KR20230012025A - 기판 처리 장치, 기판 처리 방법, 학습용 데이터의 생성 방법, 학습 방법, 학습 장치, 및 학습이 완료된 모델의 생성 방법 - Google Patents

기판 처리 장치, 기판 처리 방법, 학습용 데이터의 생성 방법, 학습 방법, 학습 장치, 및 학습이 완료된 모델의 생성 방법 Download PDF

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Publication number
KR20230012025A
KR20230012025A KR1020227044048A KR20227044048A KR20230012025A KR 20230012025 A KR20230012025 A KR 20230012025A KR 1020227044048 A KR1020227044048 A KR 1020227044048A KR 20227044048 A KR20227044048 A KR 20227044048A KR 20230012025 A KR20230012025 A KR 20230012025A
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KR
South Korea
Prior art keywords
processing
learning
substrate
information
exhaust pipe
Prior art date
Application number
KR1020227044048A
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English (en)
Korean (ko)
Inventor
줌페이 가와네
나오키 사와자키
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of KR20230012025A publication Critical patent/KR20230012025A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Drying Of Semiconductors (AREA)
KR1020227044048A 2020-05-28 2021-05-12 기판 처리 장치, 기판 처리 방법, 학습용 데이터의 생성 방법, 학습 방법, 학습 장치, 및 학습이 완료된 모델의 생성 방법 KR20230012025A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-093544 2020-05-28
JP2020093544A JP7444701B2 (ja) 2020-05-28 2020-05-28 基板処理装置、基板処理方法、学習用データの生成方法、学習方法、学習装置、学習済モデルの生成方法、及び学習済モデル
PCT/JP2021/018066 WO2021241231A1 (ja) 2020-05-28 2021-05-12 基板処理装置、基板処理方法、学習用データの生成方法、学習方法、学習装置、学習済モデルの生成方法、及び学習済モデル

Publications (1)

Publication Number Publication Date
KR20230012025A true KR20230012025A (ko) 2023-01-25

Family

ID=78723393

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227044048A KR20230012025A (ko) 2020-05-28 2021-05-12 기판 처리 장치, 기판 처리 방법, 학습용 데이터의 생성 방법, 학습 방법, 학습 장치, 및 학습이 완료된 모델의 생성 방법

Country Status (5)

Country Link
JP (2) JP7444701B2 (ja)
KR (1) KR20230012025A (ja)
CN (1) CN115668448A (ja)
TW (1) TWI781622B (ja)
WO (1) WO2021241231A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019091758A (ja) 2017-11-13 2019-06-13 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016149495A (ja) 2015-02-13 2016-08-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび同システムにおける排気量調節方法
JP6482979B2 (ja) 2015-07-29 2019-03-13 東京エレクトロン株式会社 液処理装置
JP7184547B2 (ja) 2018-06-27 2022-12-06 株式会社Ｓｃｒｅｅｎホールディングス 補正方法、基板処理装置、及び基板処理システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019091758A (ja) 2017-11-13 2019-06-13 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体

Also Published As

Publication number Publication date
TWI781622B (zh) 2022-10-21
JP2024045749A (ja) 2024-04-02
JP7444701B2 (ja) 2024-03-06
CN115668448A (zh) 2023-01-31
JP2021190530A (ja) 2021-12-13
TW202201518A (zh) 2022-01-01
WO2021241231A1 (ja) 2021-12-02

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