TWI781609B - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

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Publication number
TWI781609B
TWI781609B TW110116724A TW110116724A TWI781609B TW I781609 B TWI781609 B TW I781609B TW 110116724 A TW110116724 A TW 110116724A TW 110116724 A TW110116724 A TW 110116724A TW I781609 B TWI781609 B TW I781609B
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TW
Taiwan
Prior art keywords
substrate
gas
sublimation
solidified body
flow rate
Prior art date
Application number
TW110116724A
Other languages
English (en)
Chinese (zh)
Other versions
TW202209419A (zh
Inventor
尾辻正幸
加藤雅彦
山口佑
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202209419A publication Critical patent/TW202209419A/zh
Application granted granted Critical
Publication of TWI781609B publication Critical patent/TWI781609B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • F26B21/12—Velocity of flow; Quantity of flow, e.g. by varying fan speed, by modifying cross flow area
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW110116724A 2020-08-20 2021-05-10 基板處理方法及基板處理裝置 TWI781609B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-139221 2020-08-20
JP2020139221A JP7446181B2 (ja) 2020-08-20 2020-08-20 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
TW202209419A TW202209419A (zh) 2022-03-01
TWI781609B true TWI781609B (zh) 2022-10-21

Family

ID=80283006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110116724A TWI781609B (zh) 2020-08-20 2021-05-10 基板處理方法及基板處理裝置

Country Status (4)

Country Link
JP (1) JP7446181B2 (ko)
KR (1) KR102585601B1 (ko)
CN (1) CN114076504B (ko)
TW (1) TWI781609B (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201923298A (zh) * 2017-09-15 2019-06-16 日商斯庫林集團股份有限公司 基板乾燥方法及基板乾燥裝置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021869A (ja) * 1998-06-30 2000-01-21 Tokyo Electron Ltd 真空処理装置
JP3905784B2 (ja) * 2002-03-26 2007-04-18 大日本スクリーン製造株式会社 基板処理装置
JP4853536B2 (ja) * 2009-03-13 2012-01-11 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5681560B2 (ja) 2011-05-17 2015-03-11 東京エレクトロン株式会社 基板乾燥方法及び基板処理装置
JP5486708B2 (ja) 2013-02-28 2014-05-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2015185713A (ja) 2014-03-25 2015-10-22 株式会社東芝 基板処理装置及び基板処理方法
KR20160065226A (ko) 2014-11-07 2016-06-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6709555B2 (ja) * 2015-03-05 2020-06-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7107754B2 (ja) * 2017-09-22 2022-07-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7286359B2 (ja) 2018-06-22 2023-06-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、および乾燥前処理液
JP7122911B2 (ja) 2018-08-31 2022-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7198618B2 (ja) 2018-09-21 2023-01-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7100564B2 (ja) 2018-11-09 2022-07-13 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201923298A (zh) * 2017-09-15 2019-06-16 日商斯庫林集團股份有限公司 基板乾燥方法及基板乾燥裝置

Also Published As

Publication number Publication date
TW202209419A (zh) 2022-03-01
JP7446181B2 (ja) 2024-03-08
KR20220023287A (ko) 2022-03-02
JP2022035121A (ja) 2022-03-04
CN114076504B (zh) 2022-11-22
CN114076504A (zh) 2022-02-22
KR102585601B1 (ko) 2023-10-10

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