TWI788313B - 異向性導電接著劑 - Google Patents

異向性導電接著劑 Download PDF

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Publication number
TWI788313B
TWI788313B TW106141316A TW106141316A TWI788313B TW I788313 B TWI788313 B TW I788313B TW 106141316 A TW106141316 A TW 106141316A TW 106141316 A TW106141316 A TW 106141316A TW I788313 B TWI788313 B TW I788313B
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
particles
light
conductive adhesive
inorganic binder
Prior art date
Application number
TW106141316A
Other languages
English (en)
Chinese (zh)
Other versions
TW201834275A (zh
Inventor
青木正治
Original Assignee
日商迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201834275A publication Critical patent/TW201834275A/zh
Application granted granted Critical
Publication of TWI788313B publication Critical patent/TWI788313B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
TW106141316A 2016-11-29 2017-11-28 異向性導電接著劑 TWI788313B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016231826A JP2018088498A (ja) 2016-11-29 2016-11-29 異方性導電接着剤
JP2016-231826 2016-11-29

Publications (2)

Publication Number Publication Date
TW201834275A TW201834275A (zh) 2018-09-16
TWI788313B true TWI788313B (zh) 2023-01-01

Family

ID=62242422

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106141316A TWI788313B (zh) 2016-11-29 2017-11-28 異向性導電接著劑

Country Status (4)

Country Link
JP (2) JP2018088498A (ja)
CN (1) CN109997237A (ja)
TW (1) TWI788313B (ja)
WO (1) WO2018101003A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249689A (ja) * 2001-12-18 2003-09-05 Nichia Chem Ind Ltd 発光装置
TW201241145A (en) * 2011-03-07 2012-10-16 Sony Chem & Inf Device Corp Light-reflective anisotropic conductive adhesive and light-emitting device
JP2013195364A (ja) * 2012-03-22 2013-09-30 Tatsuta Electric Wire & Cable Co Ltd 液体検知センサー
TW201406892A (zh) * 2012-06-12 2014-02-16 Samsung Corning Prec Mat Co 無機黏著劑組成物及使用其之氣密式密封方法
TW201414385A (zh) * 2012-09-24 2014-04-01 Dexerials Corp 連接結構體的製造方法及異向性導電接著劑
TW201543502A (zh) * 2014-03-19 2015-11-16 Dexerials Corp 異向性導電接著劑

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JPS62146972A (ja) * 1985-12-20 1987-06-30 Oosakashi 水ガラス系接着剤
DE19803936A1 (de) * 1998-01-30 1999-08-05 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Ausdehnungskompensiertes optoelektronisches Halbleiter-Bauelement, insbesondere UV-emittierende Leuchtdiode und Verfahren zu seiner Herstellung
WO2006088022A1 (ja) * 2005-02-15 2006-08-24 Mitsui Chemicals, Inc. 光触媒、その製造方法、光触媒を含有する分散液および光触媒塗料組成物
JP5036205B2 (ja) * 2006-03-31 2012-09-26 京セラ株式会社 発光装置および発光モジュール
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JP2009140975A (ja) * 2007-12-04 2009-06-25 Panasonic Electric Works Co Ltd 半導体発光装置およびそれを用いる照明装置ならびに半導体発光装置の製造方法
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JP2010192834A (ja) * 2009-02-20 2010-09-02 Hitachi High-Technologies Corp Ａｃｆ熱圧着装置
WO2011125655A1 (ja) 2010-04-02 2011-10-13 株式会社ノリタケカンパニーリミテド 太陽電池用ペースト組成物およびその製造方法ならびに太陽電池
CN102906823B (zh) * 2010-06-09 2014-04-02 海洋王照明科技股份有限公司 导电胶混合物、荧光屏阳极板及其制造方法
KR101714049B1 (ko) * 2010-10-29 2017-03-08 엘지이노텍 주식회사 발광 소자 패키지
KR20140004766A (ko) * 2011-03-28 2014-01-13 후지필름 가부시키가이샤 발광소자용 반사기판 및 그 제조방법
CN103733277B (zh) * 2011-08-03 2017-03-01 日立化成株式会社 组合物套剂、导电性基板及其制造方法以及导电性粘接材料组合物
JP2013243344A (ja) * 2012-04-23 2013-12-05 Nichia Chem Ind Ltd 発光装置
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JP6036818B2 (ja) 2012-05-18 2016-11-30 コニカミノルタ株式会社 導電性基板の製造方法、導電性基板および有機電子素子
JP2014065766A (ja) 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤
JP2015046497A (ja) 2013-08-28 2015-03-12 富士フイルム株式会社 Ｌｅｄ発光素子用反射基板、ｌｅｄ発光素子用配線基板およびｌｅｄパッケージ
JP2015090887A (ja) * 2013-11-05 2015-05-11 株式会社日本セラテック 発光素子及び発光装置
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
JP6430148B2 (ja) 2014-05-23 2018-11-28 デクセリアルズ株式会社 接着剤及び接続構造体
KR20170019408A (ko) * 2014-06-10 2017-02-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Uv 차단성을 갖는 가요성 led 조립체
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JP2016178225A (ja) * 2015-03-20 2016-10-06 デクセリアルズ株式会社 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249689A (ja) * 2001-12-18 2003-09-05 Nichia Chem Ind Ltd 発光装置
TW201241145A (en) * 2011-03-07 2012-10-16 Sony Chem & Inf Device Corp Light-reflective anisotropic conductive adhesive and light-emitting device
JP2013195364A (ja) * 2012-03-22 2013-09-30 Tatsuta Electric Wire & Cable Co Ltd 液体検知センサー
TW201406892A (zh) * 2012-06-12 2014-02-16 Samsung Corning Prec Mat Co 無機黏著劑組成物及使用其之氣密式密封方法
TW201414385A (zh) * 2012-09-24 2014-04-01 Dexerials Corp 連接結構體的製造方法及異向性導電接著劑
TW201543502A (zh) * 2014-03-19 2015-11-16 Dexerials Corp 異向性導電接著劑

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網路文獻 五金工具天天看，無機膠粘劑分類 無機膠粘劑配方，資訊，http://kknews.cc/zh-tw/news/xzvk82q.html，2016/10/28 無機膠粘劑分類 無機膠粘劑配方
網路文獻 五金工具天天看，無機膠黏劑的類型 導電粘合劑的性能如何，科技，http://kknews.cc/tech/899vvaq.html，2016/11/02 無機膠黏劑的類型 導電粘合劑的性能如何;網路文獻 五金工具天天看，無機膠粘劑分類 無機膠粘劑配方，資訊，http://kknews.cc/zh-tw/news/xzvk82q.html，2016/10/28 無機膠粘劑分類 無機膠粘劑配方 *

Also Published As

Publication number Publication date
WO2018101003A1 (ja) 2018-06-07
JP7359804B2 (ja) 2023-10-11
JP2021168387A (ja) 2021-10-21
TW201834275A (zh) 2018-09-16
JP2018088498A (ja) 2018-06-07
CN109997237A (zh) 2019-07-09

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