旦附接聚合物層106及金屬層112,則金屬層之一犧牲部分112a延伸超過顯示面板102之邊緣。相對於圖1B展示犧牲部分112a在x方向上之延伸,其包含犧牲部分及對應於修整路徑140之兩個虛線140a及140b。金屬層112之犧牲部分與未修整顯示層之邊緣重疊,邊緣亦在修整之後移除。犧牲部分112a之延伸(例如沿x方向或y方向自修整路徑140至犧牲部分之外側邊緣所量測)通常為約0.5mm至約5mm。
孔130係圓形且孔130之中心與修整路徑140對準。各孔具有一半徑r,如圖1B中所標記。犧牲部分112a自顯示面板102之邊緣之延伸至少部分判定半徑r。即,犧牲部分112a自修整路徑140至犧牲部分之外側邊緣之最小延伸(如沿x方向或y方向所量測)應大於半徑r。在一些實施例中,半徑r係約0.25mm或更小(例如0.2mm或更小、0.15mm或更小、0.1mm或更小、0.05mm或更小)。
孔130之間的距離在圖1B中標記為d。距離d係約0.5mm或更小(例如0.45mm或更小、0.4mm或更小、0.35mm或更小、0.3mm或更小)。
孔130之數目及孔130之間的間距可視需要變動。一般而言,孔越大及/或各孔之間的間距d越小,金屬板將越容易修整。然而,權衡在於:孔越大或間距越小,金屬板在修整之後延伸至顯示面板之邊緣將越少以提供較少邊緣保護。相反地,當孔相對小及/或孔之間的間距相對較大時,金屬板將更難修整,但其提供更多邊緣保護。
在背板120層壓至顯示層110之後,背板及顯示層沿修整路徑140修整。例如,可使用一金屬劃線、一雷射切割器或一放電加工機修整背板120及顯示層110。
參考圖2A及圖2B,其等分別為具有修整之後的背板120之一顯示面板200之一平面圖及一橫截面圖。特定言之,顯示面板200包含金屬層112b,其係移除犧牲部分112a之後留下之金屬層112之部分。由於孔130對準,金屬層112b之部分在先前連接孔之金屬條之間凹入。
儘管金屬層122延伸超過顯示面板102之邊緣,但金屬層112b在修整之後與顯示層110之邊緣齊平。即,使在修整金屬層112之後由孔130留下之空間分離之金屬條與顯示面板200之外側邊緣齊平以使顯示層110之邊緣與金屬層112b之外側邊緣之間少有至無偏移。例如,與一第二邊緣齊平之一第一邊緣可在第二邊緣之0.05mm內,例如在0.02mm、0.01mm、0.005mm或更小內。
顯示面板200包含在其下邊緣處連接至顯示面板200且在y方向上延伸遠離顯示面板之中心之一面板尾部204。面板尾部204係用於 將顯示面板102連接至顯示面板200之驅動電子器件及其他電組件之一電連接件。面板尾部204可撓,(例如)使得其可在顯示面板併入至一電子裝置中時折疊至顯示面板下。
由於面板尾部204,不修整背板120之下邊緣202,但其自顯示層110之下邊緣201凹入,其中面板尾部204連接至面板。例如,背板120可自面板尾部204凹入0.05mm或更大(例如0.08mm或更大、0.1mm或更大、0.12mm或更大、0.15mm或更大、0.2mm或更大)。
藉由沿修整路徑140貫穿金屬層來自金屬層112移除金屬之一部分係促進金屬層修整同時亦對一顯示面板提供保護之一方式。組裝一顯示面板之另一方法(其中背板與顯示層一起修整)包含沿一修整路徑自一金屬層之一部分薄化金屬。
參考圖3A,其係修整之前的顯示面板300A之一部分之一橫截面圖,顯示面板包含一背板320,背板320包含一金屬層312及連接層114。金屬層312具有沿一修整路徑340對準之一通道342。顯示面板300A亦包含具有由連接層114連接至金屬層312之聚合物層106之顯示層110。
