TWI781622B - 基板處理裝置、基板處理方法、學習用資料之生成方法、學習方法、學習裝置、學習完成模型之生成方法及學習完成模型 - Google Patents

基板處理裝置、基板處理方法、學習用資料之生成方法、學習方法、學習裝置、學習完成模型之生成方法及學習完成模型 Download PDF

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Publication number
TWI781622B
TWI781622B TW110117628A TW110117628A TWI781622B TW I781622 B TWI781622 B TW I781622B TW 110117628 A TW110117628 A TW 110117628A TW 110117628 A TW110117628 A TW 110117628A TW I781622 B TWI781622 B TW I781622B
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TW
Taiwan
Prior art keywords
processing
learning
substrate
pressure adjustment
information
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TW110117628A
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English (en)
Chinese (zh)
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TW202201518A (zh
Inventor
川根旬平
澤崎尚樹
Original Assignee
日商斯庫林集團股份有限公司
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Publication of TW202201518A publication Critical patent/TW202201518A/zh
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Publication of TWI781622B publication Critical patent/TWI781622B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW110117628A 2020-05-28 2021-05-17 基板處理裝置、基板處理方法、學習用資料之生成方法、學習方法、學習裝置、學習完成模型之生成方法及學習完成模型 TWI781622B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020093544A JP7444701B2 (ja) 2020-05-28 2020-05-28 基板処理装置、基板処理方法、学習用データの生成方法、学習方法、学習装置、学習済モデルの生成方法、及び学習済モデル
JP2020-093544 2020-05-28

Publications (2)

Publication Number Publication Date
TW202201518A TW202201518A (zh) 2022-01-01
TWI781622B true TWI781622B (zh) 2022-10-21

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Family Applications (1)

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TW110117628A TWI781622B (zh) 2020-05-28 2021-05-17 基板處理裝置、基板處理方法、學習用資料之生成方法、學習方法、學習裝置、學習完成模型之生成方法及學習完成模型

Country Status (5)

Country Link
JP (2) JP7444701B2 (ja)
KR (1) KR20230012025A (ja)
CN (1) CN115668448A (ja)
TW (1) TWI781622B (ja)
WO (1) WO2021241231A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149495A (ja) * 2015-02-13 2016-08-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび同システムにおける排気量調節方法
JP2017033988A (ja) * 2015-07-29 2017-02-09 東京エレクトロン株式会社 液処理装置
JP2020004817A (ja) * 2018-06-27 2020-01-09 株式会社Ｓｃｒｅｅｎホールディングス 補正方法、基板処理装置、及び基板処理システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6956603B2 (ja) 2017-11-13 2021-11-02 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149495A (ja) * 2015-02-13 2016-08-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび同システムにおける排気量調節方法
JP2017033988A (ja) * 2015-07-29 2017-02-09 東京エレクトロン株式会社 液処理装置
JP2020004817A (ja) * 2018-06-27 2020-01-09 株式会社Ｓｃｒｅｅｎホールディングス 補正方法、基板処理装置、及び基板処理システム

Also Published As

Publication number Publication date
TW202201518A (zh) 2022-01-01
JP2024045749A (ja) 2024-04-02
JP7444701B2 (ja) 2024-03-06
JP2021190530A (ja) 2021-12-13
WO2021241231A1 (ja) 2021-12-02
CN115668448A (zh) 2023-01-31
KR20230012025A (ko) 2023-01-25

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