TWI785626B - 周緣部塗布裝置及周緣部塗布方法 - Google Patents

周緣部塗布裝置及周緣部塗布方法 Download PDF

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Publication number
TWI785626B
TWI785626B TW110119233A TW110119233A TWI785626B TW I785626 B TWI785626 B TW I785626B TW 110119233 A TW110119233 A TW 110119233A TW 110119233 A TW110119233 A TW 110119233A TW I785626 B TWI785626 B TW I785626B
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TW
Taiwan
Prior art keywords
substrate
coating
peripheral portion
coating liquid
speed
Prior art date
Application number
TW110119233A
Other languages
English (en)
Chinese (zh)
Other versions
TW202201485A (zh
Inventor
馬渕康史
後藤茂宏
松泰司
鈴達 胡
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202201485A publication Critical patent/TW202201485A/zh
Application granted granted Critical
Publication of TWI785626B publication Critical patent/TWI785626B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/70—Arrangements for moving spray heads automatically to or from the working position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Materials For Medical Uses (AREA)
  • Closures For Containers (AREA)
TW110119233A 2020-05-29 2021-05-27 周緣部塗布裝置及周緣部塗布方法 TWI785626B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020094883A JP7469145B2 (ja) 2020-05-29 2020-05-29 周縁部塗布装置および周縁部塗布方法
JP2020-094883 2020-05-29

Publications (2)

Publication Number Publication Date
TW202201485A TW202201485A (zh) 2022-01-01
TWI785626B true TWI785626B (zh) 2022-12-01

Family

ID=78728374

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110119233A TWI785626B (zh) 2020-05-29 2021-05-27 周緣部塗布裝置及周緣部塗布方法

Country Status (4)

Country Link
JP (1) JP7469145B2 (ko)
KR (1) KR102483535B1 (ko)
CN (1) CN113731673A (ko)
TW (1) TWI785626B (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW311237B (en) * 1997-01-13 1997-07-21 United Microelectronics Corp Photoresist coating method
TW333663B (en) * 1997-10-01 1998-06-11 Vanguard Int Semiconduct Corp The method for uniformly coating photoresist
TW201433366A (zh) * 2012-12-04 2014-09-01 Tokyo Electron Ltd 周緣部塗布裝置、周緣部塗布方法及周緣部塗布用記錄媒體
TW201822896A (zh) * 2016-09-21 2018-07-01 斯庫林集團股份有限公司 周緣部處理裝置、基板處理裝置以及周緣部處理方法
JP2019212804A (ja) * 2018-06-06 2019-12-12 東京エレクトロン株式会社 塗布膜形成装置及び塗布膜形成装置の調整方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004358381A (ja) * 2003-06-05 2004-12-24 Canon Inc 円形及び環状塗布膜の形成方法
JP2005005303A (ja) 2003-06-09 2005-01-06 Sharp Corp 溶液塗布方法および溶液塗布装置
US7662436B1 (en) * 2005-05-27 2010-02-16 Infineon Technologies Ag Method of spin coating a film of non-uniform thickness
JP2008124368A (ja) 2006-11-15 2008-05-29 Asahi Kasei Electronics Co Ltd 塗布方法
JP5096849B2 (ja) * 2007-09-13 2012-12-12 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5091722B2 (ja) 2008-03-04 2012-12-05 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP5485672B2 (ja) 2009-12-07 2014-05-07 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5682521B2 (ja) 2011-09-14 2015-03-11 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び記憶媒体
JP6475123B2 (ja) * 2015-09-01 2019-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6780330B2 (ja) 2015-11-11 2020-11-04 東京エレクトロン株式会社 塗布膜除去装置、塗布膜除去方法及び記憶媒体
TWI666684B (zh) * 2015-11-16 2019-07-21 日商東京威力科創股份有限公司 塗佈膜形成方法、塗佈膜形成裝置及記憶媒體
JP7024307B2 (ja) 2017-01-26 2022-02-24 東京エレクトロン株式会社 塗布膜除去装置、塗布膜除去方法及び記憶媒体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW311237B (en) * 1997-01-13 1997-07-21 United Microelectronics Corp Photoresist coating method
TW333663B (en) * 1997-10-01 1998-06-11 Vanguard Int Semiconduct Corp The method for uniformly coating photoresist
TW201433366A (zh) * 2012-12-04 2014-09-01 Tokyo Electron Ltd 周緣部塗布裝置、周緣部塗布方法及周緣部塗布用記錄媒體
TW201822896A (zh) * 2016-09-21 2018-07-01 斯庫林集團股份有限公司 周緣部處理裝置、基板處理裝置以及周緣部處理方法
JP2019212804A (ja) * 2018-06-06 2019-12-12 東京エレクトロン株式会社 塗布膜形成装置及び塗布膜形成装置の調整方法

Also Published As

Publication number Publication date
JP2021190572A (ja) 2021-12-13
CN113731673A (zh) 2021-12-03
TW202201485A (zh) 2022-01-01
KR20210147940A (ko) 2021-12-07
KR102483535B1 (ko) 2023-01-02
JP7469145B2 (ja) 2024-04-16

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