局部薄化金屬層312以形成通道342導致在修整期間移除少量材料。因此,通道342促進沿修整路徑340修整。可藉由形成及/或蝕刻金屬層312來提供通道342。通道342具有一寬度Wc,其應足夠大以允許層壓及修整容限。例如,Wc可為約0.5mm或更小(例如0.4mm或更小、0.3mm或更小、0.2mm或更小、0.1mm或更小)。一般而言,通道342中之金屬層312之厚度足夠厚,使得金屬層足以在層壓程序期間穩健地保持完整,同時在層壓之後提供易修整性。在一些實施方案中,通道342之厚度係通道外側之金屬層之厚度之50%或更小(例如40%或更小、30%或更 小,諸如約20%或更大)。
在背板320層壓至顯示層110之後執行修整。圖3B係已沿修整路徑340修整面板之後的一顯示面板300B之一平面圖。自通道342薄化之金屬層312之邊緣之一部分沿修整路徑340與顯示層110之邊緣之一部分齊平。金屬層312之一下邊緣312a未延伸至顯示層110之邊緣。在背板320附接至顯示層110之前預修整下邊緣312a以避免切割面板尾部204。
儘管構成上述顯示面板之結構包含特定功能層,但一般而言,其他實施例亦可行。例如,顯示面板一般可包含額外層,諸如背板之金屬層與顯示層之間的一層發泡體。替代地或另外,可消除特定層。例如,在一些實施例中,可移除聚合物層106以允許一更薄顯示堆疊。圖4A及圖4B分別為修整之前的一顯示面板400A之一部分之一橫截面圖及修整之後的一顯示面板400B之平面圖。顯示面板400A/B包含一背板420及一顯示層410。背板420包含一金屬層412及一連接層114。顯示層410包含發光層102及玻璃層104,且背板直接連接至發光層102之一背面。
圖4A展示一修整路徑440,其共用相同於修整路徑340之路徑,但亦包含一路徑440a及一路徑440b。為簡單起見,自圖4B省略與修整路徑340重疊之修整路徑440之部分。儘管修整路徑440a可沿修整路徑340修整,但修整路徑440b在路徑340及440a之修整之前預修整以避免切割面板尾部204。
因為背板420之金屬層在修整之後實質上齊平,所以可認為背板可對發光層102提供足夠邊緣保護,使得未必需要額外聚合物層(例如上述層106)。另外,消除聚合物層可導致比包含聚合物層之面板薄之一顯示面板。
參考圖1B至圖3A,支撐式顯示面板100、200及300A之最大厚度(如z方向上所量測)可為約0.15mm至約0.25mm,其取決於組成支撐式顯示面板之層之厚度。金屬層112、312及412之最大厚度可全部近似相同。例如,最大厚度可為約0.12mm或更小(例如0.1mm或更小、0.075mm或更小、0.05mm或更小、0.02mm或更小)。
任何類型之電子顯示器可用於顯示面板102,例如LCD或OLED顯示器。
所揭示之顯示面板可為一行動裝置之部分。例如,行動裝置可為一智慧型電話、膝上型電腦、平板電腦或可穿戴裝置(例如智慧型手錶或頭戴式裝置,諸如智慧型眼鏡)。在一些實施方案中,支撐式顯示面板可實施於車載顯示器或航空電子顯示器中(例如在駕駛艙顯示器或飛行途中娛樂系統中)。
行動裝置可包含(例如)用於控制一支撐式顯示面板之一電子控制模組。面板尾部204可提供支撐式顯示面板與電子控制模組之間的一電連接。一般而言,電子控制模組由自一或多個感測器接收輸入之一或多個電子組件及/或行動裝置之信號接收器構成,處理輸入,且產生及傳遞引起支撐式顯示面板提供一適合回應之信號波形。參考圖5,一行動裝置之一實例性電子控制模組500包含一處理器510、記憶體520、一顯示驅動器530、一信號產生器540、一輸入/輸出(I/O)模組550及一網路/通信模組560。此等組件彼此電通信(例如經由一信號匯流排502)。
處理器510可實施為能夠處理、接收或傳輸資料或指令之任何電子裝置。例如,處理器510可為一微處理器、一中央處理單元(CPU)、一特定應用積體電路(ASIC)、一數位信號處理器(DSP)或此等裝 置之組合。
記憶體520具有各種指令、電腦程式或儲存於其上之其他資料。指令或電腦程式可經組態以執行相對於行動裝置所描述之操作或功能之一或多者。例如,指令可經組態以經由顯示驅動器530、信號產生器540、I/O模組550之一或多個組件、可經由網路/通信模組560存取之一或多個通信頻道、一或多個感測器(例如生物特徵感測器、溫度感測器、加速度計、光學感測器、氣壓感測器、濕度感測器等等)控制或協調裝置之顯示器之操作。
信號產生器540經組態以產生適合於驅動組件(諸如一致動器)以經由致動器產生聲學/觸覺回應之變化振幅、頻率及/或脈衝輪廓之AC波形。儘管描繪為一單獨組件,但在一些實施例中,信號產生器540可為處理器510之部分。在一些實施例中,信號產生器540可包含一放大器,例如作為其之一整合或單獨組件。
記憶體520可儲存可由行動裝置使用之電子資料。例如,記憶體520可儲存電資料或內容,諸如(例如)音訊及視訊檔案、文件及應用程式、裝置設定及使用者偏好、用於各種模組之時序及控制信號或資料、資料結構或資料庫等等。記憶體520亦可儲存用於重新產生可由信號產生器540用於產生用於行動裝置之其他組件(諸如一致動器)之信號之各種類型之波形之指令。記憶體520可為任何類型之記憶體,諸如(例如)隨機存取記憶體、唯讀記憶體、快閃記憶體、可抽換記憶體或其他類型之儲存元件或此等裝置之組合。
如上文所簡要討論,電子控制模組500可包含在圖5中表示為I/O模組550之各種輸入及輸出組件。儘管I/O模組550之組件在圖5中表 示為一單一項目,但行動裝置可包含若干不同輸入組件,其包含按鈕、麥克風、開關及用於接受使用者輸入之刻度盤。在一些實施例中,I/O模組550之組件可包含一或多個觸控感測器及/或力感測器。例如,行動裝置之顯示器可包含使一使用者能夠提供輸入至行動裝置之一或多個觸控感測器及/或一或多個力感測器。
I/O模組550之各組件可包含用於產生信號或資料之專用電路系統。在一些情況中,組件可產生或提供特定應用輸入之回饋,其對應於呈現於顯示器上之一提示或使用者介面物件。
如上文所提及,網路/通信模組560包含一或多個通信頻道。此等通信頻道可包含提供處理器510與一外部裝置或其他電子裝置之間的通信之一或多個無線介面。一般而言,通信頻道可經組態以傳輸及接收可由執行於處理器510之指令解譯之資料及/或信號。在一些情況中,外部裝置係經組態以與其他裝置交換資料之一外部通信網路之部分。一般而言,無線介面可包含(但不限於)射頻、光學、聲學及/或磁性信號且可經組態以經由一無線介面或協定操作。實例性無線介面包含射頻蜂巢式介面、光纖介面、聲學介面、藍芽介面、近場通信介面、紅外線介面、USB介面、Wi-Fi介面、TCP/IP介面、網路通信介面或任何習知通信介面。
在一些實施方案中,網路/通信模組560之通信頻道之一或多者可包含行動裝置與另一裝置(諸如另一行動電話、平板電腦、電腦或其類似者)之間的一無線通信頻道。在一些情況中,輸出、音訊輸出、觸覺輸出或視覺顯示元素可直接傳輸至另一裝置用於輸出。例如,一聽覺警報或視覺警告可自行動裝置傳輸至一第二行動裝置用於在該第二裝置上輸出且反之亦然。類似地,網路/通信模組560可經組態以接收提供於另一裝 置上之輸入以控制行動裝置。例如,一聽覺警報、視覺通知或觸覺警報(或因此指令)可自另一裝置傳輸至行動裝置用於呈現。
儘管本說明書含有諸多具體實施細節,但此等不應被解釋為限制任何發明或可主張內容之範疇,而是應被解釋為專用於特定發明之特定實施方案之特徵之描述。本說明書在單獨實施方案之背景中描述之某些特徵亦可組合實施於一單一實施方案中。相反地,在一單一實施方案之背景中描述之各種特徵亦可單獨或以任何適合子組合實施於多個實施方案中。再者,儘管特徵可在上文描述為作用於特定組合中且甚至最初如此主張,但在一些情況中,來自一主張組合之一或多個特徵可自組合剔除,且主張組合可針對一子組合或一子組合之變型。
因此,已描述標的之特定實施方案。其他實施方案係在以下申請專利範圍之範疇內。例如,儘管上述顯示器描繪為直視顯示器(例如電視或電腦監視器),但其他實施方案係可行的。
112:金屬層/金屬板
112a:犧牲部分
112b:金屬層
130:孔
140:修整路徑
d:距離
r:半徑

Claims (17)

  1. 一種組裝一顯示面板之方法,其包括:將一背板層壓至一顯示層以形成一未修整顯示面板,該背板包括一金屬層,該金屬層包括具有比該金屬層之其他部分減少之金屬含量之由一或多個線段界定之一修整路徑;沿該一或多個線段修整該未修整顯示面板以界定該顯示面板之一或多個邊緣,其中針對沿由該等線段界定之該一或多個邊緣之各者之一或多個位置,該金屬層與該顯示面板之該對應邊緣齊平。
  2. 如請求項1之方法,其中該修整路徑包括沿一線配置之貫穿該金屬層之複數個通孔,各通孔與一相鄰通孔由該金屬層之一金屬條分離。
  3. 如請求項2之方法,其中該金屬層與該一或多個邊緣齊平之該等位置對應於使該等相鄰通孔分離之該等條。
  4. 如請求項2或3之方法,其中該金屬層在該等條之間的位置處自該一或多個邊緣凹入。
  5. 如請求項2或3之方法,其中該等通孔具有選自由圓形孔、方形孔、矩形孔及橢圓形孔組成之群組之一形狀。
  6. 如請求項2或3之方法,其中該等通孔具有自0.1mm至1mm之一範圍內之一最大尺寸。
  7. 如請求項1至3中任一項之方法,其中該修整路徑包括具有比該金屬層之該等其他部分減小之一厚度之一通道。
  8. 如請求項7之方法,其中藉由形成該金屬層或蝕刻該金屬層來提供該通道。
  9. 如請求項7之方法,其中該金屬層在其中該金屬層與該顯示面板之該一或多個邊緣齊平之該位置處具有該減小厚度。
  10. 如請求項2之方法,其中該線包括三段且該背板及該顯示層沿該等段之各者修整以界定該顯示面板之三個邊緣。
  11. 如請求項10之方法,其中該顯示面板包括自該顯示面板之一第四邊緣延伸之一面板尾部且該背板可自該第四邊緣凹入。
  12. 如請求項1至3中任一項之方法,其中使用一雷射修整該顯示面板。
  13. 如請求項1至3中任一項之方法,其中藉由放電加工(EDM)修整該顯示面板。
  14. 如請求項1至3中任一項之方法,其中藉由劃線修整該顯示面板。
  15. 如請求項1至3中任一項之方法,其中該顯示面板包括一有機發光二極體(OLED)層。
  16. 如請求項15之方法,其中該顯示面板進一步包括支撐該OLED層之一聚合物膜。
  17. 如請求項1至3中任一項之方法,其中該背板進一步包括一發泡體層及一壓敏黏著層。
